PAPER TITLEADVERSE EFFECT OF SEMICONDUCTOR INDUSTRY ON ENVIRONMENT AND ITS

REMEDIES

Presented by:

MD MUSTAFA KAMAL

DEPTT.OF ELECTRICAL ENGINEERING

NITTTR ,CHANDIGARH

NATIONAL CONFERENCE ONLATEST DEVELOPMENTS IN POLLUTION CONTROL AND

PREVENTION TECHNIQUES

CONTENT

Introduction

Effect of semiconductor industries on environment

Remedies

Conclusion

INTRODUCTION

INDIAN SEMICONDUCTOR INDUSTRY GROWTH RATE

PFC GASES USED IN DIFFERENT PROCESS

Perfluorocompounds (PFCs) are used extensively by the semiconductor industry in etch processes and chemical vapor deposition (CVD) chamber cleans and the vapor testing process .Common PFCs used in these processes include perfluoromethane (CF4), perfluoroethane (C2F6), trifluoromethane (CHF3), perfluoropropane (C3F8), perfluorocyclobutane (C4F8), and perfluorocyclopentene (C5F8). 

ABSORPTION SPECTRA OF PFC GASES

LIFE -TIME OF PFC GASESCompound Atmospheric

Lifetime (years)

Global warming potential

(100-years)

CO2variable 1

C2F610,000 12,200

CF450,000 7,390

SF63,200 22,800

NF3 740 17,200

CHF3270 11,700

C3F82,600 8,830

C-C4F83,200 10,300

CFC-11 55 3400

CFC-12 116 7100

May 1992: UN FCCC establishes framework for containing global warming.

Dec 1997: Following intense negotiations in Kyoto (Japan), a protocol is agreed upon by over 100 countries.

Feb 2005: 141 countries, including EU, Japan, Canada, and Russia sign the Kyoto Protocol and it gets ratified w.e.f. 16-Feb-05– The US remains a key non-signatory

The Kyoto Protocol sets legally binding targets for reducing green house gases (GHGs)

– Developed countries have a target to reduce GHG emissions by 5.2% below 1990 levels, by year 2012

– EU members committed to reduce their average emissions by 8 %

– India, China, and Brazil are classified as emerging countries and hence exempted from this protocol

KYOTO PROTOCAL

PartyTarget level and date(reductions from 1990)

Gas(es)covered

Date proposed

Brazil30% by 2020(differentiated)

CO2, CH4, N2O 28 May 1997

Canada3% by 2010,additional 5% by 2015

All GHGs 2 December 1997

Czech Republic5% by 2005,15% by 2010

CO2, CH4, N2O 27 March 1997

DemocraticRepublic of the Congo(Zaire)

10% by 2005,15% by 2010,20% by 2020

All GHGs 23 October 1996

EUat least 7.5% by 2005,15% by 2010

CO2, CH4, N2O19 June 1997,4 March 1997

France

7-10% inaverage per capitaemissions by 2010(differentiated)

All GHGs 6 December 1996

Germany10% by 2005,15-20% by 2010

CO2 26 March 1996

G-77 and Chinaat least 7.5% by 2005,15% by 2010,an additional 20% by 2020

CO2, CH4, N2O(gas-by-gas)

22 October 1997

Hungary et al.Stabilization by 2005plus pledging ofdifferentiated targets

CO2, CH4, N2O 27 March 1997

KYOTO PROTOCOL

PartyTarget level and date(reductions from 1990)

Gas(es)covered

Date proposed

Peru15% (CO2) by 2005,15-20% (all GHGs)by 2010

see previouscolumn

7 March 1997

Philippines20% by 2005,20% by 2010

All GHGs 25 March 1997

Russian Federation

Stabilization by 2010plus additionaldifferentiated targetsfor "Annex B" Parties

All GHGs 26 February 1997

Switzerland10% by 2010(differentiated)

All GHGs 29 November 1996

UK 5-10% by 2010 All GHGs 16 April 1996

USAReturn to 1990by 2008-2012

All GHGs 23 October 1997

REMEDIES (METHOD OF REDUCTION OF PFC GASES)

Process optimization-PFC gases can be reduced by using better optimization .better technology need for better optimization.

Substitution-search alternative of PFC gases. Capture and reuse-reuse the emitted gases

again in the manufacturing process. Abatement-abatement is the process in

which large plant are operate with substantially

reduced emission of PFC gases. by using carbon abatement process we can reduce the emission by 90%.

CONCLUSION

Semiconductor industries which are used various PFC gases in its different manufacturing process which are very dangerous and responsible for heating of earth ,result global warming .by using better optimization technique, better abatement method ,better substitution we can reduce these at optimum level.