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Physical Model of the Junctionless UTB SOI-FET E. Gnani , S. Reggiani, A. Gnudi, G. Baccarani Advanced Research Center on Electronic Systems (ARCES), Department of Electronics (DEIS) – University of Bologna, Italy MOS-AK/GSA Workshop April 26-27, 2012 Dresden, Germany

Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Page 1: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

Physical Model of the Junctionless UTB SOI-FET

E. Gnani, S. Reggiani, A. Gnudi, G. Baccarani

Advanced Research Center on Electronic Systems (ARCES), Department of Electronics (DEIS) – University of Bologna, Italy

MOS-AK/GSA Workshop April 26-27, 2012 Dresden, Germany

Page 2: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

E. Gnani

Outline

q  Introduction and motivation

q  Analytical model

Ø  Strong & weak depletion regions

Ø  Accumulation region

Ø  Threshold voltage model

q  Results

q  Conclusions

Page 3: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

E. Gnani

Introduction

[1] C.-W. Lee, A. Afzalian, N. D. Akhavan, R. Yan, I. Ferain, and J. P. Colinge, “Junctionless multigate field-effect transistor”, Applied Physics Letters, vol. 94, p. 053511, 2009. [2] J. P. Colinge, C.-W. Lee, A. Afzalian, N. D. Akhavan, R. Yan, I. Ferain, P. Razavi, B. O’Neill, A. Blake, M. White, A.-M. Kelleher, B. McCarthy, and R. Murphy, “Nanowire transistors without junctions”, Nature Nanotechnology, vol. 5, 2010. [3] C.-W. Lee, A. Borne, I. Ferain, A. Afzalian, R. Yan, N. D. Akhavan, P. Razavi, and J. P. Colinge, “High Temperature Performance of Silicon Junctionless MOSFETs”, IEEE Trans. on Electron Devices, vol. 53, no. 3, pp. 620–625, 2010.

q  JL FETs have no n+-i junctions for source and drain since the whole structure exhibits the same type of doping, either n+ or p+ from source to drain.

q  JL FETs have a heavily-doped channel, up to some 1019 cm-3.

q  In a JL FET the current flows mainly in the middle of the channel, and not at the Si/SiO2 interfaces as for inversion mode FETs.

NW-FET JL NW-FET

BOX

n+ n+ i

BOX

n+ n+ n+

Major differences between “classical” and JL FETs

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JL FET advantages q  Drastically simplifies the S/D engineering by

removing the related junctions as well as the S/D extension regions.

q  Nearly ideal SS and very small DIBL. q  Moderate temperature sensitivity of the carrier

mobility at large impurity concentrations. q  Absence of a strong electric field attracting

majority carriers toward the gate interface â  The cross section of the JL device must be small

in order to turn the device off.

J.P. Colinge et al., Nature Nanotechn., 2010.

ü  to understand the JL device behavior

ü  to clarify the motivations for its good properties

ü  to elucidate its strengths and weaknesses Purpose

Page 5: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

E. Gnani

The junctionless SOI FET

substrate

NA

SOI channel - ND

back-oxide

VD VS

VB

VG VG

VB

ϕss

ϕb

ϕs x = 0

x = – tbx

x = – tbx – tsub

x = xs x = xs + tox

The model provides a very accurate solution of the Poisson eq. hence: ü  it accounts for the back-oxide charge and thickness and the potential

drop within the substrate; ü  it allows for the computation of the substrate- and the Si-body lower-

and upper-surface potentials.

Page 6: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

E. Gnani

Poisson equation

Integrating once we can find the charge density at – tbx:

which gives the boundary condition at the lower surface of the channel

We start solving Poisson’s equation within the p-type substrate:

The boundary conditions are:

By neglecting the hole contribution in the SOI channel we have:

Page 7: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Device operating condition Depending on VG and VB, it may happen that, in the silicon channel,

upper and lower surfaces are

both depleted

ϕb

ϕs

upper and lower surfaces are

both accumulated

ϕb

ϕs ϕb

the lower surface is accumulated and the

upper surface is depleted

ϕs

the lower surface is depleted and the upper surface is

accumulated

ϕb

ϕs

The solution depends on the presence of a neutral region in the channel ü  depletion à no neutral region but n may not be negligible compared with ND ü  accumulation à neutral region à 2 separate space charge regions

Page 8: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Depletion condition - I A neutral region does not exist in the channel. The Poisson eq. must be solved with the initial conditions:

uc δu = -1

ξ2

This assumption can be regarded as a 1st-order approximation to the exact carrier concentration.

We do not take the depletion approximation, according to which an abrupt transition occurs between the neutral and depleted regions à we linearize the exponential term by setting u = uc + δu

ξ1

Boundary cond. δu(ξc) = 0 δuʹ′(ξc) = 0

Page 9: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Depletion condition - II

If VB – VS < φth ln(NAND/ni2) we have uʹ′b > 0. Defining α2 = exp(uS - uc) the solution of the Poisson eq. becomes:

ϕb

ϕs ϕs

ϕb ϕb ϕs

depending on whether the two channel surfaces are fully or partially depleted.

Page 10: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Depletion condition - III

If VB – VS > φth ln(NAND/ni2) we have uʹ′b < 0. Near threshold we have a monotonically decreasing behavior of u across the channel. à the largest value of u occurs at the point ξ = 0 where u = ub.

The surface potential becomes:

We define u(ξ) = ub + δu(ξ) and solve the equation:

Boundary cond. δu(0) = 0 δuʹ′(0) = uʹ′b

ϕb

δu = -1

ξd

The value ξd where δu(ξd) = −1 can be found only numerically.

Page 11: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Accumulation condition

In the neutral region we have u ≃ uS, owing to the inequality λSOI << xs

ü  2 separate space charge regions at the lower and upper surfaces ü  it allows to set the b.c. u′(u = uS) = 0 With this simplification we find:

The space charges related with the upper and lower surfaces are:

Page 12: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Electrostatic potentials

Symbols: Sentaurus Lines: this model

VB = 0 V ΦMS =1.12 V

xs = 8 nm tsub = 80 nm tox = 1 nm tbx = 30 nm

NA=1017 cm−3 ND=1019 cm−3 V = 0 V VGS from 0 to 1 V ΔVGS = 0.1 V

Symbols: Sentaurus Lines: this model

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Drain current

ND = 1019 cm−3 xs = 8 nm tox = 1 nm VB = 0 V ΦMS =1.12 V

Page 14: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Back-oxide charge & Substrate polarization Symbols: Sentaurus Lines: this model

V = 0 V VB = 0 V

V = 0 V ρbx = 0

Symbols: Sentaurus Lines: this model

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Quantum confinement Symbols: Sentaurus Lines: this model

VB = 0 V xs = 8 nm NA=1017 cm−3 ND=1019 cm−3

Symbols: Sentaurus Lines: this model

Page 16: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Threshold voltage

Assumptions q  Depletion approximation both in the Si body and in the substrate

à no electron inversion develops at the substrate-BOX interface.

q  Negligible back-oxide charge.

We modeled the device VT and SS against VSB, the back-oxide thickness and the substrate impurity concentration.

Page 17: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Threshold voltage & Subthreshold slope

Solid: tbx = 30 nm Dashed: tbx = 10 nm

Solid: tbx = 30 nm Dashed: tbx = 10 nm

ND = 1019 cm-3

ND = 1019 cm-3

Symbols: Sentaurus Dashed: extracted from ID Solid: VT model

Page 18: Physical Model of the Junctionless UTB SOI-FET - MOS-AK

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Conclusions

q  In this work we have investigated the electrical properties of the JL SOI-FET recently proposed in the literature.

q  The linearization of the electronic charge in Poisson’s equation allows us to find extremely accurate expressions of ϕss as well as of ϕb and ϕs within the Si body vs. VG and VB.

q  A simplified analytical expression of VT and SS has been worked out à excellent agreement with the numerical results, so long as the band bending in the substrate is not so large so as to generate an electron inversion layer.

q  This model sets the framework to understand some important properties, such as the device scalability, the threshold sensitivity to process parameters and its variability due to random dopant fluctuations.