Practical Debugging and Testing BGA 11Oct07

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  • 7/29/2019 Practical Debugging and Testing BGA 11Oct07

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    Practical debugging

    and testing BGA

    by David KimParamit Co.

    Oct. 11th, 2007

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    PCB1

    $4.5k with BGAs ( $50~$800 each)

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    PCB2

    $3.5k with BGAs ( $50~$800 each)

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    PCB3

    $5k with BGAs ( $100~$700 each)

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    MOREs with BGA

    PCB: More PCBs with BGAs More expensive PCBs with expensive BGAs More tests on BGAs More complicated tests (BSCAN and Silicon nail test)

    ICT: More false BGA failures

    More rework on false BGA failures More rework and replacement cost on false BGA failures More troubleshooting time on false BGA failures

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    More false BGA failure More Rework and materials

    More Time and $= $ Loss

    Less false BGA failures Less rework and materials

    Less Time and $ cost= $ Profit

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    Testing BGA

    pins < connectcheck < testjet (

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    Test coverage on BGA

    testjet/VTEP has less test coverage on Shielded BGA and micro BGA.

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    BGA Rework

    Bake - takes long hours. 8 ~ 24Hs

    Reflow Reball - not as good as a new one

    Replace - expensive BGA

    Retest - may still show false failure

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    False BGA failures with BSCAN test

    Caused by

    Contact problem (dirty nail bed, dirty probe, contaminated test vias, etc) Signal delay caused by contact resistance

    Missing and improper disables

    Random initial condition after power-on Unpredictable bus contention during the output test

    Other defected devices

    etc.

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    Verifying BGA failures

    Check Test target(s) - probe, test via(pad) Continuity from Test point to BGA pin

    R and Diode test comparing with the KGB

    Testing only failed pin in input mode forinput/bidirectional pin or in output mode foroutput pin.

    Test with longer vector cycle/receive delay Set TCLK at dh3.3/dl-0.2 and slew rate 250

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    R and Diode test

    on failed pin to Pwr/GND R test

    Internal pull-up R, pull-downR, or internal circuitimpedance to Power orGround

    Diode testCMOS SCR Latch-upresistant circuit as ESDprotection on bidirectionalbus has diodes to power andground.

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    Separating output-only pins

    Separate output-only pins from each connect test.

    Use test inputs only option for bidirectional pins andinput-only pins

    Create a script to split digital/unn_connect_xinto digital/unn_connect_x_out and digital/unn_connect_x_in

    ex.

    $ dksplite_bscan u14$ dkrdtest_bga_pin u14.ac5

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    !"tundra310.bsd", "HPBGA_304_23x23", no-- STD_1149_1_1994 VHDL Package and Package Body

    --------------------------------------------------------------------------

    entity tsi310 is

    generic (PHYSICAL_PIN_MAP : string := "HPBGA_304_23x23");-- Port List

    port (

    S_DEVSEL : inout bit;

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    !itl digital/u3d1_connect_c

    connect "u3d1"ground bounce suppression on

    family "TTL_3V3"

    !IPG: Connect test generated with CONNECTMAX value of 25

    test inputs only !* tests bidirectional pins as input and ignores Output pins.chain "u3d1_u3d1"

    tdi "PCIX1_TDO"

    tdo "CE_TDO"

    tms "CE_TMS" family "CMOS_3V3"

    tck "CE_TCK5"

    devices

    "u3d1", "_bsdl_lib/tundra310_ok.bsd", "HPBGA_304_23x23", no

    end devices

    end chain

    vector cycle 900nreceive delay 800n

    set ref on nodes "CE_TCK5" to dh 3.3, dl -0.2set slew rate on nodes "CE_TCK5" to 250

    nodesfixed low "NETIFPCIXPD_OPAQUE_EN" test "u3d1.AA18"

    node "NETIFS_AD0" hybrid test "u3d1.AA9" !*binode "NETIFS_GNT1_L" hybrid test "u3d1.AA19" !*outnode "NETIFS_GNT2_L" hybrid test "u3d1.AB1" !*outnode "NETIFS_GNT5_L" hybrid test "u3d1.AB4" !*out

    end nodes

    end connect

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    itl without "test inputs only"

    ------------------------------------------------------------------------------

    AGILENT 3070 VCL Wed Sep 26, 2007 09:40:12 AMdigital/u3d1_connect_bx.vcl

    ------------------------------------------------------------------------------

    C O M P I L A T I O N S U M M A R Y

    -------------------------------------

    4050 vectors executed.

    27 Vector RAM slots used, 0 % full.

    1026 Sequence RAM slots used, 0 % full.

    110 Directory RAM slots used, 0 % full.

    P I N S T A T E R E P O R T

    -------------------------------

    DEVICE PIN STATESPIN NODE TYPE EXECUTED

    --- ---- ---- ----------CE_TCK5 DRIVE D0 D1

    CE_TDO RECEIVE R0 R1

    CE_TMS DRIVE D0 D1

    CE_TRST_L DRIVE D1

    CENTRALPU_OE_B DRIVE D0

    HARDRESET_L DRIVE D1

    NETIF_STITCH DRIVE D1

    NETIFS_AD0 **bi** BIDIRECTIONAL D0 D1 R0 R1NETIFS_GNT1_L **out* RECEIVE R0 R1NETIFS_GNT2_L **out* RECEIVE R0 R1NETIFS_GNT5_L **out* RECEIVE R0 R1PCIX1_TDO DRIVE D0 D1

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    * itl with "test inputs only"

    ------------------------------------------------------------------------------

    AGILENT 3070 VCL Wed Sep 26, 2007 09:42:45 AM

    digital/u3d1_connect_bx.vcl

    ------------------------------------------------------------------------------

    C O M P I L A T I O N S U M M A R Y

    -------------------------------------

    2504 vectors executed.

    24 Vector RAM slots used, 0 % full.764 Sequence RAM slots used, 0 % full.

    72 Directory RAM slots used, 0 % full.

    P I N S T A T E R E P O R T-------------------------------

    DEVICE PIN STATESPIN NODE TYPE EXECUTED

    --- ---- ---- ----------CE_TCK5 DRIVE D0 D1

    CE_TDO RECEIVE R0 R1

    CE_TMS DRIVE D0 D1

    CE_TRST_L DRIVE D1

    CENTRALPU_OE_B DRIVE D0

    HARDRESET_L DRIVE D1NETIF_STITCH DRIVE D1

    NETIFS_AD0 **bi** BIDIRECTIONAL D0 D1NETIFS_GNT1_L **out* RECEIVENETIFS_GNT2_L **out* RECEIVENETIFS_GNT5_L **out* RECEIVEPCIX1_TDO DRIVE D0 D1

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    Improving BGA test for less false failures

    put pins test at the beginning of the test

    apply connectcheck to each BGA as well as testjet (VTEP is

    better). apply vector cycle and receive delay ( 500n~1000n/400n~900n)

    with the regular fixture maintenance.

    Separate output-only pins from inputs-only or bidirectional pins

    Test bidirectional pins as only input with test inputs only option.(Use dktools to split in/out/bi/single pin automatically.)

    Separate the unstable pin(s) from other pins. ( good for pins with!IPG: Disable problems, ..)

    Use debugging tool for BGA failures to verify the result as falsefailure or true failure, such like testing R and diode junction of thefailed pin to power and ground.

    Option: X-ray test with 5Dx or others, if needed.

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    Conclusion

    By improving the existing ICT test for BGAs, the numberof false failures is reduced.

    (more than 50%, depending on the program quality and the complexity of the circuit). False BGA failures can be efficiently verified with

    improved BSCAN test and R/Diode test. BSCAN test can be efficiently developed and debugged

    more stable with the automated scripts.

    Shorter development time and less sustaining time

    Less false failures Less rework and replacement Time and $ saving

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    Need dktools and my help ?

    David KimTest Development Manager

    Paramit Co.

    Ph) 408-782-2445

    [email protected]