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SCIPP R&D on the International Linear Collider Detector
SCIPP ReviewNovember 29, 2005
Presenter: Bruce Schumm
R&D Activity is increasing, with studies now on four fronts:
Physics and machine studies for e-e- running
Detector resolution standards from physics simulation
Reconstruction capabilities of all-silicon tracking
Hardware proof-of-principle of low-mass silicon tracking
Current involvements (all very much part time)
3 senior physicists, 1 post-doc (looking for a second), 4 undergraduate thesis students, 1 Engineer, 2 technical staff, one bored spouse of a Silicon Valley engineer.
International Linear Collider: Activity on the e-e- Front
Clem Heusch is the SCIPP participant in e-e- studies
• Leading international effort in the use and application of e-e- beams at the ILC
• Continuing series of workshops hosted by SCIPP; proceedings published in World Scientific
• Heusch is a member of ILC Subcommittee on International Collaboration.
Detector Resolution Standards from Selectron Production
Participants:
Senior Physicist
Bruce Schumm
Undergraduate Thesis Students
Sharon Gerbode, Heath Holguin, Troy Lau*, Paul Moser, Adam Perlstein, Joseph Rose, Matthew Vegas
Community Member (on hold before Grad School)
Ayelet Lorberbaum
*Recipient of two Undergraduate Research Awards; grad school at U. Michigan.
Original Motivation
To explore the effects of limited detector resolution on our ability to measure SUSY parameters in the forward (|
cos()| > .8) region.
SiD Tracker
selectrons
LSP
SPS 1 Spectroscopy:
At Ecm = 1Tev, selectrons and neutralino are
light.
Beam/Brehm:√smin=1 √smax=1000 = .29sz = .11 (mm)
Energy Distribution
0
50
100
150
200
250
300
350
400
450
0 7 14
22
29
36
43
50
58
65
72
79
86
94
101
108
115
122
130
137
144
151
158
166
173
180
187
194
202
209
216
223
230
238
245
252
259
266
274
281
288
Energy GeV
Co
un
ts
• sample electron energy distribution Mselectron = 143.112 (SPS1A)
Lower Endpoint
Upper Endpoint
Electron energy distributionwith beam/bremm/ISR (.16%). No detector effects or beam energy spread.
-0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.91,000
2,000
3,000
4,000
5,000
6,000
7,000
8,000
9,000
10,000
11,000
12,000
13,000
14,000
15,000
16,000
SUSY: Particle cos(theta) (no cuts)
SPS1A at 1 TeVSelectrons vs. cos()
Electrons vs. cos()
Roughly ½ of statistics above |cos()| of 0.8,
but…
The spectrum is weighted towards higher energy at high |cos()|, so there’s more information in the forward region than one might expect.
Error for COSTHETA Ranges
0.0380.046
0.086
0.0730.078
0.194
0.080
0.0900.097
0.1060.111
0.200
0.000
0.050
0.100
0.150
0.200
0.250
-0.01% 0.19% 0.39% 0.59% 0.79% 0.99% 1.19%Beamspread
Err
or
PERFECT 0-1
PERFECT 0-.8
SDMAR01 0-1
SDMAR01 0-.8
Determine the selectron mass accuracy in both the central (0 < |cos| < 1) and full (0 < |cos| < 1) region
Ongoing work:
Fitting simulaneously for selectron and gaugino (0) masses at Ecm = 500 GeV
This is an ILC Physics benchmark process
(Lorberbaum, Schumm, Vegas)
Simulation of SiD Tracking System (and SiD variants)
Participants:
Senior Physicist
Bruce Schumm
Recent Graduate Students
Christian Flacco, Michael Young*
Undergraduate Thesis Student
Eric Wallace
*Supported primarily through department (TA) funds; SLAC paid for ½ of his support this summer.
Three areas of work:
Fast MC Simulation
Billior-based LCDTRK.f (B. Schumm) provides covariance matrices for fast MC simulation and resolution plots.
Pulse Development Simulation
Provides simulation of pulse development and amplification. Will soon be incorporated in international simulation framework (awaiting “hook” from Norman Graf at SLAC)
SiD Tracking Capabilities
Explore tracking performance of SiD tracker and variants
Simulation of SiD Tracking System, continued
LCDTRK.f comparison of SiD options with TESLA (LDC) design, from Snowmass 2005
Pulse Development SimulationLong Shaping-Time Limit: strip sees signal if and only if hole is col- lected onto strip (no electrostatic coupling to neighboring strips)Charge Deposition: Landau distribution (SSSimSide; Gerry Lynch LBNL) in ~20 independent layers through thickness of deviceGeometry: Variable strip pitch, sensor thickness, orientation (2 dimen-sions) and track impact parameter
Lorentz Angle: 18 mrad per Tesla (holes), from measurements
Carrier Diffusion
)(21
exp),(0
2
ttDr
trPq
Hole diffusion distribution given by
Offest t0 reflects instantaneous expansion of hole clouddue to space-charge repulsion. Diffusion constant given by
hq qkT
D
Reference: E. Belau et al., NIM 214, p253 (1983)
sec65.00 nt
h = hole mobility
Result: S/N for 167cm Ladder
Electronics SimulationDetector Noise:
From SPICE simulation, normalized to bench tests with GLAST electronicsAnalog Measurement:
Employs time-over-threshold with variable clock speed; lookup table provides conversions back into analog pulse height (as for actual data)
RMS
Gaussian Fit
Detector Resolution (units of 10m)Essential tool for design of front-end ASIC
Non-normal incidence
Also need to understand performance as a function of various parameters, e.g., angle at entrance to the detector (identify issues for test-beam running)
Pattern Recognition Capabilities of an All-Silicon Central Tracker
Can one do pattern recognition with only five central tracking layers?
Might more layers improve performance to an extent that justifies the extra material?
SiD Tracker
Current code: Nick Sinev, U. Oregon
EVENT/TRACK SELECTION
Choose qqbar events at Ecm= 500 GeV (dense jet cores); Pan/Pythia and GEANT4 generation
Choose events/tracks that should be easily recon-structed (tracks curl up below p= 1 GeV):
Event Selection
|costhrust| < 0.5
Thrust Mag > 0.94
Track Selection
|costrack| < 0.5
p > 5 GeV/c
EFFICIENCIES FOR QQBAR EVENTS
Doesn’t look that spectacular; what might be going on here?
Of course! The requirement of a VXD stub means that you miss anything that originates beyond r ~ 3cm. This
is about 5% of all tracks.
With VXDBasedReco, we won’t see a difference between 5 and 8 layer tracking.
BAD TRACK FITS AND EFFICIENCY
TRACK PARAMETER PERFORMANCE
1. Compare width of Gaussian fit to residuals with two different estimates:
• Error from square root of appropriate diagonal error matrix element
• Error from Billior calculation (LCDTRK program)
2. Only tracks with all DOF (5 VTX and 5 CT layers) are considered.
3. Only gaussian smearing is used, since this is what is assumed for the two estimators.
Qqbar sample extends out to ~100 GeV; use +- sample to get higher energy (200-250 GeV) bin.
CURVATURE ERROR vs. CURVATURE
Standard (Original) Code
CURVATURE ERROR vs. CURVATURE
“NEW” CODE WITH MODIFIED FITTER
RESULTS FOR (LOWEST BIN)
Residuals (Gaussian smear): = 3.40x10-7
Error Matrix: = 3.12x10-7
LCDTRK: = 3.26x10-7
Actual momentum resolution is about 9% worse than LCDTRK expectation
Residuals (realistic CCD): = 3.29x10-7
Apparently, “realistic” CCD resolution is better than assumed value of 5m
Getting close to ramped-up again with senior thesis student Eric Wallace.
Port our code into new simulation framework (making forward progress!)
Incorporate realistic pulse-development simulation (reconstruction efficiency in jet core) when ready
Validate “ported” version of code.
Combine with new stand-alone central tracker code (Tim Nelson, SLAC) and optimize.
Explore different tracker configurations (8 layers).
Simulation Study Goals
Faculty/Senior
Alex GrilloHartmut Sadrozinski
Bruce SchummAbe Seiden
Post-Docs
[Gavin Nesom*]Jurgen
Kroseberg
Students
Michael YoungKunal Arya
(Com-puter Eng.
The SCIPP/UCSC ILC HARDWARE GROUP
Lead Engineer: Ned Spencer
Technical Staff: Max Wilder, Forest Martinez-McKinney
*Recently lured away by the sirens of Silicon Valley
The Gossamer Tracker
Ideas:• Low noise readout Long ladders substantially limit electronics readout and support (alternatively, improved res-olution for shorter ladders)• Thin inner detector layers• Exploit duty cycle eliminate need for active cooling Competitive with gaseous
track-ing over full range of momentaAlso: forward region…
THE LSTFE-2 CHIP
Long shaping-time front end suppresses 1/f noise, allowing for long-ladder readout
Power cycling should reduce IR heating by close to x100
Analog measurement via time-over-threshold (TOT) from low-threshold “readout” comparator.
Redesigned relative to LSTFE-1 to accommodate long pulse train and exploit more relaxed (5 Hz) duty cycle.
Submitted to TSMC 0.25m mixed-signal RF process; received August 11 (5 weeks late)
3 s shaping time; analog readout it Time-Over-Thres-hold with 400 nsec clock
1/4 mip
1 mip
128 mip
Operating point threshold
Readout threshold
RMS
Gaussian Fit
Efficiency and Occupancy as a function of high threshold
Resolution as a function of low threshold
SIMULATED PERFORMANCE FOR 167cm LADDER
1 mip
Expected analog gain of 140 mV/fC confirmed
Transition to log-arithmic response (TOT) at ~ 1.5 mip
INITIAL RESULTS
DIGITAL ARCHITECTURE: FPGADEVELOPMENT
Digital logic should perform basic zero suppression (intrinsic data rate for entire tracker would be approximately 50 GHz), but must retain nearest-neighbor information for accurate centroid.
Status of Back-End Architecture Development
• First-pass digital strategy worked out
• FPGA code developed for 8-channel system
• Simulated data stream (including noise and detector background) injected and processed in simulation
• Data rates estimated
FIF
O (L
eadin
g and
trailin
g transition
s)Low Comparator Leading-Edge-Enable Domain
Li
Hi
Hi+4
Hi+1
Hi+2
Hi+3
Hi+5
Hi+6
Li+1
Li+2
Li+3
Li+4
Li+5
Li+6
Proposed LSTFE Back-End Architecture
Clock Period = 400 nsec
EventTime
8:1 Multi-
plexing (clock = 50 ns)
Master F
IFO
Per 128 Channel Chip:
1 Master FIFO reads out 32 local
FIFO’s
Store in Master FIFO essentially
complete by end of ~1ms beam spill
Controller
FIFO
FIFO
FIFO
FIFO
FIFO
FIFO
Proposed LSTFE Back-End Architecture (cont’d)
DIGITAL ARCHITECTURE VERIFICATION
ModelSim package permits realistic simulation of FPGA code (for now, up to signal propagation delay)
Simulate detector background and noise rates for 500 GeV running, as a function of read-out threshold.
Per 128 channel chip ~ 7 kbit per spill 35 kbit/second
For entire long shaping-time tracker ~ 0.5 GHz data rate (x100 data rate suppression)
NominalReadoutThreshold
LONG LADDER CONSTRUCTION
SUMMARY
Progress on key fronts:
• Front-end electronics developmentLSTFE-2 chip (cold-rf optimization) designed and testing underway
• Digital architectureProposed back-end architecture developed and verified; raw data rates acceptable (0.5 GHz)
• Ladder construction underway
Substantial work remains in all these areas; working towards testbeam run in late 2006