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www.lpkf.com Your LPKF-Distributor
Germany (Headquarters)LPKF Laser & Electronics AGOsteriede 730827 GarbsenGERMANYPhone +49-5131-7095-0Fax +49-5131-7095-90e-mail [email protected] info www.lpkf.com
FrankreichLPKF France S.A.R.L.Z.A. de l’Églantier21 Rue des Cerisiers(C.E. 1514 Lisses)91015 Evry CedexFRANCEPhone +33-1-60862691Fax +33-1-60869622e-mail [email protected]
SlowenienLPKF Laser & Elektronika d.o.o.Planina 34000 KranjSLOVENIAPhone +386-4-2013800Fax +386-4-2013820e-mail [email protected] info www.lpkf.si
SpainLPKF Laser & Electronics Spain, S.L.Apartado Nr. 128791 Soto del Real (Madrid)Madrid/SPAINPhone +34-91-8475505Fax +34-91-8475522e-mail [email protected] info www.lpkfspain.com
UK/IrelandLPKF Laser & Electronics Ltd.Coppid Beech Lane, WokinghamBerkshire-RG40 1PDGREAT BRITAINPhone +44-1344-455046Fax +44-1344-860547e-mail [email protected] info www.lpkf.co.uk
North AmericaLPKF Laser & Electronics28220 SW Boberg Rd.P.O. Box 3858Wilsonville, OR 97070USAPhone +1-503-454-4200Fax +1-503-683-7151e-mail [email protected] info www.lpkfusa.com
LPKF distribution network
LPKF Headquarters
LPKF Distribution and
production facilities
LPKF Distributors
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ChinaLPKF Tianjin Co., Ltd.No. 1 Building, Xing Nan Cun,Ke Yan Xi Road, Nan Kai District,Tianjin, 300192PEOPLE'S REPUBLIC OF CHINAPhone +86-22-23005700Fax +86-22-23006965e-mail [email protected]
JapanLPKF Japan Co., Ltd.Yoyogi 5-8-5-304Shibuya-kuTokyo 151000JAPANPhone +81-3-34657105Fax +81-3-34676159e-mail [email protected] info www.lpkf.co.jp
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PRODUCT CATALOG 02/03
RAPID PCB PROTOTYPING
Customer Service (Free advice/support)Germany +49-5131-7095-0China +86-22-23005700 France +33-1-60862691Japan +81-3-34657105
Slovenia +386-4-2013804Spain +34-91-8475505UK/Ireland +44-1344-455046North America +1-503-454-4229
(8 am - 5 pm PST)
LPKF Produktkatalog Umschlag GB 23.04.2003 12:48 Uhr Seite 1
Index
4-layer multilayer6-layer multilayer8-layer multilayerAccessoriesAluminum ApplicationsAutoContacAutomatic tool changeAutoSwitchBase materialsBGA PlacerBoardMasterBrassBuild-up method (sequential)CAD (please use also EDA)CAM StationChemical setsCircuit board plotterCircuitCAMCompressed airCompressorConductive pasteConsumablesContacContact printingContour generatorConvection ovenCustom drill bitsCustom toolsCustomer service lineData conversionData exportData formatsData importDepanelizationDispensingDistribution networkDouble sided printingDrill bitDrill dataDrilling machineDust extractionEasyContacEasySolderEditing capabilitiesEndmillEngravingFine-pitch printingFlex boardsFlexible circuitsFlex-rigid boardsFoil engravingFront panelsFully automaticGalvanicGerberHead lightingHousingInstallationInsulation processLaser
Solder paste printingSound enclosurSpecial applicationsSpindleStarter packsStencil printerStencil printingTech supportTest adapterThrough hole platingTinningTool libraryTool managementTool ring setToolsTrainingTrainingUniversal cutterVacuum table (H100)Working depth limiterWYSIWYGZelFlexZelFlowZelPlaceZelPrint
LayoutMeasurement microscopeMicro cutterMicrometer screwMicrowave circuitsMicrowave layoutMicrowave prototypeMilling bitMiniContacMultilayer boardsMultiPressPastePCB drillingPCB millingPCB post processingPCB prototypePlastic / compositePlastic engravingPneumatic Z-axisPost processing of:· populated boards· bare boardsPrintingProgram wizardProtoLaserProtoMat®
ProtoMat® 95s/IIProtoMat® C100/HFProtoMat® C20ProtoMat® C40ProtoMat® C60ProtoMat® H100ProtoMat® L60ProtoMat® M30sProtoMat® M60ProtoMat® X60PrototypesQuality featuresQuick release colletQuick release frameReflow ovenRegistration pin methodReverse pulse platingRF circuitsRF layoutsRF prototypesRF-EndmillRivetsRoutingSatusLightScreen-printingServiceSet pin systemSign engravingSMD assemblySMD fine pitch printingSMD metal stencilsSMD polymer stencilsSMD solder paste stencilsSoftware upgradeSolder mask
31, 32, 33, 4031, 32, 33, 4031, 32, 33, 4024, 428, 14, 16, 206, 14, 16, 18, 20, 216, 281824394712732101141131025256, 2838294310, 112537351310101010, 1196, 8, 286143351014246, 2734, 4210368, 943888, 2098186, 2910 ff268181121, 54
102436267, 141111, 143529, 417, 31, 32, 33, 39, 4031, 424297968813, 14, 26
9, 209, 2043 ff102114187, 14141414181616162061313, 144553337, 297, 14117, 1436, 386, 277, 2025431313, 38747435454, 95410, 117, 28
43248263813431396, 27 ff30, 4112122535, 381413,183618261245534743
61Index
LPKF Produktkatalog Umschlag GB 23.04.2003 12:48 Uhr Seite 2
The Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2In-house Rapid PCB Prototyping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4Utilization of LPKF Systems in the Conventional PCB Process . . . . . . . . . .5Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Software Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
LPKF CircuitCAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10LPKF BoardMaster . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
LPKF Circuit Board PlotterQuality Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13LPKF ProtoMat® C-Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14LPKF ProtoMat® M/L-Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16LPKF ProtoMat® H-Series (Fully Automatic) . . . . . . . . . . . . . . . . . . . . .18LPKF ProtoMat® X-Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20LPKF ProtoLaser . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21Accessories/Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
LPKF Through-Hole Plating TechnologyRivets (LPKF EasyContac) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27Conductive Paste (LPKF AutoContac) . . . . . . . . . . . . . . . . . . . . . . . . .28Electro Plating (LPKF Contac III, MiniContac III & MiniContac III/HF) . . .29
LPKF Multilayer TechnologyMultilayer Press (LPKF MultiPress II) . . . . . . . . . . . . . . . . . . . . . . . . .31· Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
LPKF Solder Mask (LPKF EasySolder) . . . . . . . . . . . . . . . . . . . . . . . . .34Tools (Mill and Drill Bits) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35Consumables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38Surface Mount Technology (SMT)
Solder Paste Printing (LPKF ZelPrint) . . . . . . . . . . . . . . . . . . . . . . . .43Quick-Release Stencil Frames (LPKF ZelFlex) . . . . . . . . . . . . . . . . . . .45Assembly (LPKF ZelPlace & BGA Placer) . . . . . . . . . . . . . . . . . . . . . .47Reflow Oven (LPKF ZelFlow) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Other LPKF Product Lines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54Imprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56Contact Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
1Contents
Contents
LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 1
The Company
Tradition and innovationFounded in the seventies, LPKF quickly established a reputation forinnovation by launching new chemical free methods for producingprototype circuit boards. The CAD-supported milling techniqueestablished itself with electronic design engineers worldwide as aclean, efficient and environmentally friendly alternative to chemicaletching. Revolutionary when first introduced, it is now an industrystandard method throughout the world.
Success led to expansion and the opening of branch officesworldwide at an early stage. LPKF gained customers in all sectorsfrom one-man operations to major international corporations. With abroad spectrum of products and services, LPKF covers all aspectsof the in-house prototyping chain. In the beginning of the nineties,the range of products and services was significantly expanded withthe development of laser systems for making ultra-fine circuitboards followed by, the now well known, stencil laser for makingSMD paste stencils.
The company is now the world market leader for in-house “RapidPCB Prototyping” and “StencilLasers”. This status is attributable tothe company’s future-oriented product policy, large investment inR&D and the highest quality standards.
Proactively shaping marketsSpecialists in a wide range of fields continuously analyze theprinted circuit board market to identify trends and set new industrystandards for accuracy and performance. This is highlighted by themajor commitment to research and development resulting in thelarge number of patents registered in recent years. In addition, thecontinuous exchange of information between clients and LPKF’sR&D departments emphasizes the innovative power of the companyand the focus on user-oriented solutions. The aim is, by using LPKFproducts, to optimize important commercial factors for its clientssuch as time-to-market, reduction of outside service cost andflexibility through independence.
2 The Company
LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 2
Precision based on qualityFiner and finer structures and high density packaging are only feasible with thehighest levels of precision. This requires machines for PCB prototypingand production alike to be extremely precise to meet thesedemands. LPKF develops and manufactures almost everycomponent in its machines and systems. The result is aperfect synthesis of quality and high-tech: this applies tothe materials used as well as the manufacturing process.LPKF’s quality management has been certified to ISO 9001:2000.
Over 26 years experience in printed
circuit board technology
LPKF milling technology:
An efficient alternative to chemical
etching
Complete in-house Rapid PCB
Prototyping
Identifying trends, setting new
standards
Innovation through exchange of
ideas with customers
Individually tailored solution packages
for future-oriented customers
Global service network
Perfect synthesis of quality and
high-tech
ISO 9001:2000 certified supplier
Package solutionsLPKF is far more than a supplier of high-end solutions: clients around the world in a widespectrum of industry sectors also benefit from the company’s broad expertise in all aspectsof printed circuit boards. LPKF supplies individually tailored solution packages enabling itsclients to profit from rapid, flexible and independent production processes. In addition tothe machines themselves, this is accomplished with LPKF’s comprehensive consultingservices and supply of superior tools and consumables for every day jobs. The completerange of products in the LPKF Rapid PCB Prototyping segment includes circuit boardplotters, through-hole plating systems, SMD solder paste printers, component placementsystems, reflow ovens and a wide range of accessories.
The global service network keeps LPKF close to its customers and shows thecommitment to excellent customer service.
3The Company
to DIN EN ISO 9001
Certified by
LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 3
In-house Rapid PCB Prototyping
Subject to technical modifications. See imprint for details.
4 In-house Rapid PCB Prototyping
CAM (CircuitCAM/BoardMaster)
LPKFss/ds withoutthrough-hole plating
LPKFss/ds with galvanicthrough-hole plating
LPKFss/ds withmechanicalthrough-hole plating
LPKFss/ds withconductive pastethrough-hole plating
LPKFMultilayer
Structuring the internal layers
Bonding the layers
Galvanic through-hole plating
Structuring
Contour routing
Conductive paste plating
Solder mask
Tin plating
Mechanical through-hole plating
DrillingDrilling
CAM (CircuitCAM/BoardMaster)
Structuring of outer layers
Prototype printed circuit board
Contour routing
Optional
LPKF PCB Prototyping Milling Technology
ss – single-sided circuit boardds – double-sided circuit boardpth – plated through holenpth – non-plated through hole
LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 4
Subject to technical modifications. See imprint for details.
Use in conventional PCB production
5Use in conventional series production
CAM (CircuitCAM/BoardMaster)
Creating negative artwork film
Exposing photo resist
Developing photo resist
Rinsing circuit board
Drilling pth Drilling npth
Deburring
Cleaning
Laminating
Creating negative artwork film
Exposing photo resist
Developing photo resist
Rinsing circuit board
Pb/Sn
Resist stripping
Etching, rinsing, cleaning, drying
Galvanic through-hole plating
Resist stripping
Differential etching, rinsing, cleaning, drying
Pb/Sn resist
Drilling npth
Contour routing
Solder mask
De-panelling
Solder paste printing
Assembling (SMD, BGA)
Reflow soldering
Bonding the layers
Etching, rinsing, cleaning, drying
Drilling pth
Deburring
Cleaning
Galvanic through-hole plating
Desmearing etch-back
Creating negative artwork film
Exposing photo resist
Developing photo resist
Rinsing circuit board
Etching, rinsing, cleaning, drying
Resist stripping
Tin plating
ss/ds withthrough-hole plating(photo resist)
ss/ds withthrough-hole plating(Pb/Sn) (metaletching resist)
ss/ds withthrough-hole plating(tenting technology)
ss/ds withthrough-hole plating(metal etchingresist) Multilayer
Laminating
ss/ds withoutthrough-hole plating
Use of LPKF systems in conventional PCB production
LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 5
Prototype circuit boards with up to 8 layers
Use of circuit board plotters for Rapid PCB Prototyping
100 µm (4 mil) track and gap150 µm (6 mil) hole diametersThe electrical characteristics of the prototype can be accurately produced from the designdata. This is guaranteed by the precise reproduction of the geometrical properties by theLPKF circuit board plotters. The capability to create 100 µm (4 mil) tracks and gaps as wellas 150 µm (6 mil) holes enables the production of state-of-the-art circuits including BGAand fine-pitch SMD components.
LPKF ProtoMats have a broad range of applications: an enormous spectrum of rigid andflexible materials, as well as soft substrates for RF and microwave technology, can easily bemachined to produce prototype boards of production quality.
Through-hole platingAn essential part of most prototype boards are through-hole connections. LPKF offersalternative methods including: Rivets (LPKF EasyContac), conductive paste (LPKFAutoContac) and galvanic through-hole plating (LPKF MiniContac III and Contac III).
Through-hole plating with rivetsThe LPKF EasyContac system is a simple, low cost method for through-hole platingon less complex circuit boards. The process uses rivets, manually inserted with aspecial tool and then soldered. This through-hole plating method is suitable forlow-density circuit boards with up to 50 via holes.
ElectroplatingLPKF offers two different sized electroplating systems – LPKF Contac III andMiniContac III. These galvanic through-hole plating systems were specially develo-ped to provide in-house plating solutions without compromising layout density orlimiting design rules. The process takes 60 - 120 min and produces production qua-lity through-hole plating. Holes as small as 0.2 mm (8 mil) are easily plated andthere is no limit to the number of holes.
Through-hole plating with conductive pasteA dispenser mounted on the head of the LPKF circuit board plotter automaticallyinjects a special conductive paste into the holes of the board and then vacuumsout the excess paste leaving an open hole.
The paste is cured in a convection oven and creates a plated through-hole thatis solderable and can be populated with wired components. LPKF AutoContac issuitable for low-density circuit boards with up to 300 via holes with diameters of0.5 mm - 1.4 mm (20 mil - 55 mil).
Applications
Subject to technical modifications. See imprint for details.
6 Applications
LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 6
Subject to technical modifications. See imprint for details.
Production of multilayer circuit boardsMultilayer circuit boards can easily be produced in house using LPKF solutions. Today theproduction of 8-layer multilayers in ultra-fine technology is becoming a standard require-ment as much as simple double sided boards. In the production of multilayer circuit boardsin particular, electroplating systems (Contac III or MiniContac III) combined with the LPKFMultiPress II, are the backbone of the cost and time saving production of such complexprototype circuit boards.
RF and microwave circuitsDesigners of RF and microwave circuits often require a substantial number of differentprototype boards during a development project, all made with superior accuracy. Only somePCB manufacturers are set up to produce boards on special RF substrates and some of thechemical methods used are unable to provide the precise geometries required.
The LPKF ProtoMat® C100/HF was developed specifically for the RF and microwave market. It mostly uses custom designed precision tools to guarantee straight sidewalls andminimum penetration into the substrate.
Prototypes can be quickly produced for testing as soon as the design is complete, thensmall batches can also be economically made with this machine. The LPKF ProtoMat®
C100/HF easily handles all common RF substrates including PTFE and ceramic filledsubstrates (RO® 4000).
Routing slots, cut outs and board profileThe routing of slots, cut-outs and board contours or larger openings or routing of circuitboard contour to depanelize it from sheet material is no problem even with complex shapes.
Solder maskSolder masks are used in PCB mass production to increase soldering precision and protectthe boards from environmental influences. With LPKF EasySolder, LPKF has developed aneasy, inexpensive method of producing instant solder masks for prototype boards using theLPKF circuit board plotter. The mask is simply cut into an adhesive polymer material andthen bonded to the finished board.
Reverse pulse platingThe introduction of reverse pulse plating (RPP) in 2003 has considerably improvedthe quality of through-hole plating. This method guarantees uniform platingthickness in the entire hole and allows plating of more difficult aspect ratios. The “bone effect” (thicker plating at the top and bottom of the hole) is now a thingof the past. This technology is based on accurately timed reverse pulsing (anodicpolarisation of the circuit board) which precisely ablates excess material to givesmoother plating.
7Applications
LPKF Produktkatalog GB 23.04.2003 12:30 Uhr Seite 7
Flexible circuit boardsWith LPKF’s patented non-contact air bearing it is possible to process a wide range offlexible circuit materials. The crucial factor in this application is the ratio of flexiblematerial thickness to the copper layer thickness but many flexible circuits have been proto-typed on an LPKF circuit board plotter equipped with this device.
Rigid-flex circuit boardsLPKF circuit board plotters have a proven track record in the production of rigid-flex circuitboards. In small batch production as well as prototyping, the LPKF circuit board plotterswith non-contact air bearing (LPKF ProtoMat® C100/HF, H100, 95s/II and X60) highlightthe benefits of defined depth milling. Prototyping of rigid-flex circuit boards is completedquickly and easily with these machines.
Front panels and sign productionLPKF circuit board plotters can also be used for engraving and routing front panels andsigns. These high-precision systems open up numerous options for the very fine machiningof various materials, e.g.:· Plastic· Plexiglass· Aluminum· Brass, and many more.
HousingsThe multi-functional character of LPKF circuit board plotters in electronics development isalso highlighted by their ability to machine other parts such as housings. This involves theuse of different tools to suit the materials used.
Special Applications
DispensingWith the LPKF AutoContac system fitted onto an LPKF circuit board plotter it is possible todispense media of various kinds including solder paste, adhesive, conductive paste andsealing compounds.
Subject to technical modifications. See imprint for details.
8 Applications
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 8
Subject to technical modifications. See imprint for details.
Perhaps you have come up with a new idea, or want to machine other new materials. Maybeyou have a special application but have not yet found a solution, simply give us a call! Our application engineers are happy to perform tests and help you find the solutions to yourproblems any time.
Reworking assembled/unassembled circuit boardsLPKF circuit board plotters can be used in numerous positions of PCB production lines andeasily integrated. LPKF ProtoMat® systems are ideal and cost-effective additions tocongested production lines particularly for the de-panelling of circuits (LPKF ProtoMat®
X60), or the subsequent creation of holes and openings after board manufacture. Other usesinclude configuring or coding, e.g. by removing a plated hole or by severing one or moretracks. LPKF systems can also be used to rework circuit boards, which have been producedby etching.
Solder frames and inspection templatesA crucial aspect in the production of solder frames and inspection templates is precisemachining of the carrier materials to ensure a perfect fit with the mass production circuitboards. This is another ideal area of application for LPKF circuit board plotters.
Milling and engraving of special films and instant solder masksLPKF circuit board plotters can be used to produce precision artwork for the mass produc-tion of circuit boards. This saves the expense of buying and running a photoplotter or thecost of using an outside service.
The ability to cut very precisely defined openings in special films opens up other areasof application for LPKF circuit board plotters including the production of:· Instant solder mask· Prototype SMD stencils for the application of solder paste on prototype printed circuit
boards using the printing machine LPKF ZelPrint LT300
Drilling circuit boards or test adaptersLPKF circuit board plotters can be used as CNC drilling machines. The software suppliedwith each circuit board plotter system can read in drilling co-ordinates from circuit boardsif no data is available by using a camera (LPKF CircuitView) in conjunction with the teach-inmethod. Test adapters for the pinhole bed of automatic circuit board testers can be drilledor milled in materials such as plexiglass, Pertinax and antistatic fiberglass reinforced epoxyoften used for vacuum test adapters.
Use of circuit board plotters in PCB production
!
9Applications
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 9
Software package (LPKF CircuitCAM & BoardMaster)
Each LPKF circuit board plotter is delivered complete with a comprehensive software package for the import ofdata from any PCB layout CAD package and control of the machine itself. The development of the softwarefocused on three key aspects: simple operation, perfect match to the hardware, and compatibility with allstandard CAD programs. This ensures an easy to learn, easy to use and compatible package.
Plug & Play for a fast start
• Data input: Gerber®, GerberX, HP-GL™, Excellon®, Sieb & Meier, DXF, Barco®, ODB++®
• Data output: Gerber®, GerberX, HP-GL™, LMD, Excellon® formats
• Intelligent insulation: This process guarantees removal of copper using various automatic and individually adjustable insulation options, which optimize milling time and tool life, with up to four different tools per insulation strategy and freely definable rub-outs – including polygons
• Design rule check: Automatic checking of track/gap spaces• Auto contour routing: Automatic generation of routing path
with definable breakout tabs• Auto ground plane: automatic generation of ground planes• Direct drawing input: Drawing of simple front panels or PCB’s• Editing: e.g. modifying line-widths, changing hole diameters,
shifting holes, add copper areas, etc.• The WIZARD: Integrated program assistant to guide the user
and cut the learning curve.• True type fonts: (TTF) in CircuitCAM text function• Auto assign: Automatic assignment of production phases/tools
for BoardMaster• Machining order control: Modification of cutting direction
and sequence
LPKF CircuitCAMThe software interface to your CAD/EDA system
Simple integrationLPKF CircuitCAM processes the same data, which would be sent tothe PCB manufacturer. The usual data flow does not need to bechanged. Automatic importing of the aperture tables and tool listsis followed by reading in of the Gerber and NC drilling files, whichare then graphically displayed on screen. LPKF CircuitCAM providesnumerous editing options for data modification (version-dependent):
LPKF CircuitCAM is one of the few user friendly programs offeringpowerful editing options for data modification. Its core is the intelli-gent insulation process used to produce the milling paths for theLPKF circuit board plotter.
Compatible with every standard CAD/EDACircuitCAM supports all standard data formats
CAD data accepted
· GERBER®
· Extended GERBER
(RS 274 X)
· DPF (BARCO®)
· EXCELLON
· SIEB & MEIER
· DXF
· HP-GL™
· ODB ++®
Simple and functionalLPKF CircuitCAM is very easy to operate via the Windows interfacethanks to its intelligent structure. Particularly fast and effectiveoperation through programmable tool bars and input instructions.A program assistant (Wizard) guides the user through the programsequence step by step: from importing data, through generation ofmilling/routing paths, to the export of production data. Even un-skilled users can rapidly learn this software and successfullygenerate the data for the circuit board plotter.
CircuitCAM
for Windows
· CAD data
importing and
editing
· Milling data and
routing path
generation
BoardMaster
for Windows
Controlling the LPKF
circuit board plotter
· Tool library
· Process control
Subject to technical modifications. See imprint for details.
10 Software package (LPKF CircuitCAM & BoardMaster)
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 10
Subject to technical modifications. See imprint for details.
High performance CAM stationWith LPKF CircuitCAM PCB software, the user also has access to an indepen-dent CAM station. This opens up a wide range of options: production datacontrol, editing, modification, step and repeat, different design rule checks,generation of ground planes or text in true type fonts as well as contour routingpaths. LPKF CircuitCAM PCB is also a very high-performance data converter,e.g. for the conversion of AutoCAD® DXF data into Gerber files.
Upgrading LPKF CircuitCAM LITE to PCB is possible any time for a single flatfee.
Import formats
Supported shapes
Export formats
Editing functions
Special functions
Display functions
Marker functions
Graphic functions
Control functions
Insulation methods
Insulation tools
Languages
Hardware and software
specifications
Supplied with
Gerber Standard (RS-274-D), Gerber Extended (RS-274-X),
Excellon NC Drill (version 1 and 2), Sieb & Meier NC Drill, HP-GL™
LPKF BoardMaster (LMD)
Contour routing path generator with breakout tabs
Measuring
1 - 2 tools
LPKF ProtoMat® C20, C40, M30/S
Specifications
Gerber Standard (RS-274-D), Gerber Extended (RS-274-X), Excellon NC Drill (version 1 and 2),
Sieb & Meier NC Drill, HP-GL™, Barco® DPF, AutoCAD™ DXF, ODB ++®
LPKF BoardMaster (LMD), Gerber Standard (RS-274-D), Gerber Extended (RS-274-X),
Excellon NC Drill, HP-GL™
Contour routing path generator with breakout tabs, volume operations, joining/separating objects,
step & repeat (multiple PCB), polygon cut-out, ground plane generation with defined clearance,
batch functions
Measuring, design rule check
1 - 4 tools
LPKF ProtoMat® C60, C100/HF, M60, 95s/II, H100, X60, L60, Upgrade from LITE available
LPKF CircuitCAM LITE LPKF CircuitCAM PCB
Circle, square, rectangle (also rounded or angled), octagon, oval, marker, IEC 1182 (1000 - 1024) including thermal reliefs, fiducials, etc., special (arbitrary
definable).
Original modification, relocating, duplicating, rotating, mirroring, erasing, extending/severing lines, line/path extension/shortening, line path/segment parallel
shifting, line path/object polygon conversion (Fill), curve linking/closing
Zoom window (freely definable), zoom in/out, overview, redraw, individual layers selectable/visible, panning (keyboard), layer in solid/outline/center line display,
16 pre-set colors (up to 16 million freely available), different colors for tracks and pads of the same layer, different colors for insulation tools
Single element, total layer, all layers, pad groups, selection and limiting to specific layers possible for lines/polygons/circles/rectangles/pads/holes (multiple choice
and restriction to specific layers possible)
Lines (open/closed), circle, polygon, rectangle, pad, hole, text (TTF)
Single insulation method, additional multiple insulation of pads, removal of residual copper spikes (spike option), milling out of large insulation areas (rub-out),
concentric or in serpentines maintaining minimum insulation spaces, zone insulation (only PCB version)
Microsoft® Windows® 95/98/NT/2000/XP, 700 MHz processor or better, min. 128 MB RAM (256 MB recommended), screen resolution min. 1024x768 pixels
Special applications with LPKF CircuitCAM software
• Defined insulation at the push of a button
• RF- and microwave layouts
• Contour routing path generator
Because of its special functions, it is particularly easy to use LPKFCircuitCAM to process RF and microwave layouts from any original data. The intelligent polygon-fill function for instance makes the processing ofDXF data really easy.
LPKF CircuitCAM also has the option to generate routing paths auto-matically. This includes the creation of cutting paths for internal slots oropenings as well as the outer contour of the circuit board. Defined breakouttabs are created at the same time to hold the circuit board in the material.
The diverse insulation parameters and options of LPKF CircuitCAM can beindividually adjusted and easily executed. The use of several toolsguarantees optimal, reliable removal of the copper around the conductorlines.
11Software package (LPKF CircuitCAM & BoardMaster)
English, German, French, Spanish, Japanese and Chinese
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 11
LPKF BoardMasterThe powerful and comfortable control software
Automatic data transmissionAll of the processing phases and associated tools are automatically output byCircuitCAM straight into BoardMaster. The production of the circuit board canstart immediately the cutting data is processed without any program change.
This intelligent control software for LPKF circuit board plotters combines a highdegree of user-friendliness with perfect process control. The graphic userinterface can handle milling and drilling data created by CircuitCAM as well asHP-GL™ files from various design software packages.
User-friendly operating interfaceThe WYSIWYG (What-You-See-Is-What-You-Get) user interface shows all millingand drilling data as well as the size of the base material. Through a simple clickof a mouse various different layouts and step-and-repeat copies can be placedon one sheet of material. The actual machining status is constantly displayed.
Intelligent tool managementAll tool parameters such as feed rate and rpm are controlled by LPKFBoardMaster and managed in the tool library. The life of the bits is constantlymonitored and the user is prompted to change tools when the maximum tool lifeis reached. The tool change process is optimized to reduce the number ofchanges necessary. The tool changing on the LPKF ProtoMat® 95s and H100 isfully automatic and requires no user interaction.
Import formats
Control
Display function
Placement functions
Selection methods
Tool management
Tool Library
Programming the
material size
Languages
Other
Hard and software
requirements
LPKF-Mill-Drill (*.LMD), HP-GL™
All ProtoMat® plotters and LPKF 101 LC, LPKF LC/VS, LPKF HI-P, LPKF AutoMill, LPKF 91, LPKF 91s and LPKF 92s
WYSIWYG display of machining data, zoom in/out/working area/projects, previous view, all viewing methods available at all times, even during the machining process
Copy, move, step and repeat, handles multiple artworks and placements simultaneously
Total production phase, specific tools, individual drill holes/lines/segments, selection from/up to a specific hole/line segment
RPM and head down time, registering and saving actual tool life, initiating the tool change procedure if tool lifetime is exceeded
Unlimited, individual library for different material types, individual customizable parameters
Positioning with corner coordinates, with the mouse, coordinates input via keyboard, option of saving frequently used material sizes
English, German, Spanish, Japanese, French, Chinese
Acoustic signal at end of production phase and display of production time remaining, estimated production time is displayed before start
Microsoft® Windows® 95/98/NT/2000/XP, 400 MHz processor or better, min. 64 MB RAM (recommended 128 MB), screen resolution min. 800 x 600 pixels, serial port
Technical data LPKF BoardMaster
Simultaneous processing of several projects
Tool library
Selection of separate elementsLPKF BoardMaster in use
Subject to technical modifications. See imprint for details.
12 Software package (LPKF CircuitCAM & BoardMaster)
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 12
LPKF ProtoMat® – Quality features
State-of-the-art technology and materials of the highest quality ensure that LPKF circuitboard plotters comply with the most stringent specifications for precision. This appliesto the machines themselves as well as to the boards produced by them. These systemshave an extremely long and useful operational life. Each and every LPKF ProtoMat®
plotter is built to be the best of its class with thousands of installed systems to prove it.
High precision and long life
System Design• Precision linear shafts• Anti-backlash lead screws• Solid, high-precision cast machine table• Variable high-speed spindle motors
· up to 100,000 rpm· Increased tool lifetimes· Automatic, software-supported, smart warm-up
phase doubles motor lifetimes• Software-supported registration hole system• Enclosed LPKF dust extraction
· with electronic control and absolute filter to prevent micro dust particles from becoming airborne
• Quick-release tool collet· For standard and special tools with 1/8“ shaft
• Coaxial milling depth limiterEither mechanical foot or non-contact air bearing· Scans the material surface
and compensates for irregularities
· This allows the defined penetration of the tool and the production of ultra-fine structures even on soft microwave substrates
· The shape of the depth limiter provides efficientdust extraction of the entire cutting area.
Software solutions• CAM software package (CircuitCAM, BoardMaster)
For circuit boards and front panel applications: included (Windows® 95/98/2000/NT and XP compatible)· CircuitCAM: conversion and editing software with
intelligent insulation process
· BoardMaster: circuit board plotter control, process control; intelligent toolmanagement guarantees optimal use of LPKF high-precision tools. Both standard bits and special tools for RF circuits do not require any liquid cooling.
Important Parameters• Step resolution as small as 1 µm (0.004 mil) with a
repeatability of ± 1 µm (0.004 mil)• Circuit structures
· Minimum 80 µm (3.1 mil) tracks partially with 100 µm (4 mil) spacing
· Drill holes 150 µm (6 mil) and bigger
• Machining of various materials· FR3, FR4, G10, other glass fiber reinforced epoxies· PTFE, filled substrates (e.g. RT/duroid®, TLX®, etc.)· ceramic filled substrates (e.g. Rogers RO® and TMM)· brass and aluminum· plastic materials
Upgrading Options• The software already includes options such as
· dispensing and conductive paste through-hole plating.
· Teach-in-camera (LPKF CircuitView)
• Accessories and additional equipment options allow the adaptation of the systems to an enormous range of tasks
Integrated dust
extraction system
Rigid cast aluminium
table
CircuitCAM
U
U
U
U
U
Coaxial milling depth
limiter
O
BoardMaster
O
O
13LPKF ProtoMat® – Quality features
Subject to technical modifications. See imprint for details.
Customer Service (Free advice/support)Germany +49-5131-7095-0China +86-22-23005700 France +33-1-60862691Japan +81-3-34657105
Slovenia +386-4-2013804Spain +34-91-8475505UK/Ireland +44-1344-455046North America +1-503-454-4229 (8 am - 5 pm PST)
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 13
1 and 2-sided circuit boards
FR3, FR4, FR5, G10
Flexible substrates
RF & microwave substrates
Front panels/sign engraving
Machining cut outs in front panels
Contour routing of circuit boards
Multilayer PCBs up to 4 layers*
Multilayer PCBs up to 8 layers*
Test adapter drilling
Milling film artworks
SMD solder stencil cutting
Rigid-flex circuit milling
Depanelization and reworking of bare
and populated boards
Solder frames for circuit board assembly
Housing production
Applications C2
0
LPKF ProtoMat®
C4
0
C6
0
C1
00
/HF
Simple and affordable 2-sided PCBsThis circuit board plotter is an ideal entry-levelsystem for users that demand precision proto-types on an affordable budget. This model isparticularly popular in schools, colleges, anduniversities. The ProtoMat® C20 is ideal forsingle and double sided boards using analogand digital technology with medium layoutdensity.
LPKF ProtoMat® C-series
LPKF ProtoMat® C20
Robust basic model with quick tool changeInstant prototypes right out of the lab at ahigher level – The ProtoMat® C40 is setting anew standard in the industry combining thecapability to create precision single and doublesided PCBs with the operating comfort of aquick-release tool collet and the high perfor-mance of 40,000 rpm programmable motorspeed. This makes this entry-level circuit boardplotter the perfect fit for users from smallbusinesses to corporate engineering.
LPKF ProtoMat® C40
LPKF ProtoMat® C60
Ideal for RF substrates and flexThis system, especially designed for RF andmicrowave PWBs, takes prototyping to extremes.A motor speed of 100,000 rpm allows thewidest range of tools including 0.15 mm (6 mil)endmills for high performance designs. In addi-tion the ProtoMat® C100/HF is extremely versa-tile. A contact-less air bearing depth limiter isideal for use on flexible or gold plated circuits.Micrometer depth adjustment can be used to millprecise pockets into brass or aluminum backedcircuits or to route beryllium copper sheets.
The ProtoMat® C100/HF is fully compatiblewith multilayer applications and all commonmaterials including FR4, Rogers RO 4000® andTMM®, as well as PTFE substrates such asRT/duroid®, UltraLAM®, TLX®, TLY® and manyothers.
LPKF ProtoMat® C100/HF
For tight specs and diverse applicationsThe 60,000 rpm programmable speed motorallows the use of an extended range of tools,including small rectangular profiled endmillswith diameters as small as 0.25 mm (10 mil).These tools have superior characteristics for RF and microwave applications and allow maxi-mum precision with minimum penetration intothe substrate. The high-speed motor also allowsthe production of dense digital designs withtrack/gap geometries of 100 µm (4 mil) and0.2 mm (8 mil) drill holes as well as multilayerapplications.
Suitable for application
* combined with MultiPress II and Contac III/MiniContac III
C-S
erie
s
M-S
erie
s
X-S
erie
s200 x 340(7.8 x 14.4)
375 x 540(14.8 x 21.3)
530 x 650(20.9 x 25.6)
Working area in mm (inch)
Training for LPKF ProtoMat® C, M,and X-series
All LPKF products are supplied with compre-hensive operating instructions, with easy to
understand manuals to make installation andcommissioning quick and simple for the user.
Additional software assistant and multimediatraining CD allow complete self-conducted training atthe user’s convenience.
We also provide private installation and trainingclasses, both on-site or at one of LPKF’s worldwideservice facilities.
!
Subject to technical modifications. See imprint for details.
14 LPKF ProtoMat® C-series
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 14
Part number
Minimum track width
Minimum gap
Minimum hole diameter
Working area
Resolution
Repeatability
Front-to-back registration accuracy
Milling motor
Tool change
Collet
Drilling capacity
Positioning speed (max.)
Depth adjustment
X/Y positioning system
Z drive
Machine table base
X/Y linear system
Dimensions (W/H/D)
Weight
Power supply
Compressed air supply
Options/accessories
Software package CircuitCAM LITE
Software package CircuitCAM PCB
Dust extraction unit
Dust extraction AutoSwitch
Tooling starter kit (board material/tools etc.)
Measuring microscope
Mobile sound enclosure
Head illumination
CircuitView camera system
Micrometer depth adjustment
3-phase motor, 10,000 to 100,000 rpm
3-phase motor, 10,000 to 60,000 rpm
EC motor, 10,000 to 40,000 rpm
DC motor, 20,000 rpm
Pneumatic Z-stroke
Pneumatic non-contact air bearing
Raising Z-axis by 30 mm (1.2”)
109419
0.2 mm (8 mil)
0.2 mm (8 mil)
0.5 mm (20 mil)
340 mm x 200 mm (13.4“ x 7.8“)
7.937 µm (0.312 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.02 mm (0.8 mil)
DC, 20,000 rpm
Semi-automatic
1/8” collet
78 holes/min
35 mm/sec (1.38“/sec)
Mechanical scanning,
coaxial foot
stepper motors, precision lead
screws ActiveCAM®
anti-backlash Supernuts®
electromagnetic with hydraulic
damper
75mm (3”) cast aluminum
precision linear bushings and
dual shafts
16.5“ x 13.75“ x 22.25“ 1)
24 kg (53 lb)
120/240V, 50 - 60 Hz/150VA
--
•
+
+
+
+
+
+
++
+
+
++
++
++
•
++
++
++
110517
0.1 mm (4 mil)
0.2 mm (8 mil)
0.3 mm (12 mil)
340 mm x 200 mm (13.4“ x 7.8“)
7.937 µm (0.312 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.02 mm (0.8 mil)
EC (brushless), 10,000 -
40,000 rpm, programmable
Semi-automatic
1/8” quick-release collet
78 holes/min
35 mm/sec (1.38“/sec)
Mechanical scanning,
coaxial foot
stepper motors, precision
lead screws ActiveCAM®
anti-backlash Supernuts®
electromagnetic with
hydraulic damper
75mm (3”) cast aluminum
precision linear bushings
and dual shafts
16.5“ x 13.75“ x 22.25“ 1)
24 kg (53 lb)
120/240V, 50 - 60 Hz/150VA
--
•
+
+
+
+
+
+
++
+
+
++
++
•
–
++
++
++
Specifications LPKF ProtoMat® C20 LPKF ProtoMat® C40
106511
0.1 mm (4 mil)
0.1 mm (4 mil)
0.2 mm (8 mil)
340 mm x 200 mm (13.4“ x 7.8“)
7.937 µm (0.312 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.02 mm (0.8 mil)
3-phase motor, 10,000 -
60,000 rpm, programmable
Semi-automatic
1/8” quick-release collet
90 holes/min
35 mm/sec (1.38“/sec)
Mechanical scanning,
coaxial foot
stepper motors, precision
lead screws ActiveCAM®
anti-backlash Supernuts®
electromagnetic with
hydraulic damper
75mm (3”) cast aluminum
precision linear bushings
and dual shafts
16.5“ x 13.4“ x 22.25“ 2)
24 kg (53 lb)
120/240V, 50 - 60 Hz/200VA
--
–
•
+
+
+
+
+
++
+
+
++
•
–
–
++
++
++
LPKF ProtoMat® C60
107973
0.1 mm (4 mil)
0.1 mm (4 mil)
0.2 mm (8 mil)
340 mm x 200 mm (13.4“ x 7.8“)
7.937 µm (0.312 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.02 mm (0.8 mil)
3-phase motor, 10,000 -
100,000 rpm, programmable
Semi-automatic
1/8” quick-release collet
120 holes/min
35 mm/sec (1.38“/sec)
Non-contact air bearing
stepper motors, precision
lead screws ActiveCAM®
anti-backlash Supernuts®
pneumatic, 14 mm (0.55“)
movement
75mm (3”) cast aluminum
precision linear bushings
and dual shafts
16.5“ x 13.0“ x 22.25“ 3)
25 kg (55 lb)
120/240V, 50 - 60 Hz/200VA
6 bar (87 psi), 50 l/min (1.7 cfm)
–
•
+
+
+
+
+
++
+
•
•
–
–
–
•
•
++
LPKF ProtoMat® C100/HF
• standard equipment
+ optional (can be retrofitted)
++ optional (needs to be factory mounted)
– not available
Subject to technical modifications. See imprint for details.
Simple and affordable
2-sided PCBs
Robust basic model with quick
tool change
Multifunctional for tight specs
and diverse applications
Ideal for RF substrates
and flex
recommended basic equipment
15LPKF ProtoMat® C-series
Dimensions (W/H/D)
1) 420 mm x 350 mm x 565 mm
2) 420 mm x 340 mm x 565 mm
3) 420 mm x 330 mm x 565 mm
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 15
LPKF ProtoMat® M/L-series
1 and 2-sided circuit boards
FR3, FR4, FR5, G10
Flexible substrates
RF & microwave substrates
Front panels/sign engraving
Machining cut outs in front panels
Contour routing of circuit boards
Multilayer PCBs up to 4 layers*
Multilayer PCBs up to 8 layers*
Test adapter drilling
Milling film artworks
SMD solder stencil cutting
Rigid-flex circuit milling
Depanelization and reworking of bare
and populated boards
Solder frames for circuit board assembly
Housing production
Applications M3
0/s
LPKF ProtoMat®
M6
0
L60
Robust basic model with quick-release colletfor 2-sided PCBs, large panelsThe large table size makes the ProtoMat® M30very valuable for large analog and digitalboards with medium population density as wellas production of multiple copies of the same ordifferent layouts. For increased operatingcomfort, this system provides programmablespindle speed and quick-release tool collet.
LPKF ProtoMat® M30/s
LPKF ProtoMat® M60
LPKF ProtoMat® L60For extremely long circuit boards, antennasand front panelsThis circuit board plotter provides a longworking area that accommo-dates extra large circuitsincluding antennae and frontpanels. It is equipped with a60,000 rpm motor capableof handling small endmillsfor RF and microwave circuitryand a pneumatic Z-axis with extra clearance forthick substrates.
Suitable for application
* combined with MultiPress II and Contac III/MiniContac III
C-S
erie
s
M-S
erie
s
X-S
erie
s200 x 340(7.8 x 14.4)
375 x 540(14.8 x 21.3)
530 x 650(20.9 x 25.6)
Working area in mm (inch)
Subject to technical modifications. See imprint for details.
16 LPKF ProtoMat® M/L-series
For precise large and multilayer boardsThe ProtoMat® M60 is truly a multi-talentedsystem. Its large table size allows the pro-duction of large circuit boards. This isespecially helpful when producing multilayerboards as this plotter can handle multiplelayers simultaneous.
A 60,000 rpm motor guarantees perfectdrill hole quality, which is essential for properinterconnection on multilayer boards, andproduces dense circuitry from DC to RF.
It is also able to engrave and route inspec-tion templates, aluminum panels and other two-dimensional mechanical items.
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 16
Subject to technical modifications. See imprint for details.
Part number
Minimum track width
Minimum gap
Minimum hole diameter
Working area
Resolution
Repeatability
Front-to-back registration accuracy
Milling motor
Tool change
Collet
Drilling capacity
Positioning speed (max.)
Depth adjustment
X/Y positioning system
Z drive
Machine table base
X/Y linear system
Dimensions (W/H/D)
Weight
Power supply
Compressed air supply
Options/accessories
Software package CircuitCAM LITE
Software package CircuitCAM PCB
Dust extraction unit
Dust extraction AutoSwitch
Tooling starter kit (board material/tools etc.)
Measuring microscope
Mobile sound enclosure
Head illumination
CircuitView camera system
Micrometer depth adjustment
3-phase motor, 10,000 to 100,000 rpm
3-phase motor, 10,000 to 60,000 rpm
EC motor, 10,000 to 40,000 rpm
Pneumatic Z-stroke
Pneumatic non-contact air bearing
Raising Z-axis by 30 mm (1.2”)
108001
0.1 mm (4 mil)
0.2 mm (8 mil)
0.3 mm (12 mil)
540 mm x 375 mm (21.3“ x 14.8“)
7.937 µm (0.312 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.02 mm (0.8 mil)
EC (brushless), 10,000 - 30,000 rpm,
programmable
Semi-automatic
1/8“ collet
78 holes/min
35 mm/sec (1.38“/sec)
Mechanical scanning, coaxial foot
stepper motors, precision lead screws
ActiveCAM® anti-backlash Supernuts®
electromagnetic with hydraulic damper
75mm (3“) cast aluminum
precision linear bushings and dual shafts
620 x 420 x 760 mm (24.4“ x 16.5“ x 29.9“)
43 kg (94.6 lb)
120/240V, 50 - 60 Hz/150VA
--
•
+
+
+
+
+
+
++
+
+
++
++
•
++
++
++
108002
0.1 mm (4 mil)
0.1 mm (4 mil)
0.2 mm (8 mil)
540 mm x 375 mm (21.3“ x 14.8“)
7.937 µm (0.312 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.02 mm (0.8 mil)
3-phase motor, 10,000 - 60,000 rpm,
programmable
Semi-automatic
1/8“ collet
90 holes/min
35 mm/sec (1.38“/sec)
Mechanical scanning, coaxial foot
stepper motors, precision lead screws
ActiveCAM® anti-backlash Supernuts®
electromagnetic with hydraulic damper
75mm (3“) cast aluminum
precision linear bushings and dual shafts
620 x 420 x 760 mm (24.4“ x 16.5“ x 29.9“)
43 kg (94.6 lb)
120/240V, 50 - 60 Hz/200VA
--
–
•
+
+
+
+
+
++
+
+
++
•
–
++
++
++
Specifications LPKF ProtoMat® M30/s LPKF ProtoMat® M60
109797
0.1 mm (4 mil)
0.1 mm (4 mil)
0.2 mm (8 mil)
375 mm x 1,250 mm (14.75“ x 49.2“)
7.937 µm (0.312 mil)
+/- 0.005 mm (0.2 mil)
+/- 0.02 mm (0.8 mil)
3-phase motor, 10,000 - 60,000 rpm,
programmable
Semi-automatic
1/8“ collet
120 holes/min
35 mm/sec (1.38“/sec)
Non-contact air bearing
stepper motors, precision lead screw
assemblies with internal ball recirculating
system
pneumatic, 14 mm (0.55“) movement
precision milled aluminum bed
precision linear bushings and dual shafts
620 x 420 x 1,543 mm (24.4“ x 16.5“ x 60.7“)
110 kg (242 lb)
120/240V, 50 - 60 Hz/200VA
6 bar (87 psi), 100 l/min (3.528 cfm)
–
•
+
+
+
+
–
++
+
+
++
•
–
•
++
++
LPKF ProtoMat® L60
• standard equipment
+ optional (can be retrofitted)
++ optional (needs to be factory mounted)
– not available
Robust basic model with quick-release
collet for 2-sided PCBs, large panels
Multifunctional system for precise large
and multilayer boards
For extremely long circuit boards,
antennas and front panels
recommended basic equipment
17LPKF ProtoMat® M/L-series
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 17
95s/
II, H
100
380 x 420(14.9 x 16.5)
Working area in mm (inch)
1 and 2-sided circuit boards
FR3, FR4, FR5, G10
Flexible substrates
RF & microwave substrates
Front panels/sign engraving
Machining cut outs in front panels
Contour routing of circuit boards
Multilayer PCBs up to 4 layers*
Multilayer PCBs up to 8 layers*
Test adapter drilling
Milling film artworks
SMD solder stencil cutting
Rigid-flex circuit milling
Depanelization and reworking of bare
and populated boards
Solder frames for circuit board assembly
Housing production
Applications 95
s/II
LPKF ProtoMat®
H1
00
The fastest prototyping system yetThis system allows significant reduction in theproduction time of prototype PCBs. The maxi-mum milling speed is now almost doubledcompared to prior top-of-the-range systemsand the integrated smart following-vector pathgeneration allows the system to maintain ahigher average speed. The combination of bothof these features pushes the performance factorof this machine 2 - 3 times. Now prototype pro-duction of multilayer boards is accomplishedin-house comfortably. The resolution has beenincreased five fold to 1 µm, which combinedwith 100,000 rpm milling motor allows thisplotter to partially create 80 µm (3.1 mil)tracks with 100 µm (4 mil) spacing whichaccommodates all state of the art packagesincluding BGA and µBGA®.
Along with the increased performance, theH100 also includes many new features derivedfrom high volume production systems, whichup to now have been unknown in this class ofprototyping equipment. These features includeautomatic tool change, automatic tool adjust-ment by scanning sensor, and a camera systemfor automatic fiducial recognition. This elimi-nates user interaction and simplifies the boardalignment process. The H100 system alsoincludes an integrated vacuum tabletopallowing proper mounting of thin and flexiblesubstrates on the plotter.
LPKF ProtoMat® H100
Precision system with automatic tool changeThe LPKF ProtoMat® 95s offers high-speed andprecision combined with the convenience of a 30-station fully automatic tool change. A contact-less air bearing depth limiter is idealfor use on flexible or gold plated circuits.
This circuit board plotter is designed forPCB labs with a high volume of prototypes inany technology including analog, digital, powersupplies, flex boards as well as RF and micro-wave circuits. The high production speed isalso a substantial advantage for the in-housefabrication of quick turn multilayer circuitboards and small batch production.
LPKF ProtoMat® 95s/II
Suitable for application
* combined with MultiPress II and Contac III/MiniContac III
LPKF ProtoMat® H-series
Installation and training for LPKFProtoMat® 95s/II and H100
These systems are offered with installation andtraining packages to support users in their
correct operation for the many applications thatthe high end LPKF ProtoMat® 95s/II and
ProtoMat® H100 can perform.
!
Subject to technical modifications. See imprint for details.
18 LPKF ProtoMat® H-series
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 18
Subject to technical modifications. See imprint for details.
Part number
Minimum track width
Minimum gap
Minimum hole diameter
Working area
Resolution
Repeatability
Front-to-back registration accuracy
Milling motor
Tool change
Collet
Drilling capacity
Positioning speed (max.)
Depth adjustment
X/Y positioning system
Z drive
Machine table base
X/Y linear system
Dimensions (W/H/D)
Weight
Power supply
Compressed air supply
Options/accessories
Software package CircuitCAM LITE
Software package CircuitCAM PCB
Dust extraction unit
Dust extraction AutoSwitch
Tooling starter kit (board material/tools etc.)
Measuring microscope
Mobile sound enclosure
Head illumination
CircuitView camera system
Micrometer depth adjustment
3-phase motor, 10,000 to 100,000 rpm
3-phase motor, 10,000 to 60,000 rpm
EC motor, 10,000 to 40,000 rpm
Pneumatic Z-stroke
Pneumatic non-contact air bearing
Raising Z-axis by 30 mm (1.2”)
111424
0.1 mm (4 mil); 0.08 mm (3.1 mil) partially
0.1 mm (4 mil)
0.15 mm (6 mil)
420 mm x 380 mm (16.5“ x 14.9“)
1 µm (0.04 mil)
± 0.001 mm (0.04 mil)
± 0.02 mm (0.8 mil)
3-phase motor, 10,000 - 100,000 rpm, programmable
Automatic, 30 positions
1/8“ pneumatic-release collet
120 holes/min
100 mm/sec (3.94“/sec)
Non-contact air bearing: automatic setting
stepper motors, precision ball screw assemblies with internal
ball recirculating system
pneumatic, 14 mm (0.55“) movement
75 mm (3“) cast aluminum
precision linear bushings and dual shafts
650 mm x 430 mm x 750 mm (25.6“ x 16.9“ x 29.5“)
50 kg (110 lb) (without acoustic cabinet)
120/240V, 50 - 60 Hz/240VA
6 bar (87 psi), 100 l/min (3.528 cfm)
–
•
+
+
+
+
•
•
+
•
•
–
–
•
•
–
106333
0.1 mm (4 mil)
0.1 mm (4 mil)
0.2 mm (8 mil)
420 mm x 380 mm (16.5“ x 14.9“)
5 µm (0.2 mil)
± 0.005 mm (0.2 mil)
± 0.02 mm (0.8 mil)
3-phase motor, 10,000 - 60,000 rpm, programmable
Automatic, 30 positions
1/8“ pneumatic-release collet
90 holes/min
60 mm/sec (2.36“/sec)
Non-contact air bearing
stepper motors, precision ball screw assemblies with internal
ball recirculating system
pneumatic, 14 mm (0.55“) movement
75 mm (3“) cast aluminum
precision linear bushings and dual shafts
650 mm x 430 mm x 750 mm (25.6“ x 16.9“ x 29.5“)
50 kg (110 lb) (without acoustic cabinet)
120/240V, 50 - 60 Hz/240VA
6 bar (90 psi), 100 l/min (2.4 cfm)
–
•
+
+
+
+
•
++
+
+
+
•
–
•
•
–
Specifications LPKF ProtoMat® H100LPKF ProtoMat® 95s/II
• standard equipment
+ optional (can be retrofitted)
++ optional (needs to be factory mounted)
– not available
The fastest prototyping system yet!Precision system with automatic tool change
recommended basic equipment
19LPKF ProtoMat® H-series
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 19
C-S
erie
s
M-S
erie
s
X-S
erie
s200 x 340(7.8 x 14.4)
375 x 540(14.8 x 21.3)
530 x 650(20.9 x 25.6)
Working area in mm (inch)
LPKF ProtoMat® X60Drilling, Routing & DepanelingThe ProtoMat® X60 is placed between two worlds – rapidPCB prototyping plotter on one hand and versatile production drilling and routing system on the other. The large table holds panel sizes of 650 mm x 530 mm(26“ x 21“). The X60 is equipped with pneumatic z-stroke and non-contact air bearing depth limiter. The extended Z-axis range en-ables depaneling and millingof deep trenches for rigidand rigid-flex boards.
The ProtoMat® X60is also ideal forproducing anti-static inspectiontemplates forcircuit boards.
Part number
Minimum track width
Minimum gap
Minimum hole diameter
Working area
Resolution
Repeatability
Front-to-back registration accuracy
Milling motor
Tool change
Collet
Drilling capacity
Positioning speed (max.)
Depth adjustment
X/Y positioning system
Z drive
Machine table base
X/Y linear system
Dimensions (W/H/D)
Weight
Power supply
Compressed air supply
Options/accessories
Software package CircuitCAM LITE
Software package CircuitCAM PCB
Dust extraction unit
Dust extraction AutoSwitch
Tooling starter kit (board material/tools etc.)
Measuring microscope
Mobile sound enclosure
Head illumination
CircuitView camera system
Micrometer depth adjustment
3-phase motor, 10,000 to 100,000 rpm
3-phase motor, 10,000 to 60,000 rpm
EC motor, 10,000 to 40,000 rpm
Pneumatic Z-stroke
Pneumatic non-contact air bearing
Raising Z-axis by 30 mm (1.2”)
109643
0.1 mm (4 mil)
0.1 mm (4 mil)
0.2 mm (8 mil)
650 mm x 530 mm (25.6“ x 20.9“)
1 µm (0.04 mil)
± 0.001 mm (0.04 mil)
± 0.02 mm (0.8 mil)
3-phase motor, 10,000 - 60,000 rpm,
programmable
Semi-automatic
1/8” collet
120 strokes/min
50 mm/sec (1.97“/sec)
Non-contact air bearing
stepper motors, precision ball screw assemblies
with internal ball recirculating system
pneumatic, 14 mm (0.55“) movement
75mm (3“) cast aluminum
precision linear bushings and dual shafts
750 mm x 420 mm x 900 mm (29.5“ x 16.5“ x 35.4“)
69 kg (151.8 lb)
120/240V, 50 - 60 Hz/240VA
6 bar (87 psi), 100 l/min (3.528 cfm)
–
•
+
+
+
+
–
++
+
+
+
•
–
•
•
+
Specifications LPKF ProtoMat® X60
• standard equipment
+ optional (can be retrofitted)
++ optional (needs to be factory mounted)
– not available
Model for use in series production.
Working area matches standard
PCB production panels
1 and 2-sided circuit boards
FR3, FR4, FR5, G10
Flexible substrates
RF & microwave substrates
Front panels/sign engraving
Machining cut outs in front panels
Contour routing of circuit boards
Multilayer PCBs up to 4 layers*
Multilayer PCBs up to 8 layers*
Test adapter drilling
Milling film artworks
SMD solder stencil cutting
Rigid-flex circuit milling
Depanelization and reworking of bare and
populated boards
Solder frames for circuit board assembly
Machining of enclosures
Applications X60
LPKF ProtoMat®
Suitable for application
* combined with MultiPress II and Contac III/MiniContac III
Subject to technical modifications. See imprint for details.
recommended basic equipment
LPKF ProtoMat® X-series
20 LPKF ProtoMat® X-series
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 20
LPKF ProtoLaser for Rapid PCB Prototyping
Subject to technical modifications. See imprint for details.
LPKF ProtoLaser
Ultra fine geometries with laserTo be able to prototype HDI circuitry the LPKF ProtoLaser combinesthe best of both worlds. This circuit board plotter features a mecha-nical milling head with fully automatic tool change for milling,drilling and routing as well as a laser beam to create circuitgeometries as small as 40 µm (1.6 mil) with 100 µm (4 mil) pitch.The laser is also capable of drilling and skiving ceramic substrates.This system is designed to meet the needs of engineers pushing theenvelope with top-level designs without compromising theturnaround time for prototypes.
Product features• 60 µm (2.4 mil) track with 40 µm (1.6 mil) gaps• Capable of drilling and skiving Alumina and other ceramic
substrates• Fine marking and engraving of components and front panels• Extremely simple operation• Powerful software with intuitive user interface• Laser Safety Class 1
Micro coil
High-end versatility
HDI circuit structuringThe LPKF ProtoLaser uses a hybrid cutting head consisting of botha mechanical tool and a laser beam that can be used alternatively.The laser beam creates the critical fine structures, whereas themechanical milling bit removes larger copper areas, drills holes orroutes the board’s contour. A completely integrated software toolmanagement automatically handles all tool parameters as well asthe interaction between laser and mechanical machining. If particu-larly high specifications are demanded an optional cleaning processcan be applied subsequently.
Substrate cuttingAnother application of the LPKF ProtoLaser is the cutting of varioussubstrates including aluminium oxide, silicon nitride, polycrystal-line silica and others.
Laser-cut ceramics
Laser cutting head
21LPKF ProtoLaser
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 21
High-performance CAM softwareThe LPKF ProtoLaser uses the LPKF CircuitCAM/BoardMaster software package. LPKF CircuitCAM imports the artwork (Gerber® Standard [RS-274-D], Gerber® Extended[RS-274-X], DBF [Barco], Excellon® NC Drill [versions 1 and 2], Sieb & Meier NC Drill, DXF,HP-GL™, ODB++), provides the extensive functionality of a CAM package, calculates thecutting paths for the laser and the milling tools, and transfers the production data to theProtoLaser control software (LPKF BoardMaster). In addition to numerous control functions,this also incorporates comprehensive tool management and a comfortable WYSIWYG userinterface which permanently informs about the current status of the production process.
If you have any questions, or inquiries about your special applications, please contact ourLPKF application engineers at any time.
Sensor
60/40 µm (2.4/1.6 mil) ultra fine circuit
Circuit with 40 µm (1.6 mil) geometries
Micro coil 50 µm (2 mil)
Data preparation with CircuitCAM
Subject to technical modifications. See imprint for details.
22 LPKF ProtoLaser
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 22
Subject to technical modifications. See imprint for details.
Part number
Wavelength
Output
Frequency
Beam diameter
Minimum track and gap
Copper thickness
106821
1,064 nm
70 W multi-mode system
0 - 50 kHz (regulated by cutting speed)
40 µm (1.6 mil)
60 µm/40 µm (2.4 mil/1.6 mil)
< 35 µm (1 oz.)
Specifications: Laser
· HDI circuits
· Compatible with all common circuit substrates
· Engraving of components, front panels, etc.
· Machining and circuit structuring of ceramic substrates (max. thickness 635 µm [25 mil])
Applications
Milling motor
Tool change
Collet
Drilling capacity
Positioning speed (max.)
Depth adjustment
Minimum track and gap
Minimum hole diameter
3-phase motor, programmable 10,000 - 60,000 rpm
Automatic, 23 positions
1/8“ pneumatic-release collet
120 strokes/min
60 mm/sec (2.4“/sec)
Non-contact air bearing
0.1 mm/0.1 mm (4 mil/4 mil))
0.2 mm (8 mil)
Specifications: milling/drilling head
Working area
Resolution
Repeatibility
X/Y positioning system
Z drive
Dimensions (W/H/D)
Machine table unit
Laser control unit
Unit separation
Weight
Machine table unit
Laser control unit
Power supply
Machine table unit
Laser control unit
420 x 380 mm (16.5“ x 15“)
for laser applications: 415 mm x 320 mm (16.3“ x 12.6“)
5 µm (0.2 mil)
0.005 mm (0.2 mil)
stepper motors, precision ball screw assemblies with internal
ball recirculating system
pneumatic, 14 mm / 0.55” movement
730 mm x 1,340 mm x 850 mm (28.7“ x 52.8“ x 33.5“) with housing
570 mm x 1100 mm x 750 m (22.4“ x 43.3“ x 29.5“)
215 mm (8.5“)
110 kg (242 lbs) (with cover)
180 kg (396 lbs)
230 V, 50/60 Hz, 240 VA; 6 bar (87 psi) compressed air, min. 100 l/min (3.5 cfm)
3-phase, 3 x 400 V, 50 Hz, 4 kVA, 10 bar (145 psi) comp. air, min. 120 l/min (4.2 cfm),
cooling water 10 l /min (0.35 cfm), 2 - 6 bar (29 - 87 psi), max. 20 °C (68 °F)
General specifications
23LPKF ProtoLaser
LPKF Produktkatalog GB 23.04.2003 12:31 Uhr Seite 23
Accessories/options
Part number
Machine
W/H/D approx. (mm)*
Noise reduction
101097
C series
650/1,320/700
Approx. 8 dB
Size cabinets Small cabinet
108731
M series
730/1,320/950
Approx. 8 dB
Large cabinet
Standard
95s/II, H100
730/1,320/850
Approx. 8 dB
95s/II cabinet
Measuring microscopeThe measuring microscope magnifies 50 times and has a metric scale for theprecise setting of insulation gap widths and quality control.Part number 104475
LPKF acoustic cabinetsThe acoustic cabinets reduce noise and dust emissions to ensure comfortableoperations in electronic design labs or CAD offices. Storage shelves for tools andbasic materials, as well as a space for the integrated dust extraction, simplifyroutine work. LPKF acoustic cabinets are optionally available for all circuitboard plotters but are supplied standard with the LPKF ProtoMat 95s/II and theH100 for safety purposes due to the automatic tool change. The protectivecover is mobile to ensure easy travel to various locations.
Dust extractionMilling and drilling dust must be removed from the machining head to ensurethe proper operation of the milling depth limiter. The dust extraction systemguarantees reliable removal of the dust generated by machining.
LPKF AutoSwitchAutoSwitch is a useful addition to the dust extraction system. When fitted, thedust extraction system is switched on and off automatically. This ensures safety,increases the lifetime of the dust extraction system and reduces noise when themachine is not running.Part number 101473
The LPKF accessories/options are practical additions to themachines and systems. A very high degree of functionality isguaranteed by the perfect match between each component.High quality materials and precise finishing ensures productswith long lifetime.
Part number
Vacuum pressure
Air flow rate
Power consumption
Filter surface
Dim. W/H/D mm (inch)
Acoustic pressure
Absolute filter
Filter material
Surface filter cartridge
Filter efficiency
109039
Max. 20,000 Pascal
40 l/sec (1.411 cfm)
800 W (230 V)
1,200 cm2 (47.2“2) (cotton wool)
300/360/400 (11.8/14.2/15.7)
50 db(A)
HEPA filter
Glass fiber
4,300 cm2 (169.3 sq. in)
Particle size 0.5 - 0.9 µm (0.02 - 0.036 mil) 100 %
Technical data
Subject to technical modifications. See imprint for details.
24 Accessories/options
Front and rear view of the cabinet with
optional accessories * Dimensions W/H/D (inch) 25.6“/52“/27.6“ 28.7“/52“/37.4“ 28.7“/52“/33.5“
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 24
Subject to technical modifications. See imprint for details.
Hot air ovenThe hot air oven has an integrated timer and precise temperature controller,creating optimal conditions for hardening paste plated-holes and for laminatingsolder-resist films.
CompressorSome LPKF systems (e.g. ProtoMat® C100/HF, H100, 95s/II, MultiPress II, Auto-Contac) require compressed air. The compressors supplied by LPKF guaranteeclean, dry and reliable compressed air supplies.
LPKF precision ring setterThe LPKF ring setter includes a tool ring press, adjusting unit, and a measuringmicroscope. The precise adjustment of spacing rings allows different tools to beused without readjusting the milling depth settings.
LPKF CircuitViewThe LPKF CircuitView provides a camera option for the visual positioning of themilling head. This system is particularly suitable for the reworking of circuitboards, as well as the coding, and teach-in functions. CircuitView contains amonochrome camera and a frame grabber card. This option is available for allLPKF circuit board plotters.
Part number
Feature
Power
External dim. W/H/D mm (inch)
Internal dim. W/H/D mm (inch)
102073
Timer, temperature controller
1,800 W
580/290/350 (22.8/11.4/13.8)
440/210/290 (17.3/8.3/11.4)
Technical data
Part number
Tank size in liters
Max. pressure bar (psi)
Output l/min (cfm)
External dim. W/H/D mm (inch)
Weight kg (lb)
Acoustic noise level db(A)
At a distance of 4 m (LPA4)
For LPKF system
101092
9
8 (116)
33 (1.1)
360/430/360 (14.2/16.9/14.2)
21 (46.2)
33
AutoContac, MultiPress
104863
50
10 (145)
165 (5.8)
1,000/770/390 (39.4/30.3/15.4)
56 (123.2)
67
C100/HF, 95s/II, X60, H100
Technical data Compressor type
Small Large
Part number 110368
Available for All LPKF ProtoMat® LPKF ProtoMat® 95s/II, H100
Standard
Part number 106345
Available for LPKF ProtoMat® C & M series LPKF ProtoMat® 95s/II, H100
107168
LPKF StatusLightLPKF acoustic cabinets for the LPKF circuit board plotters can also beequipped with a multi-colored indicator light. The StatusLight, which isvisible from a long distance, indicates the operating status of themachine.Part number 111093
25Accessories/options
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 25
Optional accessories are typically factory mounted to the circuit board plotter and are standard on somesystems, however the user can retrofit some options.
Non-contact air bearing depth limiterThe pneumatic depth limiter has an air cushion which makes it possible to machinesensitive materials without coming into direct contact.Part number is available upon request
Pneumatic Z-strokeThe pneumatic Z-stroke makes it possible to machine thicker materials (up to a maximumof 14 mm [0.55“]). It also gives a 15 mm (0.59“) z-movement (standard: 5 mm [0.2“]),and can use tools with much smaller diameters thanks to the adjustable lowering pressure.Part number is available upon request
Micrometer screwThe micrometer screw is for the infinite adjustment of the milling depth when operating onmaterials without a milling depth limiter. Available for all LPKF circuit board plotters thisdevice works off of a backstop to control milling depth.Part number 109688
100,000 rpm motorThis motor is capable of using very small endmills (0.15 mm [6 mil]) for RF /microwaveapplications and drilling very small holes. The higher speed provides longer tool life andalso allows higher travel speeds.Part number is available upon request
Increased Z-axis height (to max. 30 mm [1.18“])Setting the Z-axis higher enables the surface machining of thicker material. The system isalso suitable for reworking assembled circuit boards. The stroke remains unchanged at 5 mm (0.2“) (15 mm [0.59“] in the case of pneumatic stroke). This option is available forall LPKF circuit board plotters with the exception of LPKF ProtoMat® 95s/II, H100 andProtoLaser.Part number is available upon request
Option
Standard
•
LPKF ProtoMat ®
C20
Integrated head illuminationThe high-performance LED ring surrounds the tool holding fixture and guarantees shadow-free illumination of the immediate machining area. This makes direct quality control ofdrilling and milling faster and easier. The head illumination is available for all LPKFProtoMat® circuit board plotters. · for mechanical depth limiter: part number 109153 · for non-contact air bearing depth limiter: part number 109154
(retrofitting upon request)(retrofitting upon request)
Subject to technical modifications. See imprint for details.
•
C40
•
C60
•
C100/HF
•
M30/s
•
M60
•
L60
•
95s/II*
•
H100*
•
X60
Option
Standard
•
LPKF ProtoMat ®
C20
•
C40
•
C60
•
C100/HF
•
M30/s
•
M60
•
L60
•
95s/II
•
H100
•
X60
Option
Standard
•
LPKF ProtoMat ®
C20
•
C40
•
C60
•
C100/HF
•
M30/s
•
M60
•
L60
•
95s/II
•
H100
•
X60
26 Accessories/options
* without Z-extension
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 26
Subject to technical modifications. See imprint for details.
LPKF EasyContac was developed for prototype circuit boards andPCB repairs with up to 50 through-plated holes per circuit board.All the necessary parts are conveniently packed in a handy box sothat it can also be used by service engineers.
The key components of the LPKF EasyContac are through-holeplating rivets made of a special copper alloy. These rivets are avail-able with external diameters of 0.8 mm (32 mil), 1.0 mm (40 mil),1.2 mm (48 mil) and 1.4 mm (56 mil). The internal diameter is 0.2 mm (8 mil) or 0.4 mm (16 mil) smaller than the desiredexternal diameter. They are manually placed in the hole and rivetedwith a stamping tool. A component lead can still be fed through thehole if necessary. The rivet is then simply soldered.
Manual system for through-hole plating
LPKF EasyContac delivers a simple and easy-to-operatesystem for the through-hole plating of circuit boardholes. The minor effort involved and low costs are the major benefits of this manual solution. LPKF EasyContac is particularly suitable where two-sided soldering is not possible, e.g. beneathcomponents. The set contains all of the necessarytools and materials with the exception of a solderingiron.
110914
No limit
< 50
2
Approx Euro 0.35 (US$ 0.35)
10 m Ω
++
2 - 3
+
Any substrate with 1.5 mm (59 mil) thickness
Technical data
Part number
Max. base material size
Number of through-plated holes per circuit board
Number of layers
Material costs/through-hole plating
Max. resistance
Environmental compatibility
Through-plated holes/min
Process reliability
Base material types
Available through-hole plating rivets, approx. dimensions in mm (mil)
110907
110758
110906
110759
Part
number
Internal
diameter
0.6 (24)
0.8 (32)
1.0 (40)
1.2 (48)
2.2 (88)
2.2 (88)
2.5 (100)
2.6 (104)
1.3 (52)
1.6 (64)
2.2 (88)
2.6 (104)
0.8 (32)
1.0 (40)
1.4 (56)
1.6 (64)
External
diameter
Collar
diameter
Length Hole diameter
0.9 (36)
1.1 (44)
1.5 (60)
1.7 (68)
LPKF EasyContac
27LPKF EasyContac
The set contains the following:· 1 automatic punch tool with
stamp tip A for 0.6 (24 mil) and 0.8 mm (32 mil) (inner diameter) rivets
· 1 stamp tip B for 1.0 (40 mil) and 1.2 mm (48 mil) (inner diameter) rivets
· 1 pair of tweezers· 1 anvil plate· 1,000 rivets per size
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 27
Conductive paste through-hole platingwith the LPKF circuit board plotter
LPKF AutoContac
Product features• Conductive epoxy paste through-hole plating• Easily integrated on any existing LPKF circuit board plotters • Suitable for boards with up to 300 holes • Option for the dispensing of various pastes (solder paste, adhesive,
conductive paste and sealants)
The patented LPKF AutoContac system is ideal for fast environmen-tally friendly in-house through-hole plating without chemicals. A special conductive paste produces plated holes suitable for com-ponent insertion and soldering in double-sided circuit boards directlyusing the LPKF circuit board plotter.
This simple and easy-to-learn technique, along with the minorinvestment required, makes independent Rapid PCB Prototypingpractical for even the smallest enterprise.
ProcedureLPKF AutoContac is suitable for circuit boards with max. 300 holesand hole diameters of 0.5 - 1.4 mm (20 - 55 mil).
A special conductive paste is automatically injected into the holeby a dispenser mounted to the head of the LPKF circuit boardplotter. The second step involves the vacuum extraction of theexcess paste. The subsequent hardening in a hot-air oven creates apermanent through-plated hole suitable for component assembly.The complete through-hole plating process is precisely andautomatically controlled by the LPKF BoardMaster circuit boardplotting software. The parameters for a specific drill hole diameterare stored in the tool library of the software.
This tried-and-tested technique combined with the individualdefinition of dispenser parameters is also used for the applicationof solder paste, adhesives, and sealants.
Through-plated hole:
view from top
101261
Varies depending on the circuit board plotter
0.5 mm - 1.4 mm (20 - 55 mil)
< 300
2
Approx. 2 Cents
150 m Ω
++
15
+
~ 45 min*
FR4, RO® 3000, RO® 4000, TMM®
Connected to LPKF circuit board plotter
6 bar (87 psi)
Specifications
Part number
Max. base material size
Hole diameter
Number of through-plated holes
Number of layers
Material costs/through-plated hole
Max. resistance
Environmental compatibility
Through-plated holes/min
Process reliability
Process duration
Base material types
Power supply
Compressed air supply
Through-plated hole:
view from bottom
Through-plated hole:
with soldered
component lead;
view from top
Dispenser
LPKF ProtoMat® C60
with LPKF AutoContac
Cross section
3
2
* Average value dependent on circuit board size
Subject to technical modifications. See imprint for details.
Vacuum removal
Thermal curing
28 LPKF AutoContac
Solder pasteDispensing needleCopper padCircuit board
Backing material
1
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 28
Subject to technical modifications. See imprint for details.
LPKF Contac III, MiniContac III & MiniContac III/HF
The LPKF through-hole plating systems were specially developed forthe professional production of prototype and small batch productionprinted circuit boards to be used in combination with an LPKFcircuit board plotter. These systems enable production qualityboards to be produced independently without the need for outsidesuppliers.
The through-plated holes comply with the highest specificationsand can be made quickly in house to avoid day long hold-ups in thedesign process. This system is particularly suitable for complexcircuit boards with any number of holes.
The LPKF Contac III can be optionally equipped for tin plating.
In house professional quality through-hole plating
Product features• No development work hold-ups• No chemical expertise or analysis required• Only four tanks• No chemical pre-coppering• Reverse pulse plating
8-layer circuit board 6-layer circuit board 4-layer circuit board
Reverse Pulse PlatingTo ensure that tomorrow’s demands are fully satisfied, the LPKFMiniContac III and Contac III systems use reverse pulse platingtechnology, providing uniform copper plating that allows plating ofmore difficult aspect ratios and smaller holes. It avoids the “bone-effect” (thicker copper growth at hole entrance) that can clog upsmall via holes entirely before they are completely plated.
This option is also very useful for small holes on high densityPCBs and improves production reliability during soldering.
Reverse pulse plating is achieved using control electronics thatmonitors the whole through-hole plating process and removesexcess material by the precise setting of reverse pulses (anodicpolarisation of the workpiece).
LPKF Contac III
LPKF MiniContac III
Conventional through-
hole plating method
(bone effect)
Reverse Pulse Plating
29LPKF Contac III, MiniContac III & MiniContac III/HF
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 29
LPKF through-hole plating technologiesStandard technology: Carbon-based through-hole plating
(black hole method)Special technology: Palladium-based through-hole plating,
especially for PTFE basedmicrowave substrates
We will be happy to provide you with a list of applicable basematerials upon request!
111253
Carbon
360 mm x 420 mm (14.2” x 16.5”)
270 mm x 330 mm (10.6” x 13.0”)
LPKF ProtoMat® 95s/II: 254 mm x 305 mm ( 10.0” x 12.0”)
≥ 0.2 mm (8 mil)
Unlimited
8
< 10 m Ω
Good
Very good
90 minutes
FR4, RO 3000, RO 4000®, TMM **
120***/240 V, 50 - 60 Hz, max. 2,000 VA
18 - 25 °C (64.4 - 77 °F)
1,150 mm x 1,110 mm x 715 mm ( 45.3” x 43.7” x 28.1”)
Yes
Specifications
Part number
Activator
Max. base material size
Max. board size *
Hole diameter
Number of plated holes
Max. number of layers
Max. resistance
Environmental compatibility
Processing reliability
Process duration
Base material types
Power supply
Ambient temperature
Dimensions( W/H/D)
Optional chemical tinning
LPKF Contac III
111252
Carbon
220 mm x 340 mm (8.7” x 13.4”)
130 mm x 250 mm (5.1” x 9.8”)
LPKF ProtoMat® 95s/II: 110 mm x 230 mm (4.3” x 9.1”)
≥ 0.2 mm (8 mil)
Unlimited
8
< 10 m Ω
Good
Very good
90 minutes
FR4, RO 3000, RO 4000®, TMM **
120/240 V, 50 - 60 Hz, 600 VA
18 - 25 °C (64.4 - 77 °F)
870 mm x 640 mm x 570 mm ( 34.2” x 25.2” x 22.4”)
No
LPKF MiniContac III
111251
Palladium
210 mm x 340 mm (8.3” x 13.4”)
130 mm x 250 mm (5.1” x 9.8”)
LPKF ProtoMat® 95s/II: 110 mm x 230 mm (4.3” x 9.1”)
≥ 0,2 mm (8 mil)
Unlimited
8
< 10 m Ω
Good
Very good
90 minutes
Various special materials
120/240 V, 50 - 60 Hz, 600 VA
18 - 25 °C (64.4 - 77 °F)
870 mm x 640 mm x 570 mm ( 34.2” x 25.2” x 22.4”)
No
LPKF MiniContac III/HF
* Smaller board size applicable if milled with air-foot circuit board plotter (C100/HF, 95s II, H100)
** Other materials upon request
*** upon request
Methods for both technologiesOptimal through-hole plating requires a very high standard holequality. The through-hole plating process starts with the pre-treat-ment of the circuit boards in three tanks for approx. 30 minutes alltogether. This process involves degreasing, pre-treatment andactivation. The circuit boards are then copper-coated in a galvanicbath. This takes 60 - 90 minutes depending upon the specifiedthickness of the copper coating.
The equipment is very environmentally friendly because it is aclosed system: all of the chemicals remain in the tank during use.The only external connection required is a cold water supply for therinsing tank. One set of chemicals lasts approximately one year. No technical expertise is required to operate or look after the tanks.
Chemical tinning optionFor the Contac III, LPKF offers the additional option of a heatedtank to provide chemical tin plating for optimal soldering ofthrough-hole plated circuit boards and oxidation protection.Part number 108267
Tin-plated circuit boards
LPKF Contac III in use
!
Subject to technical modifications. See imprint for details.
30 LPKF Contac III, MiniContac III & MiniContac III/HF
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 30
Subject to technical modifications. See imprint for details.
LPKF MultiPress II – time and cost saving in-houseproduction of prototype multilayer circuit boards.
LPKF MultiPress II
Product features• Up to eight layers• Multilayer boards to 305 mm x 254 mm (12“ x 10“)• Microprocessor controlled• Small footprint
106328
420 mm x 360 mm (16.5“ x 14.1“)
305 mm x 254 mm (12“ x 10“)
150 kN (15 t)
210 °C (410 °F)
Max. 10 bar, min. 6 bar (max. 145 psi, min. 87 psi)
Approx. 30 l/min (1 cfm)
8
After pre-heating, approx. 90 min. plus
hardening time prior to drilling *
530 mm x 600 mm x 480 mm (20.9“ x 23.6“ x 18.9“) **
Approx. 210 kg (463 lb)
240 V/50 - 60 Hz, 2000 VA
4 pressure/temperature/time profiles
FR4, others upon request
Part no. 107050
Specifications
Part number
Max. press area (gross)
Max. circuit board size (recommended)
Max. pressure
Max. temperature
Compressed air supply
Compressed air volume per minute
Max. number of layers
Pressing time
Dimensions (W/H/D)
Weight
Power supply
Microprocessor controlled
Base materials
Options
Mobile stand
The MultiPress II stores various time, temperature and pressureprofiles for processing different materials. Combined with an LPKFcircuit board plotter and an electroplating system, this equipmentis all that is required for complete in-house multilayer prototyping.
* depending upon Prepreg and selected through-hole plating process
** desk-top model
8-layer circuit board
31LPKF MultiPress II
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 31
Different LPKF technologies for the production of multilayers
Technology
Example: 4-layer multilayer
1. Sequential build-up method for multilayer production
Applications· 4, 6 and 8-layer multilayer boards with a maximum net size of 305 mm x 254 mm (12“ x 10“)· Laminating prototype solder mask (LPKF EasySolder)
Insulation engraving of both inner layers(layer 2 & 3) of the circuit board withthe LPKF circuit board plotter.
Bonding of outer layers (layer 1 & 4)with LPKF multilayer press.
Drilling multilayer through-holes withthe LPKF circuit board plotter.
Electroplating of the through-holes withLPKF MiniContac III or Contact III(connecting the inner layers).
5. Insulation engraving of the outerlayers (layer 1 & 4) of the circuit board
Surface finish: mechanical cleaning, tin plating, flux or conformal coating,prototype solder mask (LPKFEasySolder)
1.
2.
3.
4.
5.
6.
Subject to technical modifications. See imprint for details.
32 Technology
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 32
Subject to technical modifications. See imprint for details.
1. Creating layer 2 + layer 3· Layer 3
· Drilling the registration pin holes· Insulation milling
· Layer 2· Insulation milling
2. Creating layer 4 + layer 5· Layer 5
· Drilling the registration pin holes for the MultiPress II setting pins
· Insulation milling· Layer 4
· Insulation milling
3. Creating layer 6 + layer 7· Layer 7
· Drilling the registration pin holes for the MultiPress II setting pins
· Insulation milling· Layer 6
· Insulation milling
4. Bonding materialAccording to the layer construction (see figure above), the layers arepinned in the pressing package and bonded in the MultiPress II.
5. Drilling and through-hole plating· Drilling of the plated through-holes· Electroplating with LPKF MiniContac III or Contac III· Drilling of the non-plated holes
6. Creating layer 1 + layer 8· Insulation milling
7. ContourRouting the internal/external contours
8. Surface finishMechanical cleaning, tin plating, flux or conformal coating, prototype solder mask (LPKF EasySolder)
Example: 8-layer multilayer
2. Registration pin method for multilayer production
Registration pin locations
33Technologie
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 33
Instant solder mask for prototype circuit boards
LPKF EasySolder
Fast, precise, flexible: mechanically made prototype solder maskscan be produced extremely quickly using LPKF EasySolder. Thesolder mask is made out of high-quality, temperature-resistant anddimensionally stable polyimide film. A solder mask increases solde-ring reliability and protects the circuit board from environmentalinfluences. This process requires no screen printing and nophotographic technology or chemical-etching.
180 mm x 120 mm (7“ x 5“) net
Manual w/ torque wrench
60 minutes plus pre-heating
Approx. 60 - 90 min
Specifications LPKF EasySolder
300 mm x 250 mm (12“ x 10“) net
Automatic, programmable
60 minutes, automatic pre-heating
A few minutes
LPKF EasySolder withLPKF MultiPress II
Max. circuit board size
Pressure setup
Laminating time
Cool off period
s. consumables
210 mm x 297 mm (8.3“ x 11.7“), temp. resistant to 255 °C (491 °F) for 5 min. (IPC compliant),
adhesive: modified epoxy resin, 10 per pack (custom sizes available).
LPKF micro plotter (1/8“ shaft)
Metal scalpel, glue stick
and adhesive tape
Rubber, reusable up to 50 times
Accessory set LPKF EasySolder
s. consumables
210 mm x 160 mm (8.3“ x 6.3“)
210 mm x 160 mm (8.3“ x 6.3“)
210 mm x 160 mm (8.3“ x 6.3“)
210 mm x 297 mm (8.3“ x 11.7“)
210 mm x 297 mm (8.3“ x 11.7“)
210 mm x 297 mm (8.3“ x 11.7“)
LPKF EasySolder for LPKF MultiPress II
Part number
Solder mask film
Tools and accessories
Pressure compensation mat
Press sheet (stainless steel)
Cut backing material
Press cushion
Process descriptionLPKF CircuitCAM software uses the soldermask CAD data to createthe cutting paths for the circuit board plotter to mechanicallyproduce the solder mask. Structuring is done by cutting the padsout of the polyamide material using the LPKF circuit board plotter.The solder-resist mask is then bonded to the circuit board using apressing tool. The subsequent lamination process takes place in ahot-air oven at a temperature of 180 °C (356 °F) and takes about60 minutes. The bonding pressure is individually adjusted to thesize of the circuit board to ensure optimal results. LPKF EasySoldermasks are suitable for all standard soldering processes such as waveand reflow soldering, as well as manual soldering. It is temperatureresistant to 288 °C (550 °F), compliant with IPC standards. LPKF EasySolder is supplied complete with accessories and con-sumables. A hot air oven for laminating the solder mask on thecircuit board is also available from LPKF as an optional accessory.
Solder mask lamination with LPKF MultiPress IIThe LPKF MultiPress II can also be used to laminate prototypesolder masks. The advantages are a shorter process time and theability to handle larger circuit boards. The complete laminatingprocess is fully automatic and press parameters are convenientlypre-programmed.
System accessories for
applying the solder
mask
Hot air oven
LPKF MultiPress II
Part number 104425
Subject to technical modifications. See imprint for details.
34 LPKF EasySolder
Part number 102073
Part number 106328
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 34
Tools
Quality and precision – LPKF tools
Subject to technical modifications. See imprint for details.
LPKF’s development to satisfy the extreme precision andperformance requirements of current state of the art circuit boardshas produced a large range of high performance precision cuttingtools. These tools are custom designed for LPKF and made of 100 %top quality carbide resulting in significantly longer tool life, precisecuts, and diminished drill flux. The proprietary designs are accom-plished with extensive testing and design reconfiguration until the
1 2 3 4 5 6 7
Tools (1/8“-Shaft)
A Surface machining tools
(l = 36 mm/1.42“)
B Penetrating tools
(l = 38 mm/1.5“)Drills (5)
Contout router (6)
Endmill (long) (7)
A.2 Cylindrical tools
A.1 Conical tools
RF Endmill (3)
Universal cutter (2)
Microcutter (1)
Endmill (4)
35Tools
38 mm(1.50“)
36 mm (1.42“)
highest quality results are met. LPKF’s leading commitment is anongoing research and development process to continually suit theuser demands and approaching technologies.
For ease of use and to minimize the set-up time, LPKF toolscome in two different lengths: 36 mm (1.42“) for tools working onthe surface (milling bits and endmills) and 38 mm (1.5“) for toolsthat work through the material (drill and router bits).
LPKF Produktkatalog GB 23.04.2003 12:32 Uhr Seite 35
100 µm (4 mil) Copper layer
Base material
200 µm (8 mil)
150 µm (6 mil)
1
2
3
4
A - Engraving tools (36 mm [1.42“] length)
A.1 Conical Tools
A.2 Cylindrical tools
Micro cutter· For copper thickness up to 18 µm (1/2 oz.)· Minimum insulation space: 100 µm (4 mil)
(min. 60,000 rpm required)
Universal cutter· For milling insulation on any type of base
material· Minimum insulation space: 200 µm (8 mil)
Endmill· For rub-outs and wide insulations· Engraving of aluminum front panels· 0.8 mm (31 mil), 1 mm (39 mil),
2 mm (79 mil), 3 mm (118 mil) diameter
Endmill (RF)· For RF circuit outlines: 150 µm (6 mil),
250 µm (10 mil) or 400 µm (15.7 mil) diameter (min. 60,000 rpm required)
· Minimal substrate removal· Straight side walls
Subject to technical modifications. See imprint for details.
36 Tools
0.8 - 3 mm (31 - 118 mil) Øinsulations
0.8 - 3 mm (31 - 118 mil) Øengraving
Aluminum
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 36
Subject to technical modifications. See imprint for details.
1 - 3 mm (39 - 118 mil)Routing
1 - 2 mm(39 - 79 mil)
Ø
Aluminum dielectricmaterial
1 - 2 mm(39 - 79 mil)
Ø
max. 2.4 mm (95 mil) Ø
min. 0.15 mm (6 mil) Ø
5
6
7
B - Drilling /routing tools (38 mm [1.5“] length)
Spiral drill· To drill circuit boards and other materials · 0.15 mm (6 mil) to 3 mm (118 mil)· Diameters bigger than 2.4 mm (96 mil) are
automatically routed· 2.95 mm (116 mil) and 3 mm (118 mil) to
drill registration pin holes
Contour router· Routes inner and outer board contours· Routes large holes without size limitation· 1 mm (39 mil), 2 mm (79 mil), 3 mm (118 mil)
diameter
Endmill (long)· For cutting out aluminum front panels and to
mill clean contours in soft RF substrates· Also to mill pockets in brass and aluminum
backed substrates and to mill enclosures· 1 mm - 2 mm (39 mil - 79 mil) diameter
37Tools
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 37
Part number
Drill underlay material panel A41
Drill underlay material panel A32
FR4, A41, 1-sided, 35 µm (1 oz.)
FR4, A41, 2-sided, 35 µm (1 oz.)
FR4, A41, 2-sided, 18 µm (1/2 oz.)
FR4, A32, 1-sided, 35 µm (1 oz.)
FR4, A32, 2-sided, 35 µm (1 oz.)
Tool set 1/8“ shaft
Micro cutter 1/8“, l = 36 mm,
0.1 - 0.15 mm (4 - 6 mil)
Endmill (RF) 1/8“, l = 36 mm,
d = 0.25 mm (10 mil)
Adhesive tape
Circuit board cleaning pad
RF and microwave tool set
Rogers data sheet set
102368
10
10
10
1
1
3
102374
10
10
5
5
1
5
5
1
3
Product/accessory set Accessory set for LPKF ProtoMat®
C20, C40 C60
102375
5
5
5
5
5
5
1
1
3
M30/S, M40
102377
5
5
5
2
3
5
5
1
5
5
1
3
M60, 95s/II, X60, H100
111249
10
10
5
5
1
5
5
1
3
1
1
C100/HF
Consumables
ExplanationEvery LPKF circuit board plotter has a registration set pin hole system to ensurethe precise positioning of double-sided base materials in particular. This loca-tion hole system consists of set pin holes (1) positioned exactly on the centeraxis of the machine in permanent set pin hole strips (3).
A special adhesive tape (2) leaves no residue and is used to mount the basematerial. It also ensures that warped objects are held down flat on the machinestabletop. The PCB cleaning pad removes minor burrs and residues from themechanical milling process and gives the base material surface a great finish.
Start sets for LPKF circuit board plotters
Tool set 1/8“ shaft5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.6 mm (24 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.7 mm (28 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.8 mm (31.5 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 0.9 mm (35.4 mil)5 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.0 mm (39 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.1 mm (43.3 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.3 mm (51.2 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 1.5 mm (59 mil)2 Spiral drills 1/8“, l = 38 mm (1.5“), d = 3.0 mm (118 mil)1 Contour Router 1/8“, l = 38 mm (1.5“), d = 1.0 mm (39 mil)1 Contour Router 1/8“, l = 38 mm (1.5“), d = 2.0 mm (79 mil)2 Endmill 1/8“, l = 36 mm (1.42“), d = 1.0 mm (39 mil)1 Endmill 1/8“, l = 36 mm (1.42“), d = 2.0 mm (79 mil)2 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.4 mm (15.7 mil)
10 Universal cutters 1/8“, l = 36 mm (1.42“), 0.2 - 0.5 mm (8 - 20 mil)Part number 102375
RF and microwave tool set1 RO4003, 0.8 mm (32 mil) thick, 230 x 305 mm (9“ x 12“)5 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.25 mm (10 mil)3 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.4 mm (15.7 mil)5 Endmills 1/8“, l = 36 mm (1.42“), d = 1.0 mm (39 mil)2 Endmills 1/8“, l = 36 mm (1.42“), d = 2.0 mm (79 mil)2 Endmills 1/8“, l = 38 mm (1.42“), d = 2.0 mm (79 mil)3 Endmills (RF) 1/8“, l = 36 mm (1.42“), d = 0.15 mm (6 mil)Part number 111535
For all LPKF circuit board plotters, LPKF has comprehensive start and accessory sets available with high-qualitytools and consumables to ensure the highest levels of quality and precision. All of these components can alsobe ordered separately.
1
3
31
2
2
Subject to technical modifications. See imprint for details.
38 Consumables
1 210 mm x 297 mm (8“ x 12“) 2 297 mm x 420 mm (12“ x 16“)
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 38
Subject to technical modifications. See imprint for details.
For single or double-sided circuit boardsNominal thickness = copper layer + insulation layer
Example:The nominal thickness is calculated as follows:1.464 mm + 2 x 0.018 mm = 1.5 mm57.63 mil + 2 x 0.71 mil = 59 mil
Base materials
Copper layer
Copper layer
Fiberglass reinforced epoxy resin
(insulation layer)
Nominal thickness of the base material
Nom
inal
thi
ckne
ss
Copper layer
Copper layer
Fiberglass reinforced epoxy resin
(Insulation layer)
Nom
inal
thi
ckne
ss
For internal layers of multilayersNominal thickness = insulation layer
Example:The nominal thickness is calculated as follows:1.5 mm - 2 x 0.018 mm = 1.464 mm59 mil - 2 x 0.71 mil = 57.63 mil
Resin
Reinforcement
Dielectric constant εR
LPKF standard article
Phenol resin
Paper
4.70
Epoxy resin
Paper
4.90
•
Usual base material types for prototyping*
* Other materials upon request, e.g. RO4000® (Non PTFE)
Name FR2 FR3
Epoxy resin
Glass fiber
4.70
•
FR4/FR5 (G10)
Polyimide resin
None
4.2 - 4.6
Flex
RT/duroid® etc.
Polytetrafluorethylene (PTFE)
2.2 - 10.2
PTFE
Base material
Circuit board specifications are becoming ever more complex: higher packaging densities, finer structures,tighter spaces and smaller holes all require first-class base materials. This is the only way of guaranteeing high-quality results to match the increasing demands for RF and microwave technology and multilayerproduction.
Copper layer
Copper layer
Reinforcement (glass fiber)
Resin
39Consumables
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 39
LPKF multilayer start set
The selection of the proper material is particularly crucial forthe production of multilayer circuit boards. The carefullyselected components in LPKF material sets include all thenecessary materials of tried-and-tested quality to ensure thebest results and smooth production of multilayer prototypes.
The following material sets are available depending on the number of layers tobe produced:
* This requires the accessories for MultiPress II to produce multilayers with pinned layers:1 x pressing frame with positioning pins2 x pressing sheet for 400 mm x 360 mm (15.7“ x 14“)
4-layer multilayer
6-layer multilayer
8-layer multilayer
Subject to technical modifications. See imprint for details.
Part number 111493
40 Consumables
LPKF 4-layer multilayer setFloating method for ten panels with 254 mm x 304 mm (10“ x 12“) net sizePart number 106836
Contents:20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective
film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5“ x 14.2“)40 x Prepeg, size 380 mm x 320 mm (15“ x 12.6“)20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)10 x double sided FR4 laminate, 35 µm (1 oz.) Cu clad, thickness 1 mm (39 mil),
size 420 mm x 360 mm (16.5“ x 14.2“)4 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)
LPKF 8-layer multilayer setMethod with pinned layers* for ten panels with 254 mm x 304 mm (10“ x 12“) net sizePart number 111250
Contents:30 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.2 mm (8 mil),
size 420 mm x 360 mm (16.5“ x 14.2“)20 x laminate multi-layer 5 µm (1/8 oz.) copper base, thickness 0.2 mm (8 mil),
size 420 mm x 360 mm (16.2“ x 14.5“)60 x Prepreg, size 380 mm x 320 mm (15“ x 12.6“)20 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)6 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)
LPKF 6-layer multilayer setFloating method for ten panels for 254 mm x 304 mm (10“ x 12“) net sizePart number 108826
Contents:20 x single sided multilayer laminate, 5 µm (1/8 oz.) Cu. clad with protective
film, thickness 0.2 mm (8 mil), size 420 mm x 360 mm (16.5“ x 14.2“)20 x laminate multi-layer 18 µm (1/2 oz.) copper base, thickness 0.2 mm (8 mil),
size 420 mm x 360 mm (16.2“ x 14.5“)80 x Prepreg, size 380 mm x 320 mm (15“ x 12.6“)40 x pressing cardboard cushion, size 420 mm x 360 mm (16.5“ x 14.2“)10 x double sided FR4 laminate, 18 µm (1/2 oz.) Cu clad, thickness 0.46 mm (18.1 mil),
size 420 mm x 360 mm (16.5“ x 14.2“)4 x drill underlay material, size 420 mm x 360 mm (16.5“ x 14.2“)
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 40
Subject to technical modifications. See imprint for details.
Chemicals
LPKF has put together different chemical sets for use withLPKF Contac III and MiniContac III through-hole platingsystems as well as for circuit board surface finish. The setcontains high-quality perfectly matched components speciallyselected for each system to ensure the production of first classthrough-hole plated contacts.
LPKF Contac III chemical setFor through-hole plating, complete set with approx. one year’s supplyPart number 106920
Contents:4 x 13 liters (3.435 gal.) Cleaner 1104 x 10 liters (2.642 gal.) Cleaner 2101 x 10 liters (2.642 gal.) Activator 3104 x 10 liters (2.642 gal.) Copper Plater 4001 x 0.5 liters (0.132 gal.) Shine 400
Chemical set LPKF MiniContac IIIFor through-hole plating, complete set with approx. one year’s supplyPart number 108764
Contents:4 x 6 liters (1.585 gal.) Cleaner 1104 x 5 liters (1.321 gal.) Cleaner 2101 x 5 liters (1.321 gal.) Activator 3102 x 5 liters (1.321 gal.) Copper Plater 400 and2 x 1 liters (0.2642 gal.) Copper Plater 400 1 x 0.25 liters (0.066 gal.) Shine 400
Chemical set for LPKF MiniContac III/HFFor through-hole plating, complete set with approx. one year’s supplyPart number 108766
Contents:4 x 6 liters (1.585 gal.) Cleaner 1104 x 5 liters (1.321 gal.) Cleaner 2101 x Activator 310
· 4,740 ml (1.2523 gal.) Catalyst A· 265 ml ( 0.0697 gal.) Catalyst B· 100 ml (0.0264 gal.) Replenisher
2 x 5 liters (1.321 gal.) Copper Plater 400 and2 x 1 liters (0.2642 gal.) Copper Plater 4001 x 0.25 liters (0.066 gal.) Shine 400
Tin plating for Contac IIITin-plates prototype circuit boards. Protects against oxidation and providesexcellent solderability.Part number 109131
• Filled in Contac III tin plating tank 13 liters (3.5 gal.)• Good for over 500 boards 100 x 160 mm (4“ x 6“)• Shipped in powder form 1,170 gr. (39 oz.), distilled water required for setup
Tin plated circuit board
41Consumables
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 41
Accessories for LPKF AutoContacFor rapid and environmentally-friendly in-house through-hole plating withoutchemicals, LPKF AutoContac is the ideal solution. The special conductive pasteis applied by the LPKF circuit board plotter to ensure optimal through-holeplating.
LPKF AutoContac paste setTwo pre-filled cartridges with 25 gr. (0.83 oz.) paste, and one empty cartridge.Part number 106280
Polypropylene refill fitting (luer)To connect two cartridges with one another for mixing.Part number 106281
Accessory set for LPKF EasySolder for LPKF MultiPress IIPart number 106244
Contents:10 x solder mask film 75 µm (3 mil) 200 mm x 300 mm (7.87“ x 11.81“)10 x pressing cardboard cushion 210 mm x 297 mm (8.27“ x 11.7“)4 x drill underlay material 210 mm x 297 mm (8.27“ x 11.7“)2 x pressing sheet (stainless steel) 210 mm x 297 mm (8.27“ x 11.7“)2 x press compensation mat 210 mm x 297 mm (8.27“ x 11.7“)3 x micro cutter1 x scalpel1 x glue stick and adhesive tape
LPKF EasySolder accessory set for LPKF MiniPress (manual system)Part number 107644
Contents:10 x solder mask film 75 µm (3 mil) 200 mm x 300 mm (7.87“ x 11.81“)10 x pressing cardboard cushion 210 mm x 297 mm (8.27“ x 11.7“)4 x drill underlay material 210 mm x 297 mm (8.27“ x 11.7“)2 x pressing sheets (stainless steel) 210 mm x 160 mm (8.27“ x 6.3“)2 x press compensation mat 210 mm x 297 mm (8.27“ x 11.7“)3 x micro cutter1 x scalpel1 x glue stick and adhesive tape
Accessories for LPKF EasySolderThe following accessory sets are specially prepared for the LPKF EasySoldermethod. These sets ensure the production of high-quality solder masks tosimplify the assembly of SMT components. Each set contains the right amountof material to produce at least ten solder masks.
Accessories for LPKF AutoContac and LPKF EasySolder
Subject to technical modifications. See imprint for details.
42 Consumables
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 42
Product descriptionLPKF ZelPrint LT300 is a precision manual stencil printer. This tabletop modelcan be utilized for both prototypes and small batches of fine pitch SMT boards.Precise vertical separation between stencil and circuit board is guaranteed tomeet the specifications of contact printing. This unique solution allows printingof 0.3 mm (12 mil) pitch (ultra-fine-pitch area).
High positioning accuracy, simple operation and the ability to use milledpolymer stencils (limited to 0.65 mm [26 mil] pitch) reduces costs and in-creases efficiency in the production of circuit board prototypes.
This printer is shipped with a ZelFlex quick-release stretching frame forstencils but is also compatible with various other frames. The precise three-dimensional adjustment of the stencil with micrometer screws (X, Y, theta andclearance) is vital for superior printing results. The ZelPrint LT300 has freelyadjustable, high clearance PCB nesting pins that allow printing of boards thatare already populated on the other side.
LPKF provides two professional stencil printers for prototypesand small batches. Both LPKF ZelPrint models have extremelyhigh levels of precision and efficiency: Manual or semi-auto-matic: the sophisticated technology guarantees easy operationand perfect printing results.
LPKF ZelPrint with test screen, rubber squeegee and metal stencil,
clamped into a ZelFlex ZR quick-release frame (can also be
used for polymer stencils).
Manual tabletop stencil printer
LPKF ZelPrint LT300
LPKF ZelPrint PTC 350
Semi-automatic tabletop stencil printer
Product descriptionThis semi-automatic fine-pitch SMD stencil printer is designed for prototypecircuit board production as well as for the production of small to mediumquantity batches.
The powered squeegee is speed and pressure controlled and guaranteeshighly reproducible printing results. The fast and simple circuit board clamping,and the automatically switched vacuum table, allows up to 100 printing cyclesper hour. Straightforward settings and simple operation of four operating modesincluding single and dual pass printing and print-flood/flood-print cycles. The printing process can be started automatically just by closing the printer, orbe initiated manually at the push of a button. The stencil/PCB alignment isprecisely done in X/Y/Z and theta and a test print screen overlay allows quicksetup.
Stencil frames are held in place with pneumatic latches and can beexchanged quickly through slide rails. Smaller frames are held in frameadapters. The PTC 350’s rigid construction ensures the highest level of precisionand efficiency.
LPKF ZelPrint PTC 350
Product features• Semi-automatic stencil printer• Printing of rigid and flex boards• Vacuum table• Precision stencil adjust with micrometer screws• 4 printing modes• Compatible with various stencil frames, including
quick release• Test print screen included
LPKF ZelPrint
Subject to technical modifications. See imprint for details.
Product features• Manual stencil printer• Parallel stencil separation• Quick-release stencil frame included (ZelFlex ZR)• Precision stencil adjustment with micrometer screws• Compatible with various stencil frames• Test print screen included• Printing of two side populated boards
43LPKF ZelPrint
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 43
*Option
Part number
Frame dimensions
Maximum printing area
Squeegee action
Print table adjustment
Max. height of printing items
Squeegee speed
Squeegee pressure
Squeegee type
Accuracy (machine)
Accuracy (printing)
Double side printing
Dimensions (W/H/D)
Height with optional stand
Weight
Power
Compressed air
Vacuum requirements
Vacuum connection
Ambient conditions
107356
width up to 430 mm (16.92“);
length adjustable from 420 mm - 520 mm (16.54“ x 20.47“),
height adjustable from 20 - 40 mm ( 0.78“ x 1.57“)
300 x 300 mm (11.8“ x 11.8“)
manual
X and Y ±10 mm (0.4“/400 mil); υ ± 5°
5 mm (0.2“), optionally more
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rubber
± 0.025 mm (± 0.98 mil)
± 0.04 mm (1.57 mil)
max. height of components 15 mm (0.59“)
740 mm x 180 mm x 530 mm (29.1“ x 7.1“ x 20.9“)
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30 kg (66 lb)
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Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95%
Specifications LPKF ZelPrint LT300 LPKF ZelPrint PTC350
105393
457 x 584mm (18“ x 23“),
height adjustable from 30 - 33 mm (1.18“ - 1.29“)
350 x 350 mm (13.8“ x 13.8“)
power sweep
X and Y ±10 mm (0.4“/400 mil); υ ± 5°
20 mm (0.8“)
10 to 120 mm/s (0.38“ - 4.72“/s)
adjustable 0 - 6 bar (0 - 87 psi) + downstop
dual squeegee, rubber or metal*
± 0.025 mm (± 0.98 mil)
0.04 mm (1.57 mil)
max. height of components 10 mm (0.39“)
600 mm x 380 mm x 800 mm ( 23.6“ x 14.9“ x 31.5“)
1200 mm (47.4“)
80 kg (176 lb), with base 122 kg (268.4 lb)
220V-240V/50 Hz or 100V-120V/60 Hz, 300 VA
6 bar, 10 l/min (87 psi, 0.3528 cfm)
approx. 40 m3/h
40mm (1.6“) hose
Temperature: 20 - 30 °C (68 - 86 °F)
Humidity: 30 - 95%
• standard
+ optional
– not available
recommended basic equipment
Floor-standing base for semiautomatic
stencil printer PTC350
Vacuum pump, built-in floor-standing base
Vacuum pump (external)
Compressor
Dual rubber squeegee 250 mm (9.85“)
Dual metal squeegee 350 mm (13.77“)
Manual quick release frame ZR 457 x 580 mm (18“ x 23“);
Inner area 407 x 470 mm (16“ x 18.5“)
Pneumatic quick release frame Z4P 457x584
Adapter for smaller frames
Test screen overlay
Squeegee height setting with two measuring gauges
Rubber blade for squeegee
Metal blade for squeegee
ZelFlex ZR 362 x 480 mm (14.25“ x 18.89“)
ZelFlex ZR 406 x 508 mm (16“ x 20“)
Rubber squeegee 260 mm (10.23“)
Rubber squeegee 150 mm (5.9“)
Rubber/metal squeegee – custom width
Accessories LPKF ZelPrint
PTC350
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LT300
Subject to technical modifications. See imprint for details.
44 LPKF ZelPrint
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 44
Subject to technical modifications. See imprint for details.
LPKF ZelFlex
LPKF offers two different quick-release stencil frame systems, onewith mechanical and the other with pneumatic stretching mecha-nism. For ease of use the ZelFlex Z4P maintains tension without airbeing constantly connected to it. Both versions allow the stencil tobe directly mounted in the frame using a perforation system. The simple perforation pattern is royalty free and shipped as aGerber® file with every frame.
LPKF ZelFlex – quick-release stencil frames
Available for virtually every stencil printer
Product features• Available for virtually any stencil printer• Fast and simple changeover of stencils• Reduces storage space for archiving stencils• Uniform tension over the whole surface• ZelFlex Z4P maintains tension without air being connected• Environmentally friendly: no adhesives, lacquers and cleaning
solvents required
1. LPKF ZelFlex ZRMechanically stretched two-sided quick-release stencil frame forboth metal and polymer stencils
2. LPKF ZelFlex Z4PProfessional quick-release stencil frame with pneumatic 4-sideaction: Ideal for high volume environment. Frame maintains tensionafter air is disconnected.
LPKF ZelFlex Z4P
LPKF ZelFlex ZR frame with metal and polymer stencil LPKF ZelFlex Z4P with compressed air hose
45LPKF ZelFlex
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 45
Product description LPKF ZelFlex Z4P4-sided quick-release stencil frame is a flexible, cost and space saving alter-native for professional stencil print operations.
The patented stencil perforation pattern guarantees simple, fast and repeat-able stencil changeover. The stretching mechanism uses compressed air tocreate a uniform tension over the whole working area. Once charged, the framemaintains the tension and can be used for more than 24 hours without beingre-connected to an air supply. This feature allows simplified operation and easyintegration into the printer.
IMPORTANT NOTEAll LPKF ZelFlex frames are produced in many different dimensions and with different
adapters to fit most available screen printers. A Gerber® file of the royalty-free perforationpattern is supplied with every frame.
Product description LPKF ZelFlex ZRLPKF ZelFlex mechanical quick-release frames are manufactured from rigid,high-quality aluminum profiles and enable the direct mounting of stencils in theframes.
Equal tension of the stencil is achieved with patented tensioning regulators,that protect the stencil from damage through over-tensioning. Smaller stencilscan also be fitted in these frames without any problems. The tension of thestencil can be adjusted or changed even if the frame is already installed in theprinter.
Part number
Outer dimensions (W/D)*
Max. inner dimensions (W/D) **
Max. printing area (W/D)***
Max. squeegee width
Weight
ZelPrint type
101321
362 mm x 480 mm
(14.2“ x 18.9“)
312 mm x 370 mm
(12.28“ x 14.56“)
250 mm x 320 mm
(9.87“ x 12.59“)
260 mm (10.23“)
2.8 kg (6.16 lb)
LPKF ZelPrint LT300
111244
406 mm x 508 mm
(16“ x 20“)
356 mm x 398 mm
(14.01“ x 15.66“)
300 mm x 350 mm
(11.81“ x 13.77“)
300 mm (11.81“)
3.1 kg (6.82 lb)
LPKF ZelPrint LT300
LPKF ZelFlex ZR Specifications
* External dimensions without tension screws
** Rear clamping bar can be moved to reduce stencil length
*** Depending on the position of rear bar and stencil size
LPKF ZelFlex ZR 362 x 480 LPKF ZelFlex ZR 406 x 508
101318
457 mm x 584 mm
(18“ x 23“)
407 mm x 474 mm
(16.02“ x 18.66“)
350 mm x 420 mm
(13.77“ x 16.53“)
350 mm (13.77“)
3.5 kg (7.70 lb)
LPKF ZelPrint PTC350
LPKF ZelFlex ZR 457 x 584
Part number
External dimensions (W/H/D)
Max. inner dimensions (W/D)
Max. printing area (W/D)
Max. squeegee width
Compressed air supply
Air refill
Height of frame
Weight
Ambient conditions
105802
457 mm x 33 mm x 584 mm (18“ x 1.30“ x 22“)
357 mm x 484 mm (14“ x 19.05“)
337 mm x 464 mm (13.26“ x 18.26“)
340 mm (13.38“)
Dependant on the stencil thickness
Max. 6 bar (87 psi) (6 x 10 Pa) for stencils > 150 µm (6 mil)
Max. 4 bar (58 psi) (6 x 10 Pa) for stencils 100 - 150 µm (4 - 6 mil)
Every 48 hours min.
33 mm (1.29“) without adapters
5 to 10 kg (11 - 22 lb)
Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95 %
LPKF ZelFlex Z4P Specifications
!Subject to technical modifications. See imprint for details.
46 LPKF ZelFlex
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 46
Subject to technical modifications. See imprint for details.
LPKF ZelPlace & BGA Placer
LPKF ZelPlace 110, 220, 330, 340
Manual Pick and Place systems for prototype circuitboards and small batches
Product features• Fine-pitch assembly• Vacuum pick-up nozzle and precision manipulator• Modular system design• Dispenser• Various feeders• Upgradable at any time
General product descriptionLPKF ZelPlace is a manual Pick & Place system for professionalSMD assembly of prototype PCBs and small production batches.The basic unit of all LPKF ZelPlace machines is a multi-functiondispenser for applying various media, and a vacuum pick-up nozzleto place the components.
All LPKF ZelPlace models are based on the same platform.Upgrading to a more sophisticated system is possible at any time.Each ZelPlace system comes with a multifunctional dispenser unitthat features both manual and automatic dispensing mode.
LPKF ZelPlace 110 with component turntable
LPKF ZelPlace 110The LPKF ZelPlace 110 system is the ideal solution for theassembly of SMD components (surface mounted devices) with apitch between 1 mm (39 mil) and 1.27 mm (50 mil), such as SOIC,SOT, PLCC and passive components 1206 and 0805.
The components are picked with a vacuum pick-up nozzle andplaced on the PCB with the help of a guided hand support. Feedersand turntables can be mounted to LPKF ZelPlace 110 on threesides. The multi-function LPKF ZelDisp dispenser for solder pasteor adhesives is part of the Pick & Place system.
LPKF ZelPlace 220LPKF ZelPlace 220 has a guided manipulator head and integratedillumination. This allows precise and vibration-free placement of acomponent in the desired position. When placing the componentthe vacuum is controlled by the LPKF ZelDisp multifunction dis-penser unit and turned on and off automatically. In addition toclassic areas of application, this system is capable of dispensingadhesives and solder paste. Turntables (for bulk components) andfeeders can be conveniently placed on all three sides.
LPKF ZelPlace 220 enables the assembly of digital SMDs with alarge number and high density of leads. Components such as SSOPwith 0.65 mm (26 mil) pitch, TSOP with 0.5 mm (20 mil) pitch,QFP with 0.65 mm (26 mil) pitch and 160 leads, or 0402 passivecomponents, can be precisely placed with this system.
LPKF ZelPlace 220 with component turntable, tape and stick feeder
47LPKF ZelPlace & BGA Placer
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 47
LPKF ZelPlace 330/340LPKF ZelPlace 330 and 340 are the most advanced LPKF ZelPlacesystems. Both systems allow the placing of fine-pitch componentssuch as QFP with 0.5 mm ( 20 mil) and 0.4 mm (16 mil) pitch withup to 300 pins, as well as 0402 components. The edge centring ofBGA components up to 1.27 mm (50 mil) pitch is also no problemfor LPKF ZelPlace 330/340.
The X-Y-guided manipulator can be locked in x and y directionwith fine adjustment using micrometer screws. This allows highlevels of placement accuracy for SMD components. The vacuum ofthe pick-up nozzle is automatically turned on and off when placingthe component.
A swiveling micro camera can be mounted directly on themanipulator to ease placement of large components. Other optionsinclude a stereo microscope with or without a CCD camera, and amonitor, so ZelPlace 330 or 340 can also be used as an inspectionunit.
A turntable for bulk components and a range of different feederscan be placed ergonomically on all three sides (ZelPlace 330).
LPKF ZelPlace 340 contains an additional reworking station forselective soldering of SMD components. In this case, the feederscan be placed on the left side with the turntable sitting in the back.Instead of a feeder rail a second turntable can be placed on the leftside of the system.
LPKF ZelPlace 330/340 with optional stereo microscope and CCD camera
LPKF ZelPlace 330 with component turntable, feeder carrier and
feeder
Subject to technical modifications. See imprint for details.
48 LPKF ZelPlace & BGA Placer
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 48
LPKF ZelPlace BGA
Semi-automatic placement of new generation compo-nents to assemble highly integrated circuit boards.
Subject to technical modifications. See imprint for details.
BGA componentLPKF ZelPlace BGA with monitor
Product features• Semi-automatic placement of BGA and QFQ components from
5 mm x 5 mm (0.2“ x 0.2“) up to 45 mm x 45 mm (1.77“ x 1.77“)• Granite base plate• Air-bearing positioning table• Optical placement verification
Product descriptionThe placing of components with pins hidden from the top and sidesrequires reliable and precise alignment to avoid expensive anddifficult rework.
LPKF ZelPlace BGA Placer is designed for the accurate placingof different types of BGA, CSP and flip chip components, as well asfine-pitch and ultra-fine-pitch components. The system is suitablefor R&D labs as well as production facilities focusing on customdesigns and small batches.
Special optics and adjustable two-colour illumination help tosimultaneously view and align the PCB leads and the componentpins. Coarse and fine adjustment is achieved using an air-bearingtable with micrometer screw adjustment.
As soon as the component is aligned, it is automatically placedat a single push of a button.
Placing components
with CCD camera and
monitor
Max. PCB size
Max. size of components
Min. size of components
Pitch
Placement accuracy
Power supply
Compressed air
Dimensions (W/H/D)
Weight
220 mm x 300 mm (8.6“ x 11.8“)
45 mm x 45 mm (1.8“ x 1.8“)
5 mm x 5 mm (0.2“ x 0.2“)
0.3 mm (12 mil)
± 50 µm (± 2 mil)
230 V/50 Hz oder 115 V/60 Hz, 20 VA
6 bar (87 psi), min. 5 l/min (0.18 cfm), oil-free
600 mm x 430 mm x 435 mm
(23.6“ x 17“ x 17.1“)
35 kg (77 lb)
Specifications LPKF ZelPlace BGA
49LPKF ZelPlace & BGA Placer
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 49
IMPORTANT NOTELPKF ZelPlace 110, 220 and 330 can
be upgraded to LPKF ZelPlace system340.!
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Max. PCB size
Max. placement area
Operating air pressure
Vacuum
Pulse/Pause ratio
Number of dispensing points
Dispensing quantity
Turntable location
Feeder location
Power supply
Air supply
Max. device dimensions
(W/H/D)
Weight
Ambient conditions
106839
370 x 290 mm
(14.56“ x 11.42“)
220 x 300 mm
(8.66“ x 11.81“)
0.1 - 2.5 bar (1.45 - 36.25 psi)
0 - 0.8 bar (0 - 11.6 psi)
0.1 - 2s / 0.1 - 5s
up to 300 /min
minimum 0.2 mm3
left/right/back
left/right
120V or 230V, 50/60Hz. 7VA
6 bar (87 psi), 10 l/min (0.35 cfm)*
1,000 mm x 500 mm x 900 mm
(40“ x 20“ x 35“)
15 - 40 kg (33 - 88 lb)
Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95%
107953
370 mm x 340 mm
(14.56“ x 13.39“)
370 mm x 300 mm
(14.56“ x 11.81“)
0.1 - 2.5 bar (1.45 - 36.25 psi)
0 - 0.8 bar (0 - 11.6 psi)
0.1 - 2s / 0.1 - 5s
up to 300/min
minimum 0.2 mm3
left/right/back
left/right
120V or 230V, 50/60Hz. 7VA
6 bar (87 psi), 10 l/min (0.35 cfm)*
1,000 mm x 500 mm x 900 mm
(40“ x 20“ x 35“)
15 - 40 kg (33 - 88 lb)
Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95%
Specifications
LPKF ZelPlace
Entry level
LPKF ZelPlace 110
Professional system
LPKF ZelPlace 220
106840
370 mm x 340 mm
(14.56“ x 13.39“)
370 mm x 300 mm
(14.56“ x 11.81“)
0.1 - 2.5 bar (1.45 - 36.25 psi)
0- 0.8 bar (0 - 11.6 psi)
0.1 - 2s / 0.1 - 5s
up to 300/min
minimum 0.2 mm3
left/right/back
left/right
120V or 230V, 50/60Hz. 7VA
6 bar (87 psi), 10 l/min (0.35 cfm)*
1,000 mm x 500 mm x 900 mm
(40“ x 20“ x 35“)
15 - 40 kg (33 - 88 lb)
Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95%
High-end system
LPKF ZelPlace 330
106842
370 mm x 340 mm
(14.56“ x 13.39“)
370 mm x 300 mm
(14.56“ x 11.81“)
0.1 - 2.5 bar (1.45 - 36.25 psi)
0 - 0.8 bar (0 - 11.6 psi)
0.1 - 2s / 0.1 - 5s
up to 300/min
minimum 0.2 mm3
left/back
left
230V, 50/60Hz, 780VA
6 bar (87 psi), 10 l/min (0.53 cfm)*
1,000 mm x 500 mm x 900 mm
(40“ x 20“ x 35“)
15 - 40 kg (33 - 88 lb)
Temperature: 5 - 35 °C (41 - 95 °F)
Humidity: 30 - 95%
High-end / repair system
LPKF ZelPlace 340
ZelDisp dispenser
Bridge-guided unit for stereo-microscope and CCD camera
Zoom stereo-microscope unit SM143
CCD Camera
Color monitor 14“
Ball socket turntable 150 mm ( 5.90“)
Turntable set with 45 antistatic component bins
Turntable set with 90 antistatic component bins
Feeder-carrier
Tape feeder 8 mm (0.31“)
Tape feeder 12 mm (0.47“)
Tape feeder 16 mm (0.63“)
Stick feeder SO8 - SO28, SO8L - SO28L
Stick feeder PLCC28 - PLCC44
Stick feeder PLCC52 - PLCC84
Monochrome micro camera (swiveling)
Upgrade kit for LPKF ZelPlace 110 to 220
Upgrade kit for LPKF ZelPlace 110 to 330
Upgrade kit for LPKF ZelPlace 220 to 330
Upgrade kit for LPKF ZelPlace 330 to 340
Set of consumables K1
Set of consumables K2
Stand for 2 cartridges*
Vacuum gripping device*
Vacuum switch*
Foot switch with 2 m (6 ft.) cable
Set of 10 dispensing and vacuum needles*
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LPKF ZelPlace accessories LPKF
ZelPlace 110
LPKF
ZelPlace 220
LPKF
ZelPlace 330
LPKF
ZelPlace 340
• standard equipment
+ accessories
– not available
optimal configuration
* clean, dry, oil-free
* items are included in set K1 delivered with LPKF ZelPlace
Part number
104766
104767
109190
105614
105615
101339
101344
101377
101352
101351
101350
101356
101357
103897
106055
Upon request
Upon request
Upon request
Upon request
Subject to technical modifications. See imprint for details.
50 LPKF ZelPlace & BGA Placer
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 50
Subject to technical modifications. See imprint for details.
Accessories for LPKF ZelPlace 110, 220, 330 and 340
Tape and stick feederUp to 13 feeders can be mounted on the feeder carrier for fast changeover ofcomponents. They can be conveniently mounted on both sides of the system.
Turntable for bulk componentsThe turntable with either 45 or 90 ESD safe components bins can be locatedon both sides of the system as well as in the back.
LPKF ZelDispEach LPKF ZelPlace comes with a ZelDisp dispenser unit. This multi-functiondispenser with an integrated non-drop function is also designed for thedispensing of low viscosity fluids like adhesives. The dispensing pressure, timeand repetition rate between the pulses can be set as required. The dispensingcycle is started by activating the foot switch (LPKF ZelPlace 110) or pressingdown the manipulator head (all other LPKF ZelPlace versions). The Pick & Placevacuum is also generated and controlled by the LPKF ZelDisp unit.
Consumables set K1This set contains the following parts: foot switch with 2 m (6 ft.) cable, vacuumpick-up nozzle with vacuum valve, silicon hoses, cartridge adapter 10 ccm (4 inch2), two 10 ccm cartridges with caps and pistons and plungers, set of tendispensing and vacuum needles, two vacuum caps, stand for two cartridges.
LPKF consumables set K2One cartridge adapter 5 ccm, two 5 ccm cartridges with caps and pistons andplungers, set of ten dispensing and vacuum needles, two vacuum caps.
Feeder carrier with feeders
LPKF ZelDisp
ESD safe turntable for bulk components
51LPKF ZelPlace & BGA Placer
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 51
Passive components in Inch / mm
1206 (3216)
0805 (2012)
0603 (1608)
0402 (1005)
0201 (0603)
IC packages
SOT23
SOT323
SC90-TR
SOIC 1.27 mm (0.05“)
PLCC 1.27 mm (0.05“)
SSOP 0.65 mm (0.025“) - 64 leads
TSOP 0.5 mm (0.019“) - 48 leads
QFP 0.8 mm (0.031“) - 120 leads
QFP 0.65 mm (0.025“) - 100 leads
QFP 0.65 mm (0.025“) - 160 leads
QFP 0.5 mm (0.019“) - 208 leads
QFP 0.4 mm (0.015“) - 256 leads
LQFP 0.3 mm (0.011“) - 168 leads
BGA 1.5/1.27 mm (0.06“/0.05“)
BGA 1 mm (0.039“)
µBGA® 0.75 mm (0.029“)
µBGA® 0.5 mm (0.019“)
Compatible
Limited compatibility (requires skilled user or is time consuming)
additional tools may be required
Entry level
LPKF ZelPlace 110
Professional system
LPKF ZelPlace 220
High-end systems
LPKF ZelPlace 330 & 340
LPKF ZelPlace BGA
Overview of typical SMD components and recommended assembly configurations
Edge Centring
Edge Centring
Subject to technical modifications. See imprint for details.
52 LPKF ZelPlace & BGA Placer
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 52
Subject to technical modifications. See imprint for details.
LPKF ZelFlow
LPKF ZelFlow RO4, RO4/N2 Reflow Ovens
Part number
Maximum circuit board size
Preheating temperature/time
Reflow temperature/time
Long thermal treatments temperature/time
Temperature stabilisation time
Cooling
Power connection
Power consumption max.
Nitrogen gas consumption (N2 model only)
Dimensions (W/H/D)
Weight
Ambient conditions
106006
280 mm x 350 mm
(11.02“ x 13.77“)
50 - 230 °C (122 - 446 °F), 1 - 1800 s
75 - 270 °C (167 - 518 °F), 0 - 600 s
50 - 220 °C (122 - 428 °F), 1 - 1440 min
5 min
variable speed fans, processor controlled
220 - 230 V/50 - 60 Hz single phase
3,500 VA
0.28 m3/h (10 SCFH)*
500 mm x 370 mm x 450 mm
(19.7“ x 14.6“ x 17.7“)
24 kg (52.8 lb)
Temperature: 20 - 30 °C (68 - 86 °F)
Humidity: 30 - 95 %
Specifications
Product descriptionThe LPKF ZelFlow RO4 combined hot-air/quartz reflow oven is theideal tool for rapid SMD prototyping and small batch production.
Compact and versatile, the oven has a large working area andmicro-processor controlled temperature-time profiles. It is capableof SMD Reflow soldering, curing of adhesives and conductivepastes, and other thermal treatments.
The process temperature and time can be easily programmed bythe user. All parameters such as pre-heating/reflow temperaturesand times can be saved as user profiles for later use.
It is also suitable for longer treatments such as temperaturestabilisation of electronic components for up to 24 hours. The startand end of all processes is indicated visually and acoustically. Thetimers can be set to display count-up or count-down to the end ofthe process. The circuit boards are automatically cooled at the endof the process.
Its dual access design features both drawer and a clamshellopening with safety interlocks. The ZelFlow RO4/N2 featuresoptional nitrogen inerting.
Product features• Forced air (convection) and IR (quartz lamp)• Microprocessor controlled• Large working area• Automatic cooling• Programmable time/temperature profiles• Simplified user interface• N2 inerting option available (ZelFlow RO4/N2)
* Standard Cubic Feet per Hour
No special accessories available.
The LPKF ZelFlow RO4 working area is specially designed to matchthe specifications for LPKF AutoContac and LPKF EasySolder.
LPKF RO4/N2 closed LPKF ZelFlow RO4/N2 open
LPKF ZelFlow RO4 LPKF ZelFlow RO4/N2
109568
53LPKF ZelFlow
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 53
Laser systems for the production ofmetal and polymer stencils for solder-paste printing.
Laser system for drilling micro-vias,direct circuit board structuring, skivingand contour cutting of flex and rigidcircuit boards.
Laser system for the production of 3Dmolded interconnect devices (MIDs).High-density circuit structures arecreated directly on three-dimensionalplastic components.(Laser based 3D-MID technology,additive/subtractive)
Description Application LPKF system
Polymer stencil Metal stencil
Microvia Cutting
Structuring
LPKF StencilLaser SL 600 Polymer
LPKF StencilLaser SL 800
LPKF MicroLine Drill 600
LPKF MicroLine 3D
Other LPKF products
Assembled MID
Subject to technical modifications. See imprint for details.
Rigid-flex circuit board
54 Other LPKF products
Production steps
LPKF Produktkatalog GB 23.04.2003 12:33 Uhr Seite 54
Description Application LPKF system
Subject to technical modifications. See imprint for details.
Laser system for the high-resolutionstructuring of thin metal and polymerfilms using a mask projection.Available for panels and reel-to-reel.
Laser system for micro-machiningmetallic, organic and ceramic materials.
Services
50 µm lines and spaces
created by laser
structuring
Etching resist structuring
(ATOTECH) for ultrafine
circuit boards.
High-precision sensors
e.g. for temperature
measurement.
Pho
tos
cour
tesy
of
Phi
lips
Cutting, drilling and engraving
ceramics
LPKF MultifunctionLaser
MF 100 UV
LPKF MicroLine Laser
Interior glass structuring
LPKF Laser Center, North AmericaTelephone +1-503-454-4200
LPKF Laser Center, GermanyTelephone +49-5131-7095-0
3D-MID Application Center, GermanyTelephone +49-5222-944930
Sensor and sensor
elements made out of
flexible substrates, e.g.
for medical technology.
55Other LPKF products
LPKF Produktkatalog GB 23.04.2003 12:34 Uhr Seite 55
Imprint
This catalogue was prepared with enormous attention to details. LPKF reserves the right tochange specifications and other product information without notice.
Price listsThe price lists in the catalogue or attached to the catalogue are not part of the catalogue.All of the prices contained in the list apply ex works, excluding packaging and local taxes.All prices are subject to changes. Only the latest price list is valid. We will be happy toprovide you with an individual quotation containing detailed specifications based on thelatest price list.
General terms and conditionsWe also draw your attention to our general terms and conditions and terms of delivery andpayment which apply to all transactions and which we will be glad to send you upon requesttogether with the requested quotation. Special agreements must be made in writing.
Privacy protectionAll of the personal data provided by customers are only saved for our own commercialpurposes and in compliance with local privacy protection law.
Trademarks & patents© 2003 LPKF Laser & Electronics AG, Garbsen, Germany. Systems and products offered byLPKF and its subsidiaries are covered by issued and pending German and foreign patents.Products mentioned are for identification purposes only and may be trademarks orregistered trademarks of their respective companies. “LPKF”, the LPKF logo and “LPKFProtoMat” are registered trademarks of LPKF Laser & Electronics AG.
Product catalogue number 111271
Publisher
LPKF Laser & Electronics AG
Osteriede 7
30827 Garbsen
Telephone +49 (0) 51 31/70 95-0
Fax +49 (0) 51 31/70 95-90
e-mail [email protected]
web info www.lpkf.de
Concept, design and layout
AD HOME
Hauptstraße 17
30855 Langenhagen
Telephone +49 (0)5 11/2 15 67-44
Fax +49 (0)5 11/2 15 67-45
e-mail [email protected]
56 Imprint
LPKF Produktkatalog GB 23.04.2003 12:34 Uhr Seite 56
LPKF has far more products and services available than are listed in thiscatalogue. To ensure you get the best solution for your area of application, wewill be very happy to send you detailed information on other LPKF products.
Fax-No.Germany +49-5131-7095-90China +86-22-23006965 France +33-1-60869622Japan +81-3-34676159Slovenia +386-4-2013820Spain +34-91-8475522UK/Ireland +44-1344-860547North America +1-503-682-7151
Please select from the following options for Rapid PCB Prototyping:
LPKF MicroLine Laser· Sensor technology· Chip interposers· Flexible circuits· Micro-structuring of thin layers
(< 1 µm)
LPKF MicroLine 3D· 3D-MIDs (additive/subtractive)· Material processing· Glass interior structuring
LPKF MultifunctionLaser UV· Ceramic cutting· Ceramic drilling· Ceramic engraving· Glass interior structuring
LPKF HybridLaser· Structuring
LPKF MicroLine Drill 600· Structuring· Micro-via drilling· Cutting· Solder-resist ablation
LPKF StencilLaser· SMD metal stencils· SMD polymer stencils
LPKF MultifunctionLaser IR· Circuit board structuring· Cutting very thin sheets· Trimming resistances
LPKF stencil service· SMD solder stencils· Micro-cutting service· Quick-release frames· Precision shaped parts· Gobos
Demo CDPersonal consultation Sample Board
Information on other product categories
LPKF information order form
Company
Contact
Department, Building,Mail Stop
Address
City, State
Country
Fax
Telephone
57Information order form
See imprint LPKF product catalogue for details.
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LPKF Produktkatalog GB 23.04.2003 12:34 Uhr Seite 58
59Technical questionnaire
Technical questionnaire:Solutions for your specific requirements
Please fill out the following questionnaire to help us better provide you withaccurate information to meet your needs. Your business is very important to us!
DigitalArea of Application
Base material
Max. board size
Circuit board technology
Multilayer
Through-hole plating
Analog RF/Microwave Power Supplies
FR3 FR4 RF substratesPolyimide (rigid) Polyimide (flexible)Ceramic substrate Others:
less than 200 x 340 mm (8“x13“) bigger than 200 x 340 mm (8“x13“)
Single-layer Double-layer FlexMultilayer Rigid-flex
Number of layers (min - max)
Interior layer thickness (min - max)
Separation between interior layers (min - max)
Blind ViasYes YesNo No
No Yes· Max. holes per circuit board
Approx. 50≤ 300> 300
· Min. hole diameter
mm/mil
Buried Vias
See imprint LPKF product catalogue for details.
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Fax-No.Germany +49-5131-7095-90China +86-22-23006965 France +33-1-60869622Japan +81-3-34676159Slovenia +386-4-2013820Spain +34-91-8475522UK/Ireland +44-1344-860547North America +1-503-682-7151
Company
Contact
Department, Building,Mail Stop
Address
City, State
Country
Fax
Telephone
LPKF Produktkatalog GB 23.04.2003 12:34 Uhr Seite 59
60 Technical questionnaire
Circuit board properties
Circuit geometries
Prototype circuit board assembly
Soldering methods for prototypeproduction
Do you produce front panels?
Fully automatic tool changerequired?
PCB Layout Software
Export file formats
Development projects per year
No. of designs per project
No. of boards per design
How do you currently produce prototypes?
Circuit board (min - max)
Cu clad
mm/inch
µm/oz.
ConventionalSMD
Mixed assembly
Track widths (min)
Gaps (min)
Remaining ring of the pad (min)
µm/mil ( < 200 µm [8 mil])
µm/mil ( < 200 µm [8 mil])
µm/mil ( < 200 µm [8 mil])
Manual solderingConvection
Wave solderingVapor phase
Reflow soldering
Manual assembly Semi-automatic Automatic Others
No Yes
max. thickness
AluminumEngravingMilling
PlasticEngravingMilling
max. thickness
No Yes
Name Version
Gerber® Standard (RS-274-D)Gerber® Extended (RS-274-X)Excellon NC Drill
Sieb & Meyer NC DrillDXFHP-GL™
Others:
In-houseEtchingMillingWirewrap (wiring technique)
External, by service companiesEtchingMilling
Are you happy with the situation?YesNoWhy?
mm/inch mm/inch
See imprint LPKF product catalogue for details.
LPKF Produktkatalog GB 23.04.2003 12:34 Uhr Seite 60
Index
4-layer multilayer6-layer multilayer8-layer multilayerAccessoriesAluminum ApplicationsAutoContacAutomatic tool changeAutoSwitchBase materialsBGA PlacerBoardMasterBrassBuild-up method (sequential)CAD (please use also EDA)CAM StationChemical setsCircuit board plotterCircuitCAMCompressed airCompressorConductive pasteConsumablesContacContact printingContour generatorConvection ovenCustom drill bitsCustom toolsCustomer service lineData conversionData exportData formatsData importDepanelizationDispensingDistribution networkDouble sided printingDrill bitDrill dataDrilling machineDust extractionEasyContacEasySolderEditing capabilitiesEndmillEngravingFine-pitch printingFlex boardsFlexible circuitsFlex-rigid boardsFoil engravingFront panelsFully automaticGalvanicGerberHead lightingHousingInstallationInsulation processLaser
Solder paste printingSound enclosurSpecial applicationsSpindleStarter packsStencil printerStencil printingTech supportTest adapterThrough hole platingTinningTool libraryTool managementTool ring setToolsTrainingTrainingUniversal cutterVacuum table (H100)Working depth limiterWYSIWYGZelFlexZelFlowZelPlaceZelPrint
LayoutMeasurement microscopeMicro cutterMicrometer screwMicrowave circuitsMicrowave layoutMicrowave prototypeMilling bitMiniContacMultilayer boardsMultiPressPastePCB drillingPCB millingPCB post processingPCB prototypePlastic / compositePlastic engravingPneumatic Z-axisPost processing of:· populated boards· bare boardsPrintingProgram wizardProtoLaserProtoMat®
ProtoMat® 95s/IIProtoMat® C100/HFProtoMat® C20ProtoMat® C40ProtoMat® C60ProtoMat® H100ProtoMat® L60ProtoMat® M30sProtoMat® M60ProtoMat® X60PrototypesQuality featuresQuick release colletQuick release frameReflow ovenRegistration pin methodReverse pulse platingRF circuitsRF layoutsRF prototypesRF-EndmillRivetsRoutingSatusLightScreen-printingServiceSet pin systemSign engravingSMD assemblySMD fine pitch printingSMD metal stencilsSMD polymer stencilsSMD solder paste stencilsSoftware upgradeSolder mask
31, 32, 33, 4031, 32, 33, 4031, 32, 33, 4024, 428, 14, 16, 206, 14, 16, 18, 20, 216, 281824394712732101141131025256, 2838294310, 112537351310101010, 1196, 8, 286143351014246, 2734, 4210368, 943888, 2098186, 2910 ff268181121, 54
102436267, 141111, 143529, 417, 31, 32, 33, 39, 4031, 424297968813, 14, 26
9, 209, 2043 ff102114187, 14141414181616162061313, 144553337, 297, 14117, 1436, 386, 277, 2025431313, 38747435454, 95410, 117, 28
43248263813431396, 27 ff30, 4112122535, 381413,183618261245534743
61Index
LPKF Produktkatalog Umschlag GB 23.04.2003 12:48 Uhr Seite 2
www.lpkf.com Your LPKF-Distributor
Germany (Headquarters)LPKF Laser & Electronics AGOsteriede 730827 GarbsenGERMANYPhone +49-5131-7095-0Fax +49-5131-7095-90e-mail [email protected] info www.lpkf.com
FrankreichLPKF France S.A.R.L.Z.A. de l’Églantier21 Rue des Cerisiers(C.E. 1514 Lisses)91015 Evry CedexFRANCEPhone +33-1-60862691Fax +33-1-60869622e-mail [email protected]
SlowenienLPKF Laser & Elektronika d.o.o.Planina 34000 KranjSLOVENIAPhone +386-4-2013800Fax +386-4-2013820e-mail [email protected] info www.lpkf.si
SpainLPKF Laser & Electronics Spain, S.L.Apartado Nr. 128791 Soto del Real (Madrid)Madrid/SPAINPhone +34-91-8475505Fax +34-91-8475522e-mail [email protected] info www.lpkfspain.com
UK/IrelandLPKF Laser & Electronics Ltd.Coppid Beech Lane, WokinghamBerkshire-RG40 1PDGREAT BRITAINPhone +44-1344-455046Fax +44-1344-860547e-mail [email protected] info www.lpkf.co.uk
North AmericaLPKF Laser & Electronics28220 SW Boberg Rd.P.O. Box 3858Wilsonville, OR 97070USAPhone +1-503-454-4200Fax +1-503-682-7151e-mail [email protected] info www.lpkfusa.com
LPKF distribution network
LPKF Headquarters
LPKF Distribution and
production facilities
LPKF Distributors
Cata
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ChinaLPKF Tianjin Co., Ltd.No. 1 Building, Xing Nan Cun,Ke Yan Xi Road, Nan Kai District,Tianjin, 300192PEOPLE'S REPUBLIC OF CHINAPhone +86-22-23005700Fax +86-22-23006965e-mail [email protected]
JapanLPKF Japan Co., Ltd.Yoyogi 5-8-5-304Shibuya-kuTokyo 151000JAPANPhone +81-3-34657105Fax +81-3-34676159e-mail [email protected] info www.lpkf.co.jp
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PRODUCT CATALOG 02/03
RAPID PCB PROTOTYPING
Customer Service (Free advice/support)Germany +49-5131-7095-0China +86-22-23005700 France +33-1-60862691Japan +81-3-34657105
Slovenia +386-4-2013804Spain +34-91-8475505UK/Ireland +44-1344-455046North America +1-503-454-4229
(8 am - 5 pm PST)
LPKF Produktkatalog Umschlag GB 28.04.2003 10:56 Uhr Seite 1