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Nov. 15th. 2011

(Halogen(Halogen--Free Laminates)Free Laminates)

Electronic Materials Business Unit

Reduced Halogen Material Technology

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1. Environmental Activities on Green Materials Today

2. Environmental Challenges on Green Technologies for Future

1) Future Direction on Electron Products - PWB Materials 2) New Technology Development on Green Materials

AgendaAgenda

1) Panasonic Environmental Strategy 2) Global Environmental Concerns, and Why Green? 3) Green Technologies for PWB Materials

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Global Environmental Concerns, Why Green?Global Environmental Concerns, Why Green?

1960 - 1980 ( Society )Pollution control

1981- 2000 ( Production Site )Manage the toxic substance at the production site (PRTR)

＊Pollutant Release and Transfer Registers

2001- Current ( Products )The management of the toxic substance to contain to products

RoHS

Register discharge and the movement of the environmental pollution materials

REACH

Global Warming

CO2 Reduction

Energy Saving

Green IT

（15％out of global electricity generated ）

0

10000

20000

30000

40000

50000

2006 2010 2015 2020 20250

10000

20000

30000

40000

50000

World

x9.4

x5.7

x3.2x1.6

Electric Consumption（BkWh）

(Source: Ministry of Economy, Trade and Industry)

(Source: IPCC)

No Pollution Society No Pollution Society Low Carbon Society Low Carbon Society

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RoHSRoHS moves Leadmoves Lead--Free & HalogenFree & Halogen--FreeFree

Pb

Mercury

Cadmium

HexavalentChromium

PBB

PBDE

PWB Assembly PWB Materials

Leaded Solder

Lead Free Solder

Rise of Melting Point

High Heat Resistance

Rise of Reflow Temp

・Higher Degradation Temp・Higher Tg

Lead-Free

Other Bromine Flame Retardants

Halogen-Free

ConventionalType

Non-Bromine Flame Retardants

･･･

RoHSRoHS

=

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Green Technologies for PWB MaterialsGreen Technologies for PWB Materials

Flame retardants are chemicals which are added to combustible materials to renderthem more resistant to ignition. They are designed to minimize the risk of a fire starting in case of contact with a small heat source such as a cigarette, candle or an electrical fault. If the flame retarded material or an adjacent material has ignited, the flame retardant will

slow down combustion and often prevent the fire from spreading to other items.

Flame retardantsprotect modern materials such as technical plastics, building insulation, circuit boards and cables from

igniting and from spreading a fire.

What is a Flame Retardant ?

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Halogen Free Technologies for PWB MaterialsHalogen Free Technologies for PWB Materials

What is a Halogen ?

Halogen Elements are a series of non-metal elementscomprising Fluorine, (F); Chlorine, (Cl); Bromine, (Br); Iodine, (I); and Astatine, (At).

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Definition – Halogen Free Laminates(Reduced Halogen Material)

・ Bromine (Br) content: 0.09wt% (900ppm) or less

・ Chlorine (Cl) content: 0.09wt% (900ppm) or less

・ Br & Cl contents: 0.15wt% (1500ppm) or less

By combustion flask type Ion Chromatography method

JPCA-ES-01-2003, IPC 4101B, IEE 61249-2-21＜TEST-METHOD FOR HALOGEN-FREE MATERIALS＞

Halogen Free Technologies for PWB Materials Halogen Free Technologies for PWB Materials

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Elemental Technology for Flame Retardants Elemental Technology for Flame Retardants

BrominatedFlame Retardant

PhosphorusFlame Retardant

Reaction in the gas phase:The radical gas phase combustion process is interrupted by the flame retardant, resulting in cooling of the system, reducing and eventually suppressing the supply of flammable gases.・Brominated Dioxin might be generated.

Reaction in the solid phase:The flame retardant builds up a char layer; shields the material against oxygen and provides a barrier against the flame.

（Surface）

ThermalDecomposition

Diffusionin the solid

Diffusion

Combustion

Oxygen

Plastic material

Mechanism of Combustion

●To apply reactive phosphorus raw material.

Reacted with epoxy resin ●No un-reacted additives

Epoxy resin Reactive phosphorus compound

No deterioration in cured epoxy characteristics

Phosphorus flame retardant is reacted withepoxy resin.

AdvantageElemental Technology ①

Elemental Technology②

NEWHigh Heat Resistance High Heat Resistance

（（T288T288））Conventional

FR-4R-1566(W)

3 min 1 min

（IPC－TM 650）R-1577 (Meg2)

18 min

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0

100

200

300

400

500

600

700

800

900

Volu

me

Inde

x (2

000

= 1.

0)

2000

2001

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

2012

Calendar Year

Panasonic History Only

Industry History

Volume Growth of HalogenVolume Growth of Halogen--Free LaminateFree LaminateGlobal Presence in Halogen Free Laminates Global Presence in Halogen Free Laminates

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Global Presence in HalogenGlobal Presence in Halogen--Free Laminates Free Laminates

HalogenHalogen--Free Laminate ManufacturersFree Laminate Manufacturers

Global 2010$1,241M

Global 2010$1,241M

(21.5%)

(17.9%)

(19.9%)

Others

[Source: PRISMARK]

$222M

$267M

$247M $135M

(10.9%)

$82M (6.6%)

$193M (15.6%)

$95M (7.6%)

In 2010In 2010

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PWB Materials Option for HalogenPWB Materials Option for Halogen--Free Free

RR--1566(W)1566(W)Typical ApplicationsEco Ideas for Products

Mobile Equipments Mobile Equipments

Through-hole Reliability

0.30㎜

1.6mm

20 - 25um

•Test Sample

Cycle - 65C (30min)⇔125C (30min)

Failu

re R

atio

(%)

Cycle Number

R-1566W Throwing power (Uniformity of plating thickness)：80% or more

R-1755CHigh Reliable

FR-4

R-1766140Tg FR-4

•Test Result

Halogen-Free and Lead-Free AssemblyExcellent CAF PerformanceLow CTE (Z axis - 40ppm)

Automotives Automotives

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RR--1577 1577 Typical ApplicationsEco Ideas for Products

High Tg (170℃) and High Td (380 ℃)LOW CTE-Z (34ppm/ ℃)High Reliability – T288 (18min ) , T300 (5min )

Base Station Base Station

Server Server

T-288 （IPC-TM-650 TMA method）No blister time at 288℃

T-300 （IPC-TM-650 TMA method）

No blister time at 300℃

0

10

20

R-1577R-1566WConventional

HF FR-4

Conventional FR-4

0

10

20

R-1577R-1566WConventional

HF FR-4

Conventional FR-4

5

0 0

18

13

min min

PWB Materials Option for HalogenPWB Materials Option for Halogen--Free Free

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PWB Materials Proposal for HalogenPWB Materials Proposal for Halogen--Free Free

R-1577(MEGTRON2) is Halogen free material.It also has High Tg, High Td and low z-CTE for lead free soldering.It also has low Dk&Df for low power consumption.

94 V-0Bromine

1.2kN/m

45ppm/℃

280℃

>120 min

410℃

185℃

0.002

3.6

R-5775（MEGTRON6

）

30 min25 min20 min3 minIPCT288（with Cu foils）

3.84.14.44.62GHzDk

0.0060.0100.0160.0122GHzDf

94 V-0Bromine

1.5kN/m

44ppm/℃

265℃

350℃

173℃

R-1755V

94 V-0Halogen free

1.3kN/m

34ppm/℃

265℃

380℃

170℃

R-1577(MEGTRON2)

1.2kN/m1.8kN/mACu peel strength（Conventional

35um）

94 V-0Bromine

94 V-0Halogen freeULFlammability

35ppm/℃40ppm/℃TMAZ-CTE

280℃245℃－Heat resistance (1H)

360℃350℃TGATd

176℃148℃DSCTg

R-5725（MEGTRON4

）

R-1566Condition

Items

Sample thickness：0.75-0.8mm

Basic Properties

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PWB Materials Proposal for HalogenPWB Materials Proposal for Halogen--Free Free IST (Interconnect Stress Test)

>1,000

>1,000

>1,000

>1,000

>1,000

R-1755V

>1,000

>1,000

>1,000

>1,000

>1,000

R-5775（MEGTRON6）

>1,000

>1,000

>1,000

>1,000

>1,000

R-1577(MEGTRON2)

>1,000

>1,000

>1,000

>1,000

>1,000

R-5725（MEGTRON4）

467

（Mean）

972

（Mean）

582

（Mean）

878

（Mean）

>1,000

R-1566

5

4

3

2

1

No.

6

6

6

6

6

Number of Coupon

260℃

×6cycle

260℃

×3cycle

245℃

×6cycle

230℃

×6cycle

-

Reflow condition

■ Results

Treating condition : 25℃ 2min ⇔150℃ 3min, NG Judgment : Resistance changes >10%

Table. Number of Thermal cycles to occur failure (Times)

For sever conditions, Materials with High Tg, High Td and Low CTEare preferable.

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Copper type：VLP

35um 250um

-40

-35

-30

-25

-20

-15

-10

-5

0

0 1 2 3 4 5 6Frequency （GHｚ）

Tran

smis

sion

loss

（dB

/m）

ＭＥＧＴＲＯＮ６(R-5775)

ＭＥＧＴＲＯＮ４(R-5725)

ＨＦ－ＭＥＧＴＲＯＮ２(R-1577)

Conventional FR-4(R-1766T)

PCB construction

Transmission loss

R-1577(MEGTRON2) has low loss performance. It can transfer 1.5 times more amount of signal than R-1766 (Conventional FR-4).

PWB Materials Proposal for HalogenPWB Materials Proposal for Halogen--Free Free

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PWB Materials Option for HalogenPWB Materials Option for Halogen--FreeFree

■ IC Substrates

Power7 organic module

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IC Substrates Materials History for Halogen FreeIC Substrates Materials History for Halogen Free

Halogen Free

Halogen R-5715S

R-1515B

1999 ～

2005 ～

R-1515S

2007 ～

Evolve

CSP

Standard Ver.

High Elastic Modulus

R-5715E

High Elastic Modulus

R-1515Ｈ

2008 ～

R-1515B

R-1515S

R-1515Ｈ

CSP

High Elastic Modulus

+ Super High Tg

FC-Package(Build-Up PKG)

2004 ～

FC-Package(Build-Up PKG)

FC-Package(Build-Up PKG)

2009 ～+ Ultimate

Heat Resistance

R-1515A

Thick-Core200～800um

Thin-Core40～200um

Thick-Core200～800um

2007200520041999 2008 2010

EvolveEvolve

RR--1515W1515W

RR--1515E, L1515E, L

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Green Technologies for IC Substrate Materials Green Technologies for IC Substrate Materials

Unit R-1515S R-1515A R-1515W

Base resin － Epoxy Epoxy Epoxy

Flame retardant －Organic Resin&Metal-hydroxide

Organic Resin&Metal-hydroxide

Organic Resin&Metal-hydroxide

DMA ℃ 205 205 250TMA ℃ 180 180 22020℃ GPa 27 27 34-35

250℃ GPa 10 10 21CTE X ppm /℃ 12 12 10-9CTE Y ppm /℃ 12 12 10-9CTE Z ppm /℃ 30 30 ≦20CTE Z2 ppm /℃ 140 140 100Td weight loss 260℃ ％ 0.5 0.5 0.2Thermal condutivity DSC/Flash W/mk 0.7 0.7 0.7

TMA

Elastic Modulus

Item

Tg

Basic Properties

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Line up of IC Substrate Materials (All HalogenLine up of IC Substrate Materials (All Halogen--Free)Free)Applications Target IC-Packages Color Our Products

CPUGPUChip Set

MemoryDRAMSD CardSSD

DSP

High Elastic ModulusLow CTE x,y,zSuper Heat Resistance

+Ultimate Heat Resistance

+Super High-Tg+Super

High Elastic Modulus(@RT～250℃)

+Lower CTE x,y

High Elastic ModulusLow CTE x,y,zSuper Heat Resistance

FCFC--xGAxGA

CSPCSP+Super High-Tg+High Elastic Modulus

(@250℃)

Thick-Core800-100μm

Thin-Core200-40μm

R-1515SS

R-1515A A

R--1515WW

R-1515BB

R-1515HH

+Super Low CTE x,y(9ppm@R1515E, 7ppm@R1515L)

+Super High Elastic Modulus

R-1515EE/R-1515LL

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Halogen Free Technology Roadmap Halogen Free Technology Roadmap

2011 2012 2013 2014

Halogen Free, Lead Free Compatible (High Tg, High Td and Low CTE)and Low Energy Consumption (Low Dk and Low Df)

Mobile

Digital Appliance

NetworkEquipment

IC Pkg

：Developing：Under research

Halogen free Low Dk, Low Df Dk<3.8, Df<0.005

High elastic modulus & Low CTEx-yE>40GPa, CTE<5ppm Tg 270℃

High elastic modulus & Low CTEx-yE>50GPa, CTE<3ppm Tg 270℃

Low Dk(3.5), Df(0.005) and Low CTE x-y (=8ppm)

Heat dissipation materials (1.3-1.5W) Heat dissipation materials (3W)

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Thank you! Thank you!