Proven Production Solutions for Solar and Alternative Energy Manufacturers from Omron Electronics LLC

Automation Solutions for Solar Manufacturing

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Topic Page• Solar Photovoltaic Primer 3• Wafer-Based PV Manufacturing Process 7• Wafer PV Module Manufacturing Equipment 15• Thin Film PV Manufacturing Process 20• Omron Proven Solutions (wafer & thin-film) 26• Wafer-Based Solutions 39• Omron at a Glance 43• Contact Information 44

Contents

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Common Abbreviations PV – Photovoltaic CdTe - Cadmium Telluride

C-Si – Crystalline Silicon PV Cells A-Si – Amorphous Silicon PV Cells

CIGS - Copper Indium Gallium Selenide CIS - Copper Indium Selenide

TCO – Transparent conductive oxide SiN – Silicon Nitride

SiO – Silicon Oxide

Process Abbreviations/DefinitionsCVD – Chemical Vapor Deposition. Deposition is formed as a result of chemical reaction between gaseous reactants at elevated temperature in the vicinity of the substrate.

APCVD – Atmospheric Chemical Vapor Deposition.

LPCVD – Low Pressure CVD

PECVD – Plasma Enhance CVD. A process where plasma is used to lower the temperature required to deposit film onto a wafer.

MOCVD – Metal Organic CVD

CMP – Chemical Mechanical Polishing (Planarization)

EFEM - Environmental Front End Module – A wafer transport system

Solar Photovoltaic Primer

If you want to be a solar expert, go to: http://en.wikipedia.org/wiki/Solar_cell

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1. Crystalline Silicon Technology (Silicon Wafer based)– Mono-crystalline PV Cells (sliced from high purity single crystal)– Multi-crystalline PV Cells (sliced from a cast block of silicon)– A Silicon wafer is the substrate– Also ribbon silicon– Wafers are connected then laminated in glass.– More expensive to manufacture, more steps to produce– Better efficiencies, 90% market share

2. Thin Film Technology (Material Deposition based)– Amorphous Silicon PV Cells – Poly-crystalline PV Cells (non Silicon based)– Glass or a thin metal is the substrate– Silicon is deposited and interconnections are

laser etched into the material.– Fewer process steps, less expensive to

manufacture– Less efficient, 10% market share, growing

faster than C-Si

2 Primary Photovoltaic (PV) Technology Types

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Solar Energy Challenges

The keys to growth and acceptance of Solar energy no matter the technology used:

• Reduce the delivered cost per watt, but how?

• The cost of solar panels is approx. 50% in material costs and 50% in manufacturing.1. Reduce module cost by reducing material costs and manufacturing

costs.2. Reduce the installation costs.3. Increase efficiencies with new developments.

• How can Omron help?1. Reduce costs of production with higher quality equipment with less down

time and maintenance costs.2. Reduce waste by inspecting for quality in process.3. Provide seamless technologies that allow for quicker programming,

startup and installation.

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Solar Module Manufacturing Processes

Residential

Commercial

Utility

MULTICRYSTALLINE SILICON

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Silicon Wafer-Based Photovoltaic Processes

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Key to Wafer Technology Process

• Carrier and Material Handling Management

• Wafer Identification• Optical Inspection• Wet Processing• Diffusion Process• Deposition Process• Wafer Classification

Silicon Ingot Production Surface PolishSawing to Si Wafer

Laser Edging

Heat Processing

Wet Process

Lithography

Vacuum Process

Lamination

Optical Inspection

Furnace

Wafer Sorter

Stringing Process

Cells to Stringer

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Silicon Processing: Wafer Preparation• Ingot Pulling with a Rotary Servo

A seed crystal is slowly pulled from the molten silicon resulting in an ingot. Can also be done by forming ingots via a pouring process. Additionally the ingot can be cast into a block.

• Ingot SlicingA silicon ingot is sliced into wafers with a special diamond-coated blade. Wafers can be up to 150mm dia, or 156mm sq. Wafer thicknesses are getting thinner and thinner. 350 μm thick is not uncommon.

Wafer Technology Process

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• Optical InspectionSince wafers becoming extremely thin, they must be checked for cracks, chips and breakages then sorted into the cell production process. Typical solutions for this are the FZ2 True Color Vision system that provides unsurpassed contrast and color capabilities that are able to detect for breakages with 2 megapixel resolution. The ZFX2 may also be used for some defect applications as well as for simple sorting, rotation and fiducial identification.

• Wet ProcessingWet chemical processes are used for cleaning, texturing and etching. Wafers are cleaned with weak acids to remove unnecessary particles, or repair damage caused in the sawing process. The wafers are textured to create a rough surface to increase the cell efficiency. The generated PSG (Phosphorous Silicate Glass) is removed from the edge of the wafer in the wet-etching process.

Front End Wafer Processing

Wafer Technology Process

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• Diffusion FurnaceIn the diffusion furnace, atoms are diffused with silicon in a high-temperature furnace after phosphorous atoms are applied to the surface of the wafer. An N-doped layer is then created on the wafers. To ensure high quality of this thermal process, accurate and fast temperature control is key.

Wafer Technology Process

• Vacuum Processing (PVD/PECVD)In the vacuum process, also called plasma process (PECVD or sputtering), the wafer is coated with anti-reflection film (SiN) in the vacuum chambers. For optimized deposition of SiN layers, a comprehensive optimization of process parameters is required. This can improve the module efficiency. To ensure safe and stable operation, the integrity of sensing is essential.

12Wafer Technology Process

• Laser Edge Isolation/DeletionAfter PSG (phosphorous) is etched away, the n-doped layer is removed from the edges, using a laser tool. It generates a groove close to and along the edge of the wafer. With an accurate X-Y table and vision system, the laser beam moves close to and along the edges. Inspections may be required to ensure that the required layers have been removed.

• Screen Printing LithographyIn screen printing, the mesh and buses of silver are printed on the front; furthermore, the buses of silver are printed on the back. Subsequently, aluminum paste is dispensed over the whole surface of the back for passivation and surface reflection. Screen printing is one of the most critical processes to maintain high yield. In many of these applications, the primary products are FZ2 and F-series for contact and connection inspections.

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• Conveyor FurnaceAfter electric contacts are printed and conductive materials are dispensed, the cells are dried and subsequent layers are added in the conveyor furnace. Subsequently, the contacts and conductive layers are imprinted in the cell within a furnace. Conveyor furnaces are used for contact drying/firing and metallization in which an optimized temperature profile with fast ramp-up and cool-down is required. Flexible system design with a standard module helps customized design for various cells and modules. (Also see conveyor furnace applications used in wafer based PV manufacturing).

• Individual Solar CellThe result of the previous process steps are individual solar cells. The next step in the process is to make the solar module, or panel.

Wafer Technology Process

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The front end process makes the

cells….

….the back end process makes the

modules.

Wafer Technology Process

Cell

Module

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Cell Sorter

• Products Designed In:• Position Sensors: EE-SX Photo-microsensors• Conveyor Photoelectrics: E3Z, E3T• Fiber Optic Sensors: E3X• Vision for positioning and location: ZFV/X• Particle Removal: ZJ Ionizers• Power Supplies: S8VM/S8VS• PLC/Touch-screens/Remote I/O• Pushbuttons

Wafer Module Assembly

These high throughput automated cell sorters sort photovoltaic cells according to their electrical performance, tested under simulated sunlight. A special lamp provides a close match to the solar spectrum. Cells are sorted to offer various customers a cell range meets their requirements. It also ensures that lower quality cells do not get mixed in with high quality cells. These systems typically feature automatic cell handling of stacked cells and sorts the tested cells into output bins.

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Challenge During the cell/module production process, the wafer cassettes are managed centrally and locally. In the case of changes in local production it is important that the management system is flexible and can be rescheduled. If the ID’s on cassettes are readable, but not writable, a complicated program in the host computer is required. It requires considerable effort to take these various possibilities into account and furthermore, it takes time to modify the production line. Even if an unexpected system problem arises, production must continue. Moreover, a production record has to be kept for quality management.

Solution Omron offers RFID systems with a frequency that conforms to the global standard of 13.56MHz. The ID tags have a large memory, large capacity to rewrite, are resistant to harsh environments and come in compact packages. Therefore it is possible for an ID tag to carry instructions for production. It also simplifies any changes to the production plan. Omron has a fixed and hand-held reader/writer available that enable flexible management while allowing local reading of processed information in attached ID tags.

Benefit The production records help quality management while flexible production is enabled with respect to change-overs.

Cell Cassette Management

Wafer Module Assembly

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Assemblers / Tabbing and Stringing

• Products Designed In• PLC/Touch-screens/Remote I/O• Position Detection: E3Z/E3T Photoelectric• Position Detection: ZG Profile Measurement• Indexing: E3T Photos, EE-SX Photomicrosensors• Crack and Fracture Inspection: FZ Vision• Placement and Positioning: ZFV or ZFX Vision• Power Supplies: S8VS/S8VM• Pushbuttons• Safety: Light Curtains• Particulate Control: ZJ Ionizers

• Solar assemblers are an automated production machine that interconnects solar cells by soldering flat metal leads, or tabs, to cell contacts. Solar cells are processed at a throughput around 500-1000 cells per hour.

• The assemblers unloads solar cells from stacks and aligns their edges using an aligner. Tab material is fed from reels, coated with flux, cut to length, and provided with a stress-relief bend.

• Tabs and cells are aligned for soldering. High-intensity lamps in the solder head assembly provide radiant thermal energy to the cells and tabs. Both front and back cell contacts are soldered in a single step, thereby reducing thermal stress on cells. This is particularly important for high yield processing on thin solar cells.

Wafer Module Assembly

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Lay-Up Stations

• In the lay-up station, strings of soldered cells, glass plates and foils are placed on top of one another automatically after alignment with transfer equipment. The alignment has to be accurate to enhance solar-module efficiency. Each cell and glass plate is inspected before modules are assembled.

• In the lay-up process is where large loading robots are used, sensing and control is required to protect operators from turntables and lifting or handling robots for large glass plates.

• Products Designed In• PLC/Touch-screens/Remote I/O• Glass Inspection: ZS Measurement• Position Detection: E3Z/E3T Photoelectric• Position Detection: ZG Profile Measurement• Indexing: E3T Photos, EE-SX Photomicrosensors• Crack and Fracture Inspection: FZ Vision• Placement and Positioning: ZFV or ZFX Vision• Power Supplies: S8VS/S8VM• Pushbuttons

Wafer Module Assembly

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Lamination Stations• Products Designed In

• PLC/Touch-screens/Remote I/O• EJ1 for gradient temperature control• G3PZ/G3PX for multi-loop phase angle control• Glass warp Inspection: ZS Measurement• Laminate Inspection: ZS Measurement• Temperature Controls• Position Sensing: E3Z/E3T Photoelectrics,

Fiber Optics• Indexing Controls: Photomicrosensors,

Pushbuttons• ZJ-BAS Ionizers

In the lamination process, the cells are encapsulated in a vacuum between glass and foil at a high temperature. To laminate a module, uniformity of temperature is required across the full element. The processing chamber of each laminator has temperature, vacuum and atmospheric pressure capabilities, which are independently controlled to provide optimum processing conditions for particular materials and configurations including laminating glass superstrate, double glass, substrate, or flexible modules.

Wafer Module Assembly

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Thin Film-Based Photovoltaic Module Process

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Flexible Thin Film Process

Thin Film Process

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Rigid (Glass) Thin-Film ProcessGlass Substrate:24% sand74% potash2% lime/chalk

Glass Wash

Back Contact Using Sputtering Process

Laser Scribing 1 Laser Scribing 2

Laser Scribing 3

Front Contact Using Sputtering Process

Back Glass and Lamination

CVD Processes

• Traceability• Yield• Glass Alignment• Glass Handling• Glass Positioning• Glass and Wafer

Flatness• Vacuum Deposition• Over-lamination

Thin Film Process

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Glass Transfer SystemDuring all stages of the process glass substrates are conveyed, handled and stocked. Glass substrates are getting larger and the risk of breakage and accidents is getting higher, so secure glass handling is required. Large glass plates can warp under their own weight. Furthermore the various conditions of the surface or the edges make stable alignment and detection difficult.

Standard photoelectrics have been used to sense the glass substrate on the transfer systems, but because of the optical characteristics, photoelectrics have difficulty accurately detecting the position. Instead laser based measurement sensors such as the ZG Profiling Sensor for edge inspection, ZS Laser Displacement Sensor for surface and warp inspection and ZX-GT Micrometer Sensor for position measurement allow manufacturers to overcome some of these challenges. For simple glass presence or absence, the Ultrasonic E4P and special glass detection E32 fiber optic heads can been used.

Thin Film Process

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• Wash Dry/Clean ProcessA glass-cleaning machine is applied in-line to remove minuscule particles and unwanted objects. After washing with water, the glass substrate is dried with hot air. During this process, water and chemicals may need to be treated carefully and efficiently. Additionally, Omron Ionizers can be applied after this stage to ensure particulate removal Omron’s E32-L11FP sensor is suited for wet and chemical environment.

• Vapor Deposition SystemsChemical Vapor Deposition (CVD) is the most common thin film deposition method; deposition is formed as a result of chemical reaction between gaseous reactants at elevated temperature in the vicinity of the substrate. Variations of CVD processes include Atmospheric Pressure CVD (APCVD), Low Pressure CVD (LPCVD) and Plasma Enhanced CVD (EPCVD), Metal-Organic CVD (MOCVD). Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process where plasma is used to lower the temperature required to deposit film onto a substrate.

Thin Film Process

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• Laser ScribingA single substrate is subdivided into individual cells, which are electrically interconnected in series. For the subdivision and interconnection, some laser-scribing processes are applied after the deposition of the TCO layer, anti-reflection film and metal contact layers. For this process, accurate movement of glass stages and safety control is required.

• LaminationThe processed module is encapsulated between back-cover glass and the front glass laminated with EVA as an adhesive to protect the module from the environment. To laminate a module at high temperature in vacuum, uniformity of temperature across a large substrate is required in order not to decrease the efficiency.

Thin Film Process

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Omron Proven SolutionsCommon Solutions for Both Wafer and Thin Film

Topic Page• Glass Alignment 27• Linear / 2D code 28• Gradient Temperature 29• Laser Edge Ablation 30• Detection in Vacuum 31-35• Glass Sensors (general) 36• Glass Sensor in Liquid 37• Particulate Removal 38

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Glass Alignment

• Challenge In order to align transparent glass plates, the position of the edge has to be measured accurately and fast, but the position has to be the same for all glass plates, regardless of the edge condition or transparency of the glass.

• Solution The CCD algorithm ZX-GT Micrometer Sensors offers stable and accurate measurement of the edge position. Furthermore, the high-speed CCD allows fast measurement for glass ensuring accurate positioning, while support software ensures easy setting up and monitoring.

• Benefit Quick and accurate positioning allows improvement of throughput.

Common Solutions

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Linear and 2D Code Reading on Wafers, Glass or Films

• Challenge Material level management is ideal for tracking process data, but decoding any ID marking on a wafer, glass or thin film is not easy due to surface variability.

• Solution Omron offers fixed and handheld 2D code readers (V400 family) incorporating Omron’s algorithm to increase the reading rate. They are easily setup and include an easy tutorial function. The 2D code checker has the flexibility to read even the most difficult 2D codes at the highest speeds.

• Benefit Material level management with two-dimensional code makes small production lots efficient, while improved decoding rate helps to achieve high throughput.

Omron’s V400 Inspection Solutions

Common Solutions

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• ChallengeTemperature uniformity throughout a module is key to maintaining high quality in the lamination process, but it is difficult to control some heaters at the same profile due to the interference or disturbance of the lamination cycle.

• Solution With Gradient Temperature Control (GTC), Omron’s EJ1 with interacting PID control technology, a 2-dimensional temperature profile remains constant over a defined area. The EJ1 makes it possible to control the exact shape of the temperature profile at any position.

• Benefit When using Omron’s EJ1, high efficiency of the module can be realized and the set-up adjustment time is reduced.

Gradient Temperature Control

Common Solutions

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Laser Edge Isolation/Deletion/Ablation

In this process, referred to by several terms, a 10 mm - 15 mm edge around the module is removed to ensure that no material layer exists. On that edge, sealant is applied to protect the internal layers of material and a protective cover, or glass is applied. Accurate positioning and movement is required to ensure that the edge ablation is accurate. Using Omron ZX-GT for non-contact positioning along with vision and motion control. Accurate and repeatable edges are produced.

Common Solutions

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Detection in Vacuum Chamber• Challenge

Using standard photo electric sensors to detect in a vacuum chamber can cause problems because the haze that develops on view ports or lenses on sensors will obscure the view and cause a false detection.

• Solution The combination of an intelligent sensor and vacuum-resistant reflector enables stable detection using Omron’s ZS Measurement. With the E3C-LD Sensor with the E3X-DA11AT-S Automatic Threshold Controlled Amplifier, you can place the reflector for an optical retro-reflection sensor in a vacuum chamber, allowing the detection of wafers/glass through one view port.

Even though the view ports become covered with mist, the automated threshold controlled sensor can recognize the drop in optical reflected value, and automatically change the threshold in proportion with the optical value.

• Benefit Easy maintenance with stable detection over an extended period of time and an increase in equipment reliability through reducedsensing error.

Common Solutions

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Vacuum Resistant Fiber Sensing

• Challenge Outgassing is a challenge to creating and maintaining clean high-vacuum environments.

• Solution Omron’s E32 Family offers various kinds of unique vacuum-resistant fiber sensors, such as through-beam, slot, and direct-reflective types. The combination of an intelligent amplifier and vacuum-resist fibers enables the stable detection in a vacuum chamber. Even though the sensor heads or flanges become covered with mist, the sensors can recognize the drop in optical reflected value and automatically change the threshold in proportion to the optical value.

• Benefit Easy maintenance with stable detection over an extended period of time and an increase in equipment reliability through reduced sensing error.

Common Solutions

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Vacuum-Resistant Fiber Optics

• ChallengeTo place sensors in lamination chambers they have to be resistant to temperature, vacuum and atmospheric pressure.

• Solution Omron offers various kinds of fiber sensors such as vacuum-resistant and high temperature-resistant, etc. The combination of an intelligent amplifier and vacuum-resist fibers enables the stable detection in the vacuum chamber. Even though the sensor heads or flanges become misted over, the sensors still can recognize the drop in optical reflected value and automatically change the threshold in proportion to the optical value.

• Benefit Easy maintenance with stable detection over an extended period of time and an increase in equipment reliability by reducing sensing error.

Common Solutions

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PECVD or Vacuum Chamber Inspection for Glass Substrate

Sensing Object

Sensor Used

Glass base plate

Typical sensors malfunction due to the contaminants deposited on the vacuum view port. The incident level falls below the threshold level & gives a false output. The threshold level needs to be continually adjusted & thus increases downtime decreases production efficiency.

Active threshold control (ATC) automatically adjusts the threshold value.

Reduced down-time to “re-calibrate” the sensor increased productivity and throughput.

Threshold value follows to the light absorbent quantity, Stability detection is possible.

●Sensor Head（Retro-reflective）E3C-LR

●Amplifier (High function ATC type) E3C-LDA□AT

●Reflector E39-R

Photoelectric Sensor with separate Digital Amplifier (Laser type)

<Sensor with ATC function >

Previous sensors used fixed threshold values, so when the incident light level decreases with the accumulation of deposits, the sensor would malfunction.

IncidentThreshold

Light value

TimeGlass Detection

Incident Value Threshold Value

Decreased Light intensity Threshold follows

The ratio of the incident level against threshold level is fixed as a %.

Decreased Light intensity Threshold followsDeposits gradually build up on the viewport

Solution

Alternate Solutions: ZS Displacement Measurement Sensor

Problem

Solution

Result

Application details

Common Solutions

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Tips for Glass Substrate Detection in a Vacuum

Viewingport

Sensor Head (Emitter)

Reflector

When sensing the glass substrate through a viewing port and using a retro-reflective sensing mode, incline the beam (>5 deg.). This enables better detection capabilities.

Throughbeam

Retro-reflective

Transparent plate

100

96

10092 10088

Inclined at 20 deg.

Retro-reflective sensorE3C-LRE3C-LDAE39-R12

Common Solutions

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Glass PresenceGlass Presence AlignmentAlignment MappingMapping Inspection of Presence of Passing Glass

Inspection of Presence of Passing Glass

Sensing Distance ：１５～２０ｍｍ(Long Distance）

Ｅ３２-Ａ０７Ｅ１／Ｅ２

Sensing Distance ：

１０～２０ｍｍ

Ｅ３２-Ａ０８

Heat resistance ：３００℃Sensing Distance：１～５ｍｍ

Ｅ３２-Ｌ-６６-Ｓ-１

Small size thin shape (industry smallest)Sensing Distance：０～３ｍｍ

Ｅ３２-Ｌ２４Ｓ

Heat resistance ：３００℃Sensing Distance ：

５～１８ｍｍ

Ｅ３２-Ｌ６６

Sensing Distance ：０～１５ｍｍTilting Angle: ± 6°

Ｅ３２-Ｌ１６

For end face mappingHeat resistance ：１５０℃Sensing Distance ：

１５～３８ｍｍ

Ｅ３２-Ａ０９Ｈ

For end face mappingSensing Distance ：

１５～３８ｍｍ

Ｅ３２-Ａ０９

For end face mappingHeat resistance ：３００℃Sensing Distance ：

２０～３０ｍｍ

Ｅ３２-Ａ０９Ｈ２

Heat resistance ：１３０℃

Glass inspection

View port crossing over

Ｅ３２-Ｌ５６-２

Typical Glass Sensing Application products

Common Solutions

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Glass Sensor for Wet Processing

• Challenge Mechanical sensors can cause damage to the glass/wafer. On the other hand, it is difficult to detect glass/wafer with conventional optical sensors in wet conditions.

• SolutionWater/chemical proof fiber sensors allow you to use the sensing head in wet conditions. The unique structure prevents detection failure. The fluorine-resin-coated sensor head allows you to place it near a glass/wafer in wet conditions. The limited reflective structure enables detection of the transparent or shiny surface. The high water-repellent coating on the spherical lens prevents accumulation of water. The flexible (R4) and fluorine-coated fiber enables wiring in wet and chemical environments.

• Benefit Easy maintenance with fewer problems and no damage to glass/ wafer.

Common Solutions

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Sensing Object

Sensor Used

Particulates and dust are issues in the vapor chambers. They can cause depositions to improperly adhere, as well as potentially cause the glass to break when electrified if dust is attached to it.

Glass

ZJ-BAS Ionizer Bar The static charge is removed from the glass by the bar-type ionizer on both sides of the glass.

The decrease in foreign material adhesion and high speed coverage leads to reduced damage and increased total throughput.

The ZJ-BAS Ionizer bar removes static charge from the glass at high speed and has no gaps like other brands.

Series ZJ-BAS×2

Solution

Particulate Removal/Ionization

ProblemSolution

Result

Application details

Common Solutions

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Wafer Detection• Challenge

The variety of surface conditions on wafers makes stable wafer detection difficult. Some thin-films on wafers absorb a specific wavelength. These wafers cannot be detected by an optical sensor with single wavelength light source.

• SolutionOmron’s E3X-DACS RGB, true-color fiber amplifier offers a single fiber sensor with white LED emitter and RGB receiver. It is able to detect any type of wafer, such as patterning, Copper plated or ARC film. A wide range of wavelengths enables the differences between surface conditions to be distinguished and all wafers to be detected regardless of the surface condition.

• Benefit Only processed wafers are transferred and various wafers can be detected with one compact fiber sensor, saving costs and space.

Wafer Solutions

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Wafer Presence Detection

• Detect any type of wafer, (such as patterning, Cu-plated, or ARC film)• Fiber sensor amplifier with white LED emitter and RGB detector (E3X-DAC-S)

RGB Processing(Calculate simultaneously)

White LED(1/3 size of using triple LED)

RGB Detector(Make out 3 colors at a time)

3-in-1 Sensor

+Red Green Blue

+ =

Wafer Solutions

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Sensing Object

Sensor Used

Glass

Glass can become warped or have other defects during the glass manufacturing process or during the high heat processes of deposition and thermal curing. Warped or kinked glass can break in process causing major reductions in throughput due to vacuum shutdown and start-up times.

The glass surface is measured by each laser head while a single axis linear motor moves along the length of the glass.

Glass surface measurements are now reliable, fast and accurate. Warped or kinked glass is quickly removed prior to breakage. Downtime due to broken glass is eliminated and throughput is increased.

The system can utilize a Multi-controller unit, or can be connected to a PLC and HMI to simplify set-up, debugging and mathematical calculations.

ZS CMOS Displacement Laser Sensor●Sensor Head(s) ZS-LD40T●Amplifier ZS-LDC●Calculator ZS-MDC

Glass

Glass

Glass Width

Glass ＧＡＰ

Solution!

Glass and Laminate Surface Inspection

Application details

Solution

Result

Problem

Common Solutions

10μｍ

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Cell Inspection• Challenge

When cell breakage or string parallelism is inspected, the various surface colors and shapes make it difficult to detect failures. For change-over of inspected cells, it takes time to set up the next lot for inspection. Moreover, the conventional vision sensor is not fast enough for continuous inspection.

• Solution The FZ2 ‘True-Color’ and the ZFX2 Vision systems have unsurpassed color, contrast combined with resolution capabilities making this a perfect application for this sensor. With pattern matching of the shape and filtered color contrast using this system, defective products can be positively identified. Real-time searching allows inspection in fast production lines and the measured data can be sent via Ethernet to motion control, serial I/F, USB or parallel I/F. Real time communication for quick positioning is therefore possible.

• Benefit Easy setting-up, which saves time, strict quality control with a low-cost solution, and improved throughput with high-speed inspection. Save time and cost during set-up and monitor your yield and productivity at the save time.

FZ2 Color Vision

ZFX2 Color Vision

Common Solutions

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A $7.1 billion, publicly-traded global company.

Founded in 1933, over 75 years of growth.

A worldwide leader in industrial automation and controls.

• Top 5 discrete automation supplier (in the world).

• Rapid new product introductions and technology development.

• Broad sales and distribution in more than 60 countries.

• Continual improvements in operational efficiencies.

• Tailored customer training, product repair, and technical support.

Committed to corporate social responsibility.

Committed to improving customers machines and factories.

Omron at a Glance

PCB Inspection Systems, Sheet Inspection Systems, Solder Paste Printing, Other Inspection Systems, etc.

Inspection Systems

Timers, Counters, Temperature Controllers, Level Controllers, Protective Devices, Power Supplies, Digital Panel Meters, Transmission Units, Wireless Units, Energy-saving Devices, Safety related Devices, etc.

Other Control Devices

Solid-state Relays, I/O Relay Terminals, etc.Relays

Limit Switches, Basic Switches, Manual SwitchesSwitches

Vision Sensors, Image Sensors, RFID, Laser Markers, 2-Dimensional Code Readers, etc.Advanced Sensors

Photoelectric Sensors, Proximity Sensors, Displacement Sensors, Safety Light Curtains, Pressure Sensors, Ultrasound Sensors, Measurement Sensors, etc.

Sensors

AC Drives, etc.

Controllers, Servo Motors, Servo Drives, etc.

Motor Control

Motion Controllers

PLCs, Industrial Networking Equipment, Programmable Terminals, Application software, etc.

Control Equipment

App_Solar_V1 Note: Specifications are subject to change. © 2008 Omron Electronics LLC