1

CHAPTER 14Quality control and environmental activities

2 Environmental activities

1-1 Quality control system1-2 Product reliability1-3 For your safety

1 Quality control

2

Quality control and environmental activities

Quality control1.

Opto-semiconductor products from Hamamatsu Photonics

are used in a wide range of fields including medical diagnosis,

measurement, industrial instrumentation, automobiles,

information equipment, general electronics, and academic

research. As their product applications expand, demands for

even higher product quality and reliability are increasing.

To meet these marketplace demands, we are actively taking

measures to improve product quality levels.

1 - 1 Quality control system

Quality policy

Our policy at the Solid State Division of Hamamatsu

Photonics is to “take responsibility as an opto-semiconductor

manufacturer to establish a quality control system that

provides products the customer needs and to contribute to

the progress of industry and science.” To achieve this policy,

we are making continuous efforts to supply products that

are even better, cheaper, faster, and gentle on the earth to

satisfy customers.

Quality standardization

The Solid State Division employs the ISO 9001 Quality

Management System to standardize quality. In this system,

items that are basic requirements are formalized in a “Quality

Manual” and rules for design, materials, manufacture,

inspection, shipping, and equipment management are placed

in document form as “Standards” to create a consistent

quality assurance system.

Figure 1-1 shows a quality assurance chart.

[Figure 1-1] Quality assurance chart

Customer Divisionmanager

Design,developmentSales InspectionManufacture Quality

control Purchasing Shipment Supplier

Education, trainingSales/equipment/human resource planningBusiness policy

Quality objectives

Product commercialization reviewNew product

needs

Order

OKOK

OK

OK

No Good

Delivery

Receiveorder

Productionplanning

Production Calibration

Acceptance AnswerCustomer

satisfaction

Purchasing Material manufacture

SubcontractingIncoming

Supplier registrationMaterial registration

Quality policyMarketing research

Customproducts

Design plan

Catalog product proposalQua

lity

syst

emD

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tion

Com

plai

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prov

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t

Man

agem

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evie

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Approval

Practical test Inspection

Inspection

Receiving inspection

Reliability test

Quality manual, division procedures, document control

Product design

Design review

Prototype

Design verification

Pilot first sample,first product manufacturing

Design validation

Standard procedures, initial production control planning

Product authorization

Nonconformingproduct control

Product storage

Shipment

ConfirmationComplaint Reception

Root cause investigation, recurrence prevention

ReportCustomer

satisfaction report

Corrective/preventive action

Internal quality audits

ISO committee ISO promotion meeting QC meeting PQC meeting

Evaluation of the quality objectives

KOTHC032EC

Design and development

On the basis of the requirements from our customers

and marketplace, we start investigating the possibility of

production in terms of a new or custom-order product’s

functions, reliability, cost, and so forth.

(1) Input to design and development

We verify the requirements of our customers and marketplace;

outline the functions, performance, applicable regulations,

and the like; and document the information.

3

(2) Output from design and development

The designers outline appropriate information regarding

the input requirements, purchasing, and production

as well as safety and environmental requirements and

create an output document.

(3) Design review

The output from design and development is reviewed to

determine whether the input requirements can be satisfied.

(4) Design and development verification

The output from design and development is inspected

to ensure that the input requirements can be satisfied.

This is conducted in the prototype stage of product

development.

(5) Design and development validity verification

The validity of design and development is verified to

ensure that the product meets the requirements of the

intended application. This includes reliability tests. This

is conducted in the mass production stage of product

development.

(6) Product authorization

Meetings to discuss design (e.g., product specifications),

process (manufacturing and inspection), product (reliability),

and purchasing (subcontractors and suppliers) are held,

and then the product is authorized.

Process management

The production process is supervised based on QC process

charts and work standards to ensure that quality and

reliability are at levels planned in the product design. Main

production processes for opto-semiconductors include

oxidation, photolithography, ion implantation, diffusion,

electrode-forming, and etching in the front end process

(wafer process), as well as wafer dicing, die bonding, wire

bonding, and sealing in the back end process (assembly

process).

To verify that the products meet the required specifications,

Hamamatsu performs process inspections and product

inspections that check the product electrical/optical

characteristics and external appearance. The inspection

items, methods, and test criteria are established in the

product specifications. Destructive testing and lot evaluations

are done by product sampling inspections.

Control to prevent contamination of light receiving/emitting

surfaces is essential for opto-semiconductor products. The

packing process requires use of special packing materials

and techniques to safeguard light receiving/emitting surfaces

from contamination as well as countermeasures to vibration,

impact, temperature/humidity, and electrostatic charges.

Table 1-1 shows a QC process chart example.

Evaluation is made on statistical process control (SPC)

using control charts and the like to determine whether a

process is stable or is in a controlled state as well as process

capabilities. If the control chart indicates an abnormal

tendency or if the process capabilities are insufficient,

the cause of the problem is investigated and fed back to

maintain and improve the relevant process.

Process Control item MethodDocument

No. Symbol Work name Device/condition, item Measuring device, sample Sample size, frequency Record

11-1

Material acceptanceWafer Resistivity, thickness

AppearanceCheckVisual check

Each timeAll wafers

Acceptance inspection sheet Purchasing specificationWork procedure

1-2 Lead frame DimensionsAppearancePlating thickness

MicroscopeVisual checkThickness gauge

1 frame/lot1 frame/lot3 frames/lot

Acceptance inspection sheet Inspection procedure

1-3 Mold resin Characteristics Check When materials are delivered

Purchasing specification

22-1

Wafer processOxidation

Oxidation furnaceTemperature, time

Wafer appearance 1Color, uniformity

Wafer appearance 2SiO2 thickness

Check

Visual check

Thickness gauge

Each time

All wafers

1 wafer/lot

Run sheetWork logbook

Work procedureWafer processManufacturing specification

2-2 Photolithographic work PhotomaskWafer appearance 3

Pattern conditionPattern accuracy, pattern defect

Check

MicroscopeMicroscope

Each time

3 wafers/carrier3 wafers/carrier

Run sheetWork logbook

Work procedureWafer processManufacturing specification

[Table 1-1] QC process chart example (part of process)

4-4

4-2

4

Dealing with process errors

Figure 1-2 shows a system chart for error handling.

[Figure 1-2] System chart for error handling

Fault finder

Confirm details at location and on items

Supervisor Quality control Correctiveaction dept. Purchasing Supplier

Trouble report

Action needed?

Where problemoccurred?

CloseNo

YesIn-house process

Not in-houseprocess

In-house

Supplier

Corrective actioninstruction

Close

Trouble investigationrequest form

Confirmation Corrective actioninstruction

Correctiveaction

Confirmation

Correctiveaction

Recurrenceprevention check

Conf

irmati

onPr

ogre

ss/

coun

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easu

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KOTHC0029EA

When a problem occurs in the production process, which

might cause defects that exceed preset process standards

or might adversely affect the product quality, then the

problematic lot is immediately identified and separated

from other semi-finished parts. At the same time, the cause

of the problem is investigated, and the corrective action

that should be taken is decided. Along with confirming the

corrective action was effective, we take measures to prevent

the problem from reoccurring.

Equipment and work environment management

The work environment in the manufacturing process

greatly affects product quality and reliability of opto-

semiconductor products. Cleanliness, temperature, and

humidity in particular must be strictly controlled. Opto-

semiconductors are produced in clean rooms where

cleanliness is controlled at a high level. To maintain

and control the cleanliness level in clean rooms, strict

control standards are established for factors such as

cleanliness, entry/exit methods, work clothing, carry-in

items, and work procedures. Damage caused by electro-

static discharge (ESD) can be a serious problem as

process geometry shrink and diverse packages become

available, so electrostatic countermeasures are enforced.

The department dealing with products requiring

ESD countermeasures sets up special areas that must

comply with ESD control standards and gives workers

instructions in equipment and work site supervision,

work clothing, and handling methods.

Production equipment is verified after modifications or

expansions and also given regular maintenance. Specific

methods for making start-up and periodic equipment

inspections are established to perform preventive

maintenance, and constant efforts are made to prevent

quality problems and keep stable production.

Product identification and traceability

To establish traceability for determining the production

lot and material lot for the individual products delivered

to our customers, records of each process contain columns

for entering used materials, devices, and production

information. These records are stored securely as product

history information.

When necessary, as shown in the following example, the

type number, production year and month, production serial

number, and so on are indicated on the product.

• Example

S1234 3A 001Serial numberProduction month (alphabetical order... Jan: A, Feb: B, Dec: L)Production year (last digit of year)Type number

Purchasing management

Purchasing management of parts and materials has a large

effect on product quality, so we use a system that judges

and then registers both the suppliers and the parts and

materials for purchasing.

We carry out an inspection of the suppliers to check

compliance with the quality system, environment system,

green purchasing policy, business continuity capability, and

other factors. We then register those suppliers who meet

our standards and also make new and periodic supplier

audits mainly by the purchasing, quality control, and design

departments.

The semiconductor wafers, electrode materials, chemicals,

gases, and the like used to produce opto-semiconductor

products must be of high purity and high quality. The metal

and ceramic materials, printed circuit boards, and mold

resin used for packages must be of high precision and high

quality. These types of purchased items undergo strict

individual testing and are then registered before they can

be used in our products.

An incoming inspection of those purchased items is then

made based on the required specifications to verify their

quality. After acceptance, these purchased items are stored

in properly controlled locations that meet storage conditions

specified in the design standards, and a high level of

purchased item quality is maintained [Figure 1-3].

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[Figure 1-3] Purchasing control chart

Fault investigation request

Examination, acceptance

Acceptance inspection

Supplier evaluation report

Improvement plan

Design Quality control Purchasing/subcontractor management Supplier

New supplier application New supplier

Supplier registrationRequest for decision (internal memo)

Material registration application

Outsourcing application

Site investigation

Confirmation of contents Material registration Delivery specifications and drawings

QC process chart

EstimateSDS

Purchasing specificationsand the like

Preliminary survey sheet for environmentalcontrolled substances

Acceptance inspection standardsRoHS substances analysis report

High-risk material registration application

Supp

lier r

egist

ratio

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info

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Purc

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Purchasing request Order form Material, subcontracting

InvoiceInspection sheet

JudgmentNo Good

RankOther than A

A

Cause investigation

Solution response

Material specialacceptance application

Investigation, answer

Investigation, answer Material special acceptance control form

Material change application

Response Acceptance

Material change or cancellation application

Material change or cancellation Initial product, special acceptance form

Rank Amount of annual business

Basic business contractQuality assurance agreement

QC check sheetsupplier environmental

investigation report

Organization chartQuality assurance

system chartMonthly purchasing report ISO registration

certificateSite investigation plan,

result report

Site investigation

Site investigation report

Evaluation Improvement activitiesNo Good

B

S∙A

KOTHC0039EC

Measurement management

To perform product inspection accurately, a system

(traceability) to ensure the accuracy of measuring equipment

is implemented. Calibrators for calibrating the measuring

equipment are traceable to national standards through

measuring equipment manufacturers, public organizations,

or standard equipment in Hamamatsu Product Management

Division. In addition, inspection equipment and standard

elements are traceable to measuring equipment [Figure 1-4].

Furthermore, in addition to calibration, start-up inspections

and periodic inspections are made to detect and prevent

degradation in accuracy and malfunction in measuring

equipment and inspection equipment.

[Figure 1-4] Measuring equipment traceability

Solid State DivisionQuality control

Product managementdivision

National standardPublic calibration laboratory

Corporation calibration laboratory

Other calibrationlaboratory

Calibrator

Solid State DivisionManufacturing dept.

Measuringequipment

ProductsCustomer

Standards

Private calibration laboratory Measuring equipment manufacturer

Japan Electric Meters Inspection Corporation

AIST, NIST*

Measuring equipment standards, calibrator

Calibrator

Measuring equipment

Products

Inspection equipment, standard element

* AIST: National Institute of Advanced Industrial Science and Technology (Japan) NIST: National Institute of Standards and Technology (U.S.)

KOTHC0033EB

[Figure 1-5] Measuring equipment inspection example (for photodiode)

→Calibration

Standard (calibrator) Measuring equipment (source meter)

Periodic inspection

Inspection equipment made by Hamamatsu(photodiode measuring device)

Standard element(photodiode)

→←Start-up

inspection

[Figure 1-6] Calibration certificate example of calibrator

6

Change control

Changes such as in designs, purchased items, production

methods, and equipment are made in order to improve

product quality, function, reliability, and productivity.

Change planning is first drawn up, the job schedule from

change setup to completion is clarified, and the planning

is then finalized at a change conference attended by all

related departments including quality control. Finally,

the change is decided after evaluating the effects on

quality, reliability, productivity, etc. Changes requiring

the customer’s approval in advance are implemented

after obtaining the customer’s consent. Initial production

control is performed as needed and a final check made of

all effects caused by the change [Figure 1-7].

[Figure 1-7] Change control chart

Close

Follow-up

First sample confirmationCustomerconfirmation First sample control/initial production control

Change implementation

Revised standards

Change decision

Confirmation of customer’schange decisionCustomer evaluation

Customeragreement

Needed

Not needed

Issue of changeapplication formChange application

ConfirmationConfirmation Change application

Design verification/validation

Change meetingChange proposalCustomerconfirmation

NeededNot needed

Change planning formChangemeeting

Change proposal

Related sectionsSection initiating changeQuality controlSalesCustomer

KOTHC0026EB

Complaint handling

At Hamamatsu we work to speedily resolve customer

complaints by way of our complaint handling system.

The contents of the complaint are first checked, and an

investigation made to find the cause. Besides notifying the

customer of these results, we also use them as feedback in

the design and production processes to prevent a recurrence

of the trouble. If we decide, based on those investigation

results, that the quality control system must be overhauled,

then corrective action is taken and results from that action

are verified [Figure 1-8].

[Figure 1-8] Complaint action chart

Customer

Complaint

SalesCorrespondence section,

related section(design, manufacture)

Quality controlDivision manager,the responsibilityof a management

Quality judgment/correlativity investigation/making first report

Minor

ReportFirst report

Contents confirmed

HPKresponsible

ReceptionInformationconfirmationReturned product

action form

Returned product action ledger recorded

Put on thearticle card

Qualityinfluencereport ofproducts

Report

Yes

Customer complaintlevel

Specific within the range of object/enclosure

Inspection under the reproducibility conditions

Examination and confirmation of correspondence(survey result and nonconforming circumstances)

Examination and confirmation of correspondence(cause and reproducibility)

Plan of applicable products disposed/countermeasures implemented

Nonconforming products investigation report (8D report)

Investigation report

Approval/agreementReportApproval

No Good

OK

No Good

OK

Applicable products disposed/countermeasures implemented

Returned product action ledger recorded

Corrective/preventive

action

Corrective & preventive action indicating form

Follow-upCorrective & preventive action

Close Approval

Not needed

Needed

Critical, major

“Critical” & “Major”: needed “Minor”: if necessaryComplaint ac tion meeting

No

Directions

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Instruction and training

The Solid State Division provides worker instruction and

training as an active promotion to maintain and improve

product quality as well as upgrade employee skills. Employee

skills are periodically reviewed, and instruction/training

plans are then drawn up and performed as needed. When a

particular job requires obtaining qualifications, then those

are clearly specified, and a system is then set up to certify

employees who meet the requirements of the job.

The types of instruction span many areas including new

employee education, on-the-job training, and safety and

health instruction. Positive efforts are also made to collect

information outside our company in order to upgrade

employee knowledge and skills.

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1 - 2 Product reliability

Reliability

(1) Definition of reliability

In the Glossary of Terms Used in Reliability of JIS, reliability

is defined as “the capability of an item to perform a required

function under specified conditions for a specified period

of time.” We define the term as “the capability to withstand

operation under the customer’s usage environment over the

warranty period (or longer than the warranty period).”

(2) Failure region of opto-semiconductor products

The failure region of opto-semiconductor product can be

divided into initial failure, random failure, and wear-out

failure. The curve indicating the change in each failure

rate over time is called a bathtub curve.

[Figure 1-9] Bathtub curve example

Initial failure

Time

Failu

re r

ate

Random failureWear-outfailure

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• Initial failure

Initial failures occur at a relatively early period after starting

the use of a product. It is caused by a design or manufacturing

defect, incompatible usage environment, and so on. Initial

failure rate decreases as time passes. Screening inspections

before shipment can eliminate devices exhibiting initial

failures and thereby improve the initial failure rate in the

market place.

• Random failure

As the name suggests, random failures occur randomly

after the initial failure period but before the wear-out failure

period. Failures occur sporadically, and the failure rate is

nearly constant but never zero.

• Wear-out failure

Wear-out failures increase as time passes due to fatigue,

wear, deterioration, and so on. Examples of wear-out failures

in opto-semiconductor products are electromigration,

wire breakage due to repetitive temperature changes, and

sensitivity deterioration due to ultraviolet light and X-ray

exposure.

(3) Reliability testing

We make reliability tests to verify that a product meets the

specified reliability requirements. In reliability testing for

product authorization, long-term stress tests are performed to

verify that wear-out failures do not occur under the assumed

usage environment and within the assumed usage period.

Reliability tests are performed by selecting typical products

from among a group of structurally similar products. If

needed, this testing is performed individually. For a portion

of mass-produced products, to verify that the quality set

at the development stage is maintained even after mass

production, mass-produced products are sampled and

subjected to reliability tests once a year. Reliability test

methods conform to JIS, JEITA, IEC, MIL standards, and

the like. Some products are also tested according to their

product application. For example, optical communication

devices are tested according to the Telcordia GR-468

standards. Products including automotive devices are also

subjected to testing specified by the customer.

Table 1-2 shows typical reliability tests.

(4) Lifetime prediction

Wear-out failure data obtained through reliability testing can

be used to determine the cumulative failure rate over time.

By taking into account logarithmic-normal-distribution,

Weibull-distribution, and acceleration factor of reliability

testing, one can calculate the activation energy that leads to

specific wear-out failures and predict the length of time to

reach the cumulative failure rate reference (wear-out failure

lifetime).

[Figure 1-10] Failure rate prediction using Weibull plot

Time (h)

Cum

ulat

ive

failu

re r

ate

(%)

0.1100 100001000 100000

90

50

10

1

Accelerationtest failure rate

Predictedfailure rate

× Acceleration factor

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Failure analysis

Failure analysis is a way of investigating the cause of failure

and the mechanism that leads to the failure by researching

the failure that occurred in the manufacturing process,

marketplace, etc. The facts that are revealed through this

activity are fed back to design and manufacturing to prevent

the same failure from reoccurring [Figure 1-11].

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[Figure 1-11] Flow chart of typical failure analysis

Feedback

Cross section observation: focused ion beamFront side peeling observation: electron microscope and the likeElemental analysis: EDX and the like

Determination of the root cause andmechanism of problem (estimation)

Light emission observation: emission microscopeOBIRCH observation: IR-OBIRCH microscopeFront side observation: optical microscope and the like

Determination of failure location

Electrical characteristics measurement: semiconductor parameter analyzer and the likeAppearance observation: optical microscope and the like

Verification of the failure phenomenon

Collection of failure data

Failure occurrence

KOTHC0066EA

Failure analysis examples

(1) Leakage between terminals

Side face observation: reaction areas verified with an

IR-OBIRCH microscope

Test item Test condition examples Test standards

Life test

High-temperature storage Maximum storage temperature Tstg max., 1000 hours EIAJ ED-4701/200 201

Low-temperature storage Minimum storage temperature Tstg min., 1000 hours EIAJ ED-4701/200 202

High-temperature & high-humidity storage 85 °C, 85%, 1000 hours EIAJ ED-4701/100 103

High-temperature operation Maximum operating temperature Topr max., operating conditions: depends on individual specs, test time: 1000 hours EIAJ ED-4701/100 101

Low-temperature operation Minimum operating temperature Topr min., operating conditions: depends on individual specs, test time: 1000 hours EIAJ ED-4701/100 101

High-temperature & high-humidity operation

85 °C, 85%, operating conditions: depends on individual specs, test time: 1000 hours EIAJ ED-4701/100 102

Unsaturated steam pressurization 120 °C, 85%, 170 kPa, 96 hours EIAJ ED-4701/100 103

Temperature cycle Maximum storage temperature Tstg max., 30 minutes, minimum storage temperature Tstg min., 30 minutes, 100 cycles EIAJ ED-4701/100 105

X-ray irradiation Output tube voltage: 100 kV, 1 million roentgen -

UV light irradiationHg light 253.7 nm, 1000 hours

-D2 light 200 nm to 400 nm, 1000 hours

Strength test

Terminal strength

Pulling A load is imposed for 10 seconds.

EIAJ ED-4701/400 401Twisting A lead is bent 90° and rotated.

Bending A lead is bent 90° with a load applied, and is then bent back.

Vibration100 Hz to 2000 Hz, acceleration: 200 m/s2

sweep time (100 Hz to 2000 Hz to 100 Hz): 4 minutessweep direction: 3 directions of X, Y and Z, 4 times each

EIAJ ED-4701/400 403

ShockMaximum acceleration: 15000 m/s2, pulse width: 0.5 msshock direction: 4 directions of X1, (X2), Y1, Y2, Z1, (Z2), 3 times each

EIAJ ED-4701/400 404

SolderabilityAccelerated aging Steam, 4 hours

EIAJ ED-4701/300 303Lead free

Soldering by hand: 245 °C, 2 secondsReflow: 225 °C or higher (235 °C peak), 20 seconds JIS C60068-2-58

Resistance to soldering heat

Other than surface mount type 260 °C, 10 seconds EIAJ ED-4701/300 302

Surface mount type

Preprocess: JEDEC Level 5a (30 °C, 60%, 48 hours) to Level 1 (85 °C, 85%, 168 hours)

JEDEC J-STD-020Lead free: solder heating process, 3 times, 235 °C or higher (240 °C peak), 30 seconds

Electrostatic breakdown C=100 pF, R=1.5 kΩ, applied voltage: ±1 kV, number of times: 1 EIAJ ED-4701/300 304

Thermal shock 100 °C to 0 °C, 10 times EIAJ ED-4701/300 307

Transportation temperature cycle -40 °C to +70 °C, 5 times JIS C60721-3-2

Other Resistance to solvents Solvent type: isopropyl alcohol, dipping time: 5 minutes, rubbing: 5 strokes in both directions EIAJ ED-4701/500 501

Note: Please contact us for information on reliability test for individual products.

[Table 1-2] Reliability test examples

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Cross section observation: cracks verified in the TSV

insulation film (electron microscope; cross section

polisher)

Crack Crack

→ Feedback: insulation film modification, structural

improvement

(2) IC short circuit

Back side observation: abnormal signals verified with

an IR-OBIRCH microscope

Front side observation (after film peeling): foreign

substance verified in the abnormal signal area with an

optical microscope

Cross section observation: foreign substance shorting

the terminals is discovered

(focused ion beam; Fe·Cr detected from the foreign

substance through elemental analysis)

→ Feedback: complete particle control, inspection

method enhancement

1 - 3 For your safety

Handling precautions

Products must be stored and used under the conditions

specified in the delivery specification sheets. If these

conditions are not met, problems such as oxidation and

contamination of leads and packages absorbing moisture

may occur. When using our products in your products, be

sure to agree to the delivery specification sheet.

Depending on the product, precautions specific to the product

may be present in addition to general precautions. As such

details are provided in the operation manual supplied with

the product, be sure to read it.

Table 1-3 shows an example of the handling precautions of

opto-semiconductor products.

Examples of problems that have occurred due to inappropriate handling

(1) Examples of problems caused by external force

Damage to metal wiring

Examples in which the metal wiring on a bare chip is

damaged due to physical contact

Damage to sensor package

An example in which an inappropriate heatsink coupling

(e.g., improper viscosity or nonuniform grease or screws

tightened too strong) causes excessive load to be applied

to the sensor’s heat dissipation section and damages the

bonded area of the ceramic and heat dissipating sections

Ceramic area

Heat dissipation area

Cracked chip caused by external force

An example in which a strong external force applied to

the scintillator on the chip cracks the chip

10

Damage to the image sensor scintillator

An example in which the surface of the scintillator on

a chip is damaged due to physical contact with a jig or

other tool, causing adverse effects on the captured image

Scintillator damage Captured image

Broken cable of a sensor with a cable

An example in which the cable breaks due to long-term

use and repeated bending

X-ray photo of the circled area

(2) Examples of problems caused by the environment

Resin peeling caused by moisture absorption

An example in which the resin peels off the chip surface

due to moisture absorption by the package resin during

soldering, causing degradation in sensitivity due to the

increased reflectance from the photosensitive area surface

caused by the peeling

Sensitivity degradation caused by blemishes on the

package surface

An example in which the sensitivity degrades due to the

reduced light transmittance caused by soot adhering to

the package surface of a photosensor used to monitor

the flames in a boiler

Type Handling precautions Product examples

Metal, ceramicplastic package product

Electrical and optical characteristics may deteriorate if dust, contamination, or scratches are on the product. When handling the product, remember to work in a clean place, not apply strong friction to the window material, and use tweezers and/or gloves. Product deterioration is especially faster at high temperature and humidity than at normal temperature and humidity. Avoid storage or usage in an unnecessary high temperature and humidity environment.

Standard Si photodiodePhoto IC

Bare chip

Storage conditionsUnopened product: temperature: 15 °C to 35 °C, humidity: 45% to 75%, up to 3 monthsOpened product: temperature: 15 °C to 35 °C, humidity: 5% or less, up to 20 days Open the bag and mount the product in a clean room (class 10000 or better). Be careful not to physically damage or contaminate the chip, and exercise extreme caution when handling.

Evaluate and verify the effects of your mounting method and packaging material on the reliability.

Chip product

Unsealed product

Storage conditionsUnopened product: temperature: 15 °C to 35 °C, humidity: 45% to 75%, up to 3 monthsOpened product: temperature: 15 °C to 35 °C, storage in a low-humidity desiccator (no condensation), up to 3 months Open the bag and mount the product in a clean room (class 10000 or better). Be careful not to physically damage or contaminate the chip, and exercise extreme caution when handling.

Do not make contact with wiring. As a general rule, use an air blower to remove contamination. Pay attention to contamination and condensation when sealing or bonding a scintillator. When soldering, pay attention to the solder iron tip temperature, soldering time, and splashing fl ux.

Windowless product

TE-cooled type

Pay attention to prevent wiring errors to thermoelectric coolers or thermistors as errors can damage the devices. Do not use the devices at current or power exceeding their ratings.

Use heatsink with sufficient heat dissipation capacity for cooling. Keep the thermal resistance between the element and heatsink as small as possible (use heat dissipation sheets or silicon grease).

Product with built-in thermoelectric cooler

Electrostatic sensitive type

Apply measures to workplace and facilities according to the extent of deterioration that may occur. Such measures include using a conductive mat and grounding the equipment.

When handling the product, apply measures according to the extent of deterioration that may occur. Such measures include using an ionizer to remove static electricity and wearing a grounded wrist strap.

Compound semiconductorImage sensor

For UV light and X-raymeasurement

Avoid unnecessary exposure to UV light or X-rays as long-term exposure to them cause deterioration (e.g., increased dark current and sensitivity deterioration) in the product characteristics.

Radiation detectorX-ray image sensorFlat panel sensor

[Table 1-3] Handling precaution examples

11

Sensitivity degradation caused by high-energy UV light

An example in which the sensitivity of the light incident

area degrades as a result of KrF excimer laser striking and

damaging the Shottky film

[Figure 1-12] Sensitivity uniformity (Schottky type photodiode)

Position (mm)

Out

put

curr

ent

(nA)

Before UV light irradiation

KrF excimer laser (λ=248 nm) irradiation area

After UV light irradiation

0 2 4 6 8 100

160

140

120

100

80

60

40

20

12

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Environmental activities2.

Environmental idea

Recognizing that living in harmony with the global

environment is a critical issue for mankind, the Solid State

Division of Hamamatsu Photonics conducts business with

consideration to environmental conservation, and works

to create new scientific fields and new industries and to

show the road to true human health through research into

photonics technology and extending its application.

Environmental policy

The Solid State Division is conducting environmental

activities in compliance with the following environmental

policy.

Establish an environmental management system to

promote conservation of the earth’s environment by

setting up and maintaining an internal organization for

environmental protection.

Assess the impact on the environment by our activities,

products and services, set environmental objectives and

goals, review our environmental preservation activities

through environmental audits, and constantly improve

our environmental management.

Comply with environmental regulations and other

requirements we have accepted and impose our own

voluntary standards as necessary, to reduce the burden

on the environment.

Take preventative measures for curbing environmental

pollution, save energy and resources, reduce waste, and

ensure correct usage of chemical substances.

Strive to raise the understanding of the environmental

policy and the awareness of environmental issues among

all our employees through education and an in-house

publication about the environment.

Standardizing environmental management

The Solid State Division is implementing the ISO 14001

Environmental Management System and making continuous

improvements to provide proper environmental management

and reduce environmental risks.

Environmental auditing

To maintain and improve our environment management

system, we carry out external audits conducted by certification

bodies and internal audits conducted by the Solid State

Division on a regular basis.

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Activities to reduce environmental risks

The Solid State Division constantly makes improvements

that takes into account the burden on the living environment

including the atmosphere, water quality, and noise and

strives to prevent environmental pollution.

Emergency response training

The Solid State Division furnishes manuals for handling

accidents and disasters and regularly performs emergency

training according to each department’s business operation.

Environmental impact of business activities

We assess the impact on the environment by our business

activities and engages to reduce greenhouse gas, drainage,

waste, and other burden placed on the environment.

Addressing environmental issues through products

We work to make our products more compact, power

efficient, long lasting, energy efficient, and so on according

to their applications so that the burden placed on the

environment is reduced.

(1) Products contributing to the environment

Hamamatsu manufactures products that contribute to

environmental measurement of atmosphere, water quality,

and the like, content analysis of environmental management

substances, and energy reduction of ordinary electric

equipment.

Example: Infrared detectors

Infrared detectors are used to measure the absorption

peak specific to a gas in order to measure its type and

concentration. Our products are used in the greenhouse

gases observing satellite “Ibuki” (GOSAT).

[Figure 2-1] Greenhouse gases observing satellite “Ibuki”

(Courtesy of JAXA)

[Figure 2-2] Infrared detectors used in greenhouse gases observing satellite “Ibuki”

(a) InGaAs PIN photodiode (b) InGaAs linear image sensor

(2) Environmentally conscious products

As part of our global environmental conservation efforts

and reduction of burden on the environment, we apply

environmental measures on the products, develop new

products and new technologies, and promote the sales of

environmentally conscious products.

Example: CCD area image sensor S12071

With CCD area image sensor S12071, dark current noise

has been suppressed to 1/20 of that in previous products.

This has allowed the cooling temperature of the built-in

thermoelectric cooler to be increased, which has reduced

the power consumption to 1/7 of that in previous products.

Moreover, the incorporation of new packaging technology

has significantly increased the air tightness and moisture

proof reliability and prolonged the service life of the product.

[Figure 2-3] CCD area image sensor S12071

[Figure 2-4] Power consumption of built-in thermoelectric cooler

Pow

er c

onsu

mpt

ion

(W)

Previous product(Td=-10 °C)

8.2

1.2

1/7

Improved product S12071(Td=0 °C)

KMPDB0396EA

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Conforming to regulations regarding the chemicals contained in our products

Hamamatsu Photonics has established an “Environmental

Control Substance Management Standard” to control the

chemical substances contained in products. We are actively

engaged in complying with the EU RoHS directives and

regulations on chemical substances contained in products.

(1) Chemical substances regulated by RoHS

For each product, we control the amount of substances that

are specified in IEC62474 including the six substances (lead,

mercury, cadmium, hexavalent chromium, polybrominated

biphenyl, and polybrominated diphenyl ether) regulated by

RoHS directives.

Judgment on whether a product will comply with RoHS

directives is clearly specified in the quotation sheet when

drawing up an estimate.

(2) Management of high-risk materials

When there is possibility that a material may contain an

environmental management substance, we determine

that material as a high-risk material and inspect it using

an X-ray fluorescence analyzer during the acceptance test.

Green purchasing

To comply with environmental regulations on products

and minimize the burden on the environment, we at the

Solid State Division have established green procurement

policies and chemical substance management standards,

and are promoting procurement activities that give priority

to materials with a smaller load on the environment.

Working toward global environmental conservation

At the Solid State Division we conduct environmental

activities for global environmental conservation.

(1) Management of chemical substance usage quantity

If chemical substances are not properly managed,

environmental pollution can result and may cause adverse

effects on human health and ecosystem. At the Solid State

Division we accurately monitor and strictly control the

emission levels of chemical substance into the atmosphere

and water and the amount of movement of waste and so

forth.

Examples

· Management of usage quantity of chemical substances

subject to the PRTR Law

· Collection of SDS information and disclosure within our

company

· Activities to reduce VOC emissions

(2) Waste reduction, separation, and recycling

From the standpoint of reducing the burden on the

environment and using resources effectively, the Solid

State Division is promoting 3Rs (reduce, reuse, and recycle)

and proper treatment as its fundamental policies and is

engaged in activities under the slogan “Zero Emission.” In

addition, to enforce separation of waste produced, a waste

separation database has been established and is running

on our company’s intranet.

(3) Energy saving and reduction of carbon-dioxide emissions

We at the Solid State Division are expanding our energy

saving activities in an aim to reduce the energy used by

business operations by at least 1% per unit of sales compared

to the previous year. In order to prevent global warming, we

are also actively working to reduce the greenhouse gases,

such as non-energy source carbon-dioxide, that are used in

the manufacturing process .