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©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
RF Front-EndModule Comparison 2021 – Vol. 2 –Focus on 5G ChipsetTechnical and cost overview of the evolution of radio frequency front-end module technologies integrated in 5G mmWave and Sub-6 GHz Phones in 2020.SPR21530 - RF report by Stéphane ElisabethApril 2021 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 2
Table of Contents
Overview / Introduction 4o Executive Summaryo Key Take Awayo Reverse Costing Methodology
Company Profile 11o Apple, Samsung, Huawei, LG, Lenovo, Oppo, OnePlus, Vivo, Xiaomi,
RealMe, Meizu, Sharp, ZTE/nubiao Smartphones Teardown:
iPhone 12 Pro, Galaxy Note20 Ultra 5G, Mate 40 Pro, V60 ThinQ, Edge+, X50 Pro 5G, 8 pro 5G, Find X2 Pro, Mi 10 Ultra 5G, X50 Pro, Aquos R, Red magic 5G, 17
o 5G Phones Comparison: Low-End, Mid-End, High-End, Premiumo Preferred band 5G and 4G in 2020
Physical Analysis Summary 50
o Summary of the analyzed RF components
o Comparative Analysis:Module in RF Area, Pacakging Type, Design Win, Main Supplier,
Function, OEMs main Supplier Ranking
Physical Comparison 70
o Area Distribution per Supplier & Function
o Area Distribution per Supplier & Function Evolution
o Die Design Win in Number & Area
o Die Distribution per Function
o Die Distribution per Function Evolution
o Filter Distribution per Smartphone: Technology and Substrate
o PA/LNA/Switch Distribution per Smartphone: Technology and Substrate
o Material Substrate Distribution per Smartphone
Cost Comparison 89
o Chipset Cost per Smartphones
o Cost Distribution per Supplier & Function
o Cost Distribution per Supplier & Function Evolution
Market Analysis 95
o RFFE & Connectivity Market Ecosystem & Forecast
o Technology Landscape
Physical Analysis 99o Baseband Physical Analysis 101
o Qualcomm Analysis – SDR865 and SMR526✓ Package View & Dimensions✓ Die View And Dimensions✓ Die Main Block IDs
o HiSilicon Analysis – Hi6365o Mediatek Analysis – MT6190Wo Samsung Analysis – SHANNON5510o SoC Physical and Cost Comparison
o 5G Sub-6 – PAMiD Front-End Analysis 142o B41/n41 Module Analysis
o Qorvo QM75005 vs. QM78041 vs. Qualcomm QPM6585 vs. Skyworks SKY58254
o UHB, MB/HB, n77/n78, n77/n78/n79 Module analysis
o 5G Sub-6 – PAM Front-End Analysis 188o n1/n3/n7/n28/n77/n78/n79, LB/UHB module Analysis
o 5G Sub-6 – Multiplexer Front-End Analysis 209o GPS/4G/5G module Analysis
o 5G Sub-6 – Diversity – Front-End Analysis 220o n77/n78/n79, UHB Module Analysis
o 5G Sub-6 & mmWave – Front-End Analysis 241o n260/n261/n79 Module Analysis
o 5G mmWave – Front-End Analysis 252o n260/n261 Module Analysis
Feedbacks 272
Related Analyses 273
SystemPlus Consulting services 275
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 3
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Executive Summary
Last year System Plus opened hundreds of Front-End Modules (FEMs) and components to provide an overview of the RadioFrequency (RF) FEM market in selected flagship smartphones. We gathered the information into four reports to track theevolution of this technology market.
This year, System Plus Consulting again offers technical and cost comparisons of smartphone RFFEMs. Every comparisonreport will focus on a specific subject. It can be a player’s evolution, a specific technology, or a comparison of flagshipdevices.
This, the second volume of 2021, provides insights into technology and cost data for FEMs and several components foundin 31 smartphones from the latest 5G phones. It provides a ranking of 5G phones and suppliers. It features acomprehensive overview of the RFFEM architectures on the market, comparing available smartphones from thesecompanies. It reveals material substrate trends and main used die functions, along with the different choices in integrationof communication technology. We even see millimeter wavelength (mmWave) signal support this year. Also, the reportreveals how companies are integrating 5G, from premium to low-end phones.
With teardowns of the smartphones, the main RF modules and components have been extracted and physically analyzed,from the output of the transceiver to the antenna. Packaging, sizes, and technologies are studied to provide a large panelof technical and economic choices and an overview of the market.
Every component has been analyzed to understand the manufacturing process cost.
Moreover, the report includes a technical and cost comparison of the modules. It also tries to explain the smartphonemakers’ choices and supplier tendencies.
Note:
Wifi, Bluetooth and UWB Module are not included in this report.
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 4
Overview / Introduction
Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier
and Smartphone Teardowno Apple, Samsung, Huawei,
Lenovo, LGo Oppo, Vivo, OnePlus, Xiaomio RealMe, Sharp, ZTE/nubia,
Meizu
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Company Profile – Apple, Samsung, Huawei and LG – 5G RF Major Supplier
Q1 2020 Q2 2020 Q3 2020 Q4 2020 Q4 2020
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 5
Overview / Introduction
Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier
and Smartphone Teardowno Apple, Samsung, Huawei,
Lenovo, LGo Oppo, Vivo, OnePlus, Xiaomio RealMe, Sharp, ZTE/nubia,
Meizu
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Samsung Smartphone Teardown – Samsung Galaxy Note20 Ultra 5G
Samsung Galaxy Note20 Ultra 5G Front View
©2021 by System Plus Consulting
Samsung Galaxy Note20 Ultra 5G Opened View
©2021 by System Plus ConsultingSamsung Galaxy Note20 Ultra 5G Main Board
©2021 by System Plus Consulting
PAMiD
Modem
Wifi FEM
UWB FEM
RxTx
IF IC
NFC IC
Footprint Area:~XX mm²
Total Area: ~XX mm²RFFE area: ~XX mm²
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 6
Overview / Introduction
Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier
and Smartphone Teardowno Apple, Samsung, Huawei,
Lenovo, LGo Oppo, Vivo, OnePlus, Xiaomio RealMe, Sharp, ZTE/nubia,
Meizu
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Huawei Smartphone Teardown – Huawei Mate 40 Pro
Footprint Area:~XX mm²
RFFE area: XX mm²
RF Components (Marking) Manufacturer Functional Network Band Area (mm²) Quantity RF Board Proportion Cost ($)
429# MURATA PAM 5G n77/n78 XX X Xx
HI6H12V100 HISILICON LNA/Switch XX X Xx
Jt xx MURATA Filter XX X Xx
KA00 KYOCERA Filter 4G B1/B3/B7 XX X Xx
QAxx TAIYO YUDEN Filter 4G B40 XX X Xx
QM12114 QORVO Switch XX X Xx
24 xx MURATA Filter 4G B39 XX X Xx
EP UNIDENTIFIED Switch XX X Xx
SN MAXSCEND Switch XX X Xx
QM11022A QORVO Switch XX X Xx
HI6H13V100B21 HISILICON LNA/Switch XX X Xx
QM12112 QORVO Switch XX X Xx
xx OJ MURATA Filter 4G B1/B3 XX X Xx
B8367 (85F) QUALCOMM Filter 4G B41 XX X Xx
BGS12P2L6 INFINEON TECHNOLOGIES Switch XX X Xx
SKY19249 SKYWORKS Tuner XX X Xx
QM13144 QORVO Tuner XX X Xx
HI6H11SV100 HISILICON LNA/Switch XX X Xx
QM77038 QORVO PAMiD 3G/4G/5G MB/HB XX X Xx
A 5P MURATA Multiplexer 4G B2 XX X Xx
QM77033 QORVO PAMiD 4G LB XX X Xx
B8538 (8AT) QUALCOMM Multiplexer 4G B28A XX X Xx
TC MAXSCEND Switch XX X Xx
SKY13699 SKYWORKS Switch XX X Xx
B8651 (8EB) QUALCOMM Multiplexer 4G B1 XX X Xx
Hi6D05V100 HISILICON PAMiD 4G XX X Xx
QDM2310 QUALCOMM Diversity XX X Xx
1C MURATA Filter 4G B12/B13 XX X Xx
B8369 (85H) QUALCOMM Filter XX X Xx
Hi6365V100 HISILICON RxTx 2G/3G/4G/5G XX X Xx
Total XX X Xx
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 7
Overview / Introduction
Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier
and Smartphone Teardowno Apple, Samsung, Huawei,
Lenovo, LGo Oppo, Vivo, OnePlus, Xiaomio RealMe, Sharp, ZTE/nubia,
Meizu
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Mid-End Phones – 5G Version
Mid-End Phone
Mid-End Phone
RF Components
(Marking)
Manufacturer Functional Network Band Area (mm²) Quantity RF Board
Proportion
Cost ($)
MXD8543S MAXSCEND Tuner XX X Xx
JJ MAXSCEND Switch XX X Xx
MXD8540X MAXSCEND Switch XX X Xx
Hi6D05V100 HISILICON PAMiD 4G XX X Xx
Hi6D51 HISILICON PAMiD 5G n77/n78/n79 XX X Xx
540# MURATA FEM XX X Xx
434# MURATA Diversity XX X Xx
HI6H12V100 HISILICON LNA/Switch XX X Xx
HI6H11SV100 HISILICON LNA/Switch XX X Xx
VC7365 VANCHIP PAM 2G XX X Xx
BGSX24MU16INFINEON
TECHNOLOGIESSwitch XX X Xx
TC MAXSCEND Switch XX X Xx
BGS14MPA9INFINEON
TECHNOLOGIESSwitch XX X Xx
BGS12WN6INFINEON
TECHNOLOGIESSwitch XX X Xx
BGS12P2L6INFINEON
TECHNOLOGIESSwitch XX X Xx
KA02 KYOCERA Multiplexer 4G B25/B66 XX X Xx
A 7E MURATA Multiplexer 4G B28B XX X Xx
A 8Z MURATA Multiplexer 4G B20 XX X Xx
A 7D MURATA Multiplexer 4G B28A XX X Xx
1C MURATA Filter 4G B12/B13 XX X Xx
7U xx MURATA Filter 4G B28 XX X Xx
XY MURATA Filter 4G B20 XX X Xx
A 5R MURATA Multiplexer 4G B7 XX X Xx
Jt xx MURATA Filter XX X Xx
KAA KYOCERA Filter 4G B41 XX X Xx
xx Ey MURATA Filter XX X Xx
175# TAIYO YUDEN Filter 4G B40 XX X Xx
HI6H13V100B21 HISILICON LNA/Switch XX X Xx
A 6N MURATA Multiplexer 4G B12 XX X Xx
MXD8533B MAXSCEND Tuner XX X Xx
Hi6365V100 HISILICON RxTx 2G/3G/4G/5G XX X Xx
Total XX X Xx
RF Components
(Marking)
Manufacturer Functional Network Band Area (mm²) Quantity RF Board
Proportion
Cost ($)
QM77040 QORVO PAMiD 3G/4G/5G MB/HB XX X Xx
SKY78191 SKYWORKS PAMiD 4G LB XX X Xx
QET5100 QUALCOMM ET XX X Xx
LFx WISOL Filter 4G B34 XX X Xx
QM11022 (1.5x1.1) QORVO Switch XX X Xx
WX UNIDENTIFIED Switch XX X Xx
SN MAXSCEND Switch XX X Xx
QLN5030 QUALCOMM LNA XX X Xx
MXD8643 (1.55x1.55) MAXSCEND Switch XX X Xx
MXD8643 (1.18x1.18) MAXSCEND Switch XX X Xx
QM12114 QORVO Switch XX X Xx
X6 MURATA Filter 4G B40 XX X Xx
xx Lt MURATA Filter 4G B39/B41 XX X Xx
4Hxx WISOL Filter 4G B1/B3 XX X Xx
QAT3518 QUALCOMM Tuner XX X Xx
Cr xx MURATA Filter 4G B41 XX X Xx
BGA5H1BN6INFINEON
TECHNOLOGIESLNA 4G HB XX X Xx
RF1630 QORVO Switch XX X Xx
QET6100 QUALCOMM ET XX X Xx
QDM2310 QUALCOMM Diversity XX X Xx
QPM6585 QUALCOMM PAMiD 5G n41 XX X Xx
QPM5677 QUALCOMM PAMiD 5G n77/n78 XX X Xx
QPM5679 QUALCOMM PAMiD 5G n79 XX X Xx
QDM5679 QUALCOMM Diversity 5G n79 XX X Xx
QDM5677 QUALCOMM Diversity 5G n77/n78 XX X Xx
MXD8540X MAXSCEND Switch XX X Xx
QM11024 QORVO Switch XX X Xx
XU MURATA Filter 4G B12/B17 XX X Xx
XY MURATA Filter 4G B20 XX X Xx
LTE3401H NXP LNA 4G MB/HB XX X Xx
PF753 QUALCOMM Tuner XX X Xx
SDR865 QUALCOMM RxTx 2G/3G/4G/5G XX X Xx
QAT3518 QUALCOMM Tuner XX X Xx
Total XX X Xx
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 8
Overview / Introduction
Company Profile & Supply Chain o OEMs Financial, RFFEM Supplier
and Smartphone Teardowno Apple, Samsung, Huawei,
Lenovo, LGo Oppo, Vivo, OnePlus, Xiaomio RealMe, Sharp, ZTE/nubia,
Meizu
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Phone Included in the database
Smartphone List Serie Generation Version Addon Availability # of Components Region 5G Support Modem Manuf. Modem Model Model Release
Apple iPhone 12 - - 23/10/2020 37 US Sub-6/mmWave Qualcomm X55M iPhone 12 Q4-2020
Apple iPhone 12 Mini - 13/11/2020 36 US Sub-6/mmWave Qualcomm X55M iPhone 12 Mini Q4-2020
Apple iPhone 12 Pro - 23/10/2020 39 US Sub-6/mmWave Qualcomm X55M iPhone 12 Pro Q4-2020
Apple iPhone 12 Pro Max 13/11/2020 37 US Sub-6/mmWave Qualcomm X55M iPhone 12 Pro Max Q4-2020
Samsung Galaxy Z Fold2 5G 19/09/2020 25 US Sub-6/mmWave Qualcomm X55M Galaxy Z Fold2 5G Q3-2020
Samsung Galaxy Note20 - 5G 06/08/2020 28 US Sub-6/mmWave Qualcomm X55M Galaxy Note20 5G Q3-2020
Samsung Galaxy Note20 Ultra 5G 22/08/2020 24 US Sub-6/mmWave Qualcomm X55M Galaxy Note20 Ultra 5G Q3-2020
Samsung Galaxy S20 - - 06/03/2020 18 Global Sub-6 Samsung S5T5123 Galaxy S20 Q1-2020
Samsung Galaxy S20 + 5G 06/03/2020 25 US Sub-6/mmWave Qualcomm X55M Galaxy S20+ 5G Q1-2020
Samsung Galaxy S20 Ultra 5G 06/03/2020 27 US Sub-6/mmWave Qualcomm X55M Galaxy S20 Ultra 5G Q1-2020
Vivo X50 Pro - - 05/03/2020 24 CN Sub-6 Qualcomm SM7250 X50 Pro Q1-2020
Vivo Nex 3s - 5G 10/03/2020 31 CN Sub-6 Qualcomm X55M Nex 3s 5G Q1-2020
Vivo X30 Pro - - 24/12/2019 22 CN Sub-6 Samsung S5E980 X30 Pro Q4-2019
Realme X50 Pro - 5G 05/03/2020 33 CN Sub-6 Qualcomm X55M X50 Pro 5G Q1-2020
Meizu 17 - - - 15/05/2020 17 CN Sub-6 Qualcomm X55M 17 Q2-2020
ZTE/Nubia Red Magic - - 5G 21/04/2020 20 Global Sub-6 Qualcomm X55M Nubia Red Magic 5G Q2-2020
Sharp Aquos R - 5G 09/04/2020 21 JP Sub-6 Qualcomm X55M Aquos R5G Q2-2020
Motorola Edge + - - 14/05/2020 23 US Sub-6/mmWave Qualcomm X55M Edge+ Q2-2020
Oppo Find X2 - 5G 08/05/2020 32 Global Sub-6 Qualcomm X55M Find X2 Q2-2020
Oppo Reno3 - - 5G 26/12/2019 19 CN Sub-6 Mediatek MT6885Z Reno3 5G Q4-2019
Oppo Reno3 Pro - 5G 26/12/2019 32 CN Sub-6 Qualcomm SM7250 Reno3 Pro 5G Q4-2019
LG V60 ThinQ - - 17/03/2020 18 US Sub-6 Qualcomm X55M V60 ThinQ Q1-2020
OnePlus 8 - - 5G 29/04/2020 16 US Sub-6/mmWave Qualcomm X55M 8 5G Q2-2020
Xiaomi Mi 10 Pro 5G 07/04/2020 29 Global Sub-6 Qualcomm X55M Mi 10 Pro 5G Q2-2020
Xiaomi Mi 10 Ultra - 17/08/2020 29 CN Sub-6 Qualcomm X55M Mi 10 Ultra Q4-2020
Xiaomi Redmi K30 - 5G 07/01/2020 23 CN Sub-6 Qualcomm SM7250 Redmi K30 5G Q1-2020
Huawei Nova 7 SE 5G 28/04/2020 31 CN Sub-6 HiSilicon Hi6290LV100 Nova 7 SE 5G Q2-2020
Huawei Mate Xs - - 26/03/2020 40 Global Sub-6 HiSilicon Hi3690V201 Mate Xs Q1-2020
Huawei P 40 Pro - 07/04/2020 42 Global Sub-6 HiSilicon Hi3690V201 P40 Pro Q2-2020
Huawei Mate 40 Pro - 23/10/2020 30 CN Sub-6 HiSilicon Kirin 9000 Mate 40 Pro Q4-2020
Huawei Mate 30 Pro 5G 18/10/2019 35 CN Sub-6 HiSilicon Hi3690V201 Mate 30 Pro 5G Q4-2019
Total 863
• All the statistical data presented after this slide is extract from a database including the above smartphones.• 31 5G smartphones has been torndown in 2020 featuring Sub-6 and mmWave compatibility. This broadband list of smartphone give an
overview on the market, technology and cost trend in 2020.
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summaryo Summary of the analyzed RF
componentso Comparative Analysis
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Manufacturer Model Packaging Function Network Band
QUALCOMM QTM525-501 MCM AiP 5G n260/n261
QUALCOMM QTM525-501BA MCM AiP 5G n260/n261
QUALCOMM QTM525-601BA MCM AiP 5G n260/n261
QUALCOMM QTM535-500 MCM AiP 5G n260/n261
QUALCOMM QTM535-500BA MCM AiP 5G n260/n261
MURATA 1RAU LG MCM AiP 5G n260/n261
USI 37U727 MCM AiP 5G n260/n261
Components Summary – Comparison View
Manufacturer Model Packaging Function Network Band
MURATA 1XR-484 LGA FEM 5G n260/n261
MURATA 583# DSMBGA FEM 5G n79
SKYWORKS SKY53807 DSBGA FEM 5G
Manufacturer Model Packaging Function Network Band
SKYWORKS SKY58242 BGA PAM 2G/5G
HISILICON Hi6D13V100 LGA PAM 5G LB
SKYWORKS SKY58255-11 LGA PAM 4G/5G UHB
SKYWORKS SKY58258 LGA PAM 4G/5G UHB
SKYWORKS SKY58245 DSBGA PAM 5G n77/n78
MURATA 429# LGA PAM 5G n77/n78
QUALCOMM QPA5581 LGA PAM 5G n1/n3/n7/n28
HISILICON Hi6D03V100 LGA PAM 5G n79
Manufacturer Model Packaging Function Network Band
MURATA C LGA Diversity 5G
QUALCOMM QDM4850 LGA Diversity 5G
QUALCOMM QDM5630 LGA Diversity 5G UHB
QUALCOMM QDM5677 LGA Diversity 5G n77/n78
QUALCOMM QDM5679 LGA Diversity 5G n79
QUALCOMM QDM5872 LGA Diversity 5G UHB
SKYWORKS SKY53728-11 LGA Diversity 5G UHB
Manufacturer Model Packaging Function Network Band
QORVO QM28017 LGA Multiplexer GPS/4G/5G
Manufacturer Model Packaging Function Network Band
QORVO QM75005 LGA PAMiD 5G n41
QORVO QM78041 LGA PAMiD 5G n41
QUALCOMM QPM6585 LGA PAMiD 5G n41
SKYWORKS SKY58254-11 LGA PAMiD 4G/5G B41/n41
QORVO QM78143 LGA PAMiD 5G UHB
QORVO QM77038 LGA PAMiD 3G/4G/5G MB/HB
QORVO QM77040 LGA PAMiD 3G/4G/5G MB/HB
QUALCOMM QPM5670 LGA PAMiD 4G/5G MB/HB
QORVO QM78200 LGA PAMiD 5G n77/n78
QORVO QM78078 LGA PAMiD 5G n77/n78
QUALCOMM QPM5677 LGA PAMiD 5G n77/n78
QORVO QM78202 LGA PAMiD 5G n77/n78/n79
HISILICON Hi6D51 LGA PAMiD 5G n77/n78/n79
QUALCOMM QPM5679 LGA PAMiD 5G n79
QUALCOMM QPM4650 LGA PAMiD 5G UHB
Manufacturer Model Packaging Function Network Band
HISILICON Hi6365V100 BGA RxTx 2G/3G/4G/5G
MEDIATEK MT6190W BGA RxTx 2G/3G/4G/5G CDMA/2G/3G/4G/5G
SAMSUNG SHANNON 5510 BGA RxTx 2G/3G/4G/5G
QUALCOMM SDR865 BGA RxTx 2G/3G/4G/5G
QUALCOMM SMR526 BGA RxTx 5G n260/n261
• These components' structure will be presented inthis report and compared.
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summaryo Summary of the analyzed RF
componentso Comparative Analysis
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Module in RF Front-End
Proportion of Module over RF Area©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summaryo Summary of the analyzed RF
componentso Comparative Analysis
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Components Summary – Module
Evolution of Module Packaging©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summaryo Summary of the analyzed RF
componentso Comparative Analysis
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Components Summary
Main OEMs’ Suppliers in RFFEM per area©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparisono Area Distribution per Supplier &
Functiono Die Design Win in Number &
Areao Die Distribution per Functiono Filter Distributiono PA/LNA/Switch Distributiono Material Substrate Distribution
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Area Distribution per Supplier
Area distribution per supplier©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparisono Area Distribution per Supplier &
Functiono Die Design Win in Number &
Areao Die Distribution per Functiono Filter Distributiono PA/LNA/Switch Distributiono Material Substrate Distribution
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Filter Distribution
Filter Die Area distribution per Type ©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparisono Area Distribution per Supplier &
Functiono Die Design Win in Number &
Areao Die Distribution per Functiono Filter Distributiono PA/LNA/Switch Distributiono Material Substrate Distribution
Cost Comparison
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Material Distribution per smartphone
Material Substrate area distribution©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparisono Cost Distribution per Supplier &
Function
Market Analysis
Physical Analysis
Feedbacks
Related Analyses
About System Plus
Cost Distribution per supplier
Cost distribution per supplier©2021 by System Plus Consulting
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Summaryo Baseband - Front-End Analysiso 5G Sub-6- Front-End Analysiso 5G Sub-6 & mmWave - Front-
End Analysiso 5G mmWave - Front-End
Analysis
Feedbacks
About System Plus
Package Views & Dimensions
Package Top View©2021 by System Plus Consulting
XX
mm
• Package: FCBGA XX-Balls
• Dimensions: XX x XX x XX mm
• Pitch: XX mm
XX mm
• Marking: <Logo HiSilicon>Hi6365GFCV100B10GHD76419171917-TW01
Package Side View©2021 by System Plus Consulting
Package Bottom View©2021 by System Plus Consulting
XX mm
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Summaryo Baseband - Front-End Analysiso 5G Sub-6- Front-End Analysiso 5G Sub-6 & mmWave - Front-
End Analysiso 5G mmWave - Front-End
Analysis
Feedbacks
About System Plus
Die Views & Dimensions
Die Overview – Optical View ©2021 by System Plus Consulting
XX
mm
• Die Area: XX mm²(XX x XX mm)
Die Marking – Optical View ©2021 by System Plus Consulting
XX mm
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
Physical Analysis o Summaryo Baseband - Front-End Analysiso 5G Sub-6- Front-End Analysiso 5G Sub-6 & mmWave - Front-
End Analysiso 5G mmWave - Front-End
Analysis
Feedbacks
About System Plus
RF Components Summary
AntennaAntenna
Antenna
Manufacturer Model Type Phone Model Module Cost
QorvoQM75005 LGA Vivo X30 Pro $XX
QM78041 LGA Samsung Galaxy Note20 5G $XX
Qualcomm QPM6585 LGA Oppo Reno3 Pro 5G $XX
Skyworks SKY58254-11 LGA Oppo Reno3 5G $XX
Antenna
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis Summary
Physical Comparison
Cost Comparison
Market Analysis
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©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 21
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• RF Front-End Module Comparison 2020 – Volume 4
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Smartphones 2021
• 5G’s Impact on RF Front-End and Connectivity for Cellphones 2020
By System Plus Consulting:• Consumer Track – Phone
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Reverse Costing® consists in disassembling a device or a system, in orderto identify its technology and determine its manufacturing processes andcost, using in-house models and tools.
©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 25
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©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 26
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©2021 by System Plus Consulting | SPR21530 – RF Front-End Module Comparison 2021 – Vol. 2 – Focus on 5G Chipset 27
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