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PROCEEDINGS
OF THE TECHNICAL
PROGRAM
Conference: February 27 - March 4,1994 • Exposition: March 1-3,1994
Anaheim Convention Center • Anaheim, California
TECHNICAL SESSION 32
Fine- and Ultra-Fine-Pitch TechnologyChairmen: Phil Zarrow and Debra Kopp, Integrated Technology Group
"Improved Productivity through Fine-Pitch Dispensing" 1589
Patricia Waitkus and Kevin Gaugler, ESP Solder Plus
"Comparative Analysis of Stencil Technologies for Fine-Pitch and
Ultra-Fine-Pitch Printing" N/A
Richard Clouthier, AMTX-Advanced Micro Tech.
"Alternative Solder Paste Application for Ultra Fine Pitch" 1596
Donald Burr and Mike Buseman, Unisys Corporation
"Fine Pitch Rework and Repair-Process Modeling" 1601
Joe Mearig, Electronic Manufacturing Productivity Facility
TECHNICAL SESSION 33
Advances in UV Processes for Electronics
Chairman: John Beasley, California Sales Manager, EFOS Inc.
"Technology of UV-Cured, Coating, Decorating and Bonding in Electronic
Manufacturing" 1611
Richard Stowe, Mgr. of Product Development, Fusion Systems, Inc.
"New Developments in ODC-Free UV Curing, Coatings and Adhesives" 1620
Dr. Steve Cantor and Farre Huang, Dymax Corporation
"Process Control and Measurement: Key Factors Insuring the Success of
UV-Curing Adhesives, Sealants and Encapsulants" 1635
Christy Marinelli and Gregory Marinelli, Loctite Corporation
"UV-Curable Barrier Coatings for MCM's" 1648
Michael Lucey, President, Micro-Lite Technology
"Automation in UV Process for Electronics: How to Design for Them" 1655
Robert Alvarez, President, Base Technology and Pierre Metivier, ASI
"Ultra-Violet Spot Curing: An In-Line and Off-Line Spot-Cure Approach" 1661
John Beasley, California Sales Manager, EFOS Inc.
TECHNICAL SESSION 34
Advances in Test Fixtures
Chairman: Lisa MacMaster, Marketing Manager, TTI Testron
"Circuit Board Test Fixture Solutions" 1671
Ray Caggiano, Advisory Mechanical Engineer, IBM Corp.
"Improving Test Fixture Quality and Delivery with CAD Data" 1683
Tom Merline, Operations Manager, Everett Charles Technologies
"Wireless Fixture Technology" 1690
Wayne Wardwell and Lisa MacMasters, TTI Testron, Inc.
"No-Clean Flux Applications" N/AMike McKenna, Senior Test Engineer, Epic Technologies
"Incircuit Test Fixture for High-Technology Printed Circuit Boards" 1694
Monroe Taylor, III, Sr. Test Engineer, Motorola Computer Group
"Partnering for Customer Wins" 1699
Greg Geary, Marketing Manager, Automated Test Engineering
TECHNICAL SESSION 35
Linking Design to ManufacturingChairman: P. J. Noble, Consultant in Mfg. Mgmt & Tech., Noble <fe Moore Consultancy
"Linking Design to Manufacture-The Problems" 1705
P. J. Noble, Consultant in Mfg. Mgmt. & Tech., Noble & Moore Consultancy
"Using CAD Data in Manufacturing - The Right Way" 1708
Robert Myers, President, Omnimation
"Ensuring the Correctness of CAD Data in an Electric Assembly Environment" N/A
Michael Marsh and Carston Svanholm, CAM Software Research, Inc.
"Linking CAD and MRP with Manufacturing-Test and Repair" 1719
John Malon and Antony Caulcut, Fabmaster S.A.
"Dealing with the Data Explosion in PWB Fabrication"
Laura Scholten, Valor Computerized Systems
1721
TECHNICAL SESSION 36
User-Implemented CFC Phase-Outs
Chairman: Jim Price, Director of Sales and Marketing, Westek, Inc.
"High Reliability Automotive CFC Phase-Out" N/A
Mary Nutial, Autecs
"Water-Soluble Fluxes in the Military" N/A
Robert Clark, Hughes Aircraft Company
"OA Flux and Ceramic Circuits" N/A
Tim Kougher, GE SANUC
TECHNICAL SESSION 37
Materials for Electronics
Chairman: Alvin Weinberg, Mgr., Hybrid Design & Development, Siemens Pacesetter, Inc.
"Thick Film Metallic Resistors for Lightning Surge Protection" 1729
David Nabatian, Orville Brown, Anthony Maslowski, and Samson Shahbazi,EMCA - REMEX Products
"A Novel Process for the Fabrication of Corrosion-Free MultilayerMetal Conductor Structures for I/O Pin Interconnection" 1737
Umar M. Ahmad, H.S. Bhatia, S. Purushothaman, H. Dalai, W. Price,IBM Corporation
"An Alternate Technique of Producing Cofired Ceramic Circuits
and Components" 1751
Dr. Jerry Steinberg, Director of Research, Heraeus Incorporated
"Cofirable Resistors for Low Temperature Ceramic Tape" 1759
John Alexander, Product Manager, Ferro Corporation
"Diffusion Patterning-Materials Performance and Process" 1766
Robert Mason, M. T. Kirks, and C. R. S. Needes, The DuPont Company
"Material Properties and Applications of Polycrystalline Diamond for
Thermal Management" 1774
Dr. David Pickrell, Research Associate, Diamonex, Inc.
This session is Part 1 of the ISHM-organized Symposium at Nepcon West 1994.
TECHNICAL SESSION 38
Rework Issues and Solutions
Chairman: Wilfred Bernier, Jr., Process Engineer, AT&T Network Systems
"Rework of Ceramic Printed Circuit Boards" N/APhil Stenstrum, Engineer, EG&G - WASC
"Solder Replenishment for SMT Rework" 1785
Harold Hyman, Regional Sales Manager, SRT Research Technology
"No-Clean Rework" 1788
Manthos Economou, Mfg. Development Eng., Hewlett-Packard Company
"Third-Party Trainer in Rework/Repair" 1797
Doug Peck, Director, Advance Electronic Interconnect Ctr. Inc.
"The Significance of Training" 1809
Wilfred Bernier, Jr., Process Engineer, AT&T Network Systems
TECHNICAL SESSION 39
Structured Methods for Quality and Customer Satisfaction
Chairman: Sammy Shina, Associate Professor, University of Massachusetts, Lowell
Co-Chairman: Jud Miner, V. P., Sales Data Collection Prod., Datapage Technologies International, Inc.
"Zero to Sixty in Six Seconds: A Small Company's Experience in the
Development of PTFE (Teflon) Lamination Capability" 1819
N. Balakrishnan, Mfg. Engineering Manager, New Bedford Panoramex Corp.
"Bar Codes, Quality Control and the Information Highway" 1830
Jud Miner, V. P. Sales Data Collection Prod., DATAPAGE
"Barcode Applications in the Electronics Industry" 1840
Bill Bulzoni, Mktg. Manager-Electronics, Zebra Technologies Corporation
TECHNICAL SESSION 40
Fine-Pitch Technology ProcessingChairman: John Sprowl, Product Manager, Solder Creams, Alpha Metals
"Advances in Stencil Technology" 1851
Ian Heck, Product Manager, Alpha Sigma Technology
"Fine Pitch Printing Results" N/A
Mark Jalilian, Engineering Manager, Solectron
"Advances in Screen Printing Technology" 1856
Craig Brown, Vice President, DEK USA Inc.
"Printing Techniques for Fine Pitch Screen Printing" 1862
Jamey Lideen, Manufacturing Engineer, EMD Associates, Inc.
"The Synergy Required in (Specific) No-Clean Fine-Pitch Processes" 1877
Sam Gutierrez, S. Barlow, R. R. Komm and C. Tulkoff, IBM
TECHNICAL SESSION 41
Contract Manufacturing in the PWB Manufacturing IndustryChairman: Dennis Sullivan, Unisys Corporation
"Using Electronics Contract Manufactures: A Review of Industry Trends" 1885
Sandy Fox, Vice President, Technology Forecasters, Inc.
"Contract Manufacturing at a Distance-Improving Productivitythrough Effective Interaction Strategies" 1888
Jeff Shaw, V.P. Manufacturing, Picture Tel Corp.
"Contract Manufacturing-Going Cold Turkey" 1895
Vince Sonju, Manager Procurement, Unysis Corp.
"Gradual Implementation of Contract Manufacturing" N/A
Ben Parab, Dir. Supplier Mgmt., EMC Corp.
"Asia, the World's Printed Circuit Board Shop?"Mark Christensen, BPA (Technology and Management) Inc.
N/A
TECHNICAL SESSION 42
Test in the Integrated Manufacturing Environment
Chairman: Dan Romanchik, Editor, Test & Measurement World Company
"Using a Process Verification Strategy to Meet Quality, Cost and
Schedule Requirements" 1903
Dominick Haigh, Production Manager, Teradyne Inc.
"Test and the Corrective Action Process--A Systems Perspective of
ISO 9002" 1910
James Dawdy and Lynden Jones, Hewlett-Packard Company
"SPC at Polaroid: Instant Feedback for its Instant Cameras" 1920
Michael Boulos, Manufacturing Engrg. Mgr., Polaroid Corporation
"ULF: Uniform Log Format a Standard Datalog Specification for Electronic
Test Equipment" 1925
Ed Woods, President, ATE PC Product Services
"MDA's and Integrated Manufacturing" 1935
Brian Laine, Checksum, Inc.
"Latest Open Testing: An Alternative or Supplement to Automated
Optical Inspection" 1945
Irving Memis, IBM Corporation
TECHNICAL SESSION 43
PWB Manufacturing Issues: Laminates, Wet Finishes and Resists
Chairman: William Vuono, Process Engineer, Boeing Defense and Space
"Thermal and Mechanical Characterizing of High-Performance Laminates" 1957
Mark Paczkowski and Jib. Yuan, AT&T Bell Laboratories
"Effect of Lamination Tooling Dimensional Stability of Multilayer
Circuit Boards" 1965
Jih Yuan and Nien-Hua Chao, AT&T Bell Laboratories
"The Importance of Thermal Stability to the PCB and Laminate Industry" 1983
Curt Mitchell, Technical Service, General Electric ElectroMaterials
"Process Quality Assurance & Reliability Requirements for Choosing a
Solder Mask"1990
Robert Hall, Manager OEM Documentation & Specifications, McDermid, Inc.
"PWB and Component Incoming Cleanliness Issues"
Terry Mason, President, Contamination Studies Laboratory
N/A
TECHNICAL SESSION 44
Future Trends in Multichip Module PackagingChairman: Dr. Jerry Sergent, BBS PowerMod
"Three-Dimensional Multichip Modules" 2001
Dr. Charles Bauer, Techlead, Inc.
"Advanced BGA Technology for MCM Applications" 2006
Robert Marrs, Amkor/Anam
TECHNICAL SESSION 45
Materials Applications in Electronics
Chairman: Richard Sigliano, New Product Dev./Mktg. Mgr., Kyocera International
"A Comparison of MCM Packaging Technologies for a 32-Bit
High-Performance Processor" 2013
Raymond Brown and Robert L. Bone, Hughes Aircraft Company
"Higher Density Using Diffusion-Patterned Vias and Fine-Line Printing" 2229
David Bender and Amy M. Ferreira, CMAC of America, Inc.
"MCM-C Applications for Multilayer Avionics Communication Networks" N/A
Tony Jordon, United Technology Microelectronics Center
"Multilayer High Temperature Ceramics for Semiconductor & MCM Packaging" 2023
Kevin Gaughin, Kyocera International
"Application of Metal Matrix Composite Materials in SEM-E Cores and
Multi-Chip Modules" 2026
Paul Heller, Consultant, Lanxide Electronics
"Fine-Line Additive Technology for High Density Printed Wiring Boards" 2032
Michael G. Todd, M. Albert Capote, and Pradeep Granhi,
Toranaga Technologies, Inc.
"Silicon-on Silicon MCM Technologies" 2038
Jeff Demmin, National Semiconductor
This session is Part 2 of the ISHM-organized Symposium at Nepcon West 1994.
TECHNICAL SESSION 46
Very Fine-Pitch Interconnect Technology Using Laminate Substrates
Chairman: Donald Kuk, Director of Technology, Intergraph
"High Performance Materials for Advanced Interconnect Technologies" 2043
William Varnell, Corp. Director of Research & Dev., Polyclad Laminates,Inc.
"Advanced Substrate Fabrication Techniques" N/A
Dr. John Acocella, Dir. of the Advanced Tech. Group, IBM Technology Products
"Direct Photoplotting of Very Fine-Line Conductors" N/A
David Orthman, Dir. of Research & Development, Ozo Diversified Automation
"Assembly Process Tolerance Issues for Very Fine-Pitch" 2044
Jack Leonard, Michael Deley, Craig Ramsey, David and Smith,
Quad Systems Corporation
"Advanced Packaging Approaches to Very Fine-Pitch Surface-Mount
Interconnection" 2056
Phil Marcoux, Vice President, Micro SMT, Inc.
TECHNICAL SESSION 47
Volume TAB: PCB Supply Chain Issues
Chairman: Michael Baughman, Commodity Manager, Sun Microsystems Computer Corp.
"TAB PWB Specifications: Critical Concerns" 2063
Karl Sauter, Senior Staff Engineer, Sun Microsystems
"Robust TAB Process: An Assembler's View Point" 2070
Dr. Srinivas Rao and Harjinder Ladhar, Solectron
"Fine Pitch TAB: A PCB Perspective" 2079
George Dudnikow, Senior Engineering Mgr., Hadco Corporation
"TAB Bonding Process: Rework Ability/PCB Producibility" N/A
Leroy Jarvis, Advanced Process Engr., Avex Electronics
"TAB OLB in a High-Product-Mix Environment" 2082
Chris Thornton, Process/Producibility Engrg. Mgr., Texas Instruments
TECHNICAL SESSION 48
Inert Atmosphere SolderingChairman: Dr. Armin Rahn, ERSA Ernst Sachs KG, GmbH & Co.
Co-Chairman: Larry Lichtenberg, Motorola
"Investigations about the Reliability of Atmospheric and Inert-Wave
Soldering 1812-Capacitors at Various Footprint Configurations" 2091
Dr. Ing. Gundolf Reichelt, Gabriela Laneous, and Margrit Ehrich, DeTeWe
"TBD" N/ATom Schopflocher, Robologic
"Inert Soldering, Changes and Opportunities" 2108Peter Lensch, ERSA KG
"Elimination of Ozone-Depleting Chemicals through the Implementationof Cleanable Low-Solids/No-Clean Fluxes on High Reliability Harware" 2118
Patrick Scott, Phil Schuessler, Ed Hauptfleisch, and Randy Long, IBM
"Successful Implementation of No-Clean Inert AtmosphereReflow Soldering" 2128Les Hymes, Les Hymes and Associates
TECHNICAL SESSION 49
Cable and Harness Testing from the Front-Line PerspectiveChairman: Jeff Finkelstein, National Sales Manager, OmniTester Corporation
"Harness and Cable Testing Philosophy and Strategy" 2141Eric Hansen and Rob Neeper, Beckman Instruments
"From the Supplier Perspective" 2146Brent Stringham, Sales Manager, Cirris Systmes Coporation
"Harness Testing from the Automotive Perspective"Gary James, Dynalabs
2151
TECHNICAL SESSION 50
Integrated Boundary SCAN
Chairman: Tim Aspell, Manager, Innovative Technologies
"P1149.4 Mixed Signal Test Bus Standard-A Status Report" 2161
Stig Oresjo and John E. McDermid, Hewlett-Packard
"Merging Mixed-Signal Boundary-Scan Testing" 2171
Carl Thatcher, Technical Specialist, Ford Electronics
"Testing New Manufacturing Technologies" N/A
Barry Johnson, Director of Marketing, Schlumberger
"Boundary SCAN: Beyond Just Fiddling" 2182
Ellis Goldberg, Alpine Image Systems, Inc.
TECHNICAL SESSION 51
Progress in CFC-Free Product Technology to Clean and Protect Electronics
Chairman: Dr. Mo Tazi, Director of R & D, Chemtronics, Inc.
"CFC-Free Surface Preparation and Polymer Protection for
Printed Circuit Boards" 2193
Suneer Patel and Eric J. Martini, Chemtronics, Inc.
"Performance Fluids for Critical Cleaning and Drying Applications" 2197
Mark W. Grenfell, John G. Owens, and Frank Klenk, 3M Company
"Special Considerations for Cleaning with Alcohol" 2204
Peter Davis, Prod. Mgr. for Precision Cleaning and Drying, Forward
Technology Industries
"Cleaning Water-Sensitive Parts Without Ozone-Depleting Solvents" 2208
Michael Hayes, Dr.Christine Fouts, and Kevin Hrebenar, Petroferm, Inc.
"Zero Discharge, High-Performance Semi-Aqueous Cleaning of Printed-Wiring
Assemblies with a New, Non-ODC Process" 2219
Dr. Karsten Lessmann, Dr. O. K. Wack Chemie GmbH and Ed Mines,
HumiSeal Division, Chase Corp.
"Rinse-Water Treatment of Micropure CDF Circuit Cleaner" 2226
James Butler, Process Engineer, International Specialty Products
"Volatile Methyl Siloxanes (VMS) as Replacements for CFCs and Methyl
Chloroform in Precision and Electronics Cleaning" 2236
Richard Burow, R&D Commercial Devlop. Leader, Dow Corning Corporation
"An Ozone-Friendly CFC-113 Alternatives for the 1990's 2243
Abid Merchant, E.I. DuPont de Nemours & Co.
TECHNICAL SESSION 52
Thermal and Mechanical Reliability of Interconnects-Application to MCMs
Chairman: K. L. Murty, Professor, North Carolina State University
"Creep/Plastic Deformation of Components During Power Cycling of 2255
a Multichip Module"
B. Sur, and I. Turlik, MCNC Center for Microelectronic Systems Technologies
"Heatpipes-Operating Characteristics Performance Stability" 2265
J. Bowman, Digital Equipment Corporation
"Failure Processes in As-Cast Solders-Thermal Cycling and Deformation" N/AV. Raman and S. Pattanaik, IBM-ADSTAR
TECHNICAL SESSION 53
Solutions to the Known Good Die Problem
Chairman: Phil Marcoux, PPM Associates, Inc.
"Overview of Integrated Circuit Interconnect Options for
Multichip Modules" 2275Phil Marcoux, PPM Associates, Inc.
"Hardware Access Issues Confronting KGD Suppliers and Users" 2279Dr. Charles Bauer, Techlead, Inc.
"Known Good Die Solutions for Flip-Chips" 2282Dr. Glen Rinne, Gretchen M. Adema, and Iwona Turlik, MCNC Centerfor Microelectronics
"Burn-In and Dynamic Test Fixtures for KGD" 2291B. Y. Min, Fariborz Agahdel, Brad Griswold and Syed Husain,MicroModule Systems Co.; Randy Roebuck, Salvatore P. Rizzio, TexasInstruments M&C
"Testing Strategies for KGD"
Kevin Wilson and Martin Kleiner, Insyte2291
TECHNICAL SESSION 54
Concurrent Engineering-Successful ImplementationChairman: Sammy Shina, Associate Professor, University of Massachusetts, Lowell
"Avoiding the Deficit Engineering Trap" 2305
Michael Diamond, Product Manager, Industrial Dynamics Company, Ltd.
"Design for Manufacturability at the International Business
Machines Corp." 2313
Dr. Perminder Bindra and Dr. Philip Kraft, IBM Consulting Group
"Concurrent Engineering at Rockwell International" N/A
Larry Butler, Integrated Product Definition Team, Rockwell
International Corporation
"A Dynamic, Integrated Manufacturing Approach to QFD" 2322
Allen I. Sharkey, Sharkey Associates and Cindy Adiano, IBM Corp.
TECHNICAL SESSION 55
Surface Mount Technology from A to Z
Chairmen: Debra Kopp and Phil Zarrow, Integrated Technology Group
"Solder Paste and Deposition" 2329
Brian Bauer, Heraeus-Cermalloy
"TBD" N/A
Mike Zurn, Electronic Systems, Inc.
"SMT: Profile and Profiling" 2340
Norm Cox, Research, Incorporated
"Surface Mount Cleaning" 2352
Michael D. Buseman, Unisys Corporation
"Automated Inspection and Workmanship" 2356
Robert Savage, NASA Goodard Space Fit. Ctr.
TECHNICAL SESSION 56
Profiting from Test
Chairman: Louis Ungar, President, AT.E. Solutions, Inc.
"Profiting from Test: Advantages of VXIbus-Based Test Systems" 2361
Arlene Meadows, Racal Dana
"Profiting from Software Test" N/A
Dr. Jack Alanen, Litton Data Systems
"Profiting from Boundary Scan" 2380
Dr. Rod Tullos, AT&T Engineering Research Center
"Profiting from Built-in Test" 2373
Louis Ungar, President, AT.E. Solutions, Inc.
"Profiting from Integrated Diagnostics" 2389
Dr. William Randy Simpson, Institute for Defense Analysis
This session is sponsored by the ASTE.