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Solution Proposal by Toshiba © 2019 Toshiba Electronic Devices & Storage Corporation Air cleaner R17

R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

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Page 1: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

Solution Proposal by Toshiba

© 2019 Toshiba Electronic Devices & Storage Corporation

Air cleanerR17

Page 2: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

© 2019 Toshiba Electronic Devices & Storage Corporation

Toshiba Electronic Devices & Storage Corporation provides comprehensive device solutions to customers developing new products by applying its thorough understanding of the systems acquired through the analysis of basic product designs.

Page 3: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

BlockDiagram

© 2019 Toshiba Electronic Devices & Storage Corporation

Page 4: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

4© 2019 Toshiba Electronic Devices & Storage Corporation

Air Cleaner Overall block diagram

AC100V

DC10V DC5V DC 3V

Dust Sensor Module

MCU

EEPROM

Mode Switch Display

RegulatorRegulator

LEDs

AC-DC

Transistor

Single PhaseAC Motor

M

Page 5: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

5© 2019 Toshiba Electronic Devices & Storage Corporation

Single Phase AC Motor

AC100V

DC10VDC-DC

MCU

Diode

BipolarTransistor

Criteria for device selection- Small packages with good thermal

dissipation and surface mount packages can be used for reflow.

- The use of small packages reduces the board area.

- Stable motor driving can be achieved by using bipolar transistors, which have higher ESD-performance than MOSFET.

Air Cleaner Detail of main motor (1)

Proposals from Toshiba- Suitable for power supply rectification

Rectifier diode- Suitable for use in small-current

switchesBipolar transistor

- System control at low power consumption with analog interfacesMCU

2

1

Main motor drive unit(When AC mtor is used)

1

2

※ Click the number in the circuit diagram to jump to the detailed description page

7

7

Page 6: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

6© 2019 Toshiba Electronic Devices & Storage Corporation

MCU

AC-DC

AC Input

Regulator

BrushlessDC Motor

IPD M

Criteria for device selection- The use of IPD enables direct variable-

speed driving of brushless DC motors under MCU control.

- The IPD has a power withstand voltage of 600 V and can be applied to a 200 V power supply. By increasing the drive voltage, the motor can be reduced in size even with the same power.

- The use of small packages reduces the board area.

Air Cleaner Detail of main motor (2)

Proposals from Toshiba- High voltage motor can be driven from

MCU.Intelligent power devices (IPDs)

- System control at low power consumption with analog interfacesMCU

3

Main motor drive unit(When using a brushless motor)

3

※ Click the number in the circuit diagram to jump to the detailed description page

7

7

Page 7: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

7© 2019 Toshiba Electronic Devices & Storage Corporation

PhotoDiode

Heater resistance

DC5V

LED

Output1

Output2

Op-amp Op-amp

Air Cleaner Detail of dust monitor section

Dust monitor section

3

4 4 4

4

Criteria for device selection- A multistage amplifier circuit must be

used for stable signal amplification.- The use of small packages reduces the

board area.- High-precision sensing is possible by

using an ultra low noise operational amplifier.

Proposals from Toshiba- Processing analog signals with low

noiseUltra-low noise operational amplifier

4

※ Click the number in the circuit diagram to jump to the detailed description page

Page 8: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

8© 2019 Toshiba Electronic Devices & Storage Corporation

Relay

Key/7-seg LED

BuzzerMCU

LED Driver

PanelKey/LED MCU

LED Driver

Haptics Touch & FrontPanel Controller

Air Cleaner Detail of operation unit

Criteria for device selection- Typically an LED type display uses over 4

digits 7 segment LEDs.- White LEDs for LCD back light uses

LED drivers capable of large output current.

- An MCU which has analog interfaces with low power consumption is required.

Proposals from Toshiba- Only one external register sets LED

drive current. It can reduce BOM cost.7 segment LED driver

- 1ch type LED driver is suitable for a small LCD back light. Step up type LED driver for white LED

- System control at low power consumption with analog interfacesMCU

Operation unit(example of Key/LED)

5

6

7

Operation unit(example of LCD)

※ Click the number in the circuit diagram to jump to the detailed description page.

5

6

7

7

Page 9: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

RecommendedDevices

© 2019 Toshiba Electronic Devices & Storage Corporation

Page 10: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

10© 2019 Toshiba Electronic Devices & Storage Corporation

Device solutions to address customer needs

As described above, in the design of Air Cleaner, “High efficiency”, “Low power consumption of the set” and “PCB area reduction” are important factors. Toshiba’s proposals are based on these three solution perspectives.

Brushless DCMotorization

Small sizePackage

Supported

HighEfficiency

・Low-loss

High efficiency Lower power consumptionof the set

PCB areareduction

Page 11: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

11© 2019 Toshiba Electronic Devices & Storage Corporation

Device solutions to address customer needs

Brushless DCMotorization

HighEfficiency

・Low-loss

Small sizePackage

Supported

Rectifier diodeBipolar transistor

1

2

Intelligent power devices (IPDs)3

Ultra-low noise operational amplifier4

7-segment LED driver5

Step up type LED driver for white LED6

MCU7

Page 12: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

12© 2019 Toshiba Electronic Devices & Storage Corporation

Value provided

Line upPart number CRG05 CMG08

Package S-FLAT M-FLAT

IF(AV) (Max) [A] 1 1

VRRM (Max) [V] 800 600

Surface mount/compact package

Surface Mounting: The use of S-FLATTM and M-FLATTM packages contributes to the reduction of height and space-saving of equipment compared to previous lead-type devices.

Broad product lineup

A lineup of reverse voltages of 200 V to 1000 V/average forward current of 0.5A~3A is available, enabling the selection of devices according to requirements.

・ CRG05 forward current characteristic

We are showing broad products lineup with small size surface mount package that are suitable for high-density PCB assembly.

Rectifier diodeCRG / CMG series1 Brushless DC

Motorization

HighEfficiency

・Low-loss

Small sizePackage

Supported

◆Return to Block Diagram TOP

Page 13: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

13© 2019 Toshiba Electronic Devices & Storage Corporation

Value provided

Line up

Part number 2SC6026CT

Type PNP

Package CST3

VCEO (Max) [V] 50

IC (Max) [mA] 100

With broad product lineup, we provide products that meet the needs of customers.

Broad package lineupsLow collector-emitter saturation voltage

High ESD tolerance

A large number of packages, such as flat lead and leadless, are available, allowing you to choose products that suit your PCB.

The low saturation voltage between the collector and emitter realize lower power consumption.

In applications where static electricity is likely to occur, such as air-purifiers, bipolar transistors with higher ESD tolerance than MOSFET are needed.

2 Bipolar transistor2SC6026CT

Brushless DCMotorization

HighEfficiency

・Low-loss

Small sizePackage

Supported

◆Return to Block Diagram TOP

Page 14: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

14© 2019 Toshiba Electronic Devices & Storage Corporation

Value provided

Line up

Part number TPD4162F

Package HSSOP31

Prod

uct

Spec

ifica

tions

VBB (Max) [V] 600

IOUT (Max) [A] 0.7

VCC (Max) [V] 17.5

Protective function

Current limitation, Overcurrent protection,Overheat protection, Voltage reduction protection

This product optimizes for brushless motor driving that is the functions required for direct BLDC motor driving into one package.

Contributing to Low PowerContributing to reducing the number of parts

Contributing to reduction of PCB area

The power consumption can be greatly reduced by replacing from the AC motor to a brushless motor.

Built-in functions and protection functions required for inverter operation can reduce the number of parts and simplify PCB circuit.

The use of small surface mount packages contributes to the reduction of PCB area. This product has the smallest package size for the same purpose, including other companies.(As of the end of 2018, according to our survey)

Support Hall devices

Built-in bootstrap diode

Built-in protection functions

Built-inrectangular waveenergizing circuit

Built-in three-phase inverter circuit

Intelligent power devices (IPDs)TPD4162F3 High

Efficiency・

Low-loss

Small sizePackage

Supported

Brushless DCMotorization

◆Return to Block Diagram TOP

Page 15: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

15© 2019 Toshiba Electronic Devices & Storage Corporation

Value provided

Line up

Ultra-low noise operational amplifierTC75S67TU

Very small signals detected by various sensors can be amplified with very low noise.

Ultra-low noiseVNI(Typ.)=6.0 [nV/√Hz]@f=1 kHz

Small packageLow current consumptionIDD(Typ.) =430 [μA]

Very small signals detected by various sensors can be amplify with low noise using CMOS Op-amp by optimizing the processing. We achieved one of the industry’s lowest [Note 1] input equivalent noise voltage.

This is a flat lead type compact package, which contributes to the miniaturization and lower height of the printed circuit board. Packaging size: 2. 0 x 2.1 x 0. 7mm

The adoption of the CMOS process achieves lower current-consumption characteristics than our bipolar process operational amplifier.

4

[Note 1] Based on our survey (as of May 2019).

Ultra-low noise characteristic(CompanyComparison) Part number TC75S67TU

Package UFV(2.0x2.1mm)

VDD,SS (Max) [V] ±2.75VDD,SS (Min) [V] ±1.1IDD (Max) [μA] 700

VNI (Typ.) [nV/√Hz] @f = 1 kHz 6

Conventional products :TC75S63TU

Conventional products: TC75S63TU

New product : TC75S67TU

Brushless DCMotorization

HighEfficiency

・Low-loss

Small sizePackage

Supported

◆Return to Block Diagram TOP

Page 16: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

16© 2019 Toshiba Electronic Devices & Storage Corporation

Value provided

Line up

7-segment LED driverTB62785NG/FTG

LED driver which can light a 4-digit, 7-segment LED using one device

Suitable for 7-segment LED displays

Current control possible with one external resistor Lead insertion type package

This driver can serially control a 4-digit 7-segment LED. Matrix drive is performed by scanning the digits at 480 Hz. The 3-wire control can also be cascaded, reducing the number of harnesses.

The LED current can be set with an external resistor. No other components are needed.

We have a line-up of free-standing lead insertion packages (SDIP24) and small packages (QFN24) that can be used for the main board.

← Only one external resistor required

Part number TB62785NG TB62785FTG

Package SDIP24 VQFN24

Outputs 4 columns ×7 outputsOperating voltage 4~5.5V

Internal power supply 17Max. LED power supply 17

Max. output current 50mACascade connection ○

PWM control ○ 16-step light control possible (total)

Controllogic

5V

I DIG-0~3 : 320mA/digit

I SEG-a~Dp : 5~40mA/bit

4.5~17V

R-EXT

MCU

a

8 8 8

b c d e f gDp<LED駆動部>

16-bit SIPO

7seg Decoder

8

DIG Selector

8

4-bit Duty Generator

OSC1/16OSC

DATA-INCLOCKLOAD

OUT-a

OUT-b

OUT-cOUT-d

OUT-e

OUT-fOUT-gOUT-Dp

DIG-3DIG-2DIG-1DIG-0VCC

VDD

P-GND/L-GND

DATA-OUT

5 Brushless DCMotorization

HighEfficiency

・Low-loss

Small sizePackage

Supported

◆Return to Block Diagram TOP

Page 17: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

17© 2019 Toshiba Electronic Devices & Storage Corporation

Value provided

Line up

Step up type LED drivers for white LED1ch drive TB62763FMG / 4ch drive TB62771FTG

Driving series connection Hi-current type white LEDs. There are 1ch and 4ch drive type drivers.

Suitable driving a white LED for an LCD back light

Capable driving series connection white LEDs

PWM dimming function

Line up are 1ch and 4ch type drivers. 1ch type is suitable for mobile LCD and 4ch one is for small LCD PC.

1ch type maximum driving number of series connection LED is 6, 4ch one is 9/ch.Built-in step up type power supply adjusts LED driving voltage according to the LED Vf.

Minimum high level time period is 330 ns about 4ch PWM control based on constant current power supply. 1ch type is possible to dim by few kHz PWM.

Part number TB62763FMG TB62771FTGPackage SON8 WQFN24

Driving ch number 1ch 4chMaximum LED driving number 6 36

Operation voltage 2.8-5.5V 4.75-40VLED driving current ~80mA ~150mA

Built-in constant current power supply N/A Available

Built-in FET for stepping up power supply Available N/A

SON8

WQFN24

TB62763FMGTB62771FTG

6 Brushless DCMotorization

HighEfficiency

・Low-loss

Small sizePackage

Supported

◆Return to Block Diagram TOP

Page 18: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

18© 2019 Toshiba Electronic Devices & Storage Corporation

Value provided

Line up

MCUTX00 series M030 group TMPM036FWFG/TMPM037FWUG

System cost down, high efficiency system, development efficiency improvement

Built-in ARM® Cortex®-M0 CPU core

Suitable for sensing analog signal

Small package and very low power consumption

Built-in Arm Cortex®-M0 core with Thumb instruction set improves energy efficiency. Various development tool and their partners allow users many options.

Built-in multi-channel ADC and CPU system executes sensing data processing efficiently at low cost.

Cortex®-M0 and original NANO FlashTM

technology bring to the small package and low power consumption. They contribute foot print and power consumption reduction.

7

Part number TMPM036FWFG TMPM037FWUG

Maximum operation frequency 20MHz 20MHzInstruction ROM 128KB 128KB

RAM 16KB 16KBTimer 14ch 10ch

UART/SIO 6 5I2C 2 1ADC 8ch (10bit) 8ch (10bit)

LQFP100 LQFP64

TMPM036FWFG TMPM037FWUG

Brushless DCMotorization

HighEfficiency

・Low-loss

Small sizePackage

Supported

◆Return to Block Diagram TOP

* Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

Page 19: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

© 2019 Toshiba Electronic Devices & Storage Corporation

If you are interested in these products andhave questions or comments about any of them,please do not hesitate to contact us below:

Contact address: https://toshiba.semicon-storage.com/ap-en/contact.html

Page 20: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

20© 2019 Toshiba Electronic Devices & Storage Corporation

Terms of useThis terms of use is made between Toshiba Electronic Devices and Storage Corporation (“We”) and customers who use documents and data that are consulted to design electronics applications on which our semiconductor devices are mounted (“this Reference Design”). Customers shall comply with this terms of use. Please note that it is assumed that customers agree to any and all this terms of use if customers download this Reference Design. We may, at its sole and exclusive discretion, change, alter, modify, add, and/or remove any part of this terms of use at any timewithout any prior notice. We may terminate this terms of use at any time and for any reason. Upon termination of this terms of use, customers shall destroy this Reference Design. In the event of any breach thereof by customers, customers shall destroy this Reference Design, and furnish us a written confirmation to prove such destruction.

1. Restrictions on usage1.This Reference Design is provided solely as reference data for designing electronics applications. Customers shall not use this Reference Design for any other purpose, including without

limitation, verification of reliability.2.This Reference Design is for customer's own use and not for sale, lease or other transfer.3.Customers shall not use this Reference Design for evaluation in high or low temperature, high humidity, or high electromagnetic environments.4.This Reference Design shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

2. Limitations1.We reserve the right to make changes to this Reference Design without notice.2.This Reference Design should be treated as a reference only. We are not responsible for any incorrect or incomplete data and information.3.Semiconductor devices can malfunction or fail. When designing electronics applications by referring to this Reference Design, customers are responsible for complying with safety standards

and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of semiconductor devices could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Customers must also refer to and comply with the latest versions of all relevant our information, including without limitation, specifications, data sheets and application notes for semiconductor devices, as well as the precautions and conditions set forth in the "Semiconductor Reliability Handbook".

4.When designing electronics applications by referring to this Reference Design, customers must evaluate the whole system adequately. Customers are solely responsible for all aspects of their own product design or applications. WE ASSUME NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

5.No responsibility is assumed by us for any infringement of patents or any other intellectual property rights of third parties that may result from the use of this Reference Design. No license to any intellectual property right is granted by this terms of use, whether express or implied, by estoppel or otherwise.

6.THIS REFERENCE DESIGN IS PROVIDED "AS IS". WE (a) ASSUME NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (b) DISCLAIM ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO THIS REFERENCE DESIGN, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

3. Export ControlCustomers shall not use or otherwise make available this Reference Design for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). This Reference Design may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of this Reference Design are strictly prohibited except in compliance with all applicable export laws and regulations.

4. Governing LawsThis terms of use shall be governed and construed by laws of Japan.

Page 21: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

21© 2019 Toshiba Electronic Devices & Storage Corporation

RESTRICTIONS ON PRODUCT USE• Toshiba Electronic Devices & Storage Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related

hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if

reproduction is without alteration/omission.• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing

adequate designs and safeguards for their hardware, software and systems which Minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.

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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

Page 22: R17 Air cleaner - Toshiba · - Small packages with good thermal dissipation and surface mount packages can be used for reflow. - The use of small packages reduces the board area

* Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.* Other company names, product names, and service names may be trademarks of their respective companies.