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Curing of Diglycidyl Ether of Bisphenol with Nitro Derivatives of Amine CompoundsYanxi Zhang and Sergey Vyazovkin
Department of Chemistry, University of Alabama at Birmingham, Birmingham, AL 35294
IntroductionIntroduction
Cured epoxy resins are one of the most important thermosetting polymers, which are extensively used as composite materials and adhesives. If liquid crystalline (LC) structures are introduced into epoxy networks, their performance application can be improved. Recently studies have been initiated on a new type of epoxy resin, DGEBP due to the interest on liquid crystal materials. Another application area is nonlinear optical materials. The latter can be produced by curing of epoxy with nitro derivatives of amino compounds.
Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), polarized light microscope (PLM), isoconversional kinetic analysis were used to study the cure reaction of DGEBP with three aromatic amines. Quantum mechanical calculations complement the experimental findings.
Main reaction of epoxy-amine cureMain reaction of epoxy-amine cure
H2C CH + RNH2 RNHCH2CH(OH)O
H2C CHO
+ RNHCH2CH(OH) RN(CH2CH(OH) )2
Primary amine addition
Secondary amine addition
Materials and methodsMaterials and methods
O CH2 CH CH2CH2 CH CH2
O
O
O
Diglycidyl Ether of Bisphenol P (DGEBP)
N
N
N O
H2
H2
2 N
N
NH
O
H2
2
2
NH2
NO2
NO2
3-Nitro-1,2-phenylenediamine(3-NPDA)
4-Nitro-1,2-phenylenediamine(4-NPDA)
2,4-Dinitroaniline(2,4-DNA)
Advanced isoconversional kinetic analysisAdvanced isoconversional kinetic analysis
n
i
n
ij j
i
tTEJtTEJE
1 ,
,
dttRT
Et
ttTEJ
ii
exp,where
TGA DMA DSCPLMResults DiscussionResults Discussion
exo
DGEBP/4-NPDA
T /oC
Heat
Flo
w /m
W
Mas
s Fr
actio
n /%
70
80
90
100
0 50 100150200250300350-4
-2
0
2
4
DGEBP
65
70
75
80
85
90
95
100
Mas
s Fr
actio
n /%
T /oC
DGEBP
0 50 100150200250300350-4
-2
0
2
4 DGEBP/3-NPDA
exo
Heat
Flo
w /m
W
DSC and TGA curves at 2C min-1
0.05
0.10
0.15
0.20
0.25 tan
Tan
T /oC0 100 200 300 400
0
1x107
2x107
3x107
4x107
5x107
6x107
G'
Mod
ulus
/Pa
0.00
0.05
0.10
0.15
0.20
0.25 tan
0 100 200 300 4000.0
5.0x107
1.0x108
1.5x108
2.0x108
2.5x108
G'
Tan
Mod
ulus
/Pa
T /oC
DMA curves for DGEBP/4-NPDA DMA curves for DGEBP/3-NPDA
ConclusionConclusion
Cure reaction of DGEBP with 4-NPDA occurs in one step and cure reaction of DGEBP with 3-NPDA involves two steps, which are assigned to the cure of DGEBP with –NH2 in position 1 and in position 2 respectively.
DGEBP/4-NPDA system shows the formation of a liquid crystalline phase that can be converted to another mesophase on cooling if the system is not completely cured. The transition becomes irreversible on further heating.
Presence of –NO2 group makes neighboring –NH2 group highly congested and hindered from nucleophilic effects by electrostatic repulsion of the –NO2 group, which leads to a significant increase (from 50 to 100kJ mol-1) in the activation energy of cure reaction .
H Electrostatic Charge
O Electrostatic Charge
N N-H bond angle
H2 0.467 O1 -0.542 N1 110 H8 0.444 O2 -0.547 N2 109.78 H1 0.449 H7 0.482
H Electrostatic Charge
O Electrostatic Charge
N N-H bond angle
H8 0.492 O1 -0.600 N2 113.91 H2 0.443 O2 -0.519 N3 109.72 H9 0.488 H3 0.445
H Electrostatic Charge
O Electrostatic Charge
N N-H bond angle
H1 0.485 O1 -0.585 N1 116.77 H7 0.436 O2 -0.512
100 120 140 160 180-30-24-18-12-6-20246
exo
3'
3
2'
2
1'
1
Heat
Flo
w /m
W
T /oC
DSC curves for repetitive heating and cooling of
DGEBP/4-NPDA system at 2C min-1
Micrograph of the cured DGEBP/4-NPDA under crossed polarizers
(50x)
158C 170C 181C
191C
191C
Micrographs of DGEBP/4-NPDA system from a PLM with hot stage at 2C min-1
212C
0 100 200 300 400
-8
-4
0
4
8dc
c
cb
b
b
a
a
a
exo
DGEBP/3-NPDA DGEBP/4-NPDA DGEBP/2,4-DNA
Heat
Flo
w /m
W
T /oC
0.0 0.2 0.4 0.6 0.8 1.040
60
80
100
120
140 DGEBP/2,4-DNA DGEBP/3-NPDA DGEBP/4-NPDA
E k
J m
ol-1
ReferenceReferenceYanxi Zhang, Sergey Vyazovkin, Macromolecular Chemistry and Physics, 2005, 206, 342; 2005, 206, 1084; 2005, 206, 1840
212C
DSC curves at 2C min-1
Variation of activation energy with conversion
0 50 100 150 200 250
-3
-2
-1
0
exo
172oC
142oC
135oC
8 h
6 h
0 h
Hea
t Flo
w /m
W
T /oC
DSC curves for Tg of DGEBP/3-NPDA at 20C min-1
DSC and TGA curves at 2C min-1
0 50 100150200250300350
DGEBP
Heat
Flo
w /m
W
-4
-2
0
2
4
6 DGEBP/2,4-DNA
70
80
90
100 exo
Mas
s Fr
actio
n /%
T /oC
DSC and TGA curves at 2C min-1