Product End-of-Life Disassembly Instructionsh22235. · Styx FA DIS-ASS'Y B SOP Document No.: Styx FA DIS-ASS'Y B SOP Date Content Design A.Current station version list: B.Version

EL-MF877-00 Page 1 Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs

Marketing Name / Model [List multiple models if applicable.] HP EliteBook 2560p Notebook PC Name / Model #2 Name / Model #3 Name / Model #4 Name / Model #5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes

Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm

1

Batteries All types including standard alkaline and lithium coin or button style batteries

2

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

1

Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 0 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

0

External electrical cables and cords 0 Gas Discharge Lamps 0 Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)

0

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

0

Components and waste containing asbestos 0

http://standards.corp.hp.com/elclass/AMF87701.htm�

EL-MF877-00 Page 2 Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing refractory ceramic fibers

0

Components, parts and materials containing radioactive substances

0

2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if

applicable)

Description #1 Cross head of screwdriver

Description #2 TORX T8 (2.31mm)

Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first. 3. Use correct screwdriver and torque value before unlock the screw. 4. 5. 6. 7. 8.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

http://standards.corp.hp.com/elclass/AMF87701.htm�

MANUFACTURING PROCESS INSTRUCTIONSMECHANICAL ASSEMBLY

1.00

Station Version Station Version Station Version Station Version Station Version Station Version

1 1.00 11 1.00 21 1.00 31 1.00

2 1.00 12 1.00 22 1.00

3 1.00 13 1.00 23 1.00

4 1.00 14 1.00 24 1.00

5 1.00 15 1.00 25 1.00

6 1.00 16 1.00 26 1.00

7 1.00 17 1.00 27 1.00

8 1.00 18 1.00 28 1.00

9 1.00 19 1.00 29 1.00

10 1.00 20 1.00 30 1.00

Station Ver.

ALL 1.**2011-3-9 首份SOP制作程秀青

Sub-assembly name: Styx FA DIS-ASS'Y B SOP

Document No.: Styx FA DIS-ASS'Y B SOP

Date Content Design

A.Current station version list:

B.Version Modify list:

闫荣荣 Revision:

Date: 2011-3-9 Page: 1 of 34

Written by:

审核：制表：闫荣荣

MODEL : STYX

Notes : If finding anything uncommon, notice foreman or assistant at once.

Standard Operation ProcedureDocument No. : SOP Styx FA DIS ASS’Y Station :

Name : Ver. : Date :

Holding fixture list (holding fixture standard) Qty Holding fixture list (holding fixture standard) Qty

Tabulator： Issue department：

Step：

Alicia Chien NPI-SE

Disassemble rubber

1. Disassemble rubber*4 away from the four

screw holes.

1(1/1)

1.00 2011/03/09

6054B0947501

6054B0947401

6054B0947901

6054B0947601






Step：

Alicia Chien NPI-SE

Disassemble battery

1. Disassemble battery，push the battery latch

shown in the figure to left side and take out

battery.

2(1/1)

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

1. Disassemble Bottom door，push the Bottom

Door latch to the left side and take out the

bottom door.

Disassemble Bottom door

3(1/1)

SIM card 1

Bottom door

Bottom door lock

1.00 2011/03/09

http://www.iec.inventec/sites/NPI/NPISE/Shared Documents/工具及標準表格/SOP Process.ppt






Step：

Alicia Chien NPI-SE

Disassemble DDR

1. Disassemble DDR * 2 out of M/B according to the following figure.

4(1/1)

DDR

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble ODD and loosen screw

1. Loosen ODD set screw*1

2. Disassemble ODD from base, push it

rightwards as the figure showed.

5(1/1)

Electric cross screw driver 1

ODD

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble cable

1. Pull out Speaker cable CNTR from M/B

2. Pull out Blue Tooth Cable CNTR from M/B，

take Cable away from the hook.

6(1/1)

Blue Tooth Cable

speaker cable

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble Speaker and Bluetooth

1. Loosen screws，disassemble Speaker(6052A0020901) * 1 labeling 1(6052B0103801) * 2 labeling 2,3(figure 1)。

2. Take B/T module out from the groove of Speaker (figure 1)/(figure 2)

3. Take the cable out from BT module

7(1/1)

Figure 2

BT module

speaker

Figure 1


1

2

3

Figure 3

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble HDD from unit

1. Loosen screw* 4

2. Disassemble the HDD and lift upwards off the unit

8(1/1)

HDD

3

4 2

1

1.00 2011/03/09







Step：

Alicia Chien NPI-SE

Disassemble HDD module

1. Disassemble HDD CNTR away from HDD (figure 1/ figure 3)

2. Loosen HDD screw* 4 (figure 4/ figure 5)

3. Disassemble HDD BRKT away from HDD (figure 2)

9(1/1)


HDD Support fixture 1

Screws supplier 1

Figure 3

mylar

Figure 5Figure 4

1

2

3

4

Figure 1

Figure 2

1

24

3

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

1. Loosen screw * 1，disassemble Modem from MB (figure 1)

2. If no Modem, need to disassemble Rubber. (figure 2)

3. Disassemble Modem cable away from Modem module

4. Pull out RJ11 cable from Modem

Disassemble Modem


10(1/1)

Figure 1

Figure 2

1.00 2011/03/09







Step：

Alicia Chien NPI-SE

Disassemble WWAN Card

1. Disassemble WWAN Cable * 2 away from WWAN CNTR。

2. Loosen screw * 2 (figure 1)。3. Disassemble WWAN Card away from M/B.

11(1/1)

Routing stick 1

1.00 2011/03/09

Figure 1






Step：

Alicia Chien NPI-SE

Disassemble WLAN Card

1. Disassemble WLAN Cable * 2 away from WLAN CNTR

2. Loosen screw * 2 (figure 1)

3. Disassemble WLAN Card away from M/B

12(1/1)

Routing stick 1

1.00 2011/03/09

Figure 1






Step：

Alicia Chien NPI-SE

Disassemble Fan

1. Loosen Fan screw *2 (figure 2)2. Disassemble Fan Cable away from M/B

CNTR (figure 1)

13(1/1)

Figure 1

Figure 2

1.00 2011/03/09








Step：

Alicia Chien NPI-SE

Disassemble thermal module

1. Loosen thermal screw * 4（figure 2）2. Disassemble Thermal away from M/B

(figure 1)

14(1/1)

Figure 1

Figure 2

1.00 2011/03/09








Step：

Alicia Chien NPI-SE

Disassemble CPU

1. Loosen CPU socket screw(Going counterclockwise)

2. Take CPU away from socket by suction pen and place it in the kitting box.

15(1/1)

One-line screw driver 1Suction pen 1

Figure 1

Figure 2

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

1. Loosen K/B screw * 3

Loosen K/B screw

16(1/1)

1

2

3

1.00 2011/03/09








Step：

Alicia Chien NPI-SE

Disassemble Keyboard

1. Pull out K/B FFC from MB CNTR (figure 1)2. Pull out Stick Point FFC from M/B CNTR

(figure 2)3. Disassemble Keyboard , hold peak K/B of

from fan gob.(figure 3)

17(1/1)

Figure 1

FFC

Figure 2

Shall K/B peaked

Figure 3

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

1. Disassemble POWER/B FFC, FP module FFC, Function/B FFC.

Disassembly FFC

18(1/1)

1 POWER/B FFC3 Function/B FFC

2 FP module FFC

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Loosen flank hinge screw

1. Loosen flank hinge screw* 4 (figure 1/figure 2)

19(1/1)

Figure 2

Electric plum blossom screw driver 1

Support fixture 1

Figure 1

1

2

4

3

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

1. Loosen BTCB screw *4

20(1/1)

Loosen screw

Electric cross screw driver 1Hinge support fixture 2

1.00 2011/03/09

1 2

3

4






Step：

Alicia Chien NPI-SE

Loosen screw

1. Loosen screw *3

21(1/1)


1 23

1 23

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Loosen BTCB screw


22(1/1)


1

2

3

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Loosen BTCB screw


23(1/1)

Electric plum blossom screw driver 1

3

4

1

5

2

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble BTCB

1. Disassemble BTCB

24(1/1)

Figure 1

Figure 2 Figure 4

Figure 3

CRT portUSB port

3 421

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

1. Disassemble LVDS cable

Disassemble LVDS cable

25(1/1)

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble Antenna

1. Disassemble Antenna from hook.(figure 1)

26(1/1)

Figure 1

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble M/B

1. Loosen screw *1(figure 1)2. Disassemble the FFC of Smart card (figure 2)3. Take out the M/B obliquely (figure 3)

27 (1/1)

Figure 1

Figure 3


Figure 2

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Disassemble Antenna

28(1/1)

1. Disassemble Antenna (figure1)

Figure1

Routing stick 1

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Figure1

Loosen Hinge screw

29(1/1)

1. Loosen Hinge screw *2(figure 1/figure 2)


Figure 2

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

1. Press the Hinge(figure1/figure2)

Disassemble Hinge

30(1/1)

Figure 1 Figure2

1.00 2011/03/09






Step：

Alicia Chien NPI-SE

Separate Display from TPCB

31(1/1)

1. Separate LCM from TPCB(figure 1)2. Disassemble bracket *2(figure 2/figure 3)

須卡入

Figure 1

Figure 3

1.00 2011/03/09

Figure 2



Step：



Tabulator： Issue department：Jing-Wen Yang NPI-SE

Disassemble ESD/B

1. Disassemble electric conductivity fabric * 2(Figure 1 / Figure 2).

2. Disassemble ESD/B * 2 (Figure 3)

3. Disassemble FFC (Figure 4)

Figure4

Figure 1

Figure 2

Figure 3

1 (1/1)1.00 2011/03/28



Step：




Disassemble Smart card

1. Disassemble tape *1 (Figure1)2. Disassemble Smart card FFC (Figure 2)3. Disassemble touch pad FPC (Figure 2)

Figure 1

Figure 2

2 (1/1)1.00 2011/03/28



Step：




Disassemble Smart card

1. Loosen screw * 1 (Figure 1)

2. Disassemble Smart card (Figure 2)

Figure 1

Figure 2


3 (1/1)1.00 2011/03/28



Step：




Disassemble FP Module

1. Disassemble tape * 1 (Figure 1).2. Loosen screw * 1 , disassemble FP BRKT

(Figure 1)3. Disassemble FP module (Figure 2 /Figure 3)

FP module


Figure 1

Figure 2

Figure 3

4 (1/1)1.00 2011/03/28



Step：




1. Loosen screw * 2 (Figure 1, 2 ).

2. Loosen screw * 1 (Figure 3).

Loosen screw

Figure 1

Figure 2 Figure 3


5 (1/1)1.00 2011/03/28



Step：




1. Disassemble Power Board (Figure 1).2. Disassemble Function/B (Figure 2).3. Disassemble arm (Figure 3).

Disassemble Power/B, Function/B,ARM

Power/B

Function/B

arm

Figure 1

Figure 2 Figure 3

6 (1/1)1.00 2011/03/28



Step：




Disassemble Touch pad

1. Loosen screw * 1 (Figure 1) , disassembleTouch pad module.

7 (1/1)1.00 2011/03/28


Figure 1