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Recent progress towards a Pixel-TPC 1. Objectives 2. New Structures (Ingrid,Twingrid,…) + Discharge Protection 3. Gas Studies 4. Testbeam at DESY (Medipix+3GEM) 5. Simulations 6. Summary and Plans K. Desch Bonn University 19/10/2006 Participating Institutes: BONN BUCHAREST CERN DAPNIA-CEA FREIBURG NIKHEF (this talk: everything except Timepix)

Recent progress towards a Pixel-TPC 1. Objectives 2. New Structures (Ingrid,Twingrid,…) + Discharge Protection 3. Gas Studies 4. Testbeam at DESY (Medipix+3GEM)

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Page 1: Recent progress towards a Pixel-TPC 1. Objectives 2. New Structures (Ingrid,Twingrid,…) + Discharge Protection 3. Gas Studies 4. Testbeam at DESY (Medipix+3GEM)

Recent progress towards a Pixel-TPC

1. Objectives2. New Structures (Ingrid,Twingrid,…) + Discharge

Protection3. Gas Studies4. Testbeam at DESY (Medipix+3GEM)5. Simulations6. Summary and Plans

K. Desch Bonn University 19/10/2006

Participating Institutes:BONN BUCHAREST CERN DAPNIA-CEA FREIBURG NIKHEF

(this talk: everything except Timepix)

Page 2: Recent progress towards a Pixel-TPC 1. Objectives 2. New Structures (Ingrid,Twingrid,…) + Discharge Protection 3. Gas Studies 4. Testbeam at DESY (Medipix+3GEM)

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1. Objectives

Idea: use a Pixel readout chip (w/o Si sensor) as integrated device hosting pads + readout electronics for a TPC

Potential Advantages:• very small (50x50 m2) Pads• potentially very good point+momentum resolution• dE/dx via cluster counting• frontend electronics automatically integrated (‘active endplate’)

SiTPC goals in EUDET:• construction and test of the Timepix chip (CERN -Electronics team) X.Llopart’s talk • construction of module(s) for LP endplate(s) for diagnostic puposes

both Micomegas and GEMs as gas amplification systems are beiingpursued

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2. New Structures

InGrid, an integrated Micromegas

Integrate grid by wafer post processing

Low tempertaure process (spin coating, wet etching)

Perfect alignment between grid holes and pixel pads

No pillars dead areas - Flexible design

NIKHEF

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2. Discharge protection NIKHEF

Discharges - melt pixel pad

- damage Grid

1 μm thin gridAluminum Tf ~ 660 °C

Proposals:Resistive layer, RPC principle

SiProtMulti-stage amplification

TwinGrid

Page 5: Recent progress towards a Pixel-TPC 1. Objectives 2. New Structures (Ingrid,Twingrid,…) + Discharge Protection 3. Gas Studies 4. Testbeam at DESY (Medipix+3GEM)

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2. Discharge protection NIKHEF

Gain in Ar 20 iso

1.E+02

1.E+03

1.E+04

1.E+05

1.E+06

1.E+07

1.E+08

300 400 500 600

V grid (V)G

ain Unprotected

Protected

Protected

First results fromresistive layer:

First result from 2-stage amplification(Twingrid)

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3. Gas Studies Saclay

Complementary approach to fight the sparks in Micromegas structures:

• finding a gas mixture for optimal stability• damping the sparks (specific supply circuit)

Comprehensive study started

•Standard” 50 m mesh of 10 cm x 10 cm size

• Sources: - Fe 55 (5.9 keV) - COOL-X (8.1 keV)

• Monitoring of: - pressure - H2O

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3. Gas Studies Saclay

100

1000

10000

100000

50 55 60 65 70 75 80 85 90 95 100

Mesh biais (kV/ cm/ atm)

Gai

n

Iso : 1%Iso : 2%Iso : 3%Iso : 4%Iso : 5%CF4 : 3%, Iso : 1%CF4 : 3%, Iso : 2%CF4 : 3%, Iso : 3%CH4 : 6.5%CH4 : 8%CH4 : 9%CH4 : 10%CH4 : 8%, CF4 : 3%CH4 : 8%, CF4 : 5%CH4 : 8%, CF4: 10%CH4 : 10%, CF4 : 3%CH4 : 5%, CO2 : 3%CH4 : 10%, CO2 : 10%CO2 : 10%CO2 : 20%CO2 : 30%CO2 : 10%, Iso 2%CO2 : 10%, Iso 5%CO2 : 10%, Iso 10%CF4 : 3%, CO2 : 1%CF4 : 3%, CO2 : 3%CF4 : 3%, CO2 : 5%Iso : 2%, CH4 : 10%Iso : 5%, CH4 : 10%Iso : 10%, CH4 : 10%Ethane 10%Ethane 5%Ethane 3.5%Ethane 2%Ethane 3.5% - CO2 10%Ethane 3.5% - CF4 3%Ethane 3.5% - CF4 10%Ethane 3.5% - Iso 2%

Mixtures of gases containing argonMesh : 50 m gap of 10x10 size

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Saclay

• Study of detector-to-detector gain homogeneity

•Measurement of ions backflow using various InGrid geometries

• We are ready to test TimePix in gas

• Future activities and development in Saclaydesign for a Mini-chamber using Medipix2 readout chipSiTPC endplate for the Large Prototype

Field cage

Box

Micromegasmesh

Windows for source

3. Further activities at Saclay

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4. Testbeam at DESY: 3-GEM+MedipixFreiburgBonn

4 weeks of beam test in September/OctoberVery good support from DESY testbeam support : thanks to N.Meyners et al!Use ZEUS Silicon telescope: thanks to U.Kötz,I.Gregor,J.Stzuk!Support of DESY FLC group : thanks to M.Janssen et al!(NB: a pity that we were all German – would have been a nice TA1 usage, will organize at the European level next time…)

THE BEAM: 5GeV eTHE BEAM: 5GeV e--

The setup:(top view)

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4. Testbeam at DESY: 3-GEM+MedipixFreiburgBonn

Typical events (have ~100.000 tracks on tape)

raw events after some cleaning andcluster finding(remove isolated pixels)

ArCO2, ΔVGEM=404V

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4. Testbeam at DESY: 3-GEM+MedipixFreiburgBonn

Preliminary point resolutions (averaged over all drift distances)

44

48

52

56

60

64

68

72

76

3-point

mean

corr

mean

mean

(2-2-1)

mean

(1-1-1)

428V428V404 V

404 V

He/CO2He/CO

2

Ar/CO2

VGEM

m] Ar/CO

2

preliminarymixing ratio of the gases 70/30

e- from 106Ru--decay

DESY

5GeV e-

Resolutions in testbeam consistent with mult.-scatt. corrected resolutionsfrom 106Ru (2 MeV e-)

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4. Testbeam at DESY: 3-GEM+MedipixFreiburgBonn

Preliminary point resolutions: as a function of drift distance:

-2000 0 2000 4000 6000 80000

1000

2000

3000

4000

5000

-2 0 2 4 6 8

me

an [

µm

2 ]

Drift length y [mm]

=(31±5)2µm2

Drift length y [µm]

preliminary

0 1000 2000 3000 4000 5000 6000 70000

500

1000

1500

2000

2500

3000

3500

4000

45000 1 2 3 4 5 6 7

preliminary

me

an [

µm

2 ]

=(29±4)2µm2

Drift length y [µm]

Drift length y [mm]

0 (ArCO2, 2-2-1) = 375 m2

Lots of data to be analyzedStill the same Medipix chip as 1.5 years agoPrepare for Testbeam with Timepix in same setup a.s.a.p.

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4. Testbeam at DESY: 3-GEM+MedipixFreiburgBonn

Lots of data to be analyzedStill the same Medipix chip as 1.5 years agoPrepare for Testbeam with Timepix in same setup a.s.a.p.

two tracks, d<1mm

hard electron

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5. Simulations for Testbeam CERN

Generates ionization clusters/electrons along tracks anddrifts electrons towards GEMs/MicroMegas structures HEED (I. Smirnov) for cluster generation (incl. -electrons, mult. scat.) MAGBOLTZ (S. Biagi) for gas properties (diffusion, drift velocity)

“Squeeze” electrons through GEM/MicroMegas holes andperform gas amplification use simple geometric transformations, no detailed E-field simulation exponential gas gain distribution

Drift ALL electrons created in gas amplification to next GEMor MediPix (can be several Millions in total)

Count electrons collected on MediPix,generate noise + apply detection thresholds (digitization step)

CLUSCO (M. Hauschild)

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5. Simulations for Testbeam CERN

Very different primary cluster density

Ar/CO2 (70/30): 40.0cl./cm

He/CO2 (70/30): 18.4 cl./cm

Reconstructed cluster density very similar

Ar/CO2 (70/30): 6.3 cl./cm

He/CO2 (70/30): 6.2 cl./cm

ArCO2

ArCO2

HeCO2

HeCO2

Cluster densities:

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5. Simulations for Testbeam CERN

Single point resolutions:

• 0 quite similar to TB data• resolution numbers for larger drift distances (still) somewhat larger• no huge differences between ArCO2 and HeCo2 in resolution (~roughly in agreement with TB data)• no huge difference between 1-2-2 and 1-1-1 setup (in agreement with TB data)

Ar/CH4/CO2 (93/5/2) and Ar/CO2/CF4 (90/5/5) mixtures have ~2x worse resolutions than Ar/CO2 or He/CO2

large diffusion in drift region and transfer regionlarge blobs

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6. Summary and Plans

• Pixelized Readout of Micropattern Gas Detectors has been shown to be a quite attractive scheme to arrive at the BPLCTPC (=best possible linear collider TPC)

• Timepix appears to be operational! (=milestone)

• Good progress to understand the properties of this scheme - gas mixtures - integrated devices (INGrids) - simulation - first beamtest successful

• we are eagerly awaiting first Timepix samples for tests in detectors

• can start planning of a module for the EUDET infrastructure (in addition, small scale tests will of course continue)

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SiTPC is on track

7. Executive Summary