Real World PCB & ECAT Consultation IBM PCB Symposium€¦ · Early involvement, NPI and PLM Consultation (IPD, DoX & DfSC ) Engineering and Manufacturing Best -Practices Electrical

© 2011 IBM Corporation

IBM Engineering ServicesIBM Engineering Services

DRAFTDONOTDISTRIBUTE

Real World PCB & ECAT ConsultationReal World PCB & ECAT ConsultationIBM PCB SymposiumIBM PCB SymposiumNovember 2011November 2011

© 2011 IBM Corporation2


OutlineOutline

•• IBM Engineering Services OverviewIBM Engineering Services Overview

•• Test CasesTest Cases

•• Field Burns and Field Burns AvoidedField Burns and Field Burns Avoided

•• Laminate Circumferential CracksLaminate Circumferential Cracks

•• CAF StudyCAF Study

•• Technical ScopeTechnical Scope

•• Design Design GRsGRs and DFM and DFM

•• Testing and Qualification Testing and Qualification

•• SummarySummary



IBM Engineering Services OverviewIBM Engineering Services Overview

�� Engineering Services Scope Engineering Services Scope

�� OPsOPs TransformationsTransformations

�� Early involvement, NPI and PLM Consultation (IPD, Early involvement, NPI and PLM Consultation (IPD, DoXDoX & & DfSCDfSC))

�� Engineering and Manufacturing BestEngineering and Manufacturing Best--PracticesPractices

�� Electrical (components, PCB, ECAT, SI), Mechanical, Thermal, PowElectrical (components, PCB, ECAT, SI), Mechanical, Thermal, Power er

(AC & DC), FCT, and Manufacturing(AC & DC), FCT, and Manufacturing

�� Strategic Supplier, OEM and SubStrategic Supplier, OEM and Sub--tier SC Consultationtier SC Consultation

�� t=0 Testing & Reliability Test and Qualificationt=0 Testing & Reliability Test and Qualification

�� QMS & SQM (inc. DOX & LSS)QMS & SQM (inc. DOX & LSS)

�� CostCost--DownDown-- Estimation & Reduction ConsultationEstimation & Reduction Consultation

�� Field and Warranty BestField and Warranty Best--PracticesPractices



Tools & Databases� EWS—Early Warning System to

predict quality

� CI—Continued Intelligence, an

integration of EWS and other

tools used in Engineering

� ANSYS finite-element modeling

tool for thermal/mechanical

analysis

� Cadence Allegro for RF/mixed-

signal design

� Commodity market price dB

� Costimator cost engineering tools

� Environmental compliance dB

(EMARS / CRS)

� HPSS high-frequency analog

modeling tool

� Materials and Process

Engineering lab (RTP,

Poughkeepsie, Rochester) (mass

spec., FTIR, SEM, EDACs, XRF,

Thermal/mechanical, Differential

Scanning Calorimetry)

� Memory test lab

� Part number technical dB

(quality, reliability, approved

applications)

� xPlore component dB &

associated tools (supplier

problem log, PCNs, TQA, QIN,

environmental data, SQUIT,

EWS)

Capabilities� BoM optimization

� Classical testing (shock/vibration)

� Compliance testing (environmental;

UL / EMI / FCC)

� Design Reviews (function, cost,

manufacturability, yield, reliability)

� End-of-Life management

� Engineering Change management

� Failure analysis & constructional

analysis

� Improve mfg. operations

� Manage mfg. exceptions and

excursions

� Manage warranty processes

(RMAs, F/A, FMEAs)

� New Product Introduction (release

to mfg. and volume ramp-up)

� Rapid-response alternate sourcing

for continuity of supply

� Supplier Audits and Qualifications

� Supplier Relationship Management

(business and technical)

� Supply-chain reviews (supplier

readiness, manufacturing

readiness)

� Technical Project Management

� Technology Qualifications

� Test development & test

engineering

� Training / education (business and

technical)

Areas of Expertise� Bond / Assembly / Test (0th & 1st

levels)

� Electronic assembly (1st & 2nd

levels)

� Commercial Procurement:

sourcing, purchasing strategies,

negotiation methodologies, contract

writing, contract execution,

relationship management

� Cost engineering

� DOX & LSS

� Electronic commodities function,

quality, & reliability

� Environmental compliance

technology and legislation

� Final product packaging/shipping

� Market Intelligence:

industry/technology roadmaps,

supplier capabilities, pricing, market

analysis

� Mechanical assemblies

� Mfg. change management

(configurations, ECs)

� Mfg. quality systems

� Pb-free assembly

� Power

� Printed Circuit Board manufacturing

� Reliability modeling

� Statistical Process Control

� Supplier Quality Management

� Test engineering

� Thermal engineering

Global Resources� Local & regional business

relationships

� Local Commercial Procurement

staff

� Local Procurement Engineering

staff

� Local technical auditing staff

� Local native-language speakers

� Global communications systems

� LEO Supplier Training

IBM Engineering Services Menu of ExpertiseIBM Engineering Services Menu of ExpertiseIBM Engineering Services OverviewIBM Engineering Services Overview-- Menu of ExpertiseMenu of Expertise



IBM Engineering Services PCB Consultation Overview IBM Engineering Services PCB Consultation Overview

• Three IBM PCB supplier ‘up the curve’ technology qualification services projects to date• Multiple IBM ECAT supplier technology qualification projects• >50 third party system NPI and Transformation consultation projects



Test Cases (prior / current engagements) Test Cases (prior / current engagements)

• Field Burns and Field Burns Avoided (Paul Michels, Tim Younger, Brian Olson)

Problem Overview: Problem Overview: An IBM Blade Sever (MSA) Technology An IBM Blade Sever (MSA) Technology

B2P & licensed to an OEM. OEMB2P & licensed to an OEM. OEM’’s s

systems experienced >12x smoke systems experienced >12x smoke

incidents. IBMincidents. IBM’’s systems experienced s systems experienced

zero smoke. zero smoke.

Products Affected:Products Affected: OEM Blade ServersOEM Blade Servers

Failure Symptoms: Failure Symptoms: OEM Smoke IncidentOEM Smoke Incident

Exposure:Exposure: OEM => catastrophic; IBM => no OEM => catastrophic; IBM => no

exposureexposure

Impact:Impact: OEM => comprehensive field roll post OEM => comprehensive field roll post

C/A; IBM => no impactC/A; IBM => no impact

Root Cause:Root Cause: Improperly Improperly specspec’’dd & qualified PCB & qualified PCB

laminatelaminate




• Laminate Circumferential Cracks (Bruce Chamberlain, Ahmad Katnani)




• CAF Study (John Wilson, Jeff Taylor, Steve Cain, Brian Carlson, Wayne Rothschild)

Objective => establish reliability models for CAF f-modes; validate CAF reliability impact









� � � � Time to failure is a function of Temp, RH, bias voltage and spacing between conductors

� � � � Time to failure decreases as temperature increases from low temp to 68c and then time to failure increases as temp moves above 68c

� � � � Time to failure decreases as Relative Humidity increases

� � � � Time to failure decreases as bias voltage increases

� � � � Time to failure decreases as spacing between conductors decreases

� � � � High acceleration for temperature and relative humidity

� � � � No Relative Humidity Threshold



Engineering Services for ServerEngineering Services for Server--class PCB Consultation class PCB Consultation



Technical Scope Technical Scope

• Testing and Qualification (example IBM Specifications and Industry Standards)




• Testing and Qualification Lab

Nondestructive Failure Analysis

– Optical Inspection• ERSAScope

• AutoMontage

– Scanning Acoustic Microscopy (SAM)

– Vibrometer

– Thermal Imaging

– Time Domain Reflectometry (TDR)

– XRAY• 2D

• 3D

– Fourier Transform Infrared spectrometer (FTIR)

– Replacement of Suspect Module

Nondestructive Characterization

– Shadow Moire

– Coordinate Measurement Machine (CMM)

Bridge Material Flattened

0.00

0.05

0.10

0.15

Lo

g

Card 1 Site 28 Reference 1

0.0

0.2

0.4

0.6

Lo

g

Brighter Copper Area

0.0

0.2

0.4

Lo

g

Rosin acids, Pinus pinea

0.5

1.0

Ab

s 1000 1500 2000 2500 3000 3500

Wavenumbers (cm-1)




• Testing and Qualification Lab

Destructive Failure Analysis

– Dye Penetrant Testing

• Penetrating Dye • Fluorescent Dye

– Cross Section

– Scanning Electron Microscope/Energy Dispersive Using X-Ray Analysis (SEM/EDX)

– Electron Spectroscopy for Chemical Analysis (ESCA)

Destructive Characterization

– Environmental / Mechanical Stress Testing

• Accelerated Thermal Cycling (ATC)

• Power Cycling / Power Aging• Temperature & Humidity (T&H) with or without Bias• Shock & Vibration (S&V)• High Temperature Storage (HTS)• Bend Test• Knockoff test (Heatsink)

– Cross Sectional Moire

– Digital Image Correlation (DIC)



SummarySummary

IBM Engineering Services can provide PCB designers, IBM Engineering Services can provide PCB designers, fabricators/suppliers, fabricators/suppliers, CMsCMs and users with broad and deep subject and users with broad and deep subject matter expertise in tactical to strategic scope across global bomatter expertise in tactical to strategic scope across global boundaries undaries and in all PCB, interconnect and connector technologies.and in all PCB, interconnect and connector technologies.

IBM can support clientIBM can support client’’s (suppliers (supplier--clients) development of new clients) development of new technologies and capabilities to intersect with internal client technologies and capabilities to intersect with internal client and/or and/or industry roadmaps, supporting qualifications at new, expanded anindustry roadmaps, supporting qualifications at new, expanded and/or d/or higher technology levels.higher technology levels.



Contact

Eric Kline

Senior Engineer, Lead TPM and New Business Dev Mgr, BlackBelt, Master Innovator, ISC Innovation Champion

ISC Engineering Services

[email protected]

507-253-5930

Documents

Real World PCB & ECAT Consultation IBM PCB Symposium€¦ · Early involvement, NPI and PLM Consultation (IPD, DoX & DfSC ) Engineering and Manufacturing Best -Practices Electrical