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DATE March 21st, 2002
AGENDA 6:00 PM, Social Hour
7:00 PM, Dinner/Presentation
MEETING FEES $20, Members
$25, Nonmembers
MENU Chicken Cordon Blue
LOCATION Embassy Suities
3100 East Frontera Anaheim, CA
(714) 632-1221
RESERVATIONS Call: MaskTek (714) 557-3383
NO SHOWS WILL BE INVOICED. If you can not attend, please cancel
your reservation by 12 Noon on Wednesday, prior to the meeting.
See you there!
March 2002 Dinner / Presentation
Implementation of AOI and SPC in Electronics Manufacturing By, Art Schmidt, Program Manager, with Machine Vision Products, Inc.
Presently, many of the quality conscious electronics manufac-turers have successfully implemented Automated Optical In-spection (AOI) on their production lines. Generally, the em-phasis has been placed on achieving inspection of defects and the improvement of yield. However, AOI is able to generate a tremendous amount of useful data in the process. In the past, one of the difficulties of implementing Statistical Process Control (SPC) has been to transform this data into knowledge and to focus on the key process parameters. This presentation will discuss the possible outcomes and problems with cou-pling AOI and SPC methodology in electronics manufactur-ing. It also advances a methodology for optimizing the use of AOI as a key tool for SPC on the production line. The out-come of implementing AOI/SPC is higher yield and lower overall manufacturing costs.
ARTHUR SCHMIDT serves as Program Manager at Machine Vision Products, Inc. Mr. Schmidt joined MVP in March of 2000 and has since become actively involved in program management in order to develop and maintain corporate partnerships. Mr. Schmidt�s career has spanned for a period of over 14 years in which his main focus has ranged from that of Process Engineer, Production Line Manage-ment, Statistical Process Control Implementation, to Customer Applications. Previously Mr. Schmidt worked for Bethlehem Steel where he worked as an Applications Engineer. Mr. Schmidt received his Bachelor of Science degree in Electrical Engineering from Northwestern University. He subsequently received a Masters degree in Electrical Engineering from Illinois Institute of Technology.
MARCH 2002
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Well March is here already and the months are passing quickly. We had a great turnout for our February Presentation with Paul Barnes. He gave a wonderful and informative presentation in a combined meeting with the local IMAPS chapter. Though we competed with the Olympics, we still had a good turnout.
We as a board feel that even though the economy is still greatly affecting our industry, sales are down, work is slow, and layoffs are ongoing, all is not doom and gloom. The economy will improve and things will pick up again. Your local SMTA chapter is providing informative and educational speakers along with an opportunity to network and find out what is going on in the industry and how others are surviving. Even though your workload may have increased from cutbacks we urge you to mark your calendar and join us on March 21 for our next meeting. Chapter meetings are a great opportunity for you to get away, network, and grow from the educational and informative information presented. All of us as board members serve on a volunteer basis. Our schedules are also busy, but we feel that SMTA is a vital tool for our members and us. We made Chapter of the Year in 2001 and offer you one of the best-run chapters in the SMTA organization with very dedicated leaders. Please support us and take advantage of all the benefits SMTA has to offer. We need to hear from our chapter members on what you want and how we can better serve you, so we can further improve our local chapter and the events we offer.
Our board is very excited, because this month we have the opportunity of sending two of our board members (Kathy Palumbo and Michelle Ogihara) to the 2002 SMTA Chapter Officer Leadership Forum held on March 15-17 in Bloomington, Minnesota. National provides this Leadership Forum once every 2 years. It is a weekend packed full of training in all facets and work-ings of the SMTA Organization. There will be a half-day training session by a professional facilitator on how we can improve our chapter, under-standing why people join the SMTA, and how to get more SMTA members involved. It will be a fun and educational weekend and we all look forward to the information they will bring back. Look for their report in our next newsletter.
Brent Taylor grew up in White Swan, WA. He graduated from Moorpark College and has over 20 years in Elec-tronics, working in thin film, thick film and Surface Mount. He is an Engineer for Kavlico Corp, a division of Solec-tron. Kavlico is an OEM which builds Automotive and Industrial Transducers. Brent has been the Production Manager for the Hybrid Assembly division at Kavlico for 8 years. Brent is married to Cindy and they have 5 children, 3 girls and 2 boys ranging from 23 to 13 years old. They also have a 3 year old grand-daughter Kaylee. Brent and his family will vacation at Twin Lakes, CA in the Eastern Sierras this year.
Let�s all give Brent a warm �SMTA� welcome into the SMTA L.A. / O.C. Chapter!
Member Profile
CHAPTER OFFICERS
President Riki Brown
Golden West Technology Fullerton, CA
TEL: (714) 738-3775 FAX: (714) 738-7727
E-mail: [email protected]
Vice- President of Chapter Training Atul Mehta
Jet Propulsion Laboratory Pasadena, CA
TEL: (818) 393-2962 FAX: (818) 393-5055
E-mail: [email protected]
Vice-President of Chapter Eduction Scott Penin
APW Enclosures Irvine, CA
TEL: (949) 474-8998 FAX: (949) 474-1340
E-mail: [email protected]
Vice-President of Membership Michelle Ogihara
Seika Machinery, Inc. 3528 Torrance Blvd., Suite 100
Torrance, CA TEL: (310) 540-7310
E-mail: [email protected]
Secretary Kathy Palumbo
Production Analysis & Learning Services, LLC TEL: (949) 713-7229 FAX: (949) 713-7229
E-mail: [email protected]
Treasurer Nat Longrose
Spec Elite, Inc. 2031 E. Cerritos Ave, Ste 7D
Anaheim, CA 92806 TEL: (714) 774-6500 FAX: (714) 774-6501
E-mail: [email protected]
Vendor Advertisement Chairman Michelle Ogihara
Seika Machinery, Inc. 3528 Torrance Blvd., Suite 100
Torrance, CA TEL: (310) 540-7310
E-mail: [email protected]
Brent Taylor
February�s LA/OC SMTA chapter dinner meeting was held at the Four Points Sheraton in Anaheim where speaker/presenter Paul Barnes of SST International provided wonderful insight into the world of Opto-Electronic devices. The topic of his presentation was �Flux-free and void-free fiber optic packaging as-sembly process�.
Paul explained that some of the typical components in an Opto-electronics system can be a 14 Pin Butterfly, Laser Diodes, Photo Diodes, Light Transmitters, Optical Fibers, Switches, Detectors, Signal Conditioners, and Thermoelectric Cooler (TEC). Optical fibers are made from either glass or plastic. Light is transmitted from one end to another where a signal is imposed. Bandwidth is directly related to the wavelength of light transmitted. This light wave signal is capable of containing much more information than what is possible with a standard metallic conductor. Optical fiber has three elements, which are the core, cladding, and outer coating. The Core is made of glass or plastic. The cladding is usually made of the same material as the core, but with a lower index of refraction. The coating comprises one or more coats of a plastic material to protect the fiber. Some of the applications for fiber optics can be communication systems (voice, data, video trans-mission), long distance telecommunications, local area networks (LANS), industrial control systems, avionic systems, military command and control communication systems, and sensors for temperature, pressure, strain, electrical resistance and environmental changes.
The first step in the process of manufacturing an opto-electronic device is to mount the components on to a substrate using Gold-Tin (280oC) Eutectic solder. The inter-metallic bond that develops is known as the wet-ting characteristics. The Molten Gold-Tin reacts with the gold coating forming an even more gold rich inter-metallic compound.
The second step in the process is to mount the substrate to the top of a TEC cooler. Due to the TEC having temperature limitations, a lower temperature alloy is used. Indium based solders were used because of their wide range of temperatures, which makes them more suitable for step soldering. The third step in the process is to mount the TEC and substrate assembly to base of a 14-pin butterfly pack-age. An even lower Indium Alloy is used for this process. This is due to the fact that the Indium based alloys also offer a cushion effect due to the CTE mismatches. The lower temperatures were chosen so there will not be an effect on the grain structure formed during second process step. Some advantages to gold bearing solder is that it is suitable to join gold metallized components, a low contact angle, lower gold scavenging, a eutectic composition, good reflow without flux, and all while being able to withstand higher temperatures.
Voids generated during the bonding process will increase the device operating temperatures, weaken the bonding area, reduce the reliability of the device when subjected to mechanical and thermal stresses, and can be a path for stress cracks. The soldering process steps should be processed in one of three types of atmos-pheres, oxidizing, inert, or reducing. Localized non-wetting may be caused by oxides, organics, inorganic salts, metallization, inter-metallic formation, component warping, or an under layer of metallizations.
To conclude, if one addresses material metallizations, material compatibility, component cleanliness, the elimination of oxides, and the use of the correct solder alloy; coupled with precisely controlling the pressure variation process parameters and chamber environment (vacuum level, gas pressurization, heat ramp, cool down, heat dwell), a strong bond between components with virtually a void-less soldered interconnects can be achieved.
The presentation offered an excellent insight into fiber optic packaging technology. The LA/OC SMTA chapter would like to thank Mr. Paul Barnes for an excellent presentation.
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A Note From our Trusty SMTA Golf "Get Together" Organizer...
L.A. / O.C. SMTA & CCA 3rd Annual
Golf "Get Together" It's time to start preparing for our annual Golf "Get Together" scheduled for later this year. As you can see I wanted to get an early start so we
can continue improving this event�
A Brief Event History In 2000 we held the 1st SMTA Golf Tournament at Mile Square Golf Course with a field of 33 players. In 2001 the California Circuits Association joined us in hosting the tournament at Mile Square Golf Course. The field increased in size to 55 players. Due to our small field of players we were assigned starting tee times spread out over ap-proximately 2 hours. This made it difficult for some players to stay for the raffle and awards presentation.
This Years Event Plan
The SMTA / CCA Golf Tournament will be a Shot Gun Start. This means that players will start at different holes but at the same time. In turn, this allows us to "Get To-gether" for a banquet, awards presentation, and raffle at the end of the tournament. In order for the Shot Gun Start to work, we will need to have a minimum of 80 golfers.
The date for the "Get Together" is Thursday, August 8, 2002 at California Country Club in Whittier. California Country Club is a private country club, which will enable us to have the course all to ourselves. In addition, California Country Club is going to allow us full access to all of their facilities, including the Men's and Women's locker room.
1:00 PM Shot Gun Start 5:30 PM Awards Banquet (& you will be allowed to sit down)
"Cost / Player" is $95.00 Full Use of California Country Club Facilities
Warm Up Balls (Nets ONLY) Green Fees
Cart 5:30 PM Awards Banquet Only is $35.00
So, won�t you support your SMTA Chapter? Mark this date on your cal-endar and join the fun at our 3rd Annual Golf "Get Together"!
Your Faithful SMTA Golf "Get Together" Organizer,
Frank Kurisu SolderMask, Inc.
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Help Wanted: Corporate Sponsors for the Big Event. Have your company name in lights, while supporting your local chapter! For more information Contact Frank Kurisu with SolderMask, Inc. at [email protected]
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SMTA / CCA Golf �Get Together�
Thursday August 8th, 2002
Shotgun Start 1pm
California Country Club 1509 South Workman Mill Road
Whittier, CA 90601
Contact Frank Kurisu with SolderMask, Inc. at
Cost is $95.00 per player, & in-cludes, Green Fees, Shared Cart,
Warm Up Balls, & Awards Banquet. Awards Banquet Only is $35.00
Don't let this fun-filled event pass
you by!
Mark your
calendars now!
You won�t want to miss this event!
Whether you golf or not, it is fun for everyone. Come join us�
don't miss the party at the 19th
hole!
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DATE & TIME EVENT & LOCATION
April 18, 2002 L.A. / O.C. SMTA CHapter Dinner
6pm Embassy Suites, Anaheim, Ca.
Contact: Kathy Palumbo − [email protected] Reservations: MaskTek / SHeema (714) 557−3383
May 8, 2002 IMAPS Southern California Technical Symposium
To Be Announced Pasadena Convention Center
Contact: Maurice Lowery − [email protected]
May 16, 2002 L.A. / O.C. SMTA CHapter Dinner
6pm Embassy Suites, Anaheim, Ca.
Contact: Kathy Palumbo − [email protected] Reservations: MaskTek / SHeema (714) 557−3383
June 20, 2002 L.A. / O.C. SMTA CHapter Dinner & Plant Tour
6pm Location To Be ANnounced
Contact: Kathy Palumbo − [email protected] Reservations: MaskTek / SHeema (714) 557−3383
August 8, 2002 L.A. / O.C. SMTA Golf "Get Together"
1pm California Country Club, Whittier, Ca.
Contact: Frank Kurisu − [email protected]
September 19, 2002 L.A. / O.C. SMTA CHapter Dinner
6pm Embassy Suites, Anaheim, Ca.
Contact: Kathy Palumbo − [email protected] Reservations: MaskTek / SHeema (714) 557−3383
October 17, 2002 L.A. / O.C. SMTA CHapter Training
To be Announced Location To Be ANnounced
Contact: Kathy Palumbo − [email protected]
BGA�s, uBGA�s, Flip-Chips, 0402�s, 0201�s and now 1005. Have we gone too far? Where is the threshold? Does it make sense to process components this small given the processes, electrical, inspection, testing, repair-ability, and most importantly long-term RELIABILITY issues surrounding such small de-vices. Have we reached a point where we might be going backwards instead of forward? These are all essential questions, which should be answered given the drive to component miniaturization.
As we all know component miniaturization is driven by constant demand to make products better, smaller, and cheaper. As the Sony 3dB theory goes: �Next generation products should cost half as much and be one third the size and weight.� This is of course, given the fact that Sony spends +$2 billion per year for R&D of which two thirds is allocated to new product develop-ment. However, not all of us are Sony's and have such enormous budgets to allocate. The other issue is that Sony products for the most part, are almost disposable (as are most consumer electronics.)
Let us not forget some of the reasons for shifting from QFP�s, TQFP�s and TAB technologies to BGA was in part, driven by higher I/O demands and ease of manufacturing. With 0402�s, 0201�s and 1005�s on our doorstep are we now going backwards with these technologies from a manufacturing standpoint? The answer to this question will depend on whom you ask. A De-sign Engineer might say � This is great, smaller components means more space to play with, I can do more in less space�. Where as a Mfg. Process Engineer might respond � 020 what? What are you talking about? People are still trying to place 0402�s consistently with high yields. What about my process? � The true answer might lie somewhere in between.
In either case, considerations must be given to the advantages and disad-vantages before making a shift to said technologies. There are some very serious issues surrounding use of such small devices, which are especially
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applicable in high-reliability products. Such a shift done prematurely can cost a company many problems and worst of all, reputation. The strongest case against use of such small devices is given the fact that long-term reliability data using 0402 and smaller passive devices are very questionable. Other issues that need to be addressed if considering such technologies might be: -Electrical capacity (responses to higher voltages and surges.)
-Capital equipment requirements
-Assembly methods and techniques
-Solder paste printing methods and design
-Thermal process issues
-Inspection methods
-Re-workability or throw away when defective
-Test fixture compatibility
-Reliability
-Etc�
The answers to these issues are essential before making a final decision to-wards implementing these technologies. One might even consider different approaches such as using arrays containing some passive functions of one type (either resistors or capacitors) integrated in a SMD. These are already being used frequently as bus terminations. Another solution is based on inte-gral passive devices, which can combine active and passive functions. For example, active bus terminating networks are currently available. And on the horizon are embedded passive components that can be found in a multi-layer substrate (FR4 or LTCC). They are already in use in Bluetooth or VCO (voltage controlled oscillator) modules. All these solutions have a greater po-tential in respect of functional density than discrete passives and eliminate the need for placing such small devices along with the processing head-aches.
Written By:
Deon Nungaray
General Monitors USA
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Contact Riki Brown
Call: (714) 738-3775 / Fax: (714) 738-7727 / E-Mail: [email protected]
LA/OC SMTA Chapter Meeting
March 21, 2002 Embassy Suites
Anaheim, Ca.
Implementation of AOI and SPC in Electronics Manufacturing
By Art Schmidt, Program Manager, with
Machine Vision Products, Inc.
