RICH UPGRADE PROJECT STATUS REPORT 09-06-2015 @CERN Alessandro Petrolini Dipartimento di Fisica dell’Università di Genova and INFN on behalf of the RICH

RICH UPGRADE PROJECTSTATUS REPORT

09-06-2015 @CERN

Alessandro PetroliniDipartimento di Fisica dell’Università di Genova

and INFN

on behalf of the RICH group

2

OutlineA necessarily incomplete and biased selection of topics.

Common components to RICH1 and RICH2: MAPMT, BaseBoard, CLARO/FEB, BackBoard, MagneticShield

(MS),+ case …ElementaryCell (EC);

EC + PDMDB+ column structure … PhotoDetectorModule (PDM).

PhotoDetectorAssembly (PDA) Mechanics/Thermal engineering: RICH2, well advanced design; RICH1, working hard, more challenging design

(constraints). HV, LV, signal; grounding and shielding. Irradiation test program. QA. Test Beam.

09-06-2015 @CERNAlessandro Petrolini

Dipartimento di Fisica UNIGE and INFN.

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The photo-sensors: MAPMT

Hamamatsu R11265 (one inch, 64 px): RICH1 AND RICH2; “Small PMT”.

Hamamatsu R12699 (two inch, 64 px): RICH2 ONLY; “Large PMT”.



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R11265 characterization

Several devices were tested.All devices were able to detect single photons in almost all pixels.



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R11265 characterization

Typical gain uniformity: 2.5÷3.5 (pix to pix and tube to tube).

Low dark current rate: ∼ 60 Hz/cm2. Low cross-talk amplitude: ∼ 5 % with a fast bipolar

shape. Effects of magnetic field recovered by a magnetic

shield. According to the manufacturer the gain variation

strongly depends on the thickness of the cesium layer grown on the dynodes surface (a parameter hard to keep under control during the production). Hard to define a typical device behavior (both

positive and negative gain variation observed: ΔG ≅ ∓20% after 3000 h).

Aging data from Hamamatsu are ok for us.



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MaPMT R12699 (H12700)

To be used in the outer part of the RICH2. Four devices have been tested so far:

2 tubes equipped with the embedded socked: H12700;

2 tubes without socket and biased though a custom made voltage divider (standard voltage ratio): R12699.

It is being used at CBM RICH DETECTOR, FAIR lab in Darmstadt.



Feature R12699

Geometricaldimension 52×52 mm2

Photocathode minimum active

area48.5×48.5 mm2

Number of pixel and dimension 64 / 6×6 mm2

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The CLARO chipfast single photon counting with PMT





The CLARO chip

0.35 µm CMOS technology from ams. Rad tolerant up to ≈ 1 MRad (10 kGy),

≈ 1013 cm-2 1-MeV equivalent neutrons. Thresholds ranges from 30 ke- to 15 Me-. ≈ 1 mW/channel power consumption. < 25 ns recovery time. 8 channels per chip.

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CLARO8v2 – design

Aiming to build the best detector possible, within the constraints, a new version of the chip, CLARO8v2, was submitted in April.

Improvements with respect to the previous versions: improved channel-to-channel matching; larger (6x) test capacitors to inject test signals up

to 4 Me- with 1 V test signals; adjusted attenuation settings:

from 1, 1/4, 1/7, 1/10 to 1, 1/2, 1/4, 1/8; configuration register redesigned for compatibility

with rad-hard cells; power-on reset to switch on the chip in a known

state; additional measures to enhance yield.



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CLARO8v2 – channel matching



CLARO8v0 CLARO8v1 CLARO8v2

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FEB housing 8 CLARO chips

New FEB and BackBoard have been designed to be compatible with the changes of the CLARO8v2.

They are still compatible with previous versions of the CLARO and with the existing data acquisition hardware for beam test.

A very dense board…



12

A partially assembled EC



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BackBoard Every PCB is also

a structural element and part of the passive cooling system.

Jumper between signal ground and chassis Metallization of the mounting holes. Creation of copper filler areas. Improvements to electrical design.



14

EC (no MS) exploded view



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EC front-view (no MS)



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EC back-view (no MS)



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Behavior of the R11265 MAPMTin magnetic fields



Efficiency: number of events for a given B-field strength normalized to the number of events at zero B-field.

Efficiency curves averaged over all pixels of the R11265 and the R7600 as a function of the magnetic field applied in both transverse directions (x and y) and in the longitudinal direction (z).

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Magnetic shield



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Behavior of the R11265 MAPMTin magnetic fields with magnetic

shield



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MS prototypes made at CERNpreliminary results

Longitudinal B field:similar performance, efficiency≥ 90%;

Transverse B field:slightly better performance of full shield, efficiency≥ 95%.



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PDMDBDigital Electronic Board for a PDM

The limited number of sample components is not enough to make one fully-assembled PDMDB. Aim for a partially-assembled module modules

using DCDC, GBTX, VTTX, VTRX & GBT-SCA samples.

Design & layout is underway: motherboard with Kintex7; two different plugins, ECS & DAQ; motherboard could be made with production

PDMDB geometry: it would allow mechanical and thermal studies.

May need to replace the PDMDB due to radiation damage, after a certain number of years of operation.

Using sub-modules might be a benefit for the production.



227

RICH2 thermo/mechanics

Structure composed by a cooled aluminum structural bar.

Support for harness coupled to cold bar.



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RICH2 column first prototypesAW5083 cast aluminum alloy plate



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Housing of the EC and PDMDB



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Overall dissipation per EC: 15 W/EC (total). Cooling of CLARO and BaseBoard depends on the

conductivity of PCB and connectors. Conductivity of connectors?

A factor 1000 between the conductivities of Cu and FR4: small quantities of copper changes dramatically the expected conductivity and thermal simulation results.

Neglected: contact resistances, convection, irradiation…

Thermal Conduction simulation



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Both ducts with cylindrical inserts to leave 1 mm thick anularx-section...

Two ducts, 8 and 18 mm diam... Larger duct quite inefficient ..

Very preliminary CFD simulations(duct to coolant thermal exchange)

To reduce gradient 2 or more ducts shall be fluxed in opposite directions.

Large ducts: low speed and coolant stratification:inefficient exchange.

Ducts cross section to be modified to reduce stratification and increase exchange coefficient (e.g. inserts).



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RICH2 PDA layout



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Converging on a RICH1engineering design

Large boost in the last months, regular meetings. The intention is to design the RICH1 photon detector

region to allow an emergency intervention in a short technical stop of 5÷7 days (e.g. to replace EC).

Optical design finalized (i.e. fine tuned) via iterations taking into account a realistic engineering design.

Position of the photo-detector plane: now closer to beam line.

Mirror radius of curvature adjusted (3800 mm 3650 mm).

Quartz window position: at around its position in current RICH1.

The iron shielding box will be shaved by around ~70 mm (with gas enclosure tapered from 30 mm to 10 mm).

Converging on an open geometry for MAPMT housing. Can remove about 20 mm (10mm) from the top

(bottom) of the flat mirrors without any loss.



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Re-Using RICH2 components

RICH1 will inherit as much of the RICH2 design as possible.



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One Option



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Current option



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Patch Panel End



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Cooling system end



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Column insertion



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RICH1 engineeringsummary status

Also good progress on the development of the gas enclosure, photon funnel, quartz window, exit window, mirrors and mounts.

Things are progressing quite nicely, although no room for complacency.

EDRs still on schedule for the end of the year.



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SYSTEM: grounding/shielding Started investigating closely grounding and shielding

issues.

HV and signal are coupled.

HV and LV couple different EC/PDM.

Kick-off meeting sponsored by Ken with a CERN G/S expert (Georges Blanchot).

Analyzed PDA at system level and decided architecture aiming at minimizing EMI at design level.

The required improvements have been implemented into the design.



Past irradiation tests CLARO-CMOS chip (4 channels prototype):

23 MeV neutrons (Louvain); X-rays (50 kV tube, Legnaro); 60 MeV protons (Krakow).

CLARO8v0 chip: 28 MeV protons (Legnaro).

Hamamatsu UV-glass and borosilicate windows: 28 MeV protons (Legnaro).

BaseBoard and HV cables: CHARM facility (CERN).

CLARO8v1 chip: Ions (Louvain and Legnaro); 28 MeV protons (Legnaro).

MAROC3 chip 13 MeV protons and X-rays (Bucharest).



Future irradiation tests

CLARO8v2 (SEE and total ionizing dose). PDMDB (test of FPGA +memory, radiation tolerance). MAPMT (degradation of QE, gain, uniformity; unfold

window transmittance). Other EC single components. Complete PDM (EC + PDMDB). Other thermo/mechanical and optical components.



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QA workshop in Edinburgh (april 2015)

Comprehensive review of Quality Assurance (QA): photo-sensors (MAPMT); CLARO chip; FEB & CLARO; full EC; data-bases, logistics, integration, commissioning,

… Emphasis on discussions:

schedules; procedural and technical solutions; manpower….

Outcome: agreed plans: all players are pulling in the same

direction!



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What will be tested MAPMT: full characterization: tube & pixel gain (HV) (at

low and high illumination rate), dark counts, peak-to-valley ratio, signal loss, cross-talk, relative light yield (for some tubes: QE).

CLARO: currents, configure, readback, test pulse, charge injection.

FEB: s-curves for test pulse and charge injection (yielding thresholds and offsets).

EC: threshold scans with constant pulsed illumination at nominal HV (yielding optimum attenuation/threshold for each pixel).

Column functionality tests: communication and configuration fully functional, dark counts, signal from illumination at nominal HV.

Commissioning: initial configuration from QA results, HV scans with

dark counts and illumination, threshold/attenuation scans with target HV;

refinement of configuration.



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Workflow / Logistics

shipments: by industry

electronic components

Photon Detectors

no shipment needed

ECs

CERN site to pit

LH

Cb

QA

centr

es

CE

RN

Ind

ust

ry

R11265 & R12669production

CLARO chipproduction

FEBproduction

Base Boardproduction

EC mechanicsproduction

Ferrara Milano Krakow

CERN

LHCb pit

EC Assembly EC Assembly

EC QA EC QA

FEB QA

Hamamatsu ? ? ??

m-metal Assembly

Commissioning

Column Functionality Test

Edinburgh Padova

Photon Detector QA Photon Detector QA CLARO QA

Genova

FEB QA

CLARO QA*

FEB QA BB QA

CLARO QA mech QA?

EC Assembly:2x2 R112651x1 H12699

* = outsourced

EC Mounting on Columns

+ Digital Boards

Cambridge

+ m-metal

CERN?

DB QA

Back Boardproduction

?

BB QA



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Column Assembly and Commissioning



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Test-Beam 2014 An easy and robust concept was

developed. Cherenkov light was immediately

observed. We learnt many things, but still a

lot to learn… A paper is being written.



At first the light is totally internal reflected

Reflective layer on the spherical surface

Absorber layer to choose the photons created in 1 cm of material.

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Photo of one TB module.



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Defining proceduresof threshold scan



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RICH testbeam 2015

Follow the same concept as 2014. Main objectives:

Test CLARO8v2 Reach lower threshold

Understand better detection efficiency Test a bigger system

More/full elementary cells Test under different loads/temperatures Test prototype mechanics?

If time allows: Test with gas radiator.



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New full circular lens



A few materials were investigated for lenses: Glass, Quartz, LiF, CaF2; different sizes and radiuses.

Although with some materials a better resolution can be achieved, the dominant part is always the pixel size.

Borosilicate glass is cheap and readily available.

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First concept



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RICH upgrade status summary

Tests of both types of MAPMT are continuing (R11265 and R12699). BaseBoard for MAPMT ready for pre-production; case in pre-

production. CLARO8v2.0 submitted beginning of April; back mid-August. FEB and BackBoard design finalized. Last adjustments to all EC components, following EDR and TB. Study/definition of grounding/shielding scheme (LV, HV, Signal,

safety…). Design of components for the low-occupancy parts of RICH2

(R12699) started. Prototypes of column thermo/mechanics are ready. Cooling studies/design started. RICH1 challenging engineering is progressing fast; optical layout

fine-tuned. Irradiation program on-going. QA and tests facilities sorted out; labs are setting-up. Paper on 2014 TB 2014 is being written; preparing for the test

beams of 2015. Inventory/Bookkeeping/Connectivity DB is being built. Infrastructure Document for Technical Coordination being finalized. Order for MAPMT and common components will soon go out.



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The End

Good progress all over the project.

Schedule and Milestones are being tuned, in agreement and via negotiations with the management, to also take into account external (varying) schedules.



Documents

RICH UPGRADE PROJECT STATUS REPORT 09-06-2015 @CERN Alessandro Petrolini Dipartimento di Fisica dell’Università di Genova and INFN on behalf of the RICH