PowerBenchPowerBenchProgrammable Power SupplyProgrammable Power Supply

Final presentation – part AFinal presentation – part AMarch 20March 20thth, 2009, 2009

Gregory KaplanGregory KaplanDmitry BabinDmitry Babin

Supervisor: Boaz MizrahiSupervisor: Boaz Mizrahi

Project OverviewProject Overview

A versatile power supply A versatile power supply unit with multiple outputs unit with multiple outputs for laboratory use and for laboratory use and testing of various testing of various electronic devices. electronic devices.

Key featuresKey features

Programmable source/sink/meter Programmable source/sink/meter operationoperation

Up to 4 independent channelsUp to 4 independent channels Two-way communication with a Two-way communication with a

PCPC Portable designPortable design ModularityModularity

Portability featuresPortability features

Compact and lightweight caseCompact and lightweight case USB interfaceUSB interface Sink and meter functions can Sink and meter functions can

operate from battery poweroperate from battery power

Modular designModular design

Configuration can be selected Configuration can be selected according to client needs:according to client needs:– 2 or 4 channels (with or w/o 2 or 4 channels (with or w/o

negative channel)negative channel)– USB2.0 FS (12Mbit/s) or HS USB2.0 FS (12Mbit/s) or HS

(480Mbit/s)(480Mbit/s)– FPGA upgrade path existsFPGA upgrade path exists– Can function without battery Can function without battery

High-level overviewHigh-level overview

Active load

Power supply

Control unit

User interface for standalone operation

LCD KeysLEDs

DUT

Measurement unit

SpecificationsSpecifications

Source operationSource operation– Output voltage: 0.9 toOutput voltage: 0.9 to 12.6 V 12.6 V– Output current: 0 to 3.5 AOutput current: 0 to 3.5 A– Programming resolution: < 5 mVProgramming resolution: < 5 mV– Ripple and noise: < 20 mV peak-to-peakRipple and noise: < 20 mV peak-to-peak– Settling time: < 1 msSettling time: < 1 ms– Programmable current limitsProgrammable current limits

Load operationLoad operation– Input current: 0 to 3.5 AInput current: 0 to 3.5 A– Programming resolution: < 5 mAProgramming resolution: < 5 mA– Settling time: < 0.5 µsSettling time: < 0.5 µs

Meter capabilitiesMeter capabilities– Bipolar voltage precision: < 5 mV (5 MHz bandwidth)Bipolar voltage precision: < 5 mV (5 MHz bandwidth)– Bidirectional current precision: Bidirectional current precision: < 5 mA < 5 mA (1 MHz (1 MHz

bandwidth)bandwidth)

Expected performance Expected performance – LDO– LDO

An example of the simulated transient response of the LDO An example of the simulated transient response of the LDO circuit is shown below:circuit is shown below:– Output voltage step: 1V to 12.6V (with load current of 3.5A)Output voltage step: 1V to 12.6V (with load current of 3.5A)– DUT input capacitance: 0DUT input capacitance: 0μμFF, 10, 10μμF, F, 100100μμF, F, 10001000μμFF– Lead inductance of 0.5Lead inductance of 0.5μμH and lead+contact resistance of 100mΩ (each lead)H and lead+contact resistance of 100mΩ (each lead)– Worst-case overshoot: ~ 120mV (~ 1%)Worst-case overshoot: ~ 120mV (~ 1%)– Settling time: <1ms to within 5mVSettling time: <1ms to within 5mV

Time

0s 0.2ms 0.4ms 0.6ms 0.8ms 1.0msV(dut_vcc)- V(dut_gnd)

0V

5V

10V

15V

(71.353u,12.715)

Expected performance Expected performance – load– load

An example of the simulated transient response of the active An example of the simulated transient response of the active load circuit is shown below:load circuit is shown below:– Load current step: 1A with a rise/fall time of 500ns (2MHz)Load current step: 1A with a rise/fall time of 500ns (2MHz)– DUT voltage: 12.6VDUT voltage: 12.6V– Overshoot: 95mAOvershoot: 95mA– Settling time: 300ns to within 5%Settling time: 300ns to within 5%– Assumed lead inductance of 0.5uH and lead+contact resistance of 150mOhmAssumed lead inductance of 0.5uH and lead+contact resistance of 150mOhm

Current statusCurrent status

11stst board (“digital”): board (“digital”): Local power suppliesLocal power supplies USB comm. using chip vendor’s USB comm. using chip vendor’s

softwaresoftware MCU in-circuit programmingMCU in-circuit programming FPGA configuration through JTAG and FPGA configuration through JTAG and

from the on-board SPI FLASHfrom the on-board SPI FLASH Simple test firmware runs in all 3 chipsSimple test firmware runs in all 3 chipsMisc. periphery to be tested:Misc. periphery to be tested:

− Temperature monitoring chipTemperature monitoring chip− Real-time clockReal-time clock

Current statusCurrent status

22ndnd board (“analog”): board (“analog”): Assembled and will be tested as Assembled and will be tested as

soon as sufficient firmware support soon as sufficient firmware support is availableis available

Current statusCurrent status

33rdrd board (“panel”): board (“panel”): Basic features not requiring Basic features not requiring

firmware supportfirmware support More thorough tests will be done as More thorough tests will be done as

soon as sufficient firmware support soon as sufficient firmware support is availableis available

Short-term roadmapShort-term roadmap

Establish a stable and comfortable Establish a stable and comfortable working environment:working environment:– (Re)program any chip directly from PC (Re)program any chip directly from PC

(in(in progress)progress)

– Use the LCD and keyboard as a debug Use the LCD and keyboard as a debug consoleconsole

Start development of the functional Start development of the functional firmware and software, and use it firmware and software, and use it to test the “analog” boardto test the “analog” board

QuestionsQuestions

??¿¿

StatisticsStatistics

1 project1 project

2 partners2 partners

3 boards3 boards

17 months17 months

~60 breakfasts at Zoran~60 breakfasts at Zoran

129 different electronic components129 different electronic components

612 Mb in project folder612 Mb in project folder

996 nets996 nets

1221 total parts1221 total parts

~2200 man-hours~2200 man-hours

4017 solder pads4017 solder pads