Product End-of-Life Disassembly Instructionsh22235. · Document No. : Bigben disassemble SOP Station : Operation name : Ver. : Edit date: Fixture list Q’ty Step ： Caution︰If

EL-MF877-00 Page 1 Template Revision C

Last revalidation date 04-01-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions Product Category: Personal Computers

Marketing Name / Model [List multiple models if applicable.]

HP Pavilion 24 All-in-One PC ENERGY STAR

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes

Quantity of items included in product

Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)

With a surface greater than 10 sq cm M/B

6

Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button style batteries

4 (AAA batteries for K/B, mouse)

Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all that apply with an “x” inside the “[ ]”): [ ] screws [X] snaps [ ] adhesive [ ] other. Explain NOTE: Add detailed removal procedures including required tools in the sections 3.1/3.2.

1 ( RTC battery)

Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm

Includes background illuminated displays with gas discharge lamps

1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height

0

External electrical cables and cords DC Cable for External Power Supply 1

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs

Excluding B&S parts (EPS) 0

http://standards.int.hp.com/elclass/AMF87701.htm

mailto:Sustainability%20and%20Compliance%20Center%20%[email protected]%3e




Item Description Notes

Quantity of items included in product

already listed as a separate item above)

Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent chambers, and service stations.

0

Components and waste containing asbestos 0

Components, parts and materials containing refractory ceramic fibers

0

Components, parts and materials containing radioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Electric screwdriver (Cross) #1

Electric screwdriver (Trox)

Plastic stick

Wiring rod

Locking support fixture

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:

1. Follow steps described in Disassembly instruction (file attached) 2. If parts can be removed without using a tool, remove it first 3. Use correct screwdriver and torque value before unlock the screw 4. 5. 6. 7.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).






MANUFACTURING PROCESS INSTRUCTIONS

MECHANICAL DISASSEMBLYMODEL : Bigben

制表：朱亚审核：赵承阳

0.10

Station VersionStation VersionStation VersionStation VersionStation VersionStation Version

1 0.10 9 0.10 17 0.10

2 0.10 10 0.10 18 0.10

3 0.10 11 0.10 19 0.10

4 0.10 12 0.10 20 0.10

5 0.10 13 0.10 21 0.10

6 0.10 14 0.10

7 0.10 15 0.10

8 0.10 16 0.10

Station Ver.

ALL 0.10The first SOP Production Cai.mei-guo2020/1/10

2020/1/10

Design

1 of 28Page:

ContentDate

Sub-assembly name: Bigben disassemble SOP

Document No.: Bigben disassemble SOP

A.Current station version list:

B.Version Modify list:

Written by: Yi.Qiu-ling Revision:

Date:

Standard operation procedureDocument No. : Bigben disassemble SOP Station :

Operation name : Ver. : Edit date :

Fixture list Q’ty

Step：

Caution︰If there is any issue, please inform the assistant immediately

Edit: Department:Zhuya IE

Symbol identifies

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1(1/1)

1. Put the system in the disassemble tool,

remove foot pad*6

2.Remove label。(Picture1 and picture 2)

Remove master label

3.Uncrew *9 ( (STAND BASE TO Srtand

TOP COVER & Arm)

unscrew

Torsion：9.0 ± 0.5 kgf.cm

Remove foot pad/ label /unscrew 0.10 2020/1/10

Picture 1

Load tool 1

Picture 2



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2(1/1)

1.Disassemble stand base

2.Take out wireless charger connector

3.Unscrew the stand top, take out stand cover

Torsion：2.5± 0.5 kgf.cm。

Disassemble stand 0.10 2020/1/10

圖一

Screw M2*4

圖二

Load fixture 1

Electric screw driver (S-6000MS ) 1

http://www.iec.inventec/sites/NPI/NPISE/Shared Documents/工具及標準表格/SOP Process.ppt



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Wireless Charger/B

3(1/1)

1.Unscrew for LED/B，As red circle

identified

Screw P/N：6052B0207001(M2*2)

Torsion：2.0 ± 0.5 kgf.cm。2.Take out LED cable

3.Remove wireless charger

Disassemble wireless Charger Board 0.10 2020/1/10

圖一

圖二

Load fixture 1


https://www.bing.com/dict/search?q=As&FORM=BDVSP6&mkt=zh-cn

https://www.bing.com/dict/search?q=red&FORM=BDVSP6&mkt=zh-cn

https://www.bing.com/dict/search?q=circle&FORM=BDVSP6&mkt=zh-cn

https://www.bing.com/dict/search?q=identified&FORM=BDVSP6&mkt=zh-cn




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4(1/1)

Disassemble speaker cover & cable 0.10 2020/1/10

Load fixture 1

1. Move speaker cover

2. Remove the MB cable

Picture 1

Picture 3

Picture 2

DO NOT PULL TAB




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5(1/1)

1.unscrew*3

Screw P/N：6052B0257201(M3X6)

Torsion：4.5 ± 0.5 kgf.cm。

2.Remove panel , (Picture 2)

Disassemble the panel’s screw 0.10 2020/1/10

Picture 1

Picture 2

Load fixture 1





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6(1/1)

1.Take out Dongle and cable

2. Unscrew for the speaker (SPEAKER to REAR

COVER)

Screw P/N：6052B0544601


3.Take out speaker

Take out Speaker and Dongle rubber 0.10 2020/1/10

Load fixture 1

Remove

rubber

Picture 1

Picture 2

Picture 3




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7(1/2)

0.10 2020/1/10Disassemble Scalar board (only)

1.If with scalar board , then remove scalar sharding

Screw P/N： 6052B0302601 (M2x3)


2.Take out sharding

3.Remove scalar board cable

4.Remove scalar board


圖一

圖三

Scalar

cable

圖二

Load fixture 1





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7(2/2)

0.10 2020/1/10Disassemble Scalar board (only)

1.Remove aluminum sheet 55*51.3*1t

(6043B0285701)，unscrew*2。(Picture 2)

Screw P/N： 6052B0302601 (M2x3)


Screw*2

(M2x3)

Picture 2

Picture1

Load fixture 1





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8(1/1)

0.10 2020/1/10Disassemble B-CAS/B & TV board

Only TV SKU

1.Remove TV board and MB FFC

2.Take out TV Card (6042B0588501 Pixela)

Screw P/N： 6052B0302601 (M2x3.5)


3.Move B-CAS Board (24/27) (1310A3138501) ，Torsion：2.0 ± 0.5 kgf.cm。picture 3

4.MOVE Receiver PCB ，Picture 4Picture 1

拆B-CAE

FFC

Picture 3

Picture 2

Picture 4

Load fixture 1

Electric screw driver (S-6000MS) 1





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9(1/1)

1.Unscrew for Shielding DOWN

2.4 types shielding

Torsion：2.5 ± 0.5 kgf.cm

Disassemble Shielding Down 0.10 2020/1/10

QHD-TV/FHD module (6053B1759501)

UHD-Non-TV module (6053B1759701)

AMD module (6053B1759901)

QHD-NON-TV/FHD module (6053B1759601)

Load fixture 1






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10(1/2)

1. Move Antenna Cable

2.Unscrew for WLAN & SSD*2

Screw P/N： 6052B0302601(M2X3)


3.Take out DDR

Move SSD/WLAN/ Antenna cable /DDR 0.10 2020/1/10

WLAN

SSD

Picture 1

Pictue 2 Picture 3

Load fixture 1






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10(2/2)

1.Move HDD

2.Move HDD rubber

Disassemble HDD 0.10 2020/1/10

圖一

圖二



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11(1/2)

1.MOVE FFC

2.Disassemble power rubber

3.unscrew

4.Take out power board


Disassemble power board 0.10 2020/1/10

圖一

表一

圖二

Move rubber firstly

FFC

Load fixture 1






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11(2/2)

1. Move USB Board FFC and IO cable

2. Unscrew for USB Board

Torsion： 2.5 ± 0.5 kgf.cm。3. Take out USB board

4.Unscrew OSD board ，move OSD FFC

Disassemble USB board 0.10 2020/1/10

Picture 1

Picture 2

Picture 3

IO cable

USB FFC

Picture 4OSD FFC

Load fixture 1






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12(1/1)

1.Unscrew for thermall，then take out thermal


2.Thermal with DIS& UMA

Disassemble thermal 0.10 2020/1/10

Load fixture 1Electric screw driver (S-6000MS) 1





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13(1/1)

1.Unscrew for FAN。(FAN to REAR COVER)

Screw P/N：6052B0226601(M3X6+3)


2. Take out fan, and move cable

Disassemble FAN 0.10 2020/1/10

Load fixture 1






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14(1/1)

1. While the system with GPU board

2. Unscrew for GPU board

Screw PN：6052B0302601 (M2X3)

Torsion： 1.5 ± 0.5 kgf.cm

3.Take out GPU board

Unscrew for GPU board 0.10 2020/1/10

GPU BOARD (N17) Picture 1

GPU BOARD (N18) Picture 2

Load fixture 1






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15(1/3)

1.Move wireless charger cable (picture 1)

2.Move conductive fabric ,picture 5

3.Move Webcam & Mic Module Cable (Picture 2)

4.Unscrew for MB*4

Screw P/N：6152A0009203(M3X4)


Unscrew for MB and take out

camera cable

0.10 2020/1/10

Load fixture 1

Picture 2

Picture 3 Picture 1

27” Intel/AMD

Picture 4 Picture 5




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15(2/3)

1.Take out MB

Take out MB 0.10 2020/1/10

AMD_FHD (24/27) AMD_FHD (24/27)



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15(3/3)

Disassemble MB 0.10 2020/1/10

Intel_UHD (24/27) Intel_UHD (24/27)

Intel_QHD (24/27) Intel_QHD (24/27)

Intel_FHD (24/27) Intel_FHD (24/27)



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16(1/1)

1.Unscrew for MB Shielding-A, (Picture 1）

2.Unscrew for stand arm。(Picture 2)

Screw P/N：6052B0297301(M4X8)

Torsion ：4.5 ± 0.5 kgf.cm。2.Take out wireless charger cable and stand arm

Disassemble Stand arm 0.10 2020/1/10

Load fixture 1

Picture 1

圖二

Picture 3

Screw*4 (M4*8)


Picture 2





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17(1/2)

1. Unscrew*4。(F CNTR BRACKET TO MB

SHIELDING)

Screw P/N：6052B0207001(M2X2)

Torsion：2.0 ± 0.5 kgf.cm。2.Take out SIM

Disassemble SIM (QHD TV SKU Only) 0.10 2020/1/10

圖一

圖二TV PCB

Screw*4 (M2x2)



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17(2/2)

1. Unscrew *13(MB SHIELDING TO REAR cover)

Screw P/N：6152A0009203 (M3X4)


Take out MB SHIELDING

Disassemble MB Shielding 0.10 2020/1/10

Support jig 1

13

121110

9

8

7

6

5

4

3

2

1






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18(1/1)

1.Take out antenna

2.Disassemble camera housing

Remove camera module

Unscrew

Screw P/N：6052B0466901(M2.5X2)


Disassemble antenna and camera

housing0.10 2020/1/10

Load tool 1




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webcam cable

Picture 3

19(1/1)

1. Take out FFC

2. And remove camera

3. Take out MIC

Disassemble MIC board and Webcam 0.10 2020/1/10

Picture 1

Picture 2Picture 4



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20(1/1)

1. Remove conductive fabric/ cable

2.Disassemble LVDS/Control

board/Backlight/Touch cable if the system

have

Remove conductive fabric/ cable 0.10 2020/1/10

Load fixture 1

LVDS FFC

Backlight cable

Control cableControl/B

LVDS cable

Backlight cable




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21(1/1)

1.Put the frame & panel in the deboding

tool (40min with 80 degree)

2.Then remove frame

Debonding 0.10 2020/1/10

Debonding tool 1

Load fixture 1

Picture 1

Picture 2
