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Proceedings
International Microelectronics And Packaging Society
2002 International Symposium on Microelectronics
Table of Contents
Session WA1
High Density Substrates & Boards
Chairs:
Rajen Chanchani, Sandia NationalLaboratories
Andrew Strandjord, IC Interconnect
001 The Processing andAssembly ofLiquid CrystallinePolymerPrinted Circuits
Tan Zhang, R. Wayne Johnson, Auburn University; Brian
Farrell, Foster Miller, Inc.; Michael St. Lawrence, RogersCorporation
010 High-Performance Flip-Chip BGA based on Multi-
Layer Thin-Fikn Packaging TechnologyTadanori Shimoto, Katsumi Kikuchi, Hirokazu Honda,
Keiichiro Kata, Kazuhiro Baba, Koji Matsui, NEC
Corporation
016 ANew Stacked-ViaFormation TechnologyforHigh-
DensityBuild-Up PackagesTomoyuki Abe, Nobuyuki Hayashi, Motoaki Tani,Yasuhiro Yoneda, Fujitsu Laboratories Ltd.
021 Wire Bonding Study of Gold Conductors for LTCC
ApplicationsCristina Lopez, Liang Chai, Aziz Shaikh, Vern Stygar,Ferro Electronic Material Systems
027 Packaging Technology for High Performance UNIX
Server
Masateru Koide, Jie Wei, Akihiko Fujisaki, Yoshinori
Uzuka, Masahiro Suzuki, Fujitsu Limited
033 PAMAMOS Copper Nanocomposite Coatings for the
Fabrication ofPrinted Wiring BoardsDavid A. Dalman, Dendritech, Inc.; Petar R. Dvorak,
Michigan Molecular Institute; M. Frederick Hoover,Hoover Technologies; Tony Lentz, Florida CirTech, Inc.
039 Cardo Polymer Based Photo Imageable DielectricMasahiko Takeuchi, Shinji Inaba, Hironobu Kawasato,Kazuhiko Mizuuchi, Takero Teramoto, Nippon Steel
Chemical Co., Ltd.
Session WA2
LTCC Manufacturing IssuesChairs:
Ken Kuang, Kyocera America, Inc.
Aziz Shaikh, Ferro Electronic Materials
045 ColdLow Pressure Lamination of LTCC's
Andreas Roosen, University of Erlangen - Nuremberg
051 FinelJneLTCC-StmcturesbyDkectGravmePrmting(DGP) Method
Juha Hagberg, Marko Kittila, Eino Jakku, Seppo
Leppavuori, University of Oulu
057 Evaluation ofNew CaRu0} Thick FilmResistor
Formulations CompatiblewithLTCC Co-FiringRandy Klein, W. Kinzy Jones, Florida International
University
061 Characterization of Unrestrained Zero ShrinkLTCC
Material System forVolume Production of RF LTCC
Modules
Michael Ehlert, Barbie Spenser, National Semiconductor
Corporatoin; Frans Lautzenhisei, Edmar Amaya, Heraeus
Inc. CMD
065 CompliantDielectric andMagneticMaterials forBuried
ComponentsA. H. Feingold, M. Heinz, R. L.Wahlers, Electro-Science
Laboratories
071 Optical Dilatometer forInsituMeasurements of
Warpage Effects during Firing of LTCC MultilayerStructures
Matthias Wagner, Andreas Roosen, Alfons Stiegdschmitt,
University of Erlangen - Nuremberg; Dieter Schwanke,Micro Systems Engineering; Franz Bechtold, VIA
Electronic GmbH
076 LowProfile LTCCTransformers
R. L. Wahlers, C. Y. D. Huang, M. R. Heinz, A. H.
Feingold, Electro Science Laboratories; John Bielawski,
George Slama, Midcom, Inc.
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2002 International Symposium on Microelectronics
Table of Contents
Session WA3
MEMS & MEMS ApplicationsChairs:
David Galipeau, South Dakota StateUniversity
Janet Lumpp, University of Kentucky
081 Design byAnalysis ofa MEMS Pressure Sensor
Ryszard J. Pryputniewicz, Cosme Furlong, Worcester
Polytechnic Institute; Emily J. Pryputniewicz, Institute of
DefenseAnalyses
087 MechanicallyFixed and ThermallyIsolated
MicromechanicalStructures for GaAsHeterostructure
Based MEMSDevices
T. Lalinsky, S. Hascik, Z. Mozolova, E. Burian, M. Krnac,
I. Kostic, L Matay, Slovak Academy of Sciences; M.
Tomaska, J. Skriniatova, Slovak University of Technology;M. Drzik, International Laser Center
093 Laser-Assisted Selective BondingforWafer-Level &
Chip-ScaleVacuumPackaging of MEMS and Related
Micro SystemsYi Tao, Ajay P. Malshe, W. D. Brown, University of
Arkansas
099 ReliabilityTestingof Flexible Circuit-Based RFMEMS
Switches
Simone Lee, Ramesh Ramadoss, Victor Bright, K.C.
Gupta, Y.C. Lee, University of Colorado
105 One Packaging Technique of Exposed MEMS Sensors
Tim (Zhigang) Lin, Rick Yoon, IJ Research, Inc.
109 Strategies for Successfully Integrating MEMS Die onto
Laminate
Robert Dean, R. Wayne Johnson, Holly Garrison, Nicole
Schutz, Auburn University; Mike Kranz, Morgan Research
Corporation; Ron Legowik, U.S. Army Aviation & Missile
Command; Bill Bowers, Bill Payne, IITRI
Session WA4
Area Array Interconnects
Chairs;
Roupen Keusseyan, DuPontMicrocircuit Materials
Leonard Schaper, University ofArkansas
115 Design and Characterization ofa 10GHz OrganicBGA PackageRichard Lynn, Maxtek Components Corporation
123 Qualification ofPlasticBall Grid Array Packages for
Space ApplicationsThomas Estes, Yoshio Saito, TRW Space and Electronics
129 A Study ofSolderJoint Reliability ofTFBGA
Assemblies with Fresh and Reworked Solder Balls
Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung,Advanced Semiconductor Engineering, Inc.
139 LongTime Reliability ofFlip Chip Interconnections
on Flexible Substrates
Barbara Pahl, Christine Kallmayer, Technical Universityof Berlin; Rolf Aschenbrenner, Herbert Reichl,
Fraunhofer institute of Reliability and MicrointegrationIZM Berlin
145 Placement andReflow ofSolder Balls for FC, BGA,
Wafer-Level-CSP, Optoelectronic Components and
MEMS by using a new SolderJetting MethodThomas Oppert, L. Titerle, E. Zakel, Pac Tech-PackagingTechnologies GmbH; G. Azdasht, Smart Pac GmbH; T.
Teutsch, Pac Tech-Packaging Technologies USA, Inc.
151 Measurements and Simulation of SMT ComponentsRyszard J. Pryputniewicz, Cosme Furlong, Worcester
Polytechnic Institute; David Rosato, Harvard Thermal,
Inc.
157 SMT: Modeling and Uncertainty Analysis of aJ-LeadAttachment
Ryszard J. Pryputniewicz, Cosme Furlong, Worcester
Polytechnic Institute; Dariusz R. Pryputniewicz, Draper
Laboratory
Session WAS
System PackagingChairs:
Christian M Val, 3DPlus
Timothy Lenihan, Consultant
163 System-in-Package (SiP) Design for Higher IntegrationNozad Karim, Amkor Technology Inc.; Tarda Van Bever,Alcatel Microelectronics
169 WaferLevelBatch Transfer Process of RF MEMS
PassiveDeviceusing PDMS
Sang Won Park, Kabseog Kim,Jeong-Bong Lee, The
University of Texas at Dallas; Wendell Alan Davis, The
University of Texas at Arlington
175 High-Density PackagingforWrist-Wearable MedicalDevices
Etienne Hirt, Michael Scheffler, Art of Technology
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181 Very High Speed 3D "System in Package"Christian Val, Marie-Cecile Vassal, Olivier Lignier, Michel
Mardiguian, 3DPlus
188 System-on-Package (SOP): Next Generation Conver¬
gentMicrominiaturized Microsystems Solution
Rodolfo L. Gacusan, Intel Technology Philippines, Inc.
194 Modular Systems for Sensor IntegrationMatthias Klein, Hermann Oppermann, Rolf
Aschenbrenner, Herbert Reichl, Fraunhofer IZM - Berlin
Session WP1
Recent Developments in Wafer Level CSPs
Chairs;
Curtis Zwenget,Amkor TechnologyLi Wetz, Motorola SPS
199 Development of an Low CostWafer Level Flip Chip
Assembly Process for High Brightness LEDs usingthe AuSn MetallurgyGordon Elger, RafaelJordan, Maria v. Suchodoletz,Hermann Oppermann, Fraunhofer Institute fox Reliabilityand Microintegration
205 Materials for 300 mm Wafer Level PackagingTechnolo¬
giesMichael Toepper, Christina Lopper, Veronika Glaw, Karin
Samulewics, Lothar Dietrich, Herbert Reichl, Fraunhofer-
IZM and Technical University of Berlin; Albert Achen;The Dow Chemical Company
211 Designand Reliability ofa NewWL-CSPLi Wetz, Beth Keser, Jerry White, Motorola SPS
216 SolderJoint Reliability of Wafer Scale CSP PackagesJoe Smetana, Alcatel USA; Bob Sullivan, HDP User
Group International, Inc.
223 Experimental and Analytical Study on Large Passiva¬
tion Opening to Improve SolderJoint Reliability formicro SMD PackagesVivek Arora, Li Zhang, Luu Nguyen, Nikhil Kelkar,National Semiconductor Corporation
229 NewCostEffective andLow ProfileWaferLevel CSP
Masamitsu Ikumo, Hirohisa Matsuki, Yositaka Aiba,
Tetsuya Fujisawa, Mitsutaka Sato, Fujitsu Limited; Mario
Aguirre, Fujitsu Microelectronics America Inc.
Session WP2
Packaging Materials
Chairs;
HerbertJ. Neuhaus,NanoPierceConnection Systems, Inc.
Michael E. Wernle,NanoPierce Card Technologies, GmbH
234 NewMaterials forHigh Performance No-Flow
Underfill
Kathleen M. B. Gross, Steve Hackett, Donald G. Larkey,William J. Schultz, Wendy Thompson, 3M
239 Effects ofFlexibilizers on the Properties ofLiquidMicroelectronic EncapsulationMaterials
Shaoqin Gong, Michael Todd, Henkel Loctite
245 Thermal Characterization of High TemperatureReflow Compatible Epoxy Molding Compound used
inLead-FreePackagingDennis Prem Kumar Chandran, C. K. Chee, Y. He, T.
Sterret, H. P. Sow, A. V. Rudge, A. S. Abdullah, Intel
Technology (M) Sdn Bhd
251 Investigation ofElectroplated Ni and Ni-Cu AlloyUBM (Under bump Metallurgy) with Lead-Free
Solders for Flip Chip PackagesSu-Hyeon Kim, Jong Yeon Kim, Jin Yu, KAIST
256 Development ofSingle Pass Reflow Encapsulant for
Lead Free Solder BumpLin Xin, Rich Kraszewski, Jin Liu, Jennifer Allen, Seach
Hwee Goh, Chad Showalter, Linda Wong, Kester-
Northrop Grumman
261 Phase Transformation and Residual Stress Evolution
in Electroless Ni-P UBM used in Low Cost Flip Chip
TechnologyJ. Y. Song,Jin Yu, KAIST
Session WP3
RF Design and Measurements & Wireless
ApplicationsChairs:
F. D. Barlow,University of Arkansas
John Gipprich, Northrop-Grumman
267 RF MEMS: Modeling and Simulation ofSwitch
DynamicsRyszard J. Pryputniewicz, Cosme Furlong, Worcester
Polytechnic Institute; Patrick W Wilkerson, Andrzej J.Prekwas, CFD Research Corporation
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2002 International Symposium on Microelectronics
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273 LMDS Applications and RF Radio Links go for SMD
Based Module Technology- Reality, Experience and
FutureTrends
Martin Oppermann, EADS Deutschiand GmbH
279 The RF Impact of Coupled ComponentTolerancesand Gridded Ground Planes inLTCC Technology and
theirDesign Countermeasures
George Passiopoubs, Kevin Lamactaft, Nokia Networks
285 Micro-waveModule Designwith HeraLock HL2000
LTCC
Frans Lautzenhiser, Edmar Amaya, Peter Barnwell, JimWood, Heraeus CMD
292 TheNew Thick-FilmFrequencyElectronic Ballasts for
LowPowerDischargeLamps
Janusz J. Gondek, Private Institute of Electronic
Engineering; St. Kordowiak, W. Mysinski, Cracow
University of Technology; B. Kawa, J. Kocol, Technical
School of Communications; P. Gebik, P.P.UH "GECO"
Ltd.; P. Szatynski, Cracow Electronics Works "TELPOD"
295 Embedded Passives andT/R Module for Millimeter-
WaveFabricated by the PhotoimageableThick Film
Process
Seong-Dae Park, Young-Shin Lee, Chan-Sei Yoo, Erick
Kim, Jong-Chul Park, Korea Electronics TechnologyInstitute
318 Development ofa Reworkable Film inHigh Perfor¬
mance Thermal Management ApplicationsAndrew P. Collins, Chih-Min Cheng, Emerson & Cuming
324 Heat Transport Performance of Micro Heat Pipe withCross Section ofPolygonGunn Hwang, Seok Hwan Moon, Chi Hoon Jun, YounTae Kim, ETRI
330 Heat SinkDesign Optimization for OpticalTranspon¬ders
Z. F. Shi, Albert C. W. Lu, Y. M. Tan, K. H. Ang,
Singapore Institute of Manufacturing Technology; RonsonTan, Eric Tan, E20 Communications Pte Ltd.
Session THAI
3D and High Performance Packaging in Japan
(Japanese Translated Session)Chaiis:
Yuzo Shimada, NEC CorporationCharles E. Bauer,TechLead Corporation
336 High Density Packaging TechnologyResearch &
Development Roadmap inJapanManabu Bonkohara, ASET-Association of Super-Advanced Electronics Technologies
342
348
354
360
Session WP4
Thermal ManagementChairs:
Ajay P. Malshe,University of ArkansasMatt Gordon, University ofArkansas
300 Thermal Modelingand Measurement ofLarge HighPower SiliconDevices with Asymmetric Power
Distribution
Jeffrey Deeney, Hewlett Packard Company
306 Thermally Enhanced PBGA: Package Characterization,
Thermal Performance and Reliability at High Tempera¬tures (Pb-free)Swaminath Prasad, Flynn Carson, Bret Zahn, T. K. Lee,H. T. Lee, ChipPAC Incorporated
313 Packaging and ThermalManagement for kW/cm2MicrowaveAmplifiersTim (Zhigang) Iin, Rick Yoon, IT Research, Inc.
High-Density System-On-Film (SOF) using Two-
Metal LayerTapeYasuhisa Yamaji, Takehiro Suzuki, Yasuhiko Tanaka,Nakae Nakamura, Kenji Toyosawa, Yasunori Chikawa,
Sharp Corporation
Investigation of Fundamental Technology for 3D
AssemblyKei Murayama, Mitsutoshi Higashi, Mitsuharu Shimizu,Shinko Electric Industries Co., LTD.
Ultra-high-densityInterconnection Technologyof 3-
dimensional PackagingKenji Takahashi, Mitsuo Umemoto, Kazumasa Tanida,
Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago,Manabu Bonkohara, ASET-Association of Super-Advanced Electronics Technologies
Therrnosonic Flip Chip Bonding for Low Cost
PackagingTaizo Tomioka, Tomohiro Iguchi, Ikuo Mori, MasayukiSaito, Toshiba Corporation
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2002 International Symposium on Microelectronics
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366 Ultra-Thin & High-Density Packaging usingbothSides Flip Chip TechnologyKazuto Nishida, Kazumichi Shimizu, Michiro Yoshino,
Yoshihiko Yagi, Kazuhiro Uji, Matsushita Electric
Industrial Co., Ltd.; Hideo Koguchi, Chie Sasaki, NagaokaUniversity of Technology
Session THA2
RF and Microwaves Components Realization
Chairs:
A. Elshabini, University ofArkansas
DanielAmey, Dupont Microcircuit Materials
372 Mechanical and Electrical Design ofaNovel RFMEMS Switch forCryogenic ApplicationsH. Zhang, Victor M. Bright, Y. C. Lee, K. C. Gupta,University of Colorado at Boulder
377 A FrequencyTunable Half-Wave Resonator using a
MEMSVariable CapacitorPatrick Bell, Nils Hoivik, Victor Bright, Zoya Popovic,University of Colorado at Boulder
383 Accurate Prediction ofMicrostrip Impedance and
Attenuation atMillimeter-Wave FrequenciesDidier Cottet,Janusz Grzyb, Gerhard Troester, ETHZurich
389 An Investigation ofthe Properties of New-DevelopedLTCCMaterials fortheir use inMicrowave Circuit
Kazunari Watanabe, Kastutoshi Nakayama, Hiroshi Usui,
Asahi Glass Co., Ltd.
394 Multi-LayerThick-Film Microwave Components andMeasurements
Zhengrong Tian, Middlesex University; Charles Free,Colin Aitchison, University of Surrey; Peter Barnwell,
James Wood, Heraeus Circuit Materials Division
400 A High Performance 5.8 GHz PowerAmplifier DesignEnabled by aNewMicrowave PowerPackageSteven C. Evangelista, John W Roman, SatCon Electron¬
ics
Session THA3
Power Packaging TechnologiesChairs:
Douglas C. Hopkins, University atBuffalo
DaveKellerman, Material Solutions
404 Packagingand AIPMY. J. Chen, J. Mookkeen, V. Temple, Silicon Power
Corporation
408 A High Performance Polymer Thin Film Power
Electronics PackagingTechnologyRay Fillion, Eladio Delgado, Paul McConnelee, Richard
Beaupre, GE Global Research Center
415 High Density Thermal Vias in LowTemperatureCofireCeramic (LTCC)Ravindra Kandukuri, Yanquing Iiu, Marc Zampino, W.
Kinzy Jones, Florida International University
421 New LowCost Surge Resistive Inks
Michail Moroz, Aziz Shaikh, Ferro Electronic Material
Systems
427 Measurement and Effects ofHigh Electrical Current
Stress in SolderJointsHua Ye, Douglas C. Hopkins, Cemal Basaran, Universityat Buffalo, SUNY
Session THA4
Sensors PackagingChairs:
David Galipeau, South Dakota State UniversityRichard Gehman, Honeywell, Inc.
433 AStudy ofFactors Affecting Characteristics ofThick
Film NTCThermistors
David J. Nabatian, KOARTAN Microelectronic Intercon¬
nect Materials
437 An Evaluation ofMaterials and Processes Employedin the Construction ofNovel Thick Film Force
Sensors
Yulan Zheng, John Atkinson, Zhige Zhang, University of
Southampton; Russ Sion, C-Cubed Limited
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2002 International Symposium on Microelectronics
Table of Contents
441 Investigations ofThick-Film Resistors on different
Substrates forStrain-GaugeApplicationsDaiko Belavic, HIPOT; Matko Hrovat, Andreja Bencan,
Jozef Stefan Institute; Walter Smetana, Heinz Homolka,
Roland Reicher, Vienna University of Technology; Leszek
Golonka, Andrzej Dziedzic, Jaroslaw Kita, Wroclaw
University of Technology
447 Fluxless High-Vacuum Packaging of MEMS and IR
Sensors
CoryJenkins, SST International
453 ANovel Flex CircuitArea-Array Interconnect System
fora Catheter-BasedUltrasoundTransducer
Jeff Strole, Scott Corbett, MicroConnex, Inc.; Warren
Lee, Edward Light, Stephen Smith, Duke University
459 The Package and Thermal Management ofan Infrared
(ER) Sensor
Tim (Zhigang) Lin, Rick Yoon, IJ Research, Inc.
Session THA5
Advanced Interconnect and Wire BondingChair:
Lee Levine,Process Solutions Consulting
464 Anisotropically ConductiveAdhesive for Flip Chip on
PaperAssemblyJad S. Rasul, William Olson, Motorola Inc.
470 Comparison of 60-kHz and 100-kHz Wirebondingon Organic and InorganicSubstratesH. K. Charles, Jr., K.J. Mach, S.J. Lehtonen, A. S.
Francomacaro, J. S. DeBoy, R. L. Edwards, The JohnsHopkins University/APL
478 Elevated Temperature FailureMechanismsin Au-Al
Ball Bonds
Narendra Noolu, John Lippold, The Ohio State Univer¬
sity; Mark Klossner, Kulicke & Soffa Industries; Kevin
Ely, Edison Welding Institute; William Baeslack,Renssealex Polytechnic Institute
484 ProvidingProcess Solutions forTechnologicalChallenges in Hybrid ApplicationsIvy Wei Qin, Guy Rack, Kulicke and Soffa
490 TiN Coating -A Solution for High TemperatureInterconnects
Hee Yeon Ryu, R. A. Saravanan, Rishi Raj, University ofColorado at Boulder
494 Laser Processing ofFlexible Substrates
Peter Gordon, Richard Berenyi, Budapest University of
Technology and Economics
500 Potential of Flip Chip Technologies for Chip Stacking
ApplicationsHolger Woexner, Infineon Technologies AG
Session THP1
Automotive Electronics
Chair:
D. H.R.Sarma, Delphi
506 A Micromachined Gas Sensor Array for Automotive
Emissions
Jason D. Sternhagen, Kraig D. Mitzner, EricJ. Berkenpas,
Wade Kempf, David W Galipeau, South Dakota State
University
512 An Evaluation of Materials for the Environmental
Protection ofAutomotive Sensors
K. L. Pearce, E. M. Walker, J. Luo, R. A. Schultz,
Emerson & Cuming
518 Packaging Technologies for AutomotiveElectronics in
theLead-free Era
Hans Danielesson, MIKROELEKTRONIKKONSULT
AB
524 Reliability ofSmall BGAs in the Automotive
Environment
Jeffrey C. Suhling, R. Wayne Johnson, John L. Evans,
Nokibul Islam, Jing Liu, Shyam Gale, Auburn University;
James R. Thompson, DaimlerChrysler - Huntsville
Electronics
533 AMB Ceramic Substrates,A Conventional Alternative
to Unconventional Thermal RequirementsKeith Easier, Kyocera America Inc.
Session THP2
Thick Film I
Chair:
Richard Sigliano,Kyocera America,Inc.
538 Silicon Carbon-Nitride Ceramics - AHigh TemperatureSemiconductor Material for MEMS ApplicationsR. A. Saravanan, Li-Anne Dew, Victor M. Bright, Rishi
Raj, University of Colorado at Boulder
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2002 International Symposium on Microelectronics
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543 NewLead-Free Thick Film Resistors
J. Hormadaly, Ben-Gurrion University of the Negev
548 MCM- D/C Based on Cu/ BCB Thin Film and LTCC:
Lessons Learned
Fred Barlow, Michael Glover, Jeff Mincy, Errol Porter,
Len Schaper, Aicha Elshabini, University of Arkansas
554 Thick-Film PrintablePolymer InsulatorPaste:
Development, Testing and Results
K. I. Arshak, D. P. Egan, University of Limerick
560 Structural Optimization for Ultra Fine Pad Pitch LDI
Devices
Jin-Hyuk Lee, Sa Yoon Kang, Dae-Woo Son, Kwan-Jai
Lee, Se-Yong Oh, Samsung Electronics
566 AdvancedThickFilm System forAIN Substrates
Y. L. Wang, A. F. Carroll, J. D. Smith, Y. Cho, R. J. Bacher,
D. K. Anderson,J. C. Crumpton, C. R. S. Needes, DuPont
Microcircuit Materials
571 Mixed-Metal, LowLoss Green Tape Systems for
Military, Automotive and Wireless ApplicationsDaniel I. Amey, Michael A. Smith, Kenneth E. Souders,
Timothy P. Mobley, Christopher R. S. Needes, DuPont
Microcircuit Materials
Session THP3
Passive Integration in PWB, Thin Film and On
Chip TechnologiesChairs:
Robert Heistand II, AVX CorporationRichard Charbonneau, StorageTek
577 Embedded Passives Technology for PCBs: Materials,
Design, and Process
Jiming Zhou, John D, Myers, Delphi Delco Electronics
Systems; John J. Felten, DuPont i-Technologies
583 CompositeDielectric Laminate forIntegrated Capaci¬tors
Kirk Slenes, Erik Luther, Tuqiang Chen, TPL Inc.
587 Novel Structure of Integral Passives Substrate and
HighFrequency Characteristics
Utsumi Shigeru, Hirofumi Fujioka, Mitsubishi Electric
Corporation
593 High-QRFInductors Fabricated usingWLP Redistri¬
bution TechnologyQuan Tran, QingMa, Intel Corporation
604 High-Q RF Inductors on Low Resistivity Silicon
through Wafer Post-ProcessingG. Carchon, W. De Racdt, E. Beyne, IMEC-MCP/HDIP
610 Integrated Capacitors for Multichip Module Packaging
ApplicationsAllen C. Keeney, A. Shaun Francomacaro, RichardL.
Edwards, Harry K. Charles, Jr., Johns Hopkins Univer-
sity/APL
Session THP4
Novel Manufacturing TechnologyChairs:
Nicole Cavanah, Rockwell International
David Virissimo, Hi-Q Materials, Inc.
617 Die Place Pickup TipsKevin Blakelock, Motorola A1EG
622 System Considerations for Active Laser Trimming of
Bluetooth Modules
Bruce Couch, Yun Chu, Joe Lento, GSI Lumonics
626 Ultrasonic Bonding: UnderstandingHowProcess
Parameters determine the Strength ofAu-Al Bonds
Michael Mayer, ESEC SA;Juerg Schwizer, ETH Zurich
632 Yield Improvement Methodologies for Flip Chip
Assemblies using Solder On Pad (SOP) Substrates
Sarathy Rajagopakn, Mukul Joshi, Kishor Desai, LSI
Logic Corp.
637 Implementation of Integrated Packaging ofDC/DCConverter andPFC IPEMs usingBumpless Intercon¬
nected Embedded Chip TechnologyZhenxian Liang, J. D. Van Wyk, Fred C. Lee, Virginia Tech
641 OpticalLeakTesting of Hermetic Semiconductor,
MEMS and Optoelectronic Devices
John Newman, Steve Thayer, NorCom Systems Inc.
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2002 International Symposium on Microelectronics
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Session THP5
ReliabilityChairs:
James T. Cook,Microelectronic Business Associates
GregCaswell, Xetel Corporation
650 Impact ofUnder Bump Metallurgyon SolderJoint
Reliabilityof Flip Chip on LowTemperature Co-Fired
CeramicSubstrate
N. Duan, J. Scheer,J. Bielen, M. van Kleef, Philips Centre
forIndustrialTechnology
656 EffectofAl Pad Surface Morphology on the Flip-Chip
Solder Bump ReliabilityEsther W.G Yau, Simon P.C. Law, J. Z. Wei, Philip C. H.
Chan, Hong Kong University of Science and Technology
662 Electromigrationin WLCSP SolderBumpsGlenn A. Rinne, Krishna K. Nair, Julia Roe, Unitive, Inc.
668' Materials Characterization ofthe Effect ofMechanical
Bendingon AreaArrayPackage Interconnects
Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, DougAbbott, Dongji Xie, Flextronics Inc.
679 Material Set Comparison in Moisture Sensitivity
Classification ofNonhermetic Organic PackagesWilliam R. Schildgen, Cameron T. Murray, 3M Company
685 A Case Study inTest Vehicle Design forReal-Time
Reliability CharacterizationDennis Krizman, Scott Waters, Alex Chen, Celestica
International Inc.
691 SolderJoint Reliability Testing of Back-to-Back
Assembled BGA ComponentsJoyce E. S. Taylor, David W. Peters, Hewlett- Packard
Company
Session THP6
Interactive Forum (PosterSession)
697 Evaluation of TwoNovel Lead-Free Surface Finishes
Richard Ludwig, Ning-Cheng Lee, Indium Corporation of
America; Chonglun Fan, Yun Zhang, LucentTechnology
704 Improved Long-Term Stability of SolderJointsthrough Rapid ReflowingFritz Herbert, Lutz Dorn, Technical University Berlin
708 BeyondPeriodic PulseReverse
Enrique Gutierrez Jr., TecNu, Inc.
715 WASPP Program: Advanced Passivation and near
Hermetic Seals for Advanced Packages and Harsh
Environments
Charles Reusnow, Lockheed Martin Missiles and Fire
Control
721 Thermal Properties of New Composites ofDiamond
and CopperKatsuhito Yoshida, Hideaki Morigami, Takahiro Awaji,Tetsuo Nakai, Sumitomo Electric Industries, Ltd.
727 TechnicalChallenges of Stencil PrintingTechnology for
Ultra Fine Pitch Flip Chip BumpingDionysios Manessis, Rainer Patzelt, Sabine Nieland,Technical University of Berlin; Andreas Ostmann, Rolf
Aschenbrenner, Herbert ReichL Fraunhofer Institute for
Reliability and Microintegration - IZM
733 Challenge of Flip Chip Encapsulation TechnologiesKevin Chai, Eddy Wu, Roger Hsieh, J. Y. Tong,Siliconware Precision Industries Co., Ltd.
738 Flip-Chip PackagingSolution for CMOS Image SensorDevice
Jong-heon Kim, In-Soo Kang, Sung-O Oh, Hak-Nam
Kim, Esdy Baek, C-Cube Digital Corp., Ltd.; Tae-Jun Seo,
Samsung Electro-Mechanics
744 Electroplated Micro-inductors and Micro-transformers
forWirelessApplicationsJae Y. Park, Jong U. Bu, LG Electronics Institute of
Technology
749 Structures ofCantilever with Implanted Strain GaugeM. Husak, P. Kulha, J. Jakovenko, Czech Technical
University of Prague; Z. Vyborny, Academy of Sciences
of the Czech Republic
755 High-Resolution Integration ofPassives using Micro-
Contact Printing (|0.CP)Charles D. E. Lakeman, Patrick F. Fleig, TPL Inc.
760 Investigations of the Effects of g-Radiation on the
Optical andElectrical Properties ofNickel Phthalocya-
nine (NiPc) Thick FilmA. Arshak, S. M. Zleetni, K. Arshak, J. Harris, Universityof Limerick
766 High Dose Optical andElectrical Sensor Dosimeter
usingCobalt Phthalocyanine (CoPc) Thick Film
A. Arshak, S. M. Zleetni, K. Arshak, J. Harris, Universityof Limerick
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772 Prediction of Shrinkage and Deformation duringLTCC Device Production
Aravind Mohanram, Gary L. Messing, David J. Green,
Clive A. Randall, Pennsylvania State University
778 An ExperimentalStudy of the Thermal Performance
of HeatPipe Embedded Cold Plate for Satellite
Electronic CoolingDavid B. Sariaf, Thermacore International, Inc.;DevarakondaAngirasa, NASA Glenn Research Center
784 NewMicrocontact for Separable, Reusable,HighDigitalSpeed Level-2 Interconnections
Dariusz R. Pryputniewicz, Dimitty G. Grabbe, Ryszard J.Pryputniewicz, Worcester Polytechnic Institute
790 Direct Printingof LowTemperature Conductors for
HDI, Displays, and other Fine-Feature Systems
Christopher Wargo, Yvonne Kunz, David Richard, Pardee
Inc.
795 Patternable Compliant Silicones forAdvanced
PackagingApplicationsLyndonJ, Larson, James S. Alger, Stanton J. Dent,
Geoffery B. Gardner, Brian R. Harkness, Robert T.
Nelson, Dow Corning Corporation
800 A Study of the Conduction Mechanisms of Screen-
Printed ThickFilms of MnZn Ferrite
K. Arshak, K. Twomey, University of Limerick
806 Biomedical Sensors: New Application Horizons? - A
Review
Gabor Harsanyi, Budapest University of Technology and
Economics
Session FA1
High Density PackagingChairs:
R. Wayne Johnson, Auburn UniversityScottPopelar, IC Interconnect
812 High Density Stacked Packaging Solution for SiP
ApplicationsVern Solberg, Tessera Technologies, Inc.
818 Design andReliability Study for Flip Chip Applica¬tions on Ultra-Thin Flexible Substrates usingNanoPierce Connection SystemTechnologyB. Zou, M. Kober, F. Blum, S. Mieslinger, L. Gaherty, W.
Steinberg, B.Bahn, M. Wernle, H. Neuhaus, NanoPierce
Technologies, Inc.
825 Wirebondability ofElectroless Ni/Au Plated MCM
Substrates
Jaydutt Joshi, Scth Greinet, Conexant Systems, Inc.
831 Design and Reliability Study ofHigh-DensityHZ-Ball StackTechnologyIlyas Mohammed,Young-Gon Kim,Tessera Technologies,Inc.
839 Reliability ofthe 1 st Level and the 2nd Level
Inteconnections on the Flip Chip PBGAPackageEun-Chul Ahn, Young-Min Lee, Ju-Hyun Ryu, Tae-
GyeongChung, Se-Yong Oh, Samsung Electronics Co.,
Ltd.
845 Reliability Challenges ofFlip Chip on OrganicSubstrate
Tae-je Cho, Eun-Chul Ahn, Jong-Bo Shim, Ho-Joong
Moon, Se-Yong Oh, Samsung Electronics Co.
Session FA2
Thick Film II
Chair:
Paul Galletta, Teledyne ElectronicTechnologies
851 Simulation, Characterization and Design ofEmbed¬
dedResistors in LTCC for High Frequency Applica¬tions
Gangqiang Wang, Fred D. Barlow, Aicha Elshabini,
University of Arkansas (HiDEC)
860 Experiences in Obtaining Cross Belt Unifoimity of
±1°C in a 24inch Wide Thick Film Conveyor FurnaceFred Dimock, BTU International
864 Copper Electroplating forThick-Film Power Applica¬tions: A SuccessfulLaboratory Method for
PrototypingJC I. Arshak, D. P. Egan, University of Limerick
870 Insertion Loss ofA6 LTCC System up to 40 GHz
Liang Chai, Aziz Shaikh, Vern Stygar, Ferro Electronic
Material Systems; Reinhard Kulkc, IMST GmbH
875 A Study ofMicrowave Behavior ofa Thin-Print Gold
Ink
David J. Nabatian, KOARTAN Microelectronic Intercon¬
nect Materials; Chuck Rosenwald, ARTEK Corporation;
F. Barlow, H. Kabir, University of Arkansas
xix
2002 International Symposium on Microelectronics
Table of Contents illllllBlBllR
Session FA3
Thermal Mechanical and Electrical ModelingChair:
LiZhang, National Semiconductor Corp.
880 Linearized Superpositionusing CFD for Thermal and
Power Characterization ofElectronic Equipment-withSignificantThermal Radiation andNatural Convection
Paul Gauche, Flomerics Inc.; Wen Wei, Intel Corporation
886 Thermo-Mechanical Simulation and Modeling ofRFPower SensorMicrosystemJiriJakovenko, Miroslav Husak, Czech Technical Univer¬
sity; Tibot Lalinsky, Slovak Academy of Sciences
892 Modeling ofReturn Loss onMultilayer Package for
WidebandApplicationsNansen Chen, Kevin Chiang, Y. P. Wang, Siliconware
Precision Industries Co., Ltd; Yeong-Lin Lai, National
Changhua University of Education
897 New Configurations for High Frequency Capacitorsand Composite Structures for Embedded Passive and
RFIC ApplicationsKala Gururajan, Harish Peddibhotla, Raghu K. Settaluri,
Oregon State University
903 Analysis ofPCB Power/Ground Plane Decouplingwith New Solver TechnologyRichard Remski, Ansoft Corporation
909 3D Electromagnetic Simulation ofOptoelectronicTransceiverStructures
John C. Schultz, Gordon Henson, 3M Company; Robert
Trammel, Marek Turowski, CFD Research Corporation(CFDRC)
915 The Extraction of a Two-Resistor/Two-CapacitorModel for Common IC Packages and their Implemen¬tation in CFD
David W Stiver, Sarang Shidore, Flomerics Inc.953
956
Session FA4
OptoelectronicsChairs:
Phil ZuluetaJPLEphraim Suhir, Iolon, Inc.
921 Characterization ofAdhesives forLow TemperatureMicroelectronics and Photonics PackagingC. Taylor, H. Naseem, W. Brown, University of Arkansas
927 AdhesiveAssembly for Optoelectronic Transceivers
John Schultz, Glen Connell, Gordon Henson, Ron Davis,3MCompany
933 "Curing" LowYields in Photonics
Richard S. Garard, Lambda Technologies, Inc.
936 An O/E Measurement Probe Based on an Optics-Extended MCM-D Motherboard TechnologyHerbert DePauw, J. De Baets, J. Vanfleteren, A. VanCaister, Ghent University (ELIS-TFCG) / IMEC
942 An Optimized System Level Design Methodology for
an Opto-electronic TransceiverModuleWinfred Morris, Abdolreza Langari, MindspeedTechnologies
947 Planar Optical WaveguidesFabricated by Ion-Exchangeof Transition Metal Ions in Commercial and SpecialOptical Glasses
Jarmila Spirkova, Pavlina Nebolova, Pavla Nekvindova,Martin Mika, Institute of Chemical Technology, AnnaMackova, Karel Mach, Czech Academy of Sciences; JosefSchrofel, Czech Technical University
Appendix
Organizational Members
Index of Authors
XX
