REQUEST FOR PROPOSAL FOR HI-REL PCB WIRING, ASSEMBLY ... · RFP for PCB Wiring & Assembly of Electronics Packages for Hi-Rel GROUND Projects 5 4.0 FACILITY & MAN POWER REQUIREMENTS:

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RFP No : SAC/TRC/GND/02/JULY-16

REQUEST FOR PROPOSAL

FOR

HI-REL PCB WIRING, ASSEMBLY & PACKAGES

FOR

GROUND PROJECT

SPACE APPLICATIONS CENTRE AHMEDABAD – 380 015

RFP for PCB Wiring & Assembly of Electronics Packages for Hi-Rel GROUND Projects

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CONTENTS

PAGE

ABBREVIATIONS AND ACRONYMS

1.0 PART-I Technical Bid INTRODUCTION 4

2.0 SCOPE OF WORK 4

3.0 REFERENCE DOCUMENTS 4

4.0 FACILITY & MAN POWER REQUIREMENTS 5

5.0 WORK DETAILS 5

6.0 EXECUTION OF CONTRACT OPERATION 10

7.0 INPUT REQUIREMENTS OF PROPOSAL FROM

VENDOR

10

8.0 GENERAL REQUIREMENTS 11

9.0 COMPLIANCE STATEMENT 11

10.0 SCHEDULE & MILESTONES 11

11.0 TENURE OF WORK 11

12.0 SETTLEMENT OF DISPUTES 12

ANNEXURE–I to VI 15 to 35


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ABBREVIATIONS AND ACRONYMS

CCGA CERAMIC COLUMN GRID ARRAY

CD COMPACT DISK

COC CERTIFICATE OF COMPLIANCE

CQFP CERAMIC QUARDTURE FLAT PACK

HMC HYBRID MICRO CIRCUIT

LLCC LEAD LESS CHIP CARRIER

MLB MULTI LAYER BOARD

MRB MATERIAL REVIEW BOARD

NPTH NON PLATED THROUGH HOLE

PCB PRINTED CIRCUIT BOARD

PCBA PRINTED CIRCUIT BOARD ASSEMBLY

PID PROCESS IDENTIFICATION DOCUMENT

PTH PLATED THROUGH HOLE

QC QUALITY CONTROL

QFN QUADRATURE FLAT PACK NO LEAD

RFP REQUEST FOR PROPOSAL

SAC SPACE APPLICATIONS CENTRE

SMD SURFACE MOUNT DEVICE

SOIC SMALL OUTLINE INTEGRATED CIRCUIT

(GULL WING LEAD)

SR SEMIRIGID CABLE

SRV STORE REQUISITION VOUCHER

T&E TEST AND EVALUATION


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PART-1

TECHNICAL BID

1.0 INTRODUCTION:

This Request for Proposal (RFP) document provides the details of the work involved, mode of

operation, delivery schedule, tendering procedures etc. It should be clearly understood by

vendor that work involved is of High Reliable (Hi-Rel) electronics Ground Hardware where

availability, quality & reliability is expected to be built into the system. For this purpose, vendor

is required to follow all Quality Assurance guidelines laid down for Hi-Rel ground hardware

work.

It is very much important that vendor proposal should include all technical details in the

proposed offered, as attached in Para 4.0 below, for our evaluation/acceptance of the offer.

This RFP is being floated for printed circuit boards wiring & assembly of electronics packages

for Hi-Rel ground hardware projects: (1) At vendor’s premises using vendor’s tools and materials and

(2) At SAC for the minor kinds of rework on wired PCBs and in the final packages after functional

testing.

2.0 SCOPE OF WORK:

This RFP is for the Hi-Rel ground hardware electronics fabrication work starting from PCB

wiring to final package assembly level. Vendor should have well established fabrication

facilities with trained / skilled and sufficient manpower to meet our Hi-Rel electronics

fabrication requirements. In general this work includes turret swaging, component mounting &

soldering, local potting, conformal coating etc. Package assembly includes wiring and

harnessing of different types of cables to connectors, box/chassis wiring, rack wiring etc. The

work shall be carried out in accordance with the procedures laid down in ISRO-PAX-300 (Copy

enclosed as Annexure-I). Vendor’s Inspectors have to carry out visual inspection with

necessary inspection aids at various stages on 100% basis, to ensure adherence to the guidelines,

quality levels and procedures laid down in ISRO-PAX-300 and respective fabrication

document, Ground jobs shall be complying, but not mandatorily adhere to, ISRO-PAX-300.

3.0 REFERENCE DOCUMENTS:

A. ISRO-PAX- 300: Workmanship Standards for the Fabrication of Electronics Packages.

B. ISRO-PAS-207: Storage, Handling and Transportation requirements for Electronics hardware.

Latest revision of the standards generated from time to time shall be applicable and made available.


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4.0 FACILITY & MAN POWER REQUIREMENTS:

Vendor’s facilities should meet ISRO-PAX-300 (except for Class-100000 clean room, certified

manpower and Microscopic Inspection at 10X). Facility shall be an AC room with humidity controls

having adequate cleaning process and antistatic precautions is essential as bare minimum requirements.

Vendor should have the necessary fabrication tools, aids, accessories as listed in Annexure II. Vendor

should have trained / skilled fabricator(s) and inspector(s) (minimum 4 fabricators and 2 inspectors

exclusively for this RFP, considering work load requirements), who can take up the proposed work at

their factory. In addition to the above, 1 fabricator and 1 inspector may be required to carry out work at

SAC premises. Vendor should have at least 2 years’ experience in Hi-Rel electronics fabrication

related work in the reputed organizations.

4.1 Fabrication Material aspect:

(a) For the work carried out at vendor’s premises

Consumable such as Solder, Flux, Cleaning Solvent and other related materials to be

procured / arranged by the vendor; however quality/supplier details will be provided by

SAC and has to be adhered to. These Quality specifications will be binding to the vendor.

(b) For the work to be carried out at SAC

All the facilities and materials required for the fabrication work will be supplied by SAC.

5.0 WORK DETAILS:

Selected vendor is expected to follow the typical work flow as per Annexure-III flow chart

No 1 (sample) & details as below,

a. Wiring and assembly of the cards using components supplied by the SAC.

b. If required, after the completion of testing, Rework / replacement of components.

c. Packaging, sub system wiring, chassis wiring, rack wiring etc.

d. Type of components generally used in PCB Wiring are listed in Annexure-IV

e. Mechanical assembly and fixing of the cards (and their harness/ connectors) in identified

packages.

f. Readiness for delivery

g. Typical work load envisaged is given in table GND-1 below

5.1 WORKLOAD & FLOW SEQUENCE:

Vendor is expected to follow the typical work flow as per Annexure-III flow chart No 1

(Sample) & typical workload table envisaged tentative is given in Table onb1 below.

Type of components generally used in PCB wiring are listed in Annexure-IV


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Table-GND-1

Typical work load – GROUND

Apart from the work load depicted in the above table various works regarding device encapsulation,

epoxy application, thermal tape application, masking, etc are also likely to be as per need basis. To

meet the critical time schedule, part of the work may have to be carried out by the vendors at SAC

premises, Vendor will be required to work in shift basis if required.

5.2 Typical fabrication Stages: The total work is defined in different stages of work.

Stage A: Component-tinning stage: - Component Lead Cleaning and Tinning

- Inspection

- Rework / Acceptance and inspection

Stage B: Component-mounting Stage: - PCB cleaning

- PCB bake

- Terminal swaging

- Inspection

- Rework if required followed by inspection

- Component preparation and bending /lead forming

- Component mounting (including connector)

- Inspection

- Rework if required followed by inspection

Sr.

No.

Nature of the Job Unit/ year Total Qty.

For 3 years

1 Total no. of cards / packages for the period of 3

years.

450-600 cards

225 packages

1350-1800 cards

675 packages

2 Component tinning, placement & soldering (with

cleaning) on PTH/NPTH PCBs

3,75,000 solder

joints

1125,000 solder

joints

3 Soldering/Crimping multi core cables/wires on

terminals/circular/D connectors

1,20,000 pins 360,000 pins

4 Harnessing of wires/cables-bunch 750 Meters . 2250 Meters .

5 Coil / transformer winding 300 Nos. 900 Nos.

6 Epoxy/Araldite /radiation shielding /Local potting / thermal Grease Application / Doubler fixing

300 comp. 900 comp.

7 Conformal coating 100-200 cards 200-600 cards

8 SR, MF141 and other types of cables 300 nos. 900 nos.

9 EMI gasket fitting 200 Nos. 600 Nos.

10 Lead forming for Flat Pack, CQFP, SOIC, per

component

2000 6000

11 Package Wiring 225 675


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Stage C: Component Soldering Stage: - Soldering

- Inspection

- Rework / Acceptance - Final Inspection prior to submission

- Modification if any

Stage D: Packaging Stage: - Connector assembly with wire tagging

- Connector fixing on panel

- Continuity checking

- Panel/ Package harnessing

- Card fixing & turret wiring

- Continuity testing of individual cards

- Next card wiring & repeat of above steps

- Harnessing of wire bundles on cards

(All the stages include cleaning, inspection & rework if any)

A Package may contain from 1 card to 16 cards.

5.3 Other desirable operations: Following operations are also required based on the subsystem/ systems requirements; hence Vendor is

required to quote for these operations also.

1. Connector fitting (D type, SMA, Circular etc)

2. Panel fitting

3. DAM filling / Encapsulation

4. Any modification at any stage. (Wired PCBs / Packages)

Hi-Rel fabrication work for the above mentioned stages has to be completed as per required

specifications and acceptance criteria. The vendor shall do inspection of the finished card /

assembly, with necessary reworks and before submitting it to SAC for acceptance. Vendor is

required to ensure that all the issues/actions are closed out before delivery of the job.

5.4 QUALITY REQUIREMENTS FOR ACCEPANCE OF JOB

Vendor shall comply with the PAX-300 Document in total, including quality requirements

defined there-in with respect to the activities carried out under this RFP and P.O.

As the components used are extremely costly, all efforts should be made to handle carefully.

In case of Non-Conformance, vendor is required to report the deviation along with full details

with the proposed corrective actions proposed by vendor immediately to focal person in SAC

Ahmedabad. The corrective actions shall be cleared by SAC focal point in consultation with

QA/QC, SAC focal person.

Vendor shall ensure all the issues/actions are closed out before delivery of the job.


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For the Hi-Rel ground hardware project work like earth station equipment, rack integration,

ground checkout systems for space hardware etc. final inspection and clearance by QC-SAC is

essential. quality Audit will be conducted on sample basis from the fabricated lot. Audited lot

will be accepted only after close out by the vendor for the action generated due to quality audit

(If any).

5.5 DOCUMENTATION:

Following fabrication records in the formats specified by SAC shall be maintained by Vendor.

In addition specific requirements if required time to time needs to be maintained.

- History sheet/Inspection Reports. - Calibration records of equipment.

- Report of Discrepancy and Dispositions etc.

5.6 DELIVERY OF JOBS The vendor should comply the delivery schedule as per SAC instructions. Typical schedule for a PCB

comprising of 100 components of 1000 solder joints need to be assembled in 3 working days. However,

delivery of jobs schedule will be finalized by SAC focal person in discussion with vendor’s focal person

and it will be binding to vendor.

Vendor is required to submit following deliverables,

1. Completed Job.

2. All the original documents supplied by SAC.

3. History records for fabrication and inspection at all stages.

4. Non - Conformance management record.

5. All material and component related inventory and inspection records.

5.7 RESPONSIBILITY The responsibility of vendor and SAC is defined in subsequent Para in detail.

5.7.1 SAC RESPONSIBILITY

SAC will provide the following details to the vendor as per the applicable work/job.

(1) Fabrication documents- component layout diagrams, components list, Harness details, assembly

flow chart etc.

(2) Required quantity of components, Package, Mechanical hardware.

(3) Formats for maintaining inventory, for the components supplied by SAC, which shall include

components consumed, defective components, and unfinished and finished wired assemblies.

(4) Methods for storage of components, assemblies in process and finished assemblies, dispatch of

components & wired assemblies.

(5) Procurement Details & Suppliers List of materials. (Soft copy as DML list). This will be provided

to successful bidders.

(6) Functional testing by SAC.

(7) Periodic audit of facilities and jobs.

(8) Document titled “Workmanship Standard for the Fabrication of Electronic Packages”,

ISRO-PAX-300. Other reference documents will be given to the vendors after the award of contract.

(9) Special precautions to be followed while carrying out fabrication work, if any.

(10) Final disposition on non conformance issues.


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5.7.2 RESPONSIBILITIES OF VENDOR

(1) Vendor will be required to collect jobs from SAC campus as and when informed by SAC focal

person and delivery the completed jobs back to SAC campus.

(2) Collection of materials (bare cards, components, layout drawings & related details) and delivery

of completed goods will be the responsibility of the vendor.

(3) Vendor should follow time schedule provided by SAC for earliest completion of PCB wiring and

assembly. Vendor should note that projects being of national importance and time bound, earliest

delivery as per agreed schedule should be made for PCB wiring and assembly. Vendor should

study and have clarity about job at the time of job loading and seek clarifications immediately.

(4) Vendor shall return back all the related records of PCB wiring, component mounting / soldering

and assembly details

(5) After functional testing of wired PCB modification if any, shall be carried out by vendor.

(6) The vendor shall provide weekly progress report regularly.

(7) Vendor shall comply with the requirements of SAC with respect to up gradation of its facility,

training of new personnel on Hi-Rel soldering techniques and fabrication procedures at SAC,

calibration of tools and equipments used for fabrication and closeouts.

(8) Vendor shall maintain an inventory of the components supplied by SAC, components consumed,

defective components, unfinished and finished wired assemblies etc.

(9) Vendor shall maintain the records relating to all fabrications / reworks performed at their facility

in the formats prescribed by SAC and the copies of the same will form the part of the deliverables.

(10) Vendor shall send a status report every week on all the items under fabrication.

(11) Vendor shall inform critical/problem areas if any immediately.

(12) Vendor shall follow priorities and adjust its plan of fabrication, based on the advice of the focal

Point from SAC.

(13) Vendor shall depute 1 fabricator and 1 inspector for smaller jobs and rework etc. in SAC campus,

however in case of urgent requirements and with instruction from SAC vendor has to depute more

fabricators and inspectors in SAC, and they will be required to work in shift also

(14) Vendor shall seek certification from ISRO for any new methods or any new tools / machineries

other than those prescribed by SAC.

(15) Vendor shall provide necessary access to SAC personnel for periodic inspection of the facility at

their premises, and extend necessary cooperation for technical reviews as needed.

(16) The vendor has to mention security & safety related provisions taken by him at his premises. His

personals must keep the wired PCBs, components in the proper packaging & in proper cupboard

(ESD Safe) at all stages of job execution.

(17) Extreme care should be taken to avoid damage to PCB and components. In case if it found that

damage is done to PCB or components, replacement or costs will be required to be paid by the

vendor to SAC. As the components used are space qualified & extremely costly, all efforts should

be made to handle carefully.

(18) The transportation package shall be marked with “High Reliability Packages”. PCB/Packages

shall be with proper ESD safe packaging with silica gel pouch to avoid the damage during

transportation from rough handling, heat, humidity, dust, mechanical shock, vibration and ionic

contamination.

(19) Vendor is required to work in shifts as per instruction from SAC.

(20) If minimum persons as defined in RFP are not exclusively available for SAC for this RC, then the

party may be penalized for the first instance, in case of subsequent follow up, vendor fails to retain

fabricators and inspectors RC may be short closed.


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6.0 EXECUTION OF CONTRACT OPERATION:

1. On intimation from SAC focal person (by e-mail/fax/text message), vendor’s focal

person/authorized person has to collect job card, fabrication details, PCB, components, jig,

mechanical parts etc. from SAC, within 12 hours, through returnable gate pass.

2. Upon completion of the job vendor has to submit the completed job as well as fabrication file to

SAC focal person by making proper entries at SAC security & in returnable gate pass.

3. In case of any clarification required by the vendor during the job in progress, vendor can contact

SAC focal person through email/fax/telephone etc.

4. After accepting the completed job by SAC, on monthly basis vendor will be required to submit the

bills in triplicate as per the format advised by SAC.

7.0 INPUT REQUIREMENTS OF PROPOSAL FROM VENDOR:

Interested parties may attend pre bid discussion on the date notified in the tender notice.

The vendor shall submit proposal in two parts.

PART - I : Technical & Commercial (without prices) Bid

PART – II : Price Bid Both part I and part II should be submitted in two separate sealed envelopes which may be put

in another envelop super-scribing tender number and due date of the tender. Incomplete bids

shall be treated as invalid and rejected.

I. Technical Bid/Proposal:

1. Details of experience of vendor in Hi Rel Fabrication related work, along with supporting

documents. 2. Vendor’s infrastructure, organization set up & quality manual

3. Detailed fabrication plan and procedure followed presently, & setup available.

4. Whether the party is having work experience with ISRO / DRDO, Aerospace and Hi-Rel

fabrication industries, certified facilities and manpower certified by ISRO or by other

reputed organization.

5. Vendor’s capability, Yearly turn over & other supporting documents to verify the same. 6. Vendor is required to submit technical compliance as per table no. T-1(Annexure-V).

7. Copy of Commercial (without prices) Bid:

8. The commercial terms applicable for the item quoted should be indicated in this part. Price should

not be indicated in this part.

II. Commercial Part:

Detailed break –up of costs, meeting technical compliance for tasks involved for PCB Wiring &

Packaging etc as per SAC requirement, shall be submitted in separate sealed envelope to SAC on or

before the date specified in the tender notification.

For further details, please refer instructions for two-part tender enclosed.


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8.0 GENERAL REQUIREMENTS

(1) SAC reserves the right to review the progress of work at various stages. SAC reserves the right to

verify & audit at any time, adherence by the vendor to the workmanship standards and procedures

specified, through visits with or without prior notice.

(2) SAC reserve the right to enter in to multiple parallel rate contracts against this RFP. This will be

decided by SAC on the basis of technical suitability. Contract shall be awarded on acceptance of

rates fixed by SAC.

(3) The technical information, drawings and other related documents given by SAC in the course of the

work shall remain the property of Government of India, Department of Space. The given Material /

Documents should not be used for any other purpose or be duplicated in any case.

(4) The handling of assembled PCBs and hardware shall be done in a careful manner to avoid stress and

damage to the parts as per the ISRO-PAX-207.

(5) Vendor shall be binding to the terms and conditions of SAC purchase procedure.

9.0 COMPLIANCE STATEMENT

The bid should contain, beside the facility & capability details, the following aspects also:

1. A statement that whether the Vendor has understood the requirements of work and confirms

feasibility of taking up Hi-Rel fabrication to the required quality standards.

2. Designation, qualification and experience of the operator and inspector who will be engaged for

Hi-Rel work shall be provided to SAC, along with copy of the certificate.

3. A statement that whether the Vendor undertakes to observe all the procedures and

methodologies recommended for fabrication, inspection and transportation of hardware as

agreed.

4. A statement that the Vendor agrees to all the clauses stipulated in this RFP. Compliance table

Annexure V is to be properly filled and to be submitted along with Technical Part-I bid.

5. No conditional offers will be acceptable.

10.0 SCHEDULE & MILESTONES:

The vendor should comply the delivery schedule as per SAC instructions. Typical schedule for a PCB

comprising of 100 components of 1000 solder joints need to be completed in 3 working days The schedules and delivery has to be done in consultation with the SAC focal person for the completion

of the task.

Vendor’s focal person is required to be continuously interacting with SAC for the execution of the job

and has to inform the progress weekly basis.

11.0 TENURE OF CONTRACT Contract will be awarded for a period of three years and may be extended on mutual agreement. SAC

reserves the right to terminate the contract at any time without any liability.


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12.0 SETTLEMENT OF DISPUTES

The work to be assigned and taken up is based on mutual trust and confidence. Differences of opinion, if

any, which arise during the performance of the work, will be settled through mutual consultation

between SAC and the vendor.

13.0 ARBITRATION

In the event of any dispute or difference arising out of or in connection with this Contract, the same shall

be settled amicably by mutual consultation. If such resolution is not possible, then the unresolved

dispute or difference shall be referred to the sole arbitration by a person appointed by Director, Space

Applications Centre. Arbitration shall be conducted in Ahmedabad in accordance with provisions of the

Indian Arbitration and Conciliation Act 1996 as amended from time to time. The decision of the

Arbitrator shall be final and binding upon the parties and expenses of the arbitration shall be paid as may

be determined by the Arbitrator.


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PART-II

Commercial Part

Commercial part of the RFP shall contain the quotation with costs break-up as mentioned below in Table A-1,

A-2 of the proposals shall be submitted in separate sealed envelope to SAC on or before the date specified in

the tender notification, considering the typical work load defined in Para 5.0 of Technical Part-I.

Terms & Conditions: 1. Payment Terms: Final payment will be made after successful completion of the job and accepted by SAC.

2. Rates quoted should be firm and fixed for entire duration of contract.

3. Quantity of each item shown in workload Para 5.0 of Technical Part-I, is approximate as per our past

experience, however no guarantee can be given regarding the minimum order quantity, per year and payment

will be made on the actual accepted work done.

4. Termination of Contract: SAC reserves right to terminate the contract by giving a notice of 30 days, for

reasons such as non-adherence to the terms of the contract, unsatisfactory performance, or any other reason.

5. Publicity: No Publicity of any kind regarding this contract shall be given without explicit written permission

by SAC.

6. Commercial Terms & Conditions are given in ANNEXURE-VI

Table : GND A(1)

Format for activities & charges

Sr.

no.

Description of Activity

In Vendors premises

(using vendors

facility and material)

Rate in Rs.

In SAC premises (using

SAC facility and

material) Rate in Rs.

a.

Cost per accepted solder joint inclusive of lead

preparation, mounting & soldering. (Except fine

pitch devices) (20 mil Pitch).

b.

A. Cost of per component tinning.

B. Cost of Component Mounting Per Component

C. Cost of Soldering per Solder Joint.

c.

Cost per accepted solder joint for the fine pitch

device. (20 mil Pitch ), inclusive of device tinning,

mounting and soldering.

d. Cost per accepted crimp joint

e. Cost per meter of harnessing of wires/cables

f. Cost of local potting per component

g Cost of conformal coating per sq.cms

h Coil making on formers (per turn).

i Epoxy application (Thermal or conductive like H-

74 / Gold / Silver) per device


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j Dam filling per device

k Araldite Application / thermal Grease Application

per device

l Lead forming for Flat Pack, CQFP, SOIC

k Mechanical fitting per operation

m Cost of removal per component from PCB

n

Cost per operation as per other desirable operations

1. Connector fitting (D type, SMA, Circular etc)

Panel Fitting

2. Gasket Applications

3. CC touch up

O

Cost for per person deputed at SAC for fabrication

( Minimum number of solder joints cost or actual

work done by fabricator, whichever is higher)

No. of solder joints cost

Table-A2 Cost of Cable @ per cable Assembly.

In Vendor’s

Premises using

vendor’s facility

In SAC Premises using

SAC facility

o

Cost of Semi-Rigid Cable @ per cable

Assembly per cable(SR Cable supplied by

SAC.

p Template making per bend

q Cable bending per bend

r

Connector Soldering ( Pin preparation, pin

soldering, de-Golding jacket soldering

cable tinning, Teflon pushing per operation

s Connector Crimping ( Pin preparation, pin

mounting, crimping ) per operation

t

Cap soldering (degolding, tinning

soldering ) per operation of packaging

stage

u Cost of flexible RF Cable @ per cable

Assembly.

Note: Solder joint on both sides of PCB (PTH) will be considered as a single solder joint.


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ANNEXURE–I

A. ISRO-PAX- 300: Workmanship Standards for the Fabrication of Electronics Packages.

B. ISRO-PAS-207: Storage, Handling and Transportation requirements for Electronics hardware.

ANNEXURE–II

List of Tools Required:

Typical tools used for electronic fabrication are required to be purchased by the vendor; the following is the

representative of types of tools required. The number of the tools can be decided by the vendor with the clear

understanding that Vendor will be able to do the required works after tools are cleared by SAC & as per PAX-

300. For the jobs in SAC vendor is required to bring the tools kit to SAC on returnable basis.

- Magnifier with 4X capability

- Microscope

- Oven for PCB baking & other jobs

- Bristol Brushes

- Soldering iron - Temperature controlled with digital read out

- Flat nose pliers

- Anti-wicking tool - Bullet type, L type

- Heat sink for component lead

- Round/Flat nose pliers - long/short

- Diagonal cutter

- Lead Bending tool/ strip

- Lead clinching tool

- Wire-stripper

- Weighing balance

- Crimping tools

- Bit cleaner

- Flux dispenser

- Cleaning solvent dispensing bottle

- Solder wire holder

- Solder Pots with Dross Remover (Temp controlled)

- Swaging system

- Cable fabrication aids.

Desirable Tools/equipment: Lead forming tools, vapor degreaser.

If any specific fabrication job needs any precision tool it will be provided by SAC on returnable basis against

gate pass. It must be returned to SAC at the time of delivery of finished job.


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Bare PCB, Components & relevant detail

ANNEXURE – III

Sample flow chart for PCB wiring & assembly

Hi-REL Electronics PCB wiring & assembly fabrication Flow Chart (sample)

Turret swaging, connector fitting & etc.

Component tinning, mounting etc.

Soldering, cleaning & inspection

Functional Testing (SAC) (If any modification / change) Soldering has

to be done by vendor at SAC

Wired job delivered to designer/ indenter


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ANNEXURE –IV

Typical list of components used for fabrication of PCB wiring

Passive components (Axial and SMD) Resistors,

Capacitors,

Inductors,

Relays/ Switch

Trimmer/ Pots

Transformer/ coils

Turrets/ Terminals

Connectors (multi-pin, standard D sub to micro-D, nano –D )

Active Component (Leaded and SMD) Transistor, Diodes, SCR, ICs

HMCs etc.

Packages: DO-7, DO-14, DO-35, TO-35, TO-39, TO-5 etc.

Metal Can TO-3 / TO-39, DIP (Dual- in -line),

PGA packages, SOICS, QFP, QFN, PQFP, CQFPs ,CCGA,BGA etc


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Annexure-V Compliance Table GROUND

Sr. no. Points (Compliance with value and details)

1. Vendor’s facilities should meet

ISRO-PAX-300

- Area of Facility :

- ESD safe number of work

benches

- No of tool Kits for fabrication

-Details for inspection aid

-No. of PCBs/Packages Wired

for space use in last two years

-Number of fabricators /

inspectors & list


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Clause

Points (Compliance with value and details)

4.0

Vendor’s facilities should meet

ISRO-PAX-300 (except for

Class-100000 clean room,

certified manpower and

Microscopic Inspection at 10X).

Facility shall be an AC room

with humidity controls having

adequate cleaning process and

antistatic precautions is essential

as bare minimum requirements.

Vendor should have the

necessary fabrication tools, aids,

accessories as listed in

Annexure II. Vendor should

have trained / skilled

fabricator(s) and inspector(s)

(minimum 4 fabricators and 2

inspectors exclusively for this

RFP, considering work load

requirements), who can take up

the proposed work at their

factory. In addition to the above,

1 fabricator and 1 inspector will

be required to carry out work at

SAC premises. Vendor should

have at least 2 years’ experience

in Hi-Rel electronics fabrication

related work in the reputed

organizations.

4.1 Fabrication Material aspect:

(a) For the work carried out at

vendor’s premises

Consumable such as Solder,

Flux, Cleaning Solvent and

other related materials to be

procured / arranged by the

vendor; however

quality/supplier details will be

provided by SAC and has to be

adhered to. These Quality


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specifications will be binding

to the vendor.

(b) For the work to be carried

out at SAC

All the facilities and materials

required for the fabrication

work will be supplied by SAC.

5.0 WORK DETAILS:

Selected vendor is expected to

follow the typical work flow as

per Annexure-III flow chart No

1 (sample) & details as below,

1. Wiring and assembly of the

cards using components supplied

by the SAC.

2. If required, after the

completion of testing, Rework /

replacement of components.

3. Packaging, sub system wiring,

chassis wiring, rack wiring etc.

4. Type of components generally

used in PCB Wiring are listed in

Annexure-IV

5. Mechanical assembly and

fixing of the cards (and their

harness/ connectors) in identified

packages.

6. Readiness for delivery

7. Understanding of Typical

work load envisaged is given in

table GND-1


21

5.1 WORKLOAD & FLOW

SEQUENCE: Vendor is expected to follow the

typical work flow as per

Annexure-III flow chart No 1

(Sample) & typical workload table

envisaged tentative is given in

Table onb1 below.

Type of components generally used

in PCB wiring are listed in

Annexure-IV

5.2 Typical fabrication Stages: The total work is defined in

different stages of work. Stage A: Component-tinning

stage: - Component Lead

- Cleaning and Tinning

- Inspection

- Rework / Acceptance

and inspection

Stage B: Component-mounting

Stage: - PCB cleaning

- PCB bake

- Terminal swaging

- Inspection

- Rework if required

followed by

inspection

- Component

preparation and

bending /lead

forming

- Component mounting

(including

connector)

- Inspection

Rework if required followed by

inspection

Stage C: Component Soldering

Stage: - Soldering

- Inspection

- Rework /

Acceptance - Final Inspection prior

to submission

- Modification if any


22

Stage D: Packaging Stage: - Connector assembly

with wire tagging

- Connector fixing on

panel

- Continuity checking

- Panel/ Package

harnessing

- Card fixing & turret

wiring

- Continuity testing of

individual cards

- Next card wiring &

repeat of above steps

- Harnessing of wire

bundles on cards

(All the stages include

cleaning, inspection &

rework if any)

A Package may contain

from 1 card to 16 cards.

5.3 Other desirable operations: Following operations are also

required based on the subsystem/

systems requirements; hence

Vendor is required to quote for

these operations also.

1. Connector fitting (D type,

SMA, Circular etc.)

2. Panel fitting

3. DAM filling / Encapsulation

4. Any modification at any

stage. (Wired PCBs /

Packages)

Hi-Rel fabrication work for the

above mentioned stages has to

be completed as per required

specifications and acceptance

criteria. The vendor shall do

inspection of the finished card

/ assembly, with necessary

reworks and before submitting

it to SAC for acceptance.


23

Vendor is required to ensure

that all the issues/actions are

closed out before delivery of

the job.

5.4 QUALITY REQUIREMENTS

FOR ACCEPANCE OF JOB

Vendor shall comply with the

PAX-300 Document in total,

including quality requirements

defined there-in with respect to

the activities carried out under

this RFP or P.O.

As the components used are

extremely costly, all efforts

should be made to handle

carefully.

In case of Non-Conformance,

vendor is required to report the

deviation along with full details

with the proposed corrective

actions proposed by vendor

immediately to focal person in

SAC Ahmedabad. The

corrective actions shall be

cleared by SAC focal point in

consultation with QA/QC, SAC

focal person.

Vendor shall ensure all the

issues/actions are closed out

before delivery of the job.

For the Hi-Rel ground hardware

project work like earth station

equipment, rack integration,

ground checkout systems for

space hardware etc. final

inspection and clearance by QC-

SAC is essential. quality Audit

will be conducted on sample

basis from the fabricated lot.

Audited lot will be accepted

only after close out by the

vendor for the action generated

due to quality audit (If any).


24

5.5 DOCUMENTATION:

Following fabrication records in

the formats specified by SAC

shall be maintained by Vendor.

In addition specific

requirements if required time to

time needs to be maintained.

- History sheet/Inspection

Reports. - Calibration records of equipment.

- Report of Discrepancy and

Dispositions etc.

5.6 DELIVERY OF JOBS The vendor should comply the

delivery schedule as per SAC

instructions. Typical schedule for a

PCB comprising of 100

components of 1000 solder joints

need to be assembled in 2 to 3

working days. However, delivery

of jobs schedule will be finalized

by SAC focal person in discussion

with vendor’s focal person and it

will be binding to vendor.

Vendor is required to submit

following deliverables,

1. Completed Jobs.

2. All the original documents

supplied by SAC.

3. History records for fabrication

and inspection at all stages.

4. Non – Conformance

management record.

5. All material and component

related inventory and inspection

records.

5.7 RESPONSIBILITY The responsibility of vendor and

SAC is defined in subsequent

Para in detail.


25

5.7.1 SAC RESPONSIBILITY

SAC will provide the

following details to the vendor as

per the applicable work/job.

(1) Fabrication documents-

component layout diagrams,

components list, Harness

details, assembly flow chart

etc.

(2) Required quantity of

components, Package,

Mechanical hardware.

(3) Formats for maintaining

inventory, for the

components supplied by

SAC, which shall include

components consumed,

defective components, and

unfinished and finished

wired assemblies.

(4) Methods for storage of

components, assemblies in

process and finished

assemblies, dispatch of

components & wired

assemblies.

(5) Procurement Details &

Suppliers List of materials.

(Soft copy as DML list).

This will be provided to

successful bidders.

(6) Functional testing by SAC.

(7) Periodic audit of facilities

and jobs.

(8) Document titled

“Workmanship Standard for

the Fabrication of Electronic

Packages”,

ISRO-PAX-300. Other

reference documents will be

given to the vendors after the

award of contract.

(9) Special precautions to be

followed while carrying out

fabrication work, if any.

(10) Final disposition on non-

conformance issues.


26

5.7.2. RESPONSIBILITIES OF

VENDOR (1) Vendor will be required to

collect jobs from SAC campus

as and when informed by SAC

focal person and delivery the

completed jobs back to SAC

campus.

(2) Collection of materials (bare

cards, components, layout

drawings & related details) and

delivery of completed goods

will be the responsibility of the

vendor.

(3) Vendor should follow time

schedule provided by SAC for

earliest completion of PCB

wiring and assembly. Vendor

should note that projects being

of national importance and

time bound, earliest delivery as

per agreed schedule should be

made for PCB wiring and

assembly. Vendor should study

and have clarity about job at

the time of job loading and

seek clarifications

immediately.

(4) Vendor shall return back all

the related records of PCB

wiring, component mounting /

soldering and assembly details

(5) After functional testing of

wired PCB modification if

any, shall be carried out by

vendor.

(6) The vendor shall provide

weekly progress report

regularly.

(7) Vendor shall comply with the

requirements of SAC with

respect to up gradation of its

facility, training of new

personnel on Hi-Rel soldering

techniques and fabrication

procedures at SAC, calibration

of tools and equipment used

for fabrication and closeouts.


27

(8) Vendor shall maintain an

inventory of the components

supplied by SAC, components

consumed, defective

components, unfinished and

finished wired assemblies etc.

(9) Vendor shall maintain the

records relating to all

fabrications / reworks

performed at their facility in

the formats prescribed by

SAC and the copies of the

same will form the part of the

deliverables.

(10) Vendor shall send a status

report every week on all the

items under fabrication.

(11) Vendor shall inform

critical/problem areas if any

immediately.

(12) Vendor shall follow

priorities and adjust its plan

of fabrication, based on the

advice of the focal Point

from SAC.

(13) Vendor shall depute 2

fabricators and 1 inspector

smaller jobs and rework etc. in

SAC campus, however in case

of urgent requirements and

with instruction from SAC

vendor has to depute more

fabricators and inspectors in

SAC, and they will be

required to work in shift also

(14) Vendor shall seek certification

from ISRO for any new

methods or any new tools /

machineries other than those

prescribed by SAC.

(15) Vendor shall provide

necessary access to SAC

personnel for periodic

inspection of the facility at

their premises, and extend

necessary cooperation for


28

technical reviews as needed.

(16) The vendor has to mention

security & safety related

provisions taken by him at his

premises. His personals must

keep the wired PCBs,

components in the proper

packaging & in proper

cupboard (ESD Safe) at all

stages of job execution.

(17) Extreme care should be taken

to avoid damage to PCB and

components. In case if it

found that damage is done to

PCB or components,

replacement or costs will be

required to be paid by the

vendor to SAC. As the

components used are space

qualified & extremely costly,

all efforts should be made to

handle carefully.

(18) The transportation package

shall be marked with “High

Reliability Packages”.

PCB/Packages shall be

wrapped in halide free butter

paper followed by polythene

bag with silica gel pouch to

avoid the damage during

transportation from rough

handling, heat, humidity, dust,

mechanical shock, vibration

and ionic contamination.

(19) Vendor is required to work in

shifts as per instruction from

SAC.

(20) If minimum persons as

defined in RFP are not

exclusively available for SAC

for this RC, then the party

may be penalized for the first

instance, in case of subsequent

follow up, vendor fails to

retain fabricators and

inspectors RC may be short

closed.


29

6.0 EXECUTION OF

CONTRACT OPERATION:

1. On intimation from SAC focal

person (by e-mail/fax/text

message), vendor’s focal

person/authorized person has

to collect job card, fabrication

details, PCB, components, jig,

mechanical parts etc. from

SAC, within 12 hours, through

returnable gate pass.

2. Upon completion of the job

vendor has to submit the

completed job as well as

fabrication file to SAC focal

person by making proper

entries at SAC security & in

returnable gate pass.

3. In case of any clarification

required by the vendor during

the job in progress, vendor can

contact SAC focal person

through email/fax/telephone

etc.

4. After accepting the completed

job by SAC, on monthly basis

vendor will be required to

submit the bills in triplicate as

per the format advised by

SAC.

7.0 INPUT REQUIREMENTS OF

PROPOSAL FROM

VENDOR:

Interested parties may attend pre

bid discussion on the date notified

in the tender notice.

The vendor shall submit proposal in

two parts.

PART – I: Technical &

Commercial (without prices) Bid

PART – II: Price Bid Both part I and part II should be

submitted in two separate sealed

envelopes which may be put in

another envelop super-scribing

tender number and due date of


30

the tender. Incomplete bids shall

be treated as invalid and

rejected.

I. Technical Bid/Proposal:

1. Details of experience of

vendor in Hi Rel Fabrication

related work, along with

supporting documents.

2. Vendor’s infrastructure,

organization set up & quality

manual

3. Detailed fabrication plan and

procedure followed presently, &

setup available.

4. Whether the party is having

work experience with ISRO /

DRDO, Aerospace and Hi-

Rel fabrication industries,

certified facilities and

manpower certified by ISRO

or by other reputed

organization.

5. Vendor’s capability, Yearly

turn over & other supporting

documents to verify the

same.

6. Vendor is required to submit

technical compliance as per

table no. T-1(Annexure-V).

7. Copy of Commercial (without

prices) Bid:

8. The commercial terms

applicable for the item quoted

should be indicated in this part.

Price should not be indicated

in this part.

II. Commercial Part:

Detailed break –up of costs,

meeting technical compliance

for tasks involved for PCB


31

Wiring & Packaging etc. as per

SAC requirement, shall be

submitted in separate sealed

envelope to SAC on or before

the date specified in the tender

notification.

For further details, please

refer instructions for two-part

tender enclosed.

8.0 GENERAL

REQUIREMENTS

(1) SAC-ISRO reserves the right to

review the progress of work at

various stages. SAC-ISRO

reserves the right to verify &

audit at any time, adherence by

the vendor to the workmanship

standards and procedures

specified, through visits with or

without prior notice.

(2) SAC reserve the right to enter in

to multiple parallel rate

contracts against this RFP. This

will be decided by SAC on the

basis of technical suitability.

Contract shall be awarded on

acceptance of rates fixed by

SAC.

(3) The technical information,

drawings and other related

documents given by SAC in the

course of the work shall remain

the property of Government of

India, Department of Space.

The given Material / Documents

should not be used for any other

purpose or be duplicated in any

case.

(4) The handling of assembled

PCBs and hardware shall be

done in a careful manner to

avoid stress and damage to the

parts as per the ISRO-PAX-207.

(5) Vendor shall be binding to the

terms and conditions of SAC

purchase procedure.

9.0 COMPLIANCE

STATEMENT The bid should contain, beside the


32

facility & capability details, the

following aspects also:

1. A statement that whether the

Vendor has understood the

requirements of work and

confirms feasibility of taking up

Hi-Rel fabrication to the

required quality standards.

2. Designation, qualification and

experience of the operator and

inspector who will be engaged

for Hi-Rel work shall be

provided to SAC, along with

copy of the certificate.

3. A statement that whether the

Vendor undertakes to observe

all the procedures and

methodologies recommended

for fabrication, inspection and

transportation of hardware as

agreed.

4. A statement that the Vendor

agrees to all the clauses

stipulated in this RFP.

Compliance table Annexure V

is to be properly filled and to be

submitted along with Technical

Part-I bid.

5. No conditional offers will be

acceptable.

10.0 SCHEDULE &

MILESTONES: The vendor should comply the

delivery schedule as per SAC

instructions. Typical schedule for

a PCB comprising of 100

components of 1000 solder joints

need to be completed in 3

working days The schedules and delivery has to

be done in consultation with the

SAC focal person for the

completion of the task.

Vendor’s focal person is required

to be continuously interacting

with SAC for the execution of the

job and has to inform the

progress weekly basis.


33

11.0 TENURE OF CONTRACT At present contract will be awarded

for a maximum period of three

years and may be extended on

mutual agreement. SAC reserves

the right to terminate the contract

at any time without any liability.

12.0 SETTLEMENT OF

DISPUTES The work to be assigned and taken

up is based on mutual trust and

confidence. Differences of opinion,

if any, which arise during the

performance of the work, will be

settled through mutual consultation

between SAC and the vendor.

13.0 ARBITRATION: In the event of any dispute or

difference arising out of or in

connection with this Contract, the

same shall be settled amicably by

mutual consultation. If such

resolution is not possible, then the

unresolved dispute or difference

shall be referred to the sole

arbitration by a person appointed by

Director, Space Applications

Centre. Arbitration shall be

conducted in Ahmedabad in

accordance with provisions of the

Indian Arbitration and Conciliation

Act 1996 as amended from time to

time. The decision of the Arbitrator

shall be final and binding upon the

parties and expenses of the

arbitration shall be paid as may be

determined by the Arbitrator.

PART-

II

PRICE BID ( Commercial Part)

Terms & Conditions: 1.Payment Terms: Final payment

will be made after successful

completion of the job and

acceptance by SAC.

2.Rates quoted should be firm and

fixed for entire duration of contract.

3.Quantity of each item shown in


34

workload Para 5.0 of Technical

Part-I, is approximate as per our

past experience, however no

guarantee can be given regarding

the minimum order quantity, per

year and payment will be made on

the actual accepted work done.

4.Termination of Contract: SAC

reserves right to terminate the

contract by giving a notice of 30

days, for reasons such as non-

adherence to the terms of the

contract, unsatisfactory

performance, or any other reason.

5.Publicity: No Publicity of any

kind regarding this contract shall be

given without explicit written

permission by SAC.

6. Purchase Terms & Conditions

are given in ANNEXURE-VI


35

ANNEXURE – VI

Purchase - Terms & Conditions

1) Raw Material Bank Guarantee 1) The vendor shall furnish Bank guarantee towards the cost of raw

material supplied to him as Free issue material (FIM), for Rs. 03 lakhs as per terms and conditions of SAC

purchase in the SAC approved format.

The Vendor shall safeguard the issued material and shall make arrangements for proper accounting of the same

and balance materials if any shall be returned to the purchaser along with the end product. Vendor will have to

reimburse the cost of the components damaged while in their custody.

2) Performance Bank Guarantee (PBG): The vendor shall furnish PBG for Rs 2,00,000, as per purchase terms

& conditions.

3) Payments: Payments will be made by SAC based on certification of bills by the Officer designated as Focal

Point at SAC. Payments will be processed at SAC expeditiously on receiving bills from Vendor and settled

within thirty days from the date of acceptance by the Focal Point.

4) Liquidated Damage: Any inordinate delay that could be attributable to party shall attract a Liquidated

Damage at the rate of 0.5% (half percent) of the order value for each fortnight, with a ceiling of 10% (Ten

percent) of the order value.

5) Confidentiality: Vendor shall not divulge the information relating to the circuits, products, fabrication

procedures, quality control methods etc., which may have been exclusively provided by SAC for the purpose of

execution of work entrusted under this contract, to any third party and shall not use the same for any purpose

other than execution of this contract, without prior written consent from SAC.