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Cleaning Requirements in the Sub 28

Nanometer World “Things that Didn’t Matter Now Do”

SEMATECH Workshop

Current and Future Defectivity Issues from Components in the Semiconductor Industry

12-13 November 2012

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Agenda

• Speaker Biography

• Company Profile

• The 28 Nanometer Cleaning Barriers

• Surface Cleanliness

• Particles

• Substrate and Coatings

• Summary

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Speaker Bio – Dave Zuck • COO/CTO QuantumClean – 12 Years Since Inception

• BS Chemical Engineering – Lehigh University

• Previous: President of ESCA (MSR Today) – 2 Years

• Previous: Air Products and Chemical's – 18 Years

• Specialty Gases & Chemicals Engineering & Manufacturing

• On-site Installation /Management of Fab High Purity Gas and Chemical Delivery Systems (and cleanliness validation)

• Global Electronic Fab Systems Manager

• Survivor of the “Agony of Ultra Clean” & “Six 9’s Wars”

• PPM PPB PPT PP(???)

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QuantumClean Profile • Established 2000 • Business: Global provider of outsourced process tool parts cleaning and

analytical engineering services to the semiconductor industries. • 17 Locations

• Israel, Scotland, US, Taiwan, Singapore , Korea, Netherlands • 14 Part Cleaning Facilities and 3 lab locations

• 900+ employees • Customers

• >95% of global 300 mm Fabs • Roadmap Supplier to Worlds Largest Semiconductor Companies • Significant New Part Clean Supplier for Major OEMs

• Technology • 28, 22, and lower , nanometer cleaning technologies • >125 patents • Thousands of recipes/BKM Cleaning Methods • ChemTrace: Global Leader in Analytical Services and Technologies

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Part Cleaning Generally Missed The Ultra-Clean Revolution

• To a large extent, the standard for part clean cleanliness was/and largely is now “visual”

• i.e. “The part looks great, lets run it in the tool!”

• The tool itself is used for part cleanliness validation

• Test wafers, conditioning wafers, Tencor, TXRF, VPD, RGA, etc. (At what real cost in terms of time and expense?)

• For larger geometries (>45 nanometers) most parts worked, but that didn’t/doesn’t mean they are “clean”!

• At 28 Nanometers and below, things that didn’t matter now do!

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Surface Cleanliness: The Reality • Reality: In the sub 28 nanometer world, contaminants

that didn’t matter now do.

Typical Part Cleanliness

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The Source of the Contamination? • Residual Process Deposition

• Cleaning Process/Methods/Chemistries/Ovens

• People

• Part Substrate Composition/Coating

• Environment

• Cleanroom Air

• Cleanroom Wipes, Gloves, and Handling

• Bagging Material

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Critical Particle Size ITRS Roadmap

• Reality: In the Sub 28 nanometer world, particles that did not matter now do!

Typical Part Validation

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Below 0.3 Microns There Are a Lot of Particles

• In the Sub 28 nanometer world, particles that did not matter now do!

Typical

Part Validation

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Particle Sources • Process Deposition

• Cleaning Methods (Ovens, BB, DI, U/S)

• Plant Air/Cleanroom Air/Process Gases

• People, Gloves, Wipes, Handling

• Bagging Material

• Substrate/Coating (no plasma)

• Al, Ca, Na, K contaminants (plasma reaction)

• Substrate/Coating Etching (in Plasma)

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The Issues With Substrates and Coating

• All substrates & coatings etch. At 28 nanometers and lower, part etching that didn’t matter now does!

Current 28 nanometer

Technology and lower

Data Source:

Sun, Jennifer, AMAT

“Yttria Applications”

Patent #8,067,067

Nov 29, 2011

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Summary • Parts generally missed the Ultra-Clean Revolution

• Parts are generally not really clean

• “Thank Goodness” dirty parts do work above 28 nanometers

• Fabs pay a lot to use the tool for part “metrology”

• TXRF, Tencor, VPD, RGA, Test Wafers, Test Wafers, Conditioning Time, etc.

• But in the sub 28 nanometer world . . . . . . .

“Things that didn’t matter now do!”