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Photomicrosensor (Transmissive)
EE-SX3340/EE-SX4340Compact Slot / SMD Type (Slot width: 4 mm)
• Unique 4 mm Slot width.• PCB surface mounting type.• High resolution with a 0.5-mm-wide aperture.• Choice of 2 types of Photo-IC output (EE-SX3340: Dark ON,
EE-SX4340: Light ON).
Ordering Information
Photomicrosensor
Ratings, Characteristics and Exterior Specifications
Absolute Maximum Ratings (Ta = 25°C)
*1.Continuous Forward Current and Collector Power Dissipation must be derated complying. The product should be used without freezing or condensation.
*2. In case of reflow soldering, conditions which are shown at the temperature profile should be kept.
Exterior Specifications
Electrical and Optical Characteristics (Ta = 25°C)
Be sure to read Safety Precautions on page 3.
Appearance Sensing method
Connecting method Sensing distance Aperture size (H × W)
(mm) Output type Model
Transmissive(slot type) SMT Emitter 1.04 × 1.4
Detector 1.4 × 0.5 Photo IC
EE-SX3340(Dark-ON)
EE-SX4340(Light-ON)4
5.5
8
4 mm (Slot width)
Item Symbol Rated value Unit Remarks
Emitter
Forward current IF 30 mA --- *1
Reverse voltage VR 4 V ---
Detector
Power supply voltage VCC 16 V ---
Output voltage VOUT 28 V ---
Output current IOUT 16 mA ---
Permissible outputdissipation
POUT 80 mW --- *1
Operating temperature Topr -30 to +85 °C --- *1
Storage temperature Tstg -40 to +100 °C --- *1
Reflow soldering temperature Tsol 255 °C 10 sec.
max. *2
Connecting method Weight (g)Material
Case
SMT 0.2 PPS
Item SymbolValue
Unit ConditionMIN. TYP. MAX.
EmitterForward voltage VF --- 1.2 1.5 V IF = 20 mA
Reverse current IR --- 0.01 10 μA VR = 4 V
Peak emission wavelength λP --- 940 --- nm IF = 20 mA
DetectorPower supply voltage VCC 4.5 --- 16 V ---
Low-level output voltage VOL --- 0.12 0.4 V
VCC = 4.5 to 16 VIF = 0 mA(EE-SX3340)IF = 10 mA(EE-SX4340)IOL=16 mA
High-level output voltage IOH --- --- 100 μA
VCC = 4.5 to 16 VIF = 10 mA(EE-SX3340)IF = 0 mA(EE-SX4340)VOH = 28 V
Current consumption ICC --- 4 10 mA VCC = 4.5 to 16 V
Peak spectral sensitivity wavelength
λP --- 870 --- nm VCC = 4.5 to 16 V
LED current when output is OFF(EE-SX3340)
IFT --- --- 8 mA VCC = 4.5 to 16 VLED current when output is ON(EE-SX4340)Hysteresis H --- 15 --- % VCC = 4.5 to 16 V *1
Response frequency f 3 --- --- kHzVCC = 4.5 to 16 VIF = 20 mAIOL = 16 mA *2
Response delay time tPLH
(tPHL) --- 6 --- μsVCC = 4.5 to 16 VIF = 20 mAIOL = 16 mA *3
Response delay time tPHL
(tPLH) --- 10 --- μsVCC = 4.5 to 16 VIF = 20 mAIOL=16 mA *3
2
EE-SX3340/EE-SX4340
*1.Hysteresis denotes the difference in forward LED current value, expressed in percentage, calculated from the respective forward LED currents when the photo IC in turned from ON to OFF and when the photo IC in turned from OFF to ON.
*2. The value of the response frequency is measured by rotating the disk as shown below.
*3.The following illustrations show the definition of response delay time. The value in the parentheses applies to the EE-SX4340.
Engineering Data (Reference value)
0.5 mm0.5 mm
2.1 mmDisk
tPHL tPLHt
t0
0tPLH tPHL
t
tInput0
Output0
Input
Output
EE-SX3340 EE-SX4340
Fig 1. Forward Current vs. CollectorDissipation Temperature Rating
Fig 2. Forward Current vs. Forward Voltage Characteristics (Typical)
Fig 3. LED Current vs. Supply Voltage (Typical)
Fig 4.LED Current vs. Ambient Temperature Characteristics (Typical)
Fig 5. Low-level Output Voltage vs. Output Current (Typical)
Fig 6. Low-level Output Voltage vs. Ambient Temperature Characteristics (Typical)
Fig 7. Current Consumption vs. Supply Voltage (Typical)
Fig 8. Response Delay Time vs. Forward Current (Typical)
Fig 9. Repeat Sensing Position Characteristics (Typical)
0
20
40
60
80
100
120
0
10
20
30
40
50
60
-40 -20 0 20 40 60 80 100
POUT
IF
Ambient temperature Ta (°C)
For
war
d cu
rren
t IF (
mA
)
Out
put a
llow
able
dis
sipa
tion
PO
UT (
mW
)
For
war
d cu
rren
t IF (
mA
)
Forward voltage VF (V)
0
10
20
30
40
50
60
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Ta = -30°C
Ta = +25°C
Ta = +85°C
IF
RL
ICCVCC
OUT
GND
VOUT
0 2 4 6 8 10 12 14 16
IFT OFF (IFT ON)
IFT ON (IFT OFF)
Ta = 25°CRL = 1 kΩ
Supply voltage VCC (V)LE
D c
urre
nt IF
T (
mA
)
0
0.5
1
1.5
2
2.5
3
3.5
4
IF
RL
ICCVCC
OUT
GND
VOUT
Ambient temperature Ta (°C)
LED
cur
rent
IFT (
mA
)
VCC = 5 VRL = 330 Ω
-60 -40 -20 0 20 40 60 80
0
0.5
1
1.5
2
2.5
3
3.5
4
IFT ON (IFT OFF)
IFT OFF (IFT ON)
VCC
OUT
GND
IOUT
0.001
0.01
0.1
1
1 10 100
Ta = 25°C VCC = 5 V IF = 0 mA (15 mA)
Output current IC (mA)
Low
leve
l out
put v
olta
ge V
OL
(V)
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16
0.18
0.2
-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80
VCC = 5 V IF = 0 mA (15 mA)
IOL = 16 mA
IOL = 5 mA
Low
leve
l out
put v
olta
ge V
OL
(V)
Ambient temperature Ta (°C)
IF
RL
ICCVCC
OUT
GND
VOUT
IF
RL
ICCVCC
OUT
GND
VOUT
Ta = 25 °CIF = 0 mA (15 mA)
0
0.5
1
1.5
2
2.5
3
3.5
4
0 2 4 6 8 10 12 14 16
Supply voltage VCC (V)
Cur
rent
con
sum
ptio
n IC
C (
mA
)
IF
tPLH
tPLH
tPHL
tPHL
t
t
t
VOUT
(EE-SX3@@@)
VOUT
(EE-SX4@@@)
IF
RL
ICCVCC
OUT
GND
VOUT
tPHL (tPLH)
tPLH (tPHL)
0
5
10
15
20
25
30
35
40
VCC = 5 V RL = 330 Ω Ta = 25°C
Res
pons
e de
lay
time
tPH
L, tP
LH (
µs)
Forward current IF (mA)
0 5 10 15 20 25 30 35 40 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6
Ta = 25°CIF = 10 mAVCC = 5 VRL = 4.7 kΩn = repeat 20 times
d1 = 0.005mm
ON(
OFF)
OFF(
ON)
Out
put t
rans
isto
r
Distance d (mm)
Light baffle
(Center of optical axis)
-�0�+d
IF
RL
ICCVCC
OUT
GND
VOUT
3
EE-SX3340/EE-SX4340Safety PrecautionsTo ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor.
This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes.
Do not use the product with a voltage or current that exceeds the rated range.Applying a voltage or current that is higher than the rated range may result in explosion or fire.Do not miswire such as the polarity of the power supply voltage.Otherwise the product may be damaged or it may burn.Do not short-circuit the load.Otherwise explosion or burning may occur.This product does not resist water. Do not use the product in places where water or oil may be sprayed onto the product.
Do not use the product in atmospheres or environments that exceed product ratings.This product is for surface mounting. Refer to Soldering Information, Storage and Baking for details.Dispose of this product as industrial waste.
Dimensions and Internal Circuit (Unit: mm)
Photomicrosensor
CAUTION
Precautions for Safe Use
Precautions for Correct Use
<Detector><Emitter>
<Emitter>
Optical axis
2.5 mm dia. / 0.3 mm recess
<Detector>
2
Recommended soldering patterns
A B
A B
2 6
Cross sectional view B-B
Terminals are exposed in the end face of the board
Cross sectional view A-A
R0.3R0.3
1.5
0.7
0.341.4
11
2.8
1
45.5
(0.4)
0.4
0.4
1
1
1
(0.4)
24±0.2
1
1
2.8
1
1
0.5±0.15
1.5
1.4
4
(2×16°)
(2×0.2)
8
1.5
(2×30°)
(2×0.3)
2×R0.5
(1)
(2)
(4)
(5)
(3)
Terminals are exposed in theend face of the board
Marking(Upper: model, Lower: lot number)
(3)(2)
(1)
(4)
Top view
(5)
EE-SX3340EE-SX4340
Internal circuit
Terminal No. Name
(1) Anode
(2) Cathode
(3) Power supply voltage
(4) Output
(5) ground
Aperture size (H × W)
Emitter Detector
1.04 × 1.4 1.4 × 0.5
Unless otherwise specified, the tolerances are ±0.2 mm.
EE-SX3340/EE-SX4340
4
Tape and ReelReel (Unit: mm) *
Tape (Unit: mm)
Tape quantity1,000 pcs./reel50 pcs./pack ** EE-SX3340-1/EE-SX4340-1 (50 pcs./pack) has no reel, only tape is attached.
80±1dia.
W1
W2
W1 = 13.5±1
W2 = 17.5±1
330±2 dia.
13±0.2 dia.
2±0.521±0.8 dia.
PHOTO MICROSENSOR
Quantity
Country of origin
Lot number
Product name
8.3
4 2 12
1.75
5.5
12
4.2
0.4
5.7
E
C
A
K
1.5 dia.
Tape Pull-out direction
Note: Direction of product packing is upper figure.
EE-SX3340/EE-SX4340
5
Soldering Information
Reflow soldering : Temperature profile1. The reflow soldering can be implemented in two times complying
with the following diagram.All the temperatures in the product must be within the diagram.
2. The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm.
Manual solderingThe manual soldering should not be applied to the products, otherwise the housing may be deformed and/or the Au plating may be peeled off by heat.
Other notesThe use of infrared lamp causes the temperature at the resin to rise particularly too high.All the temperatures in the product must be within the above diagram.Do not immerse the resin part into the solder. Even if within the above temperature diagram, there is a possibility that the gold wire in the products is broken in case that the deformation of PC board gives stress to the products.Please confirm the conditions (including material and method of flux and cleaning) of the reflow soldering fully by actual solder reflow machine prior to the mass production use.
StorageStorage conditionsTo protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions:
Temperature: 10 to 30 °CHumidity: 60% RH max.
Treatment after open1. Reflow soldering must be done within 48 hours stored at the
conditions of humidity 60% RH or less and temperature 10 to 30°C.
2. If the product must be stored after it is unpacked, store it in a dry box or reseal it in a moisture-proof package with desiccant at a temperature of 10 to 30°C and a humidity of 60% RH or less. Even then, mount the product within one week.
BakingIn case that it could not carry out the above treatment, it is able to mount by the following baking treatment. However baking treatment shall be limited only 1 time.
Recommended conditions: 60°C for 24 to 48 hours (reeled one) 100°C for 8 to 24 hours (loose one)
120 sec max.
150 to 180°C max.
1 to 4°C/s
1 to 4°C/s
1 to 4°C/sec
260°C max.
10 sec max.
230°C
255°C
Time (s)
Tem
pera
ture
(°C
)
40 sec max.
• Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product. • Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad
systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms.
OMRON CorporationElectronic and Mechanical Components Company Contact: www.omron.com/ecb Cat. No. E462-E1-04
0819(0117)(O)
Note: Do not use this document to operate the Unit.