PIC: the next generation IC - · PDF fileSource: MIC Japan, Fujitsu, NTT; ... 100G 100/400G becomes more ubiquitous using SM fiber 100G ... modulator semiconductor optical

Michael LebbyProfessor, Glyndwr University

CEO, OneChip Photonics

Director Corp Relations, USC

PIC: the next generation IC…

Within photonics we should

focus on 3 takeaways…

• Will photonics enables many things and will be part of our lifestyle?

• Will photonics will be integrated – just like ICs 50years ago and will it drive new product designs?

• Is integrated photonics a paradigm shift for the tech community?

Now let’s look at the details…

Agenda

• Introduction to photonics

• Global markets for photonics

– Lighting, solar, communications, displays

• Integrated photonics applications

– Datacenters, medical, consumer

• Is photonics the next generation IC?

– InP, SiP, PP platforms

• Summary

The impact of

photonics on our

lifestyle…

A decade ago what were

we thinking at OIDA?

Is photonics our lifestyle? Everything has happened…

A decade ago: a truly green vehicle

with solar/LEDs/battery…

High tech in 2005…Sources: Philips Lumileds

Today photonics enables a

future lifestyle (Japanese view)

Through the visualization of unseen things…Sources: OIDA research, IOA

• Atmosphere

• Hidden objects

• Bacteria

• Viruses

• Safety

• Health

• Comms

• Internet

In a decade: driverless cars…

photonics everywhere

From sensors, displays, fiber, LEDs, lasers…

In a decade: Utilizing solar

energy will be more important…

• CPV produces

more electricity in

areas of high direct

normal irradiation

(DNI) than

conventional PV

systems

• CPV advantages:

– High insolation

– Low diffuse to

direct ratio

– Annual average

DNR 6.9kW/m2

per day (High)

Sources: Solar Systems

Will solar CPV (concentrated PV) accelerate?

In a decade: Photonics in

renewables…burst through barriers

• Barrier: Scaling up renewable GW in our infrastructure– Cost of renewable electricity

– Performance and reliability

– Infrastructure robustness and capacity

– Simplfying dispatchable energy (wind)

• Barrier: Obsoleting petroleum (fossil) based fuels– Cellulosic ethanol cost (wood, grass, non-edible plants)

– Life cycle sustainability of biofuels

– Fuels infrastructure, standards, metrics

– Demand, utilization and intermediate blends

• Barrier: Shrinking energy demand of buildings, automotives, etc– Coordinated implementation of model building codes

– Market does not value efficiency

– Cost of energy efficient technologies

– Performance and reliability of new technologies

Sources: NREL, Dan Arvizu

We need decade programs: attitude cultural

Global markets

for photonics

Photonics categories:

broad and varied

Photonics

Industry

OE/photonic

components- HBLED, LED module

- CCD, Image sensor

- Solar cell

Flat panel displays- LCD (TFT, TN, STN)

- PDP, VFD, OLED

- Microdisplay, LTPS TFT

Optical I/O devices- DSC, copier, fax

- Laser printer, bar code

- Scanner

Optical storage- CD, DVD, Bluray

- Optical disk player for PC

- RW disk

Optical fiber comms- Optical cable, passives

- Optical comms equip

- Optical actives, modules

Precision optics- Lasers, optical lens

- Precision optical lens

- Laser app equip

Solid state lighting- In-organic LED. module

- Organic LED, module

Large opportunity for integrationSources: OIDA research, IOA

0.0

100.0

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300.0

400.0

500.0

600.0

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Re

ven

ue

($B

illio

n) Photonic lighting

Precision optical lens and laser

Optical fiber comm

Optical storage

Optical I/O devices

Flat panel displays

Optical components

Global photonics market

(USA perspective)

• Growing from $353B in 2009 to $516B in 2021

– FPD big driver 3.9% CAGR; SSL still best growth at 29% CAGR

Sources: OIDA research, IOA

Outlook is strong for photonics…

$516B

2021

Global photonics market

(Taiwan perspective)

• Growing from $551B in 2012 to $649B in 2015 (~$850B in 2021)

– FPD remains big segment at $196B; lighting growing to $43B by 2015

After 2009; steady increase towards $1T mktSource: IOA

$430B

$649B$551B

Photonics in Japan

• Domestic production in Japan ~$100B

• Solar and lighting strong growth

Rise of Asia in photonics affecting JapanSource: IOA, OITDA

2008

PV

GDP

Domestic photonics production

Global solar markets

(Taiwan perspective)

Solar corrected, but now in growth again

• Market growing quickly to 50GW in 2015

• Production corrected in 2011; now at $148B

Source: IOA

CorrectionGW $B

Lighting market growing steadily…

(Taiwan view)

Solid state lighting is not going away…Source: IOA

• By 2020 lighting market is 65%!

– LED 54% and OLED 11%

• By 2015 LED/OLED combine for $43B

$B

$B

2020

What are the

drivers for the

next generation

communications?

Network as a catalyst for

change in lifestyle

• Social lifestyle personal lifestyle

Before

Computer centric

Experts level

Data exchange

Exchange

Today

Network centric

Trained level

Archival access

Datacenter

Future

User centric

Pedestrian level

Cloud access

Large datacenter

Source: M IC Japan, Fujitsu, NTT; OIDA Research

Lifestyle evolves through heavy use of data and traffic

Social networking user growth is

driving bandwidth, datacenters, infrastructure

Trend is not slowing: its accelerating…Source: dreamgrow.com

>1Billion

from Exa to Zetta-bytes…

Source: Cisco, pcmag.com

Driven by consumer internet…

Kilo = 103

Mega = 106

Giga = 109

Tera = 1012

Peta = 1015

Exa = 1018

Zetta = 1021

Yotta = 1024

Only 60+ Exabytes/month in 2014 and growing…

Internet traffic to reach 1.3Zettabytes by 2016…

107Exabytes

2016

VNI = Visual networking index

Now we have the

emergence of

new traffic

patterns…

Evolution of a new

datacenter fabric

Cloud era data

center fabric3.Modern spine/leaf

data center2.Legacy multi-tier

data center1.

5% of traffic EW Up to 75% of traffic EW

Source: Cisco and Juniper

N-S flow – legacy

Low connections

E-W flow – virtualization

Many connectionsOmni-flow fabric

Enormous connections

78% CAGR of internet bandwidth growth to 2016

Which means we

have to upgrade

the hubs…

It was telephone exchanges

in the 60s…

Telephone exchanges: large buildings to aggregate traffic…Source: GPO

Noisy: 1000s of crickets…”strowger” switch

• ~100kbps ‘board/rack’ aggregate

• ~X10,000,000 slower than…

Today everything is

going datacenter…

Google today…ubiquitous tomorrowSource: Google

Sound of fans whirring – the comm’s hub of the future

• ~1Tbps board aggregate

We have to

address

datacenter pain

points…

DC: engineering headaches

with pain points

LARGER

FASTER

GREENER

DENSER

Single Mode

Fiber

400G plus

< 2W/port

Smallest footprint

(QSFP, microQ)

photonics is the

ideal platform to

achieve these

specs

Photonics is going to

another level by adding

electronics (OEIC)

Advanced technology will win datacenter…

DC = Datacenter

Datacenter

Single mode fiber wins

in the datacenter

500m 2km 10km

100m

Modern data center requires 500m ~ 2km

STOP

Multi Mode Fiber (SR)

Single Mode Fiber (LR)

100G

100/400G becomes more ubiquitous using SM fiber

100G

VCSEL laser

DFB laser

Standards at

400Gbps for

datacenters

Company Method Gbit/s # Demonstrated Comments

JDSU/Fujitsu DMT 100 4 TOSA with integrated four

DML TOSA with multiplexer

(EML and MZM options)

BER ok but marginal and uses

expensive Fujitsu DAC

Huawei PAM4

DMT

NRZ

56 8 NRZ with four EML TOSA Prefer 56 Gbaud to 112 Gbaud for

reasons of limited bit error rate

Oclaro NRZ

PAM4

50

100

8

4

No 8 laser TOSA needs 24% more

power than 4 laser TOSA

Mitsubishi /

Oclaro

NRZ 50 8 EML TOSA single channel Preferred – best link budget

Cisco PAM4 56 8 Lithium niobate single

channel

NeoPhotonics PAM4 112 4 Single components LiNbO3 Limited by DAC bandwidth

NeoPhotonics PAM4 56 8 Single Components EAM

NEC PAM4

NRZ

56 8 No

NEC PAM4

DMT

112 4 No

Hitachi PAM4 100 4 EML and LiNbO3 comparison EML version preferred solution

Standards activity

for 400Gbps

50Gbps is a common theme…

Photonics integration

drives miniaturization

(and higher traffic

capacity)

The quest for smaller boxes

(and 100Tbps)

2012 2013 20142011 2015

Switch Density Tbps

400G

800G

1T

10T

CFP

CFP/2

CFP/4

QSFP LR4 200Gbps (4x50)

CFP

CFP/2

CFP/4

QSFP

Source: Molex (modified to fit in the context)

OneChip

OEIC engine

Industry

Miniaturization enables the roadmap: PIC drives it…

Ultra-small, ultra-fast

OEIC engine for

Micro QSFP

Line rate 50Gbps

Initially 4 channels (4x50) = 200Gbps

Later 8 channels(8x50) = 400Gbps

100T

14 © 2013 Ethernet Alliance

Why do we integrate?

! Density!

SX1016 – 640 Gb/s: 64 Port 10 GE Switch

SX6036 – 2 Tb/s: 36 Port QSFP+ Switch

Many Terabit Switch

SFP and QSFP pluggable transceivers provide excellent front panel density, but they do have limits

QSFP 400Gbps (8x50)

Micro QSFP 800Gbps (16x50)

2016

PIC OSA engine(Photonic Integrated Circuit,

Optical sub-assembly)

Standard

Tx/Rx Modules

Solving the “compactness”

problem

144 mm2

PLC

Discrete

solution10.2 mm2

SEI InP PIC

(Oct 2013)6.75 mm2

(1.5x4.5)

OCP solution

Integrated photonics drives higher traffic capacitySource: Optoplex, SEI

Traffic is not the

only application

for integrated

photonics…

Medical applications:

Optical coherence tomography

Integration enables miniaturization SiP PIC (visible λ)?Source: USDHHS, Topcon, Envisonoptical , Wikiepedia, Photonics.com, GE, Intel

Sarcoma

Eye

Integrated chip

Mid infra-red applications:

Spectroscopy

Integration enables miniaturization III-V PIC?

FTIR (Fourier transform infrared spectroscopy)

Source: Nature, Wikiepedia, Agilent, Ocean Optics, Robertsbiology

Integrated chip

Medical applications:

Cytometry and detection

• Measurement & characterization of cells

Integration enables miniaturization SiP PIC?

Flow cytometer

SpectrophotometerHybridization arrays

Source: Becton-Dickinson, Affymetrix, ATI, Wikiepedia

Integrated chip

Capsule endoscopy

using photonics

Source: NIH-NCI, www.givenimaging.com

Integration enables miniaturization PIC intelligence?

Military applicationsfor biophotonics

• Battle space

• CB agent detection

• Biowarfare defense (BWD)

• Food safety

• Field intelligence

• Explosives & landmine detection

• Intrusion detection

• Water quality

• Biomonitoring

• Medical

• Diagnostics

• Forensics

• Infectious disease detection

• Therapeutics

• Drug & vaccine development

• Homeland Defense

• CB agent detection

• Intrusion sensors

• Littoral & border protection

• Explosives detection

• Building & structural monitoring

• Water supply monitoring

• Immune Buildings

• Law enforcement

Source: M CH Engineering

Broad opportunities for PICs in defense…

http://www.ausaid.gov.au/keyaid/medical.jpg

http://www.ausaid.gov.au/keyaid/medical.jpg

http://www.173rdairborne.com/images/iraq-3 soldiers.jpg

http://www.173rdairborne.com/images/iraq-3 soldiers.jpg

Is photonics

integration the

‘next generation’

IC?

Why do we integrate?

• Like any

semiconductor IC:

to achieve key

goals…

– Size, weight, power,

performance, and

cost

– Classic CMOS IC

allows higher

functionality

Integration enables innovative products…Source: Wikiepedia

2.6B transistors

2011

What options do we

have for PICs

today?

3 technology platforms

• Incumbent: –InP (Indium Phosphide)

• New challenger: –SiP (Silicon Photonics)

• Another new challenger: –Polymer Photonics (PP)

Who will win? Will all solutions win?

✔

?

?

✔

Incumbent:

Indium Phosphide

(InP)

Photonic Integrated Circuit (PIC)

Laser

Monitor

MonitorTAP

1:4 Splitter

EAMOD

Waveguide

100G transmitter chip using InPcompound semiconductor with epitaxy

PIC is a circuit with no electronic circuitry

Compound semiconductor

platform - outsourced

• Indium Phosphide (InP)

• Foundry epitaxial growth

• Foundry fabrication

Photonics devices are all

integrated together

• Waveguides, optical routing

4x25G PSM4

Transmitter

100G Coherent

Receiver

(a.k.a. 2x4 90°

Hybrid Rx)

(TIA at back)

100G Coherent

Receiver

(a.k.a. 2x4 90°

Hybrid Rx)

(TIA on side)

OneChip approach to InP PICs

• Fully monolithic InP PIC

– Core strengths

• Waveguide design

– Dilute waveguide for package

connection

– Passive guide for routing

• Integration of electrical components

– Resistors/capacitors

• Edge detector for high speeds

• Laser emitter and modulators (DC/AC)

• Fabrication of complex InP devices in a

fabless model

8yrs of PIC development at OneChip

InP PIC building

blocks developed…

distributed feedback laser

electro-absorption modulator

semiconductor optical amplifier

waveguide photodetector

P

I

P

V

P

I

I

P

ACTIVE COMPONENTS

laterally-tapered spot-size converter

Directional coupler – mode converter

vertical wavelength splitter

planar wavelength division (de)multiplexer

PASSIVE COMPONENTS

OneChip Photonics Component Library

Comprehensive library of components for integration

What’s next for

InP?

OEIC?

A PIC with integrated

electronics…

The game changer –

Integrated electronics to save real estate

• Indium Phosphide transistors are faster than Silicon

• Ft to 400+ GHz allows for future signaling speeds well over 100 Gbps per channel

• Electronics integration enables miniaturization

• No I2C, no pads fan-out

• Electronics integration enables lower power

• Opto-Electronic Integrated Circuit (OEIC)

Pre

-

Am

p

LA

/AG

C

Outp

ut

Buffer

RSSI

I2C Control

Pre

-

Am

p

LA

AG

C

Outp

ut

Buffer

RSSI

I2C Control

Commercial TIA

Customized

Design, no

function

loss

OneC

hip

OE

IC

Integrated electronics keeps all functionality!

PIC Rx chip

OCP WDM

PIC receiver

e.g.Mindspeed

4x25G TIAIntegrated TIA

300% TIA

footprint

reduction

@ 15%

OEIC real

estate

increase

OneC

hip

OE

IC

OEIC enables tiny footprint and lower cost solution

OEIC integrates electronics

onto the PIC…

Source: M indspeed/M ACOM

WDM PIC

receiver with

integrated

TIA = OEIC

The quest for smaller boxes...

with OEICs

2012 2013 20142011 2015

Switch Density Tbps

400G

800G

1T

10T

CFP

CFP/2

CFP/4

QSFP LR4 200Gbps (4x50)

CFP

CFP/2

CFP/4

QSFP

Source: Molex (modified to fit in the context)

OEIC engine

Industry

OEIC enables even smaller chip solutions…

Ultra-small, ultra-fast

OEIC engine for

Sub-Micro QSFP

100T

QSFP 400Gbps (8x50)

Micro QSFP 800Gbps

(16x50 or 8x100)

2016

PIC OSA engine(Photonic Integrated Circuit,

Optical sub-assembly)

Standard

Tx/Rx Modules

New challenger:

Silicon Photonics

(SiP)

Use of $B fabs for

photonics…

What is silicon photonics?

It’s the buzz of today…

• Use the economies of scale of a $B CMOS fab as platform

– Heterogeneous with III-V, oxide, nitride, SiGe for innovative applications

• Issues

– Volume? <1% of the business of a silicon fab: attention?

– Lasers? InP best option (impractical for silicon)

– Packaging: bump/bond InP lasers; I/O with electronics and optics

Many merits; many questions (lots of investment)

?

?

Source: Intel

Will SiP achieve the

cost/performance

metrics???

SiP is complex, however,

innovation with PP helps…

• Silicon photonics needs very high volumes

• Silicon photonics is becoming more complex than

‘simply silicon’

– Detectors, TIA/drivers are requiring SiGe

• SiGe means epitaxial growth $$

– Lasers are InP and require flip-chip bumping/bonding etc

• Integration of CMOS and photonics not easy $$

– Luxtera now packaging 3 silicon chips (CMOS, Laser and Photonics chip) as its

easier than pure monolithic integration…

• SiP integration with polymer photonics (PP)

– Low cost, high performance, less complex fab

Yes – SiP will win in time although mkts may evolve…

✔

✔ ✔

✔✔

New challenger:

Polymer

Photonics (PP)

Blends New Material

• LWLG Multi-Chromophore Process• Increased loading of

chromophore

• Increased EO activity

• Does not sacrifice thermal stability

• Increased durability

• Low voltage

Source: Lightwave Logic (LWLG)

Chemistry of polymer photonics

Polymers offer ‘scalability’ in volume and cost

Polymer photonics: Fiber to slot waveguide

Grating Coupler

Taper CouplerSlot Mode

Grating Coupler

Optical 38GBd

• Reduced size

• Integration advantage

• Improved insertion lossLight in

Taper

Coupler

Initial results promising: polymer and silicon photonicsSource: Lightwave Logic (LWLG)

Flexible OLED displays

enable many new applications

Source: Prof. Changhee Lee, SNU, Korea

Future display

concepts

Applications drive different solutions to photonics

Trade-offs between

the technologies

Monolithic Integration (one

chip)

Polymer photonics with SiP

Opto-Eletronic IC (OEIC) made

possible in single chip

Simpler packaging

Small size

Indium

Phosphide

Low power CMOS

Silicon fab for processing

Economies of scale ???

Silicon

Photonics

Winner has to achieve the clear priorities in their market

All 3 want to do

integrated photonics…

InP incumbent however SiP and PP are attractive… Source: Lightwave Logic (LWLG)

Silicon poor laser…

Polymer photonics with InP

InP laser

SiP and PP photonics

Si driver/TIA

Si Semi-custom ASIC

Technology choice:

Scale shows practicality…

Silicon photonics is not simply a silicon solution…

All InP combinations of technology All SiP/PP

InP laser

InP photonics

InP driver/TIA

InP Semi-custom ASIC

Silicon photonics

✔✔✔

✔✔✔

InP compound semiconductorChallenger

Incumbent

?

Polymer photonics

Challenger

USA Integrated

photonics

competition and

update (2015)

USA competition in 2015

•IMI (Institute for Manufacturing Innovation)–$1B investment for 15 manufacturing hubs

–Integrated photonics one of the hubs

–$110M over 5years

–End to end innovation ‘ecosystem’• Domestic integrated photonics chip fabrication foundry access,

seamlessly integrated and standardized design tools, automated packaging, assembly and test, and workforce development

Driven to strengthen manufacturing in USA

Integrated photonics competition finalists

• Florida (led by UCF) called PRISM– Vertically integrated foundry play with 68 industrial partner

– Universities: Georgia Tech, Clemson, Illinois, Alabama

– Cited expertise: Flexible glass, specialty fiber, high power diode lasers

• New York (led by SUNY) called AIM photonics– Vertically integrated foundry play with total funding ~$650M

– 21 industrial partners with 5:1 match (PR April 2015)

– Universities: Rochester, Arizona, UCSB, MIT

– Cited expertise: Silicon photonics, large 300mm fab that is IMEC-like

• California (led by USC) called IPI-CDMS– Horizontally integrated foundry play with total funding ~$500M

– >60 industrial partners

– Universities: ASU, Ohio state, UCSD, UC Berkeley, UCLA

✔

✗

✗NY vertical integration model won…

DoD guidelinesfor funding

DoD wanted focus in design, test, A&Pkg, education, training

Low-Volume

Circuit

Designers-- Startup, SMEs, IDMs,

Defense, University, etc.

Since 1981

ITAR – USA Vendors

DMEA Accredited/Trusted

• Design Kits, Doc

• Design Check

• Technical Q’s

• Prototypes/Small Prod.

• Flexibility on Die Size

Dicing + Packaging• Flip-Chip, Plastic, …

Process

Monitoring• In situ circuits

Circuit Designs

User Support

Cost-Effective Prototype

and Small-Volume

Chips

>60,000

Completed

Projects

Wafer + Device Testing• Parametric, Functional

Leading Foundry Access• Small Lots, Multi-Project Runs

• TSMC, IBM, Global Foundries, …

• CMOS, RF, III-V, MEMS, Photonics

MOSIS horizontalbusiness model

MOSIS service to IC and fab end-to-end (+ photonics)

Your

Chip Is

Here

Multi-project reticule

~ 50 different designs

Many designs on single die; cost to

customer is approximately in direct

proportion to area used

Shared Costs: mask, wafer, and foundry and packager interface

Typical 28nm CMOS cost: single run: >$4M; MPW user: <$150K

MOSIS MPWstructure (ICs)

Shared costs can be very competitive

Technology

roadmaps

Actual industry needs are complex (will simplify next few slides)

2015 2018 2020 2022

Modules/TxRxData rate density

Form factor

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

S/C chip line rateLevel of integration

Energy/bit

Modulation formatPackaging platform

Generic pkg design

Perf/real estateBumping design

Perf/channel

Channels/real estate

TSV processesChip interconnect

Fiber technology

AC/DC wafer testConnector design

R&QA

25G PIC/OEIC M/Ch 100Gbps OEIC

NH 25GHz PIC OSA NH100Gbps OEIC OSA (SiP or C/S)

SiP PIC stk 10-25GHz TSV+3D stk 50GHz OEIC (SiP or C/S) 3D-baseline 3D 25GHz PIC 3D 50GHz PIC

Purple Brick Wall = Technology cost barrier

Slanted Font: Major industry efforts are required for commercialization

40Gbps 100Gbps 400Gbps 1000Gbps

<10km <10km <2km <2km <2km

10 Tbps/1U 25Tbps/1U 50Tbps/1U 100Tbps/1U 400Tbps/1U

$5/Gbps $2/Gbps <S0.5/Gbps

<$5/Gbps $0.5/Gbps$1/Gbps>$10/Gbps (<2km)

10-100m 5-50m 1-25m

<$1/Gbps <$0.5/Gbps <$0.25/Gbps <$0.05/Gbps

$1/Gbps $0.25/Gbps <$0.15/Gbps

10-25Gbps 50Gbps 100Gbps >1000Gbps Disc Driver/TIA OEIC 100Gbps int Driver/TIAInt TIA OEIC int Driver/TIA 50Gbps

CFP4 QSFP DSFP SFP+ (new)

20pJ/b 10pJ/b 4pJ/b 2pJ/b 0.5-1pJ/b

25GHz FlipChip; 50GHz FlipChip 100GHz Flip Chip

25Gbps/Ch 50Gbps/Ch 100Gbps/Ch

CFP4/1D array QSFP and 2D array SFP & 2D array

100/mm2 500/mm2 1000/mm2 10,000/mm2

10Gb/mm2 40Gb/mm2 (inc driver/TIA) 80Gb/mm2 120Gb/mm2

300m 10G (1D array) 100m 25G (2D array/MCF)

NRZ NRZ/PAM4 NRZ/PAM4/8 NRZ/PAM4-16

10-25G 50G 100G

Std Bellcore Adv R&QA process R&QA C/S & SiP manf product

$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall Coherent?

3D 50GHz OEIC Purple Brick Wall 3D 100GHz OEICPurple Brick WallTSV+3D stk PIC 25GHz

Purple Brick WallNH 50Gbps OEIC OSA (SiP or C/S)

10Gbps PIC Purple Brick WallM/Ch 50G OEIC50G PIC/OEIC

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall 50m 50G (1D/MCF) 100m 25G (1D/MCF)

Purple Brick Wall

Purple Brick Wall DSFP and 2D array

Purple Brick WallR&QA C/S and SiP for prototype

74

Technology cost barriers

2015 2018 2020 2022


Form factor

Typical link reach

Ind wish (@400Gbps)

Institute plan

Typical link reach

Ind wish (@400Gbps)

Institute plan


Energy/bit


Generic pkg design


Perf/channel



Fiber technology


R&QA





<10km <10km <2km <2km

<2km




10-100m 5-50m 1-25m

<$1/Gbps <$0.5/Gbps <$0.25/Gbps

<$0.05/Gbps








100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


3D 50GHz OEIC Purple Brick Wall 3D 100GHz OEICPurple Brick Wall


10Gbps PIC Purple Brick Wall50G PIC/OEIC

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick WallDSFP and 2D array


Purple Brick Wall

= Technology cost barrier

Silicon world…Red brick wall (ITRS) technology barrier

SiP and III-V new world…Purple brick wall (IPI-CDMS) technology cost barrier

Sometimes we have the technology but not at the costfor industry to implement…

These are pain points the industry wants solved

Filling the gaps fordatacenter interconnects

2015 2018 2020 2022


Form factor

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

Typical link reach

Ind wish (@400Gbps)

Photonics foundry


Energy/bit


Generic pkg design


Perf/channel



Fiber technology


R&QA




40Gbps 100Gbps 1000Gbps

<10km <10km <2km <2km <2km




10-100m 5-50m 1-25m









100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall





Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall



Accelerating customer goals by at least 1year or more is an attractive proposition…

Example: for HPC short distance (10-100m) interconnects; industry wishes

$0.25/Gbps @400Gbps in 2019, and folks need to plan on ‘scalable’ technologies

to support $0.25/Gbps @400Gbps by 2018 (1 full year earlier)

Feeding the gapswith technology

2015 2018 2020 2022


Form factor

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

Typical link reach

Ind wish (@400Gbps)

Photonics foundry


Energy/bit


Generic pkg design


Perf/channel



Fiber technology


R&QA




40Gbps 100Gbps 1000Gbps

<10km <10km <2km <2km <2km




10-100m 5-50m 1-25m









100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall





Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall



Technology

And the technology will be integrated photonics…

Scalable projects: low cost, low volume

2015 2018 2020 2022


Form factor

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

Typical link reach

Ind wish (@400Gbps)

Photonics foundry


Energy/bit


Generic pkg design


Perf/channel



Fiber technology


R&QA





<10km <10km <2km <2km <2km




10-100m 5-50m 1-25m









100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall





Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall



Optimizing

technology and

creating scalable

solutions to achieve

roadmap goals

Achieve industry metrics:cost barriers

2015 2018 2020 2022


Form factor

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

Typical link reach

Ind wish (@400Gbps)

Photonics foundry


Energy/bit


Generic pkg design


Perf/channel



Fiber technology


R&QA





<10km <10km <2km <2km <2km




10-100m 5-50m 1-25m









100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall





Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall



Optimizing todays

technology and

creating scalable


roadmap goals

Driving through

technology cost

barriers for

industry

The hard to reachchallenges

2015 2018 2020 2022


Form factor

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

Typical link reach

Ind wish (@400Gbps)

Photonics foundry


Energy/bit


Generic pkg design


Perf/channel



Fiber technology


R&QA





<10km <10km <2km <2km <2km




10-100m 5-50m 1-25m









100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall





Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall



Driving through

technology cost

barriers for

industry

Optimizing todays

technology and

creating scalable


roadmap goals

Hard to reach

performance

challenges

A continually evolvingroadmap

2015 2018 2020 2022


Form factor

Typical link reach

Ind wish (@400Gbps)

Photonics foundry

Typical link reach

Ind wish (@400Gbps)

Photonics foundry


Energy/bit


Generic pkg design


Perf/channel



Fiber technology


R&QA





<10km <10km <2km <2km <2km




10-100m 5-50m 1-25m









100/mm2 500/mm2 1000/mm2 10,000/mm2




10-25G 50G 100G


$1/Gbps

Purple Brick Wall

>100G

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Micro-SFP

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall





Purple Brick Wall

Purple Brick Wall

Purple Brick Wall

Purple Brick Wall


Purple Brick Wall



Update metrics,

technologies, timing

as needed by

industry: living

document

Even the venture

capitalists are

smelling

opportunity…

Pertinent transactions in

communications for PIC related technologies

? <30M$,

2012

271 M$, 2012

400 M$, 2013

82 M$, 2013

47 M$, 2013

Technology sale;

40G/100G discrete

components

Technology sale;

40/100G silicon

photonics

$200M rev (2X) to

access InP discrete

40/100G

Technology sale:

Silicon Photonics

solution 40/100G

CMOS VCSEL Driver

and TIA 40/100G with

~$20-30M rev (2X)

Ma230 M$, 2014 InP Laser componentsMACOMBin Optics

High interest (~$1B) in photonics for datacenterSource: Pacific Core Partners

Summary

Let’s review…

• Global markets for photonics are huge and growing ($500B+)

– Lighting, solar, strong growth (especially Asia)

– Communications growth area (Europe/North America)

• Internet is still growing quickly

– Our appetite for data is still growing

– New applications are being enabled through miniaturization

• Integrated photonics is the next generation IC

– PICs will be key chips for datacenters as they grow to 400, 800, 1Tbps

– Trend to integrate electronics with photonics for smaller real estate

– III-V InP, silicon photonics, and polymer photonics all will become

PICs

Integrated photonics is a central theme…

In a decade:

the 3 technology platforms…

• Incumbent: – InP (Indium Phosphide)

• New challenger: – SiP (Silicon Photonics)

• Heterogeneous, oxide, nitride, SiGe

• Another new challenger: – Polymer Photonics (PP), OLED

All will be symbiotic with each other

✔

✔

✔

Remember the 3 takeaways

from the beginning…

• Photonics enables many things and is part of our lifestyle…from medical to consumer

• Photonics will be integrated – just like ICs 50years ago and drive new product designs…absolutely…and the next generation IC…

• Is integrated photonics a paradigm shift for the tech community…no question…

Our thirst for smaller, lighter, faster will enable PICs…

Thank you for

listening:[email protected]

Documents

PIC: the next generation IC - · PDF fileSource: MIC Japan, Fujitsu, NTT; ... 100G 100/400G becomes more ubiquitous using SM fiber 100G ... modulator semiconductor optical