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Planar Polymer Waveguides for Medical Applications
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Agenda
● vario-optics ag● Planar polymer waveguides and their
integration● Coupling schemes● EOCB's for medical sensors●
EOCB's for high speed data transfer● Conclusions
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vario-optics agHeiden, Switzerland
● Spin off from Varioprint AG● Own clean room with necessary
equipment● Financed privately● Independent from Varioprint
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History
2002 Varioprint starts development of EOCB technology
2004 Cleanroom installation1st patent filed
2005 1st electro-optical circuit board demonstrated at SMT in
Nürnberg
2006 Establishing regular EOCB fabrication runsSuccessful
completion of 2 EOCB-projects
2007 Winner of “Swiss Technology Award 2007”2008 Assembly of
electro-optical components with
conventional SMD insertion machines2009 Spin-off vario-optics
ag2011 New LDI- and layer deposition machine
installed
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Electro-Optical Circuit BoardLayer Build-up
Mirror Waveguide
Electrical layers
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Manufacturing:Substrate
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Manufacturing:Deposition of Lower Cladding
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Manufacturing:UV-Curing
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Manufacturing:Deposition of Core Layer
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Manufacturing:Mask- or LDI- Structuring
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Manufacturing:Development of Core Layer
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Manufacturing:Deposition of Upper Cladding
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Manufacturing:UV-Curing
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Manufacturing:Lamination
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Waveguide Properties
● Substrates: rigid, flex, up to 305 x 460 mm2
● Dimensions: 30 x 30 µm2 – xxx x 500 µm2
● Pitch: min. 60 µm (aspect ratio: 1:1)
● Optical attenuation: < 0.05 dB/cm @ 850nm
● Numerical Aperture: 0.33 ( /2 = 19.2°)Θ
50 µm
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Additional Degree of Freedom in Design
Splitter / Combiner
Taper / Lense Structures
Crossings
High density interconnects
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Butt-Coupling
● Direct, horizontal coupling(LED's, Laser/Photodiodes,
Fibers)
● High coupling efficiency● No further optics required● Passive
assembly
PCB with electronic components
Lower cladding layer
Core layer
Upper cladding layer
LED Waveguide carrier (FR4)Optical Casting
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Coupling Element
● Optical attenuation: 1.2 dB
● Pitch: 500 µm
● Pick & Place tolerance: ± 100 µm (3 dB loss)
● Layer thickness variation: up to 1mm
Opto-Electronic Device
Mirror
WaveguideParallel
LightBeam
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Electro-Optical Circuit Boards for Medical Applications
● Sensors– Light sources– Light absorbance– Evanescence field –
Index change– Bending– ...
● High speed data transfer– High speed
imaging– Bio-chemical
simulations (Supercomputing)
– ...
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EOCB's for Sensors
● Better optical performance for splitters/ combiners compared
to fiber-based systems
● High reproducibility● Complex planar
optical systems
● Highly integrated electronics and optics
● Automated, passive assembly
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Highly Integrated, 4-Wavelengths-Laser-Source
● Highly integrated, fits into a cigarette box
● Competes with free-space and fiber based optics
● 4 laser sources of different wave-lengths coupled into one
glass fiber
● Splitter for reference channel
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Optical PH-Electrode
● Highly integrated electro-optical sensor for PH-detection
(spectral absorption)
● Complex planar optical structure● Optical layer thickness: 500
µm
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Blood-Coagulation Sensor
● Puck – electro-magnetically moved
● Light barrier to monitor movement
● Highly integrated electro-optical sensor
Puck Bood
3 mm
5 mm
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Evanescence Field / Index Change
● Cladding layers can be structured as well
● Detection of the presence of material
„Open cladding“
Exposed waveguides
Cladding
Core
Medium
n1 n2
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Optical vs. Electrical High Speed Signal Transmission
● Higher bandwidth density
● Lower cost at high datarates
● Reduced complexity
● Significant reduction of power losses (up to 75%)
● No electro-magnetic radiation
● Galvanic separation
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Optical Flex Supporting High Data Rates
● 1 x 48 inputs, 4 x 12 outputs● > 480 Gbit/s● Passively
assembled MT-ferrules● Realized by panel-size (305 x
460 mm2)
MT pins
Alignmentstuds
Coppermarkers
waveguides
Alignmentslots
PCB
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Optical Backplane
● Rigid-flex board (260 x 360 mm2)
– 192 waveguides on backplane (2 Tbit/s)
– 192 waveguides on linecard
● Finisars optical Engine
– 2 x 12 x 10 Gbit/s, passively cooled
● Huber + Suhners optical backplane connector
Live demo – data rate of 10Gbit/s
Backplane(4 Linecards)
Optical Engines
Line-card
Backplane Connector
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Conclusions
● Electro-optical circuit board technology is used within more
and more applications
● Data- and telecom applications can profit from reduced costs
and power consumptions at higher data rates
● Better optical performance and reduced costs for complex
optical systems for sensor application
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Contact
Dr. Felix BetschonMittelbissaustrasse
CH-9410 Heiden, Switzerland+41 71 898 80 60
[email protected]
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The future is bright!
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