Publication of IPC-8497-1 “Cleaning Methods and ...thor.inemi.org/webdownload/newsroom/Presentations/iNEMI_at_OFC... · A draft of IPC-8497-01 “ Cleaning Methods and Contamination

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Publication of IPC-8497-1 “Cleaning Methods and

Contamination Assessment for Optical Assembly” and Future

Research Strategy

Dr. Tatiana Berdinskikh, OFC 2006

March 6, 06

1

Presentation OutlinePresentation Outline

• Baseline research used for IPC-8497 “ Cleaning Methods and Contamination Assessment for Optical Assembly”

• Collaboration with the standards bodies• Development of IPC-8497 “ Cleaning Methods and

Contamination Assessment for Optical Assembly”• Future Research Strategy

– iNEMI project “Fiber Connector End-Face Inspection” (progress review)

– Future Plans

2

Past participantsPast participants

• Tatiana Berdinskikh, N. AlbeanuCelestica

• Jennifer Nguyen, Solectron• Yves Pradieu, Solectron-Iphotonics• Randy Manning, Tyco Electronics• Dave Silmser/Heather Tkalec, Alcatel• Tom Mitcheltree, Cisco Systems• Thomas Ronan, Ingrid Levy, Aerotech• Frank (Yi) Zhang, Avanex• Denis Gignac, Nortel Networks• Carla Gleason, ExceLight

Communications Inc/ Sumitomo Electric

• Les Aseere, Sanmina• Matt Brown, USCONEC• Steve Lytle, Westover Scientific• Susan Grant, Corning• Arnaud Nicolas, FCI• Mark Vogel, Trace Labs• David Horat, Diamond• Paul Mohr JDSU

3

Current participantsCurrent participants

• Tatiana Berdinskikh, Celestica• Jose Garcia, JDS Uniphase• Steve Lytle, Westover Scientific• Randy Manning, Tyco Electronics• David Fisher, Tyco Electronics• Tom Mitcheltree, Cisco Systems• Thomas Ronan, Aerotech• Heather Tkalec, Alcatel • Frank (Yi) Zhang, Avanex• Denis Gignac, Nortel Networks• Doug Wilson, PVI Systems• Dr. Chip Kilmer, Sagitta• Dr. Sun-Yuan Huang, Intel• Carla Gleason, ExceLight

Communications Inc/ Sumitomo Electric

• Harvey Stone, Microcare• John Culbert, Megladon Mfg• Yutaka Sadohara, Sumitomo Electric

4

Fiber Optic Signal Performance Fiber Optic Signal Performance

The cleanliness of fiber optics connectors is recognized as an industry wide-problem;

• There was no industry-standard for cleanliness of fiber optics connectors in 2002;

• The cleaning and inspection processes of contaminated connectors affect manufacturing time and therefore increase test and product cost for high density port systems;

• The influence of scratches/particles/oil contamination on optical performance has not been previously investigated in detail

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Fiber Optic Signal Performance ProjectFiber Optic Signal Performance Project

• Fiber Signal Performance Project: Feb, 02- Sep, 04• Objectives:

– Learn the effects that many anomalies have on the performance of a fiber optic signal

– Identify the severity of optical signal loss due to the most common potential hazards found in supplier and internal manufacturing processes

• Benefits:

– Develop an Industry Standard for cleanliness of fiber optics connectors.

– Improve the cleaning process and prevent fiber endface contamination

6


7


Published by Journal of SMTA, 2003

35

4045

50

5560

65

D44

D54

D55

D56

D57

D601

D614

D621

D625

D30

D262

D320

D45

D603

D604

D613

D615

D616

D617

D626

D050

D728

D323

Connector Number Launch cable & DUTs defects-free

Launch cable defects-free, CUTs S/N D44 to D320 scratches applied to thecaldding area, DUTs S/n D45 to D323 scratches applied to the fiber MFD

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a) Particles on Ferrule and Cladding Area

00.20.40.60.8

11.2

JSC

1

JSC

3

JSC

5

LSC

4

TSC

152

TSC

153

Conn. ID

IL (d

B)

B-IL(1550)B-IL (1310)A-IL(1550)A- IL (1310)

b) Particles on Ferrule and Cladding

020406080

JSC

1

JSC

3

JSC

5

LSC

4

TSC

152

TSC

153

Conn. ID

RL(

dB) B- RL (1550)

B- RL (1310)A RL (1550) A RL (1310)

•IL-1550nm/1310nm(clean)=0.24/0.25dB;

•IL-1550nm/1310nm(contaminated)=0.92/1.07dB;

•RL-1550nm/1310nm (clean)=57.3/55.5dB;

•RL-1550/1310nm (contaminated)=56.5dB/55.6dB

Particle is on the cladding layer

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Critical parameters:Distance the particle from the coreSize of the particleType of the particleHardness of the particle/thickness

IL=1550/1310 (contaminated)=0.14/0.15 dB

RL=1550/1310 (contam.)=59.6/58.5 dB

IL=1550/1310 (clean)=0.11/0.11 dB

RL=1550/1310 (clean)=58.6/56.8 dB

IL=1550/1310 (contaminated)=16.77/18.08 dB

RL=1550/1310 (contaminated)=20.3/20.8 dB

IL=1550/1310 (clean)=0.11/0.05 dB

RL=1550/1310(clean)=58.0/57.6dB

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•Oil application resulted in significant changes of RL:

•RL decreased from 56.3 dB to 43.6 dB (wavelength-1310nm) and from 57.2dB to 45.1 dB (wavelength 1550 nm)

0

10

20

30

40

50

60

70

1 3 5 7 9 11 13 15 17 19

Sample #

Ret

urn

Loss

, dB

Clean, 1310 Clean, 1550 Oil, 1310 nm Oil,155

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

1 3 5 7 9 11 13 15 17 19

Sample #

Inse

rtio

n Lo

ss, d

B

Clean, 1310 nm Clean, 1550 Oil,1310 nm Oil, 155

Oil Contamination

Oil ContaminationOil Contamination

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Zones definition (Fiber Check Analysis)Zones definition (Fiber Check Analysis)

2005 Research

Clean Fiber

Cladding, 25um<d<120um

Contact Diameter130um<d<250um

Area near the core, d<25um

Ferrule Diameter250um<d<400um

Epoxy Ring Zone, 120um<d<130um

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60A-3WD-2M

20.4umPublished by APEX 2005

T19-3WD-2M25.5um25um Area contamination ~50um

Initial IL: 0.08dBInitial RL: 53dB

IL after contamination: 0.63dBRL after contamination: 24dB

3 x Standard Deviation of IL: 0.0213dB3 x Standard Deviation of RL: 3.46dB

Failed

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AnovaAnova Test ResultsTest Results

Statistical Data Analysis- 2005 data

Box-plot graph for the IL of the sample 57A: clean (57A clean) andcontaminated, Subgroup 1 (57A IL 1) and Subgroup 2 (57A IL 2)

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The Factors Affected on the Optical PerformanceThe Factors Affected on the Optical Performance

Delta IL vs Distance from Core

-0.2

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

2

0 5 10 15 20 25 30 35 40 45 50

Distance From Core (micron)

Del

ta IL

Delta IL

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The Factors Affected on Optical PerformanceThe Factors Affected on Optical Performance

Published by APEX 2004

Delta RL vs Distance From Core

-50

-40

-30

-20

-10

0

10

0 5 10 15 20 25 30 35 40 45 50

Distance from Core (micron)

Del

ta R

L

Delta RL

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no non1

dn2, High index layer due to polishing

Connection/contact layer

−= dnRdBRL

λπ 14cos12log10)(

)cos21()cos2( 212

22

1212

22

1 δδ rrrrrrrrR ++++=

hnnnnnr

nnnnr 2

12

122

20

201

4,,λπδ =

+−

=+−

=

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RL Modeling DataRL Modeling Data

0 10 20 30 40 50 600

50

100

150

200

250

S ample Connector Number

Laye

r Thi

ckne

ss [n

m]

Arizona dust contaminated connectors: estimated contamination layer thickness at 1550 nmParticles trapped in between two endfaces result in air gap

p yPublished by APEX 2005

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Ferrule Contact Diameter CalculationFerrule Contact Diameter Calculation

• Contact diameter calculations for mated connector pairs– Minimum contact diameter 146 µm, 0.5 kgf, 5 mm end face radii– Maximum contact diameter 195 µm, 0.9 kgf, 30 mm end face

radii– Estimated contact diameter range for test connectors,

156-185 µm• Contact diameter equations

– Ferrule end face deformation h at 0.5 kgf and 0.9 kdf contact force

– Contact Diameter equationh 0.5 R( ) 1918 R 0.795−⋅ h 0.9 R( ) 2368 R 0.795−⋅

d contact R 1 R 2,( ) 2 h R 1( )⋅ R 1⋅ h R 1( )2− 2 h R 2( )⋅ R 2⋅ h R 2( )2−+

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Receptacles ModulesReceptacles ModulesPublished by Photonics North 2006 conference

Sumitomo/ExceLight experiment for Receptacle Modules

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Gage R & R StudyGage R & R Study

Per

cent

Part-to-PartReprodRepeatGage R&R

100

50

0

% Contribution

% Study Var% Tolerance

Sam

ple

Ran

ge

4

2

0

_R=1.891

UCL=4.868

LCL=0

Aoki Joe Kaneko

Sam

ple

Mea

n 42

36

30

__X=37.43UCL=39.37

LCL=35.50

Aoki Joe Kaneko

Sample10987654321

40

32

24

OperatorKanekoJoeAoki

40

32

24

SampleA

vera

ge10 9 8 7 6 5 4 3 2 1

42

36

30

Operator

Aoki

JoeKaneko

Components of Variation

R Chart by Operator

Xbar Chart by Operator

ORL by Sample

ORL by Operator

Operator * Sample Interaction

Published by Photonics North 2006 Conferencea o udy

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Occluded Area ImagesOccluded Area Images--More DetailMore Detail

OFC 2006

Labeled Detected Particles(color coded by annular ring)

Labeled with rings

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Delta IL Delta IL vsvs Gaussian Weighted % Occluded AreaGaussian Weighted % Occluded Area

Delta IL vs Gaussian Weighted % Occluded Area

y = 0.0009x 2 - 0.0065x + 0.0239

R 2 = 0.8166

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

0 10 20 30 40

GWpOA

delta ILPoly. (delta IL)

The Delta IL for the worse-case defects and scratches based on inspection criteria is less than 0.03 dB

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PublicationsPublications

“Optical Connector Contamination/ Scratches and its Influence onOptical Signal Performance’, Journal of SMTA, V. 16, issue 3, 2003, pp.40-49“ At the Core:How Scratches, Dust, and Fingerprints Affect Optical Signal Performance’, Connector Specifier, January 2004, pp.10-11“ Degradation of Optical Performance of Fiber Optics Connectors in a Manufacturing Environment’, Proceedings of APEX2004, Anaheim, California, Feb 19-Feb 26, 2004, pp.PS-08-1-PS-08-4“Cleaning Standard for Fiber Optics Connectors Promises to Save Time and Money”, Photonics Spectra, June 2004, pp.66-68“Development of Cleanliness Specification for Single- Mode Connectors”, Proceedings of APEX2005, Anaheim, California, Feb 21-26, 2005, pp. S04-3-1- S04-3-16.“Keeping it clean: A cleanliness specification for single-mode connectors”, Connector Specifier, Aug, 05, pp.8-10.“Contamination Influence on Receptacle Type Optical Data Links”,Photonics North, 2005, Toronto, Canada, Sep, 05.“Development of Cleanliness Specifications for 2.5 mm and 1.25 mmferrules Single- Mode Connectors” – Proceedings of OFC/NFOEC, Anaheim, California, Mar 5-10, 06

8 Papers published by the Project Team

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Leading the IndustryLeading the Industry

Collaboration with TIA, IEC and IPC• The Project is collaborating with International Electrotechnical

Committee (IEC), Telecommunications Industry Association (TIA) and IPC to develop a cleanliness standard.

iNEMI presentations:• OMI conference, Ottawa, Apr-29-May 1, 2003• IEC meeting, Montreal, Quebec, Canada, Oct 6-13, 2003 (presented by T.

Berdinskikh, Celestica)• APEX2004, Anaheim, California, Feb 19-Feb 26, 2004• IEC meeting, Locarno, Switzerland, Apr, 04 (presented by T. Mitcheltree,

Cisco)• IEC meeting, Warsaw, Poland, Sep, 04 (presented by R. Manning, Tyco)• A draft of IPC-8497-01 “ Cleaning Methods and Contamination Assessment for

Optical Assembly” has been submitted to IPC (June, 04)• APEX2005, Anaheim, California, Feb, 05 • IEC meeting, Charlotte, NC, Apr, 05 (presented by R. Manning, Tyco)• OFC2006, Anaheim, California, Feb, 06

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Collaboration with the standardization bodiesCollaboration with the standardization bodies

Our Objective:• Update the criteria in IEC doc “61300-3-35: Basic test and

measurement procedures” based on quantitative data• Harmonize our recommendations across all

vendors/CMs/OEMs to achieve a true international standard

Summary from Montreal IEC-2003:• Scratches and particles within 25um diameter definitely affect

SMF performance• Scratches outside of 25um definitely do NOT affect SMF

performance• Further investigation needed on particles outside 25um

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Summary from IEC meeting, Locarno, Apr, 04, presented by the iNEMI team

• Small Carbon particles on the ferrule did not show any performance degradation

• Small Carbon particles on the cladding outside the 25 um zone do not significantly impact performance

– e.g., Up to 17 particles on cladding outside of 25um…no impact• Contamination particles can prevent direct physical contact

creating an air gap between two endfaces• Further investigation is needed for contamination located

at cladding and ferrule areas• Investigate the influence on the Arizona dust particles on

the optical signal performance

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IPCIPC--8497 development8497 development

• Project Team made the initial contacts with IEC, TIA and IPC representatives at OMI conference, Ottawa, May, 2003

• The first- face-to-face meeting of the project team on the standard development was held at Celestica and Cisco facilities in Salem, Jun, 04.

• The final document was submitted to the IPC review in July, 05

• The IPC-8497-1 “ Cleaning Methods and Contamination Assessment of Optical Assembly” was published by IPC in Feb, 2006.

• The acceptance of an industry standard for SM connectors will result in significant cost savings to fiber optics industrydue to the elimination of insufficient cleaning and over cleaning and the reduction of contaminated non-conformance material.

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IPC IPC --84978497--1 content1 content

1. Scope2. Applicable documents3. Terms and Definitions4. Cleaning Specification5. Contamination6. Inspection Equipment7. Cleaning Methods8. End-caps9. Performance testing10.Electrostatic Charge Effect ( ESD) and Connector

Cleanliness11.The Influence of Scratches/Contamination on Optical

Signal Performance

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Scope of IPCScope of IPC--84978497

• The scope of the specification is to describe the methods of inspecting and cleaning all optical interfaces so their interconnectivity does not result in loss of optical signal. It also describes methods of contamination prevention

• The target audience for this standard are Manufacturing Operators, Manufacturing Process Engineers, Quality Engineers and Field System Installers

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Inspection CriteriaInspection Criteria

Inspection Criteria for SMF Pigtail and Patchcord Connectors

anynone > 10 microns130 to 250 microns2 — Contact Zone

anyany120 to 130 micronsAdhesive Zone

none > 3 micronsany < 2 microns

5 from 2 - 5 micronsnone > 5 microns

25 to 120 microns1b — Cladding Zone

nonenone0 to 25 microns1a — Core Zone

Scratches (width)Defects (diameter)DiameterZone/Description

Allowable Defects and Scratches

anynone > 10 microns130 to 250 microns2 — Contact Zone

anyany120 to 130 micronsAdhesive Zone

none > 3 micronsany < 2 microns

5 from 2 - 5 micronsnone > 5 microns

25 to 120 microns1b — Cladding Zone

nonenone0 to 25 microns1a — Core Zone

Scratches (width)Defects (diameter)DiameterZone/Description

Allowable Defects and Scratches

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Fiber Connector EndFiber Connector End-- Face InspectionFace Inspection

• Objective:• This project is developing requirements for allowable

surface defects, such as scratches, pits, and contamination. Based on experimental data and the results of mathematical modeling, the group plans to define the zone criteria and pass/fail visual requirements for polished connectors, single mode fiber.

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Phase 1Phase 1

• PHASE 1 ( Completed)• Fiber Optic Connector End-face Anomaly Assessment for

SM fiber• The losses, (IL and RL), which occurs on SC, FC, LC, MU

connectors due to contamination with Arizona road dust and polishing scratches will be examined.

• The DOE (Design of experiment) that was used in the Fiber Optic Signal Performance Project for singlemode SC connectors will be used for this phase of the project. (Ref: Avanex experiments, Optical Signal Performance project )

• Statistical data analysis will be performed.• Results for the influence of scratches and Arizona road

dust for SC connectors will be compared with the results from the other types of connectors (SC, FC, LC, MU)

• Mathematical modeling for the RL results will be provided.• Inspection criteria for SM connectors will be finalized.

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Phase 2Phase 2

• PHASE 2- In Progress• Fiber Optic Connector End-face Anomaly Assessment for

MM fiber• The loss (IL, RL, and BERT) realized by MM applications

due to fiber optic connector end-face anomalies (polishing scratches and Arizona dust contamination) will be assessed.

• The DOE (Design of experiment) that was used in the Fiber Optic Signal Performance Project for singlemode SC connectors will be used for this phase of the project. (Ref: Avanex experiments, Optical Signal Performance project )

• Perform Gage R & R study• Statistical data analysis will be performed.• Inspection criteria for MM connectors will be developed

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Phase 3Phase 3

• PHASE 3- In Progress (Sumitomo/ExceLight initiatives)• Fiber Optic Connector End-face Anomaly Assessment for

Receptacle Modules• Data rates to be studied will be chosen (OC-48, OC-192, etc.)• Provide Gage R & R study for test and measurement equipment• A method for application of anomalies will be developed• The influence of the dust and scratches on the optical

performance of receptacle modules will be investigated• Statistical data analysis will be performed• Critical factors such as particle size, distance from the core, type

of particles, will be identified• The correlation between measurements, (RL, BERT and other

tests yet to be determined), and images of the connector end-face will be calculated.

• Criteria for cleanliness of receptacle modules will be developed

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Phase 4Phase 4

• PHASE 4- In progress• Collaboration with standards bodies• A roadmap for the collaboration with the TIA, IPC, IEC

will be developed.– Collaboration with the IPC will be on standard IPC-8794-

01: "Cleaning methods and contamination assessment for optical assembly" (completed)

– A recommendation to update the IEC doc “61300-3-35: Basic test and measurement procedures” based on quantitative data will be put forth.

• Recommendations will be harmonized across all vendors, EMS providers, and OEMs to achieve a true international standard.

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Phase 5Phase 5

• PHASE 5- In Progress• Improving the cleaning process and prevention of

contamination• To understand the root causes of contamination and

develop the strategy to prevent or minimize the risk of contamination in the manufacturing environment

– Compare different cleaning materials with improved ESD capability to prevent connector charging during the cleaning process

– Contamination caused by the dust cap– Standardization of the dust cap: developing a

recommendation on materials and design– Investigation of ESD effects for mated optic connectors

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Phase 6Phase 6

• The following topics require further research to determine if other consortia or standards bodies have not already performed the work.

• Fiber Optic Connector End-face Anomaly Assessment for SM APC

• Estimate of the time & effort needed to investigate SM APC.

• Fiber Optic Connector End-face Anomaly Assessment for MT ferrule

• Estimate of the time & effort needed to investigate SM MT ferrule

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Future PlansFuture Plans

• Further research will focus on the development of a cleanliness specification for MM connectors and receptacle modules.

• Open discussion

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Back Up SlidesBack Up Slides

Back up SlidesBack up Slides

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Core is blocked

•IL-1550nm/1310nm(clean)=0.39/0.51dB•IL-1550nm/1310nm(contaminated)=2.88/3.61dB•RL-1550nm/1310nm(clean)=56.2/54.6dB;•RL-1550nm/1310nm(contaminated)=37.1/34.5dB

IL-Particles on Core/Cladding/Ferrule

010203040

JSC1

JSC2

JSC3

JSC4

JSC5

LSC1

TSC138

Conn. ID

IL (d

B)

B-IL(1550)B-IL (1310)A-IL(1550)A- IL (1310)

RL-Particles on Core/Cladding/Ferrule

020406080

JSC1

JSC2

JSC3

JSC4

JSC5

LSC1

TSC138

Conn. ID

RL

(dB

)

B- RL (1550) B- RL (1310)A RL (1550) A RL (1310)

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Particles on Ferrule only

0

0.2

0.4

0.6

IL (d

B)

B-IL(1550)

B-IL (1310)

A-IL(1550)

A- IL (1310)

Particles on Ferrule only

4550556065

Conn. ID

RL

(dB

)

B- RL(1550) B- RL(1310)A RL (1550)

A RL (1310)

•IL-1550nm/1310nm (clean)=0.19 dB/0.21 dB

•IL-1550 nm/1310nm (contaminated)=0.21dB/021 dB

•RL-1550nm/1310nm (clean)=55.7 dB/54.5 dB

•RL -1550nm/1310nm (contaminated)=55.6 dB/54.5 dB

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IL-1550nm/1310 nm(clean connector)=0.05/0.09 dB,IL -1550nm/1310 nm (contaminated connector)=0.04/0.05 dB,RL-1550/1310 nm (clean connector)=58.2/57.4 dB,RL-1550nm/1310 nm (contaminated connector)=57.3/56.4 dB

Carbon Particles on Cladding / Ferrule AreaDistances calculated with VisionGauge software

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Occluded Area GraphsOccluded Area Graphs

Data for connector LC07

Incremental occluded area vs radius Cumulative occluded area vs radius

For comparison, core exclusion zone area is about 491 µm2

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Inspection Criteria ProposalInspection Criteria Proposal

Ideal SMF SC UPC ceramic-ferrule endface

Documents

Publication of IPC-8497-1 “Cleaning Methods and ...thor.inemi.org/webdownload/newsroom/Presentations/iNEMI_at_OFC... · A draft of IPC-8497-01 “ Cleaning Methods and Contamination