Qualcomm 3D Sonic Sensor Fingerprint...©2019 by System Plus Consulting | SP19465 –Qualcomm 3D Sonic Sensor 1 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected]

©2019 by System Plus Consulting | SP19465 – Qualcomm 3D Sonic Sensor 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Qualcomm 3D Sonic Sensor FingerprintUltrasonic Fingerprint SensorSP19465 - MEMS report by Stéphane ELISABETH

LAB. Analysis by Veronique LE TROADECJuly 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Qualcomm

o Samsung Galaxy S10 Plus Teardown

Market Analysis 18

o MEMS & Sensors Market Forecast

Physical Analysis 21

o Summary of the Physical Analysis 22

o Module Extraction 23

Display Integration

AMOLED Display Interaction

Display Cross-Section

o Module Assembly 32

Module Views & Disassembly

Module Cross-Section

o Sensor Die 42

Sensor Die View & Dimensions

Sensor Overview & main Blocs

Sensor Die Cross-Section

Sensor Die Process Characteristic

o ASIC Component 58

Package View & Dimensions

ASIC Die View & Dimensions

ASIC Delayering & main Blocs

ASIC Die Process

ASIC Die Cross-Section

ASIC Die Process Characteristic

Comparison with Qualcomm Sense ID 80

o Comparison with LeEco Le Max Fingerprint:

Integration, Structure, Die, Process

Manufacturing Process 87

o Global Overview

o Ultrasonic Sensor Die Front-End Process & Fabrication Unit

o Sensor Front-End Process Flow

o ASIC Front-End Process Flow & Fabrication Unit

Cost Analysis 97

o Summary of the cost analysis 98

o Yields Explanation & Hypotheses 100

o Ultrasonic Sensor die 102

Sensor Front-End Cost

Sensor Die Probe Test & Dicing

Sensor Die Panel & Die Cost

o ASIC Component 105

ASIC Front-End Cost

ASIC Die Probe Test, Bumping & Dicing

ASIC Wafer & Die Cost

o Module Cost 109

Cost Comparison with Synaptics FS9500 114

o Comparison with Vivo X21UD Fingerprint:

Integration, Sensor and ASIC, Cost

Selling price 118

Feedbacks 122

SystemPlus Consulting services 124




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Cost Comparison

Selling Price Analysis

Related Reports

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm 3D Sonic Sensor.

• Either with the Exynos or the Qualcomm Chipset, the Samsung Galaxy S10 series is the first to feature the UltrasonicFingerprint Sensor directly under display. The sensor is located on the front of the device directly glued on the OLED material.

• This report focusses on analyzing the ultrasonic sensor and its integration with the display. The sensor is manufactured usingLTPS (Low-Temperature Polycrystalline Silicon) technology on glass substrate. Using ferroelectric polymer, the sensorgenerated and process ultrasonic waves on the substrate. The component includes also acoustic horn structure in order tofocalize the ultrasonic waves.

• Since the last version of the device, Qualcomm managed to realize several changes at the TFT level reusing some mask layers.Also, the QBIC (Qualcomm Biometric Integrated Circuit) has evolved in term of circuit and power handling.

• This complete analysis of the Ultrasonic Fingerprint Module includes analyses of the Sensor die and the ASIC, along with acost analysis and price estimation for the module. It also includes a physical and technical comparison with the previousversion of the sensor in the LeEco LeMax Pro.




Overview / Introduction

Company Profile & Supply Chain o Qualcommo Fingerprint Technologyo Samsung Galaxy S10 Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Samsung Galaxy S10 Plus Teardown

Samsung Galaxy S10 Plus Overview©2019 by System Plus Consulting

Dimensionso Height: 162.6 mmo Width: 77.1 mmo Thickness: 7.9 mm

Weighto 198 g

FingerprintSensor

• By using the Ultrasonic fingerprint sensor, Samsung can provide an almost full front display.





Company Profile & Supply Chain o Qualcommo Fingerprint Technologyo Samsung Galaxy S10 Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Fingerprint Supply Chain (Estimation)






Market Analysiso MEMS & Sensor Forecast

Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

MEMS & Sensors Market Forecast






Physical Analysis o Module Extractiono Module Assembly

o Views & Dimensionso Cross-Section

o Sensor Dieo Views & Dimensionso Overviewo Die Processo Die Cross-section

o ASIC Componento Views & Dimensionso Delayeringo Die Processo Die Cross-section

Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Module Extraction

Qualcomm 3D Sonic Sensor Assembly©2019 by System Plus Consulting


Copper Layer

Sensor Die Flex PCB

Polymer #1 Layer

Adhesive










Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Module Extraction – Display Cross-Section











Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Die Overview & Dimensions










Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Die Overview










Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Die Cross-Section










Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Die View & Dimensions






Physical Analysis

Physical Comparisono Integrationo Moduleo Module Cross-Sectiono Sensor Dieo Die Cross-Section


Cost Analysis

Cost Comparison


Related Reports

About System Plus

Ultrasonic Fingerprint Integration – Samsung S10 vs. LeEco Le Max

Samsung Galaxy S10 – Front & Rear View©2018 by System Plus Consulting

LeEco Le Max – Front & Rear View©2018 by System Plus Consulting

Fingerprint Sensor

• The sensor was first integrated under a metal cover back in 2016.

• In the Samsung galaxy S10, the sensor is for the first time integrated under display.

1st Gen.2nd Gen.






Physical Analysis

Physical Comparison

Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito Sensor Die Process Flowo ASIC Die Front-End Processo ASIC Fabrication Unit

Cost Analysis

Cost Comparison


Related Reports

About System Plus

Ultrasonic Sensor Front-End Process






Physical Analysis

Physical Comparison

Manufacturing Process Flowo Sensor Die Front-End Processo Sensor Fabrication Unito Sensor Die Process Flowo ASIC Die Front-End Processo ASIC Fabrication Unit

Cost Analysis

Cost Comparison


Related Reports

About System Plus

Ultrasonic Sensor Process Flow (1/4)






Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso Sensor Die Costo ASIC Component Costo Complete Module Cost

Cost Comparison


Related Reports

About System Plus

Ultrasonic Sensor Front-End Cost






Physical Analysis

Physical Comparison




Cost Comparison


Related Reports

About System Plus

ASIC Wafer & Die Cost






Physical Analysis

Physical Comparison




Cost Comparison


Related Reports

About System Plus

Module Assembly Cost






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparisono Optical vs. Ultrasonic Module

o Integrationo Sensoro Cost


Related Reports

About System Plus

Ultrasonic Fingerprint vs. Optical Fingerprint – Qualcomm vs. Synaptics






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price

Related Reports

About System Plus

Estimated Manufacturer Price






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Plus

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

MEMS & SENSORS• Status of the MEMS Industry 2019• Consumer Biometrics: Market and Technologies Trends 2018• Next-Generation Human Machine Interaction in Displays 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

MEMS & SENSORS• Synaptics’ Under-Display Fingerprint Scanner Inside the VIVO X21

UD Smartphone• FPC’s FPC1268 in the Huawei Mate 9 Pro and Huawei P10 series• Qualcomm® Snapdragon Sense™ ID 3D Fingerprint

Related Reports



https://www.i-micronews.com/products/status-of-the-mems-industry-2019/

https://www.i-micronews.com/products/consumer-biometrics-market-and-technologies-trends-2018/

https://www.i-micronews.com/products/next-generation-human-machine-interaction-in-displays-2019/

https://www.systemplus.fr/reverse-costing-reports/synaptics-under-display-fingerprint-scanner-inside-the-vivo-x21-ud-smartphone/

https://www.systemplus.fr/reverse-costing-reports/fpcs-fpc1268-in-the-huawei-mate-9-pro-and-huawei-p10-series/

https://www.systemplus.fr/reverse-costing-reports/qualcomm-snapdragon-sense-id-3d-fingerprint/














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Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Pluso Company serviceso Contact

Business Models Fields of Expertise

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Reports(>60 reports per year)

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Trainings






Physical Analysis

Physical Comparison


Cost Analysis

Cost Comparison


Related Reports

About System Pluso Company serviceso Contact

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Qualcomm 3D Sonic Sensor Fingerprint...©2019 by System Plus Consulting | SP19465 –Qualcomm 3D Sonic Sensor 1 22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected]