Developed by Wilocity, which has been aQualcomm subsidiary since 2014, the RFIC featuresup to four transceivers controlling up to 32antennas, both patch and quasi-Yagi-type, for thebeamforming at 60 GHz. The SiP uses non-conventional molded packaging developed byAmkor. It has innovative interconnections, enablingthe redistribution of the BB processor signal to theprinted circuit board (PCB). Copper pillars inside themolding and a very thin confined PCB substratecomplete the signal distribution structure.

This report includes a full investigation of themodule, featuring a detailed study of the SiP andthe antenna board including die analyses, processesand board cross-sections. Finally, it contains acomplete cost analysis and a selling priceestimation of the system.

Qualcomm VIVE® QCA9500 High Density WiGig/WiFi802.11ad Chipset for the 60 GHz Band

Disruptive double side molded system-in-package-based chipset for millimeter-wave applications targeting consumer devices, including integrated antennae

2018 will be a key milestone in the journey towards 5G communication. Several areas,from semiconductor to packaging, will improve their technologies to be suitable for 5Gdeployment. We now know that the 5G frequency will be in the millimeter wave(mmWave) range. In this band, the IEEE has already licensed a Wifi 802.11 protocol,known as WiGig. Using 7 GHz of bandwidth in the 60 GHz band, it allows gigabit data-rates similar to wired communication. Only two main players share this upcoming market,Intel and Qualcomm. And as a pioneer in 5G development, Qualcomm is now offering aWiGig chipset. It provides an early glimpse of 5G mobile user experiences andtechnologies using an innovative System in Package (SiP) approach in the VIVE® QCA9500.

This complete solution serves both mobile computer devices and access points, specificallyrouters. The module comes with two boards linked by a coaxial connection. The first boardfeatures a radio frequency integrated circuit (RFIC) and innovative antennae, and the secondfeatures an advanced SiP with a double sided molding configuration. The SiP integrates abaseband (BB) processor along with a switch, a regulator, a crystal, memory and more than60 surface mounted device (SMD) components, all in a single package smaller than 40 mm².This is the first double side molded device we found in the market, and it could be a keymilestone for 5G SiP technology.

Title: Qualcomm

QCA9500 WiGig Chipset

Pages: 145

Date: January 2018

Format: PDF & Excel file

Price: EUR 3,990

COMPLETE TEARDOWN WITH:

• Detailed photos and

cross-sections

• Precise

measurements

• Material analysis

• Manufacturing

process flow

• Supply chain

evaluation

• Manufacturing cost

analysis

• Estimated sales price

TABLE OF CONTENTS

ANALYSIS PERFORMED WITH OUR COSTING TOOL IC PRICE+ AND 3D PACKAGING COSIM+

IC Price+

AUTHORS:

Dr. Stéphane

Elisabeth

Stéphane has a

deep knowledge of

materials characte-rizations and electronics systems.

He holds an Engineering Degree in

Electronics and Numerical

Technology, and a PhD in

Materials for Microelectronics.

to setup its laboratory. He

previously worked for 25 years

at Atmel Nantes Technological

Analysis Laboratory as fab support

in physical analysis, and for three

years at Hirex Engineering in

Toulouse, in a destructive physical

analysis lab.

Yvon Le Goff

(Lab)

Yvon has joined

S y s t e m P l u s

Consulting in 2011

3D Package CoSim+

System Plus Consulting offerspowerful costing tools toevaluate the production costand selling price from singlechip to complex structures.

IC Price+

The tool performs the

necessary cost simulation of

any Integrated Circuit: ASICs,

microcontrollers, DSP,

memories, smartpower, and

more.

3D Package Cosim+

Cost simulation tool toevaluate the cost of anyPackaging process: Wafer-level packaging, TSV, 3Dintegration…

Overview / Introduction

Company profile & WiGig technology

TP-LINK Talon AD7200 Teardown

Physical Analysis• Physical analysis methodology• Module analysis Module view and dimensions Module marking and block

diagram• Baseband board analysis Board disassembly Board bill of material Board cross-section

• Baseband SiP analysis Package view and dimensions Package opening: Copper pillar,

bill of material Package cross-section: PCB,

copper pillar, dimensions Package process analysis

• Die analysis: Baseband processor,switch, regulator, memory Die view and dimensions Die cross-section Die process

• Physical analysis comparison SiP vs discrete

• Antenna board analysis Board disassembly Board bill of material Board cross-section

• Die analysis: RFIC Die view and dimensions Die cross-section Die process

Manufacturing process flow• Die fabrication unit: Baseband processor, RFIC• Packaging fabrication unit• SiP package process flow

Cost analysis• Overview of the cost analysis• Supply chain description• Yield hypotheses• Die cost analyses: Basebandprocessor, RFIC Front-end cost Wafers and die costs

• SiP Package cost analysis SiP Front-end cost SiP Cost by process step

• Final test cost• Final assembly• Component cost

Estimated Price Analysis

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Advanced RF SiPs for Cell Phones: Reverse Costing

Overview

Smartphone RF Front-End Module Review

RF Front End Modules and Components for

Cellphones 2017

Physical analyses and coststimation of radio-frequency SiPsfrom Skyworks Solutions, Murata,TDK-Epcos, Qorvoand Broadcom/Avago.

Review of RF front-end modulesand components found in fiveflagship smartphones: AppleiPhone 7 Plus, Samsung Galaxy S7,Huawei P9, LG G5, & Xiaomi Mi5.

A dynamic market with highresponsivity to technicalinnovation, the RF front endindustry is set to grow at 14%CAGR to reach $22.7B in 2022.

Pages: 140Date: November 2017

Full report: EUR 4,990*

Pages: 295Date: February 2017

Full report: EUR 4,990*

Pages: over 222Date: March 2017

Full report: EUR 5,490*

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