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Industrial Selector Guide
Making embedded systems better with robust reliable performance
Freescale Semiconductor, Inc. Quarter 3, 2015SG200 Rev. 8.0
C
Page numberPage 3
Page 4Page 5Page 6
re-driver Page 6Page 7
ity Transceivers Page 8Page 9
Page 10Page 10
SG200 (Selector Guide) (3Q2015) – 2
ontentsPRODUCT Sub category
Battery Management Intelligent Battery Sensors
Drivers and Switches 12 V and 36 V eXtreme SwitchesConfigurable I/O - Signal ConditioningValve Control
Engine and DC Motor Control High Voltage H-Bridge Drivers and Three Phase FET PLow Voltage H-Bridge Motor Drivers
Power Management System Basis Chips (SBC) CAN Bus and LIN ConnectivEmbedded System Power Management
Transceivers Engine ManagementIntelligent Distributed Controllers (IDC)
F
BaAdditional Information Packaging Status
MM B h,
Selectable Internal or external temp sense, GPIO, including SPI functionality, internal or external oscillator.Window watchdog with Selectable Timing, Normal/Stop/Sleep/Crank mode control high voltage wake-up input.
48-pin QFNExposed Pad
ProductionEVB
MM,
Four battery voltage measurements with internal resistor dividers, and up to five direct voltage measurements for use with an external resistor divider. Measurement synchronization between voltage channels and current channels Five external temperature sensor inputs with internal supply for external sensors Low-power modes with low-current operation. Multiple wake-up sources: LIN, timer, high-voltage input, external CAN interface, and current threshold and integration. Precision internal oscillator and connections for external crystal.
48-pin QFNExposed Pad
ProductionEVB
Ref. Design
TTcStoCoinFsn
SMARTMOS technology brings a wide range of component reductions, power capability,
performance analog, and robustness.e offered in EPP and RoHS compliant packages;
ibraries
ent
od_num_scheme/ANALOGPN.pdf
SG200 (Selector Guide) (3Q2015) – 3
reescale Semiconductor Industrial Products
ttery Management — Intelligent Battery Sensors Product Description Main Characteristics MCU
ReferenceMCU Details
912_637 Integrated Precision Battery Sensor Simultaneous battery voltage and current measurement with 16-bit sigma-delta ADC & IIR filter. Voltage regulators: 2.5 V/10 mA & 60 mA, 5.0 V/80 mA. LIN 2.1 physical Layer with selectable slew rates and triggered wake-up
16-bit MCU(CPU12_V1)
S12 16-bit core, 128KB/96 KB Flash, 6 KRAM, 4 KB data FlasESCI, 16-bit 4 Channel Timer, Internal Clock Generator, BDM
9Z1_638 Battery Sensor with CAN and LIN This is a fully integrated battery monitoring device. The device supports precise current measurement via an external shunt resistor. The MM9Z1_638 includes LIN 2.2 protocol and physical interface, and an MSCAN protocol controller
16-bit MCUS12Z
S12Z MCU with 128 KB Flash, 8 KB RAM4 KB EEPROM
he product categories range from Power Actuation and Communication ransceivers to Signal Conditioning and Embedded MCU + Power. Power Actuation overs a broad range of load control and drivers, including motor control.MARTMOS—Freescale Semiconductor SMARTMOS technology allows designers interface high-precision components with the harsh automotive environment.ost-Effective—Ideally suited for rug automotive applications, SMARTMOS solutions ffer a cost-effective blend of analog, digital, and robust power silicon that enables tegrated, mixed signal, power control ICs.unctionality—SMARTMOS solutions implement traditional analog functions with maller die size, and a modular process produces components with the minimum umber of process steps for each circuit, minimizing overhead.
Benefits—Freescale Semiconductorbenefits to today’s designs, includingdurability, efficiency, precision, high-Packaging - Freescale device may bview the external web for specifics.For additional information, visit:Documentation, Tool, and Product Lwww.freescale.comwww.freescale.com/analogwww.freescale.com/powermanagemwww.freescale.com/productlongevitywww.freescale.com/files/shared/doc/ pr
DrStatus/FaultReporting
Protection Features
Packaging Status
MC
MC Status Pin, Current Monitor,
Temperature
Overcurrent, Overtemperature,
Short-circuit, Undervoltage
Lock out
16-pin PQFN Production
MC Status Pin, SPI
reporting, Current Monitor,
Temperature
Overcurrent, Overtemperature,
Short-circuit, Undervoltage
Lock out
16-pin PQFN ProductionEVB
MC Status Pin, SPI
reporting, Current Monitor,
Temperature
Overcurrent, Overtemperature,
Short-circuit, Undervoltage
Lock out
16-pin PQFN ProductionEVB
MC Status Pin, SPI
reporting, Current Monitor,
Temperature
Overcurrent, Overtemperature,
Short-circuit, Undervoltage
Lock out
16-pin PQFN ProductionEVB
MCMC SPI Fail-safe mode,
Overcurrent shutdown,
Overtemperature, Short-circuit
32-pin SOICWExposed Pad
Production
MC SPI Fail-safe mode, Overcurrent Shutdown,
Overtemperature, Short-circuit
32-pin SOICWExposed Pad
ProductionEVB
MCMC SPI Fail-safe mode,
Overcurrent Shutdown,
Overtemperature, Short-circuit
54-pin SOICWExposed PAD
ProductionEVB (6517)
MC SPI Fail-safe mode, Overcurrent Shutdown,
Overtemperature, Short-circuit
32-pin SOICWExposed PAD
Production EVB
MC SPI Fail-safe mode, Overcurrent Shutdown,
Overtemperature, Short-circuit
32-pin SOICWExposed PAD
Production EVB
MC SPI Fail-safe mode, Overcurrent shutdown,
Overtemperature, Short-circuit
32-pin SOICWExposed PAD
ProductionEVB (6500)
SG200 (Selector Guide) (3Q2015) – 4
ivers and Switches — 12 V and 36 V eXtreme Switches Product Description No of
OutputsHigh-side or Low-
side
Maximum Current
Each Output (A)
RDS(on) (m) of Each Output
Current Limitation (A)
Current Limitation
Standby Max (A)
Control
12XSB 12 V Industrial Multipurpose Low RDS(on) eXtreme Switches
34981 Single High-side Switch (4.0 m), with PWM, Protection and Diagnostics
1 H 40 4 100 5.0 Parallel
34982 Self Protected 2.0 m Switch with Diagnostic and Protection
1 H 60 2 150 10 Parallel, SPI
34984 Self Protected 4.0 m Switch with Diagnostic and Protection
2 H 30 4 100 10 Parallel, SPI
34988 Self Protected 8.0 m Switch with Diagnostic and Protection
2 H 15 4 50 10 Parallel, SPI
12XSC 12V External Industrial Lighting Multichannel eXtreme Switches07XSC200 Dual High-side Switch (2 x 7m), with
PWM, Protection, Diagnostics and SPI Control
2 H 6.0 2 x 7 93 5.0 SPI and Parallel
10XSC425 Quad High-side Switch (2 x 10 m, 2 x 25m), with PWM, Protection, Diagnostics and SPI Control
4 H 6.0 2 x 0, 2 x 25 39, 78 5.0 SPI and Parallel
12XSF External Industrial Lighting Multichannel Scalable eXtreme Switches07XSF517 Penta High-side Switch (3 x 7 m2 x
17 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver.
5+1 H 11, 5.5 3 x 172 x 7
100, 50 20 SPIParallel
08XSF421 Quad High-side Switch (2 x 8 m, 2 x 21 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver
4+1 H 11, 5.5 2 x 82 x 21
100, 50 20 SPIParallel
17XSF400 Quad High-side Switch (4 x 17 m), with PWM, Protection, Diagnostics and SPI Control. Also, 1 logic level output driver
4+1 H 5.5 4 x 17 50 20 SPIParallel
17XSF500 Penta High-side Switch (5 x 17 m), with PWM, Protection, Diagnostics and SPI Control. Also, one logic level output driver.
5+1 H 5.5 5 x 17 50 20 SPIParallel
MC
MC SPI Fail-safe mode, Overcurrent shutdown,
Overtemperature, Short-circuit,
Parallel operation
23-pin PQFN ProductionEVB
MC SPI Fail-safe mode, Overcurrent shutdown,
Overtemperature, Short-circuit,
Parallel operation
23-pin PQFN ProductionEVB
MC SPI Fail-safe mode, Overcurrent shutdown,
Overtemperature, Short-circuit,
Parallel operation
23-pin PQFN ProductionEVB
MC SPI Fail-safe mode, Overcurrent shutdown,
Overtemperature, Short-circuit,
Parallel operation
32-pin SOICExposed PAD
ProductionEVB
MC SPI Fail-safe mode, Overcurrent shutdown,
Overtemperature, Short-circuit,
Parallel operation
32-pin SOICExposed PAD
ProductionEVB
DrOperatingVoltage (V)
Packaging Status
MC 5.5 to 26 32-pin SOICWExposed Pad
ProductionEVB
MC 5.5 to 28 32-pin SOICWExposed Pad
ProductionEVB
MC 4.5 to 36 32-pin SOICWExposed Pad
ProductionEVB
CD 4.5 to 36 48-pin LQFP-EP 1Q 2016EVB Planned
DrStatus/FaultReporting
Protection Features
Packaging Status
SG200 (Selector Guide) (3Q2015) – 5
36XSD 36 V Multipurpose Industrial Low RDS(on) Intelligent eXtreme Switches
06XSD200 Dual High-side Switch (2 x 6 m), with PWM, Protection, Diagnostics and SPI Control (24 V)
2 H 9.0 2 x 6 30, 90 10 SPI and Parallel
10XSD200 Dual High-side Switch (2 x 10 m), with PWM, Protection, Diagnostics and SPI Control (24 V)
2 H 6.0 2 x 10 18, 55 10 SPI and Parallel
16XSD200 Dual High-side Switch (2 x 16 m), with PWM, Protection, Diagnostics and SPI Control (24 V)
2 H 3.0 2 x 16 9.0, 27 10 SPI and Parallel
22XSD200 Dual High-side Switch (2 x 22 m), with PWM, Protection, Diagnostics and SPI Control (24 V)
2 H 3.0 2 x 22 9.0, 27 10 SPI and Parallel
50XSD200 Dual High-side Switch (2 x 50 m), with PWM, Protection, Diagnostics and SPI Control (24 V)
2 H 1.2 2 x 50 3.5, 11 10 SPI and Parallel
ivers and Switches — Configurable I/O - Signal Conditioning Product Description Main Characteristics Switch Monitor
Voltage (V)34972 22 input Multiple Switch Detect Interface with 16 mA Wetting Current and
Suppressed Wake-upMultiple switch detection interface with suppressed wake-up designed to detect closing and opening of up to 22 switch contacts (14 GND, 8 configurable), wetting current of 2.0 mA or 16 mA.
-14 to 38
-14 to 40
34975 22 input Multiple Switch Detect Interface with 32 mA Wetting Current and Wake-up
22 inputs contact monitoring (14 GND, 8 configurable), 4.0 mA or 32 mA pulse wetting current, low-power mode interrupt capability, wake-up. Can supply current to external sensors.
-14 to 38/40
34978 22 input Multiple Switch Detect Interface with programmable Wetting Current Multiple switch detection interface designed to detect closing and opening of up to 22 switch contacts (14 GND, 8 configurable), programmable wetting current from 2.0 to 20 mA. 24 to 1 Analog Multiplexer.
-14 to 38 V
1030 33 Channel Multiple Switch Detection Interface with Programmable Wetting Current
Multiple switch detection interface designed to detect closing and opening of up to 33 switch contacts (21 GND, 11 configurable), programmable wetting current from 2.0 to 20 mA, 35 to 1 Analog Multiplexer
-14 to 38 V
ivers and Switches — 12 V and 36 V eXtreme Switches (continued)Product Description No of
OutputsHigh-side or Low-
side
Maximum Current
Each Output (A)
RDS(on) (m) of Each Output
Current Limitation (A)
Current Limitation
Standby Max (A)
Control
DrInterface and Input Control
Protection Features
Packaging Status
SB5.0 p sy
/D
SPI Overcurrent, Open Load,
Overtemperature, VDS monitoring,
Overvoltage, Undervoltage, Clock Failure,
Watchdog
48-pin LQFP-EP
ProductionEVB
SB5.0 p
/D
SPI Overcurrent, Open Load,
Overtemperature, VDS monitoring,
Overvoltage, Undervoltage, Clock Failure,
Watchdog
64-pin LQFP-EP
ProductionEVB
Enrol Status
ReportingProtection Features
Packaging Status
MC llel Status Flag Output Short-circuit Protect, Overcurrent
Limit, Overtemperature
32-pin SOICW with Exposed
Pad
ProductionEVB
MC llel Status Flag Output Short-circuit Protect, Overcurrent
Limit, Overtemperature
54-pin SOICW with Exposed
Pad
ProductionEVB
GD llel SPI Programmable Deadtime,
Reverse Charge Injection
56-pin QFN ProductionEVB
Planned
SG200 (Selector Guide) (3Q2015) – 6
ivers and Switches — Valve Control Product Description Main Characteristics Load Supply Voltage
(V)Min. Max.
Other Features
0410 Fully Integrated Quad Valve Controller System on Chip 36 V
Integrates high precision, x4 valve drivers current regulated or x4 PWM valve drivers, DC motor pump predriver (16KHz), x2 low- side drivers, ADC 10-bit safety state machine
6.0 36 Current regulated valve drivers up to 2.25 A, up to KHz, PWM valve drivers uto 5.0 A, up to 5.0 KHz, Eacurrent control, x3 input A
0800 Fully Integrated Octal Valve Controller System on Chip 36 V
Integrates fail-safe switch, high precision, x4 valve drivers current regulated, x4 PWM valve drivers, DC motor pump predriver, low-side driver and high-side driver for general purpose, ADC 10-bit safety state machine
6.0 36 Current regulated valve drivers up to 2.25 A, up to KHz, PWM valve drivers uto 5.0 A, up to 5 Khz, Easycurrent control, x3 input A
gine and DC Motor Control — High Voltage H-bridge Drivers and Three Phase FET Pre-driver Product Description Main Characteristics No of
OutputsRDS(on) (m)
of EachOutput
Peak CurrentLimitation
(A)
CurrentLimitation Standby
Max
Cont
34931 5.0 A H-Bridge Brushed DC Motor Driver, Single, 5.0 - 28 V, 5.0 A, SOICW-EP 32 ld
Automatic thermal back-off; Real-time current output Feedback; Low leakage current
2 120 8.0 50 A Para
34932 5.0 A Dual H-Bridge Brushed DC/Stepper Motor Driver, 5.0 - 28 V, 5.0 A, SOICW-EP 54 ld
Automatic thermal back-off; Real-time current output Feedback; Low leakage current
4 120 8.0 50 A Para
3000 Three Phase Field Effect Transistor Pre-driver Triple high-side and low-side FET predrivers, with parallel & SPI control and programmable deadtime (shoot-through protect)
6 6000 high-side5000 low-side
2.0 56 A Para
EnStatus Reporting Protection
FeaturesPackaging Status
MC Shutdown Shoot Through Protect,
Undervoltage Detect,Thermal detection
16-pin UQFN ProductionFRDM EVB
MC SPI Programmable Deadtime,
Reverse Charge Injection Protect
54-pin SOICWExposed Pad
ProductionEVB
MP Shutdown Shoot Through Protect,
Undervoltage Detect
16-pin QFN ProductionFRDM EVB
MP Shutdown Shoot Through Undervoltage
Detect
24-pin TSSOP ProductionFRDM EVB
MP Shutdown Shoot Through Protect,
Undervoltage Detect
20-pin VMFP ProductionFRDM EVB
MP Shutdown Shoot Through Protect,
Undervoltage Detect
16-pin VMFP ProductionFRDM EVB
MP Shutdown Shoot Through Protect,
Undervoltage Detect
24-pin QFN16-pin VMFP
ProductionFRDM EVB
MP Shutdown Shoot Through Protect,
Undervoltage Detect
16-pin VMFP ProductionFRDM EVB
SG200 (Selector Guide) (3Q2015) – 7
gine and DC Motor Control — Low Voltage H-Bridge Motor Drivers Product Description Main Characteristics Operating
Voltage (V)Control Output Drives
High/Low-side,Drive Current
34933 Dual H-Bridge Motor Driver, 7.0 V, 1.4 A Peak, 200 kHZ PWM, for Stepper Motor or two H-Bridges
Monolithic dual H-Bridge driver IC in ultra-small 3X3 mm UQFN package, integrated charge pump and protection
2.7 to 7.0 Parallel 1.4 A
34937 Three-Phase Field Effect Transistor Pre-driver Triple high-side and low-side FET pre-drivers with parallel and SPI control and programmable shoot-through protect
8.0 to 58 Parallel, SPI 3 H, 3 L, 1.0 A (typ.)
C17C724 Dual H-Bridge Motor Driver, 5.5 V, 0.8 A Peak, 200 kHZ PWM, for Stepper Motor or two H-Bridges
Monolithic dual H-Bridge driver IC in ultra-small 3X3 mm QFN package and 1 uA sleep mode
2.7 to 5.5 Parallel 0.8 A
C17510 H-Bridge Motor Driver, 15 V, 3.8 A Peak, 200 kHZ PWM, with integrated MOSFET driver
Monolithic H-Bridge driver IC with integrated charge pump and protection. Includes unique MOSFET gate drive option.
2.0 to 15 Parallel 3.8 A
C17529 Dual H-Bridge Motor Driver, 6.8 V, 1.4 A Peak, 200 kHZ PWM, for Stepper Motor or two H-Bridges
Monolithic dual H-Bridge driver IC with integrated charge pump and protection
2.0 to 6.8 Parallel 1.4 A
C17533 Dual H-Bridge Motor Driver, 6.8 V, 1.4 A Peak, 200 kHZ PWM, for Stepper Motor or two H-Bridges
Monolithic dual H-Bridge driver IC with integrated charge pump and protection, 2 uA sleep mode
2.0 to 6.8 Parallel 1.4 A
C17511 H-Bridge Motor Driver, 6.8V, 3.0 A Peak, 200 kHZ PWM, with integrated MOSFET driver
Monolithic H-Bridge driver IC with integrated charge pump and protection. Includes unique MOSFET gate drive option
2.7 to 5.7 Parallel 3.0 A
C17531 Dual H-Bridge Motor Driver, 6.8V, 1.4 A Peak, 200 kHZ PWM, for Stepper Motor or two H-Bridges
Monolithic dual H-Bridge driver IC with integrated charge pump and protection
2.0 to 6.8 Parallel 1.4 A
Poher tures
Control and
StatusReporting
Protection Features
Packaging Status
CM us p, 3.3 MCU
D nt time-
Parallel High system ESD spec.
14-pin SOICN Production EVB
CM nal ng buck ter, p RC or, ted andler
SPI Overvoltage protection, High-
current protection, High-
temperature detection
24 QFN 2Q 2016EVB Planned
CM ifferent on , /Device on, ted andler
SPI Overcurrent protection for the IO link channels
Over temperature monitoring and
protectionOvervoltage protection
48 QFN 4Q 2015EVB Planned
MC us p, 3.3 MCU
Parallel High system ESD spec.
8-pin SOICN ProductionEVB
MC . I/O, ut, pin tible C34905.
“Secured” SPI
Overcurrent, Overtemperature,
Short-circuit, Undervoltage
detect
32-pin SOICW
Exposed Pad
ProductionEVB
MC . I/O, out, pin tible C34905.
“Secured” SPI
Overcurrent, Overtemperature,
Short-circuit, Under-voltage
detect
32-pin SOICW
Exposed Pad
ProductionEVB (‘905)
MC . I/O, ut, output, wer
with d RST lity.
“Secured” SPI
Overcurrent, Overtemperature,
Short-circuit, Undervoltage
detect
32-pin SOICW
Exposed Pad,
ProductionEVB
FS ssure t
“Secured” SPI
Overcurrent, Overtemperature,
Over & Undervoltage
detect
48-pin LQFPExposed Pad
4Q 2015EVB
SG200 (Selector Guide) (3Q2015) – 8
wer Management — System Basis Chips (SBC) CAN Bus and LIN Connectivity Transceivers Product Description Main Characteristics Bus Type
and Standard
OperatingVoltage
(V)
CurrentLimitation Standby
(A) Typ. Max.
OtFea
0902 Dual High-Speed CAN Transceiver The CM0902 is a dual high-speed CAN transceiver device, providing the physical interface between the CAN protocol controller of an MCU and the physical dual wire CAN bus. Both channels are completely independent, featuring CAN bus wake-up on each CAN interface, and TXD dominant timeout functionality
Dual CAN HS dual wire
4.5 to 5.5 - 15 CAN bwake-uor 5.0 VI/O, TXdominaout
3010 IO-Link Device CM3010 includes one fully-featured IO-Link channel and one switching output channel. It integrates an advanced power management block consisting of a DC-DC buck pre-regulator followed by an LDO.
IO-Link 9.0 to 30 - 500 Additioswitchioutput,DC-DCconverOn-chioscillatintegraframe h
3120 IO-Link Master CM3120 includes two fully-featured IO-Link channels which can work in threedifferent operation modes. Circuit integrates an IO-Link frame handler fullycompliant with the IO-Link v1.1 specification and which implements most of the IO-Link communication tasks.
IO-Link 8.0 to 32 - - Three doperatimodesMasteroperatiintegraframe h
34901 High-Speed CAN Transceiver Single CAN high-speed physical layer provides the physical interface between an MCU and the physical dual wires of the CAN bus. The MC34901 supports long-length CAN node interconnects for industrial applications.
CAN HS dual wire
4.5 to 5.5 - 5.0 CAN bwake-uor 5.0 VI/O
34903 System Basis Chip (SBC)-Gen 2-with High Speed CAN & LIN Interfaces
High-speed CAN and one LIN physical interface. 5.0 or 3.3 V VDD regulator.
LIN single wire
5.5 to 27 15 35 ConfigMUX-ocompawith M
34904 System Basis Chip (SBC)-Gen 2-with High Speed CAN Interface
High-speed CAN physical interface. 5.0 or 3.3 VDD and VAUX regulators with current sharing.
CAN high-speed, dual
wires
5.5 to 27 15 35 ConfigMUX - compawith M
34905 System Basis Chip (SBC)-Gen 2-with High Speed CAN & LIN Interfaces
High-speed CAN and one LIN physical interfaces. 5.0 or 3.3 VDD and VAUX regulators with current sharing.
CAN high-speed, dual
wires.LIN single
wire
5.5 to 27 15 35 ConfigMUX-oSAFE Low-pomodesINT ancapabi
6407 Safe System Basis Chip with Buck and Boost DC/DC up to 800 mA
Multiple switching and linear voltage regulators, built-in enhanced high speed CAN interface fulfills the ISO11898-2 and -5 standards.
CAN high-speed, dual
wires.
5.6 to 40 32 60 Safe Aproduc
FS ssure t
“Secured” SPI
Overcurrent, Overtemperature,
Over & Undervoltage
detect
48-pin LQFPExposed Pad
4Q 2015 EVB
FS e wake- or 5.0V upply, og
ed MUX SAFE
“Secured” SPI
Overcurrent, Overtemperature,
Short-circuit, Undervoltage
detect
48-pin LQFP Exposed Pad
Production EVB (33909)
PoAdditional Features Packaging Status
VR
I2C bus, 4 Bucks, 5 LDOs, VREFDDR and VTT features for
DDR Memory support
56-pin WF-QFN Exposed
pad
ProductionEVB
MM
Coincell charger, OTP memory, I2C bus, 6 Buck, 1 Boost and 6 LDO V-
Regs.
56-pin QFN,(8 x 8 x 0.85
mm)Exposed pad
(2 Types)
ProductionEVB
PRGM
MM
Coincell charger, OTP memory, I2C bus, 4 Buck, 1 Boost and 6 LDO V-
Regs.
56-pin QFN,(8 x 8 x 0.85
mm)Exposed pad
ProductionEVB
PRGM
PF
Coincell charger, OTP memory, I2C bus, 4 Buck, 1 Boost and 6 LDO V-
Regs.
48-pin QFN,(7 x7 x 0.85
mm)Exposed pad
ProductionFRDM EVB
PRGM
PF
Coincell charger, I2C bus, 3 Buck, and 6 LDO V-Regs.
48-pin QFN,(7 x7 x 0.85
mm)Exposed pad
ProductionFRDM EVB
PRGM
Poher tures
Control and
StatusReporting
Protection Features
Packaging Status
SG200 (Selector Guide) (3Q2015) – 9
6408 Safe System Basis Chip with Buck and Boost DC/DC up to 1.5 A
Multiple switching and linear voltage regulators, built-in enhanced high speed CAN interface fulfills the ISO11898-2 and -5 standards.
CAN high-speed, dual
wires.
5.6 to 40 32 60 Safe Aproduc
4409 System Basis Chip with DC-DC and Multiple Switch-to-Ground Interface
Buck/Boost DC/DC and linear voltage reg-ulators. Single enhanced high speed CAN interface fulfills the ISO11898-2 and -5 standards) plus four LIN's compatible with specification 2.1 and SAEJ2602-2. Also contains 6 switch to ground inputs.
CAN high-speed, dual wires. LIN single wire
2.5 to 35 100 200 Multiplsourceup, 3.3MCU sWatchdtimer, Switchinputs,output output
wer Management — Embedded System Power Management Product Description Main Characteristics MCU Support Operating
Voltage (V)Protection Features
500 Power Management Integrated Circuit for QorlQ LS1 networking communications processors
Quad buck regulator with up to 4.5 A output and five user-programmable LDOs
QorlQ LS1 series
2.8 to 4.5 Thermal protection,
Undervoltage detection, V-Regs
current limitsPF0100 Power Management Integrated Circuit for i.MX6
SeriesHighly integrated, fully programmable PMIC with 4/ 6 buck regulators, 5.0 V boost regulator, 6 general purpose LDOs, 1 VSNVS LDO/switch and DDR Reference
i.MX 6 series 3.0 to 4.5 Thermal protection,
Undervoltage detection, V-Regs.
current limitsPF0200 12 Channel Configurable Power Management
Integrated CircuitHighly integrated, fully programmable PMIC with 3/ 4 buck regulators, 5.0 V boost regulator, 6 general purpose LDOs, 1 VSNVS LDO/switch and DDR Reference
i.MX 6 series 2.8 to 4.5 Thermal protection,
Undervoltage detection, V-Regs.
current limits3000 Power Management Integrated Circuit for i.MX6
and i.MX7 FamiliesHighly integrated, fully programmable PMIC with 3/4 buck regulators, 5.0V boost regulator, 6 LDOs, 1 VSNVS LDO/switch and DDR reference
i.MX6 series and i.MX7
series
2.8 to 4.5 or 3.7 to 5.5 Thermal protection,
undervoltage detection, V-Regs.
current limits3001 Power Management Integrated Circuit for i.MX6
and i.MX7 Families in “always ON” applicationsHighly integrated, fully programmable PMIC with 3 buck regulators, 6 LDOs and 1 VSNVS LDO/switch
i.MX6 series and i.MX7
series
2.8 V to 4.5 V or 3.7 V to 5.5 V
Thermal protection,
undervoltage detection, V-Regs.
current limits
wer Management — System Basis Chips (SBC) CAN Bus and LIN Connectivity Transceivers (continued)Product Description Main Characteristics Bus Type
and Standard
OperatingVoltage
(V)
CurrentLimitation Standby
(A) Typ. Max.
OtFea
Trrol Operating
Voltage (V)Packaging Status
MC llel 4.5 to 36 32-pin SOICWExposed Pad
ProductionEVB
Ref. DesignMC I,
llel6.0 to 18 48-pin LQFP,
Exposed PadProduction
EVB
MC I,llel
6.0 to 18 48-pin LQFP,Exposed Pad
ProductionEVB
Tril Additional
InformationPackaging Status
MM 2 k , ESCI, it ADC, imer, erator
High voltage wake-up Inputs, Selectable gain, I-sense, Battery Voltage Sense. Timing, Normal/Stop/Sleep mode control, Hall Supply of 18 V/30 mA
48-pin LQFPExposed Pad
Production
MM s 6 KB emory 8 KB.
ses error CC) on parate
for storage, gital nd a ted PLL.
Analog functions consists of three integrated low-side drivers, one pre-driver, a +5.0 V, voltage pre-regulator, an MCU watchdog circuit, an ISO 9141 K-Line interface, and a parallel interface for MCU communication.
100 lead LQFP,Exposed Pad
ProductionRef. Design
MM has 8 KB d flash 8 KB or S family
same the S12P ror CC) on parate
for storage, gital nd a ted PLL.
Analog functions consists of three integrated low-side drivers, one pre-driver, a +5.0 V, voltage pre-regulator, an MCU watchdog circuit, an ISO 9141 K-Line interface, and a parallel interface for MCU communication.
100 lead LQFP,Exposed Pad
ProductionRef. Design
SG200 (Selector Guide) (3Q2015) – 10
ansceivers — Engine Management Product Description Main Characteristics Peak Current Limit
(A)RDS(on) (m)
Cont
33812 Single-cylinder Engine Control Integrated Circuit Engine control power IC, with three low-side drivers, one pre-driver, +5.0 V pre-regulator, ISO 9141 physical interface and MCU watchdog circuit.
2 @ 6.01 @ 2.0
2 @ 2001 @ 1000
Para
33813 One-cylinder Small Engine Control IC Engine control analog power IC intended for one cylinder motorcycle and other small engine control applications. Includes ISO 9141 communication interface.
1 @ 3.01 @ 6.02 @ 2.41 @ .110
1 @ 4001 @ 300
2 @ 15001 @ 20000
SPPara
33814 Two-cylinder Small Engine Control IC Engine control analog power IC intended for two cylinder motorcycle and other small engine control applications. Includes ISO 9141 communication interface.
2 @ 3.01 @ 6.02 @ 2.41 @ .110
2 @ 4001 @ 300
2 @ 15001 @ 20000
SPPara
ansceivers — Intelligent Distributed Controllers (IDC) Product Description Main Characteristics MCU Reference MCU Deta
912_634 Integrated S12 MagniV Based Relay Drivers with LIN Cascaded dual Voltage Regulator 2.5 V/50 mA and 5.0 V/80 mA, LIN Physical Layer with Selectable Slew rates, Window Watchdog with Selectable Dual high-side and Dual Low-side Switches with Embedded S12 MCU + Power + LIN
16-bit MCU S12 16-bit Core, 3Flash, 2.0 kB RAMMulti channel 10-b16-bit 4 Channel TInternal Clock Gen
912_P812 S12P MCU and Multifunctional Ignition and Injector Driver System In Package (SiP)
An engine control IC combining an MCU (S12P) and analog control die (MC33812) intended for motorcycle and other single/dual cylinder small engine control applications.
16-bit MCU S12P
The MCU S12P haRAM, and flash msize of 96 KB or 12The S12P family ucorrection code (Eflash memory, a sedata-flash modulediagnostic or data a fast analog-to-diconverter (ATD), afrequency modula
912_S812 S12XS MCU and Multifunctional Ignition and Injector Driver System In Package (SiP)
An engine control IC combining an MCU (S12XS) and analog control die (MC33812) intended for motorcycle and other single/dual cylinder small engine control applications.
16-bit MCU S12XS
The MCU S12XS or 12 KB RAM, anmemory size of 12256 KB. The S12Xuses many of the features found on family, including ercorrection code (Eflash memory, a sedata-flash modulediagnostic or data a fast analog-to-diconverter (ATD), afrequency modula
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PACKAGING
TAPE AND REELDESIGNATOR
INDICATOR
SG200 (Selector Guide) (3Q2015) – 11
oduct Numbering — Analog Auto and Power Management Devices
gacy product numbering is available in ANALOGPN on www.freescale.com
SCPC
mm
33 - Automotive 34 - Industrial
xxxx v
32 - Consumer
35 - Medical/Military
FF
0000(default b
- Qualified Standard- Custom Device- Prototype Device
rMC
MCPRODUCT CATEGORY
MARKET
FAMILY/ROADMAP
CORE
SILICON REVISION
VARIATI(Defined by BU)
(default blank)
CM - Communication
BC - Battery Chargers
MM - Millimeter wave
PF - Power FusionSA - Safety AirbagSB - Safety Braking
VR - Voltage RegulatorXS - eXtreme switch
FS - System Basis Chips
CD - Configurable Detection
HB - H-Bridge
AR - Alternator Regulators
GD - Gate Drivers
BM - Battery Management
MR - MMIC Radar
SD - Smoke Detection
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SG200 Q3 2015, Rev. 8.08/2015
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