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1 REV: 13-10-01 Part Ⅰ Package Outline Drawing Part Ⅱ Carrier Tape Outline Drawing Part Ⅲ Reel Outline Drawing

Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

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Page 1: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

1

REV: 13-10-01

Part Ⅰ

Package Outline Drawing

Part Ⅱ

Carrier Tape Outline Drawing

Part Ⅲ

Reel Outline Drawing

Page 2: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

2

Table of Contents

Part Ⅰ - Package Outline Drawing

DIP-8 PACKAGE OUTLINE DRAWING ----------------------------------------------------------- Ⅰ-1 DIP-14 PACKAGE OUTLINE DRAWIN ------------------------------------------------------------ Ⅰ-2 DIP-16 PACKAGE OUTLINE DRAWING ---------------------------------------------------------- Ⅰ-3 DIP-18 PACKAGE OUTLINE DRAWING --------------------------------------------------------- Ⅰ-4 DIP-20 PACKAGE OUTLINE DRAWING --------------------------------------------------------- Ⅰ-5 SOP-8 Exposed Pad(Heat Sink)PACKAGE OUTLINE DRAWING ------------------------- Ⅰ-6 SOP-8 PACKAGE OUTLINE DRAWING --------------------------------------------------------- Ⅰ-7

SOP-14 PACKAGE OUTLINE DRAWING -------------------------------------------------------- Ⅰ-8

SOP-16 (150 mil) PACKAGE OUTLINE DRAWING -------------------------------------------- Ⅰ-9 SOP-16 (150 mil) Exposed Pad (Heat Sink) PACKAGE OUTLINE DRAWING ---------- Ⅰ-10

SOP-16 (300 mil) PACKAGE OUTLINE DRAWING -------------------------------------------- Ⅰ-11

SOP-20 PACKAGE OUTLINE DRAWING -------------------------------------------------------- Ⅰ-12

SOP-24 PACKAGE OUTLINE DRAWING -------------------------------------------------------- Ⅰ-13

SOT-23 PACKAGE OUTLINE DRAWING -------------------------------------------------------- Ⅰ-14

SOT-23-5 PACKAGE OUTLINE DRAWING ------------------------------------------------------ Ⅰ-15

SOT-23-6 PACKAGE OUTLINE DRAWING ------------------------------------------------------ Ⅰ-16

SOT-89 PACKAGE OUTLINE DRAWING -------------------------------------------------------- Ⅰ-17

SOT-89 5PIN PACKAGE OUTLINE DRAWING ------------------------------------------------- Ⅰ-18

SOT-143 PACKAGE OUTLINE DRAWING ------------------------------------------------------- Ⅰ-19

SOT-223 PACKAGE OUTLINE DRAWING ------------------------------------------------------- Ⅰ-20

MSOP-8 PACKAGE OUTLINE DRAWING -------------------------------------------------------- Ⅰ-21 MSOP-8 Exposed Pad(Heat Sink)PACKAGE OUTLINE DRAWING ----------------------- Ⅰ-22 MSOP-10 PACKAGE OUTLINE DRAWING ------------------------------------------------------ Ⅰ-23 MSOP-10 Exposed Pad(Heat Sink)PACKAGE OUTLINE DRAWING --------------------- Ⅰ-24 TO-92 PACKAGE OUTLINE DRAWING ----------------------------------------------------------- Ⅰ-25

TO-220 PACKAGE OUTLINE DRAWING --------------------------------------------------------- Ⅰ-26

Page 3: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

3

TO-220B PACKAGE OUTLINE DRAWING ------------------------------------------------------- Ⅰ-27 TO-220-5L PACKAGE OUTLINE DRAWING ----------------------------------------------------- Ⅰ-28

TO-252-3L PACKAGE OUTLINE DRAWING ---------------------------------------------------- Ⅰ-29 TO-252-4L PACKAGE OUTLINE DRAWING --------------------------------------------------- Ⅰ-30

TO-252-5L PACKAGE OUTLINE DRAWING --------------------------------------------------- Ⅰ-31 TO-263-3L PACKAGE OUTLINE DRAWING ---------------------------------------------------- Ⅰ-32 TO-263-5L PACKAGE OUTLINE DRAWING ---------------------------------------------------- Ⅰ-33 QFN 12L-3x3x0.6-0.65mm PACKAGE OUTLINE DRAWING ------------------------------- Ⅰ-34 QFN 12L-3x3x0.75-0.5mm PACKAGE OUTLINE DRAWING ------------------------------- Ⅰ-35 QFN 12L-3x3x0.9-0.5mm PACKAGE OUTLINE DRAWING --------------------------------- Ⅰ-36 QFN 12L-4x4x0.75-0.8mm PACKAGE OUTLINE DRAWING -------------------------------- Ⅰ-37 QFN 12L-4x4x0.9-0.8mm PACKAGE OUTLINE DRAWING --------------------------------- Ⅰ-38 QFN 16L-3x3x0.6-0.5mm PACKAGE OUTLINE DRAWING --------------------------------- Ⅰ-39 QFN 16L-3x3x0.75 -0.5mm PACKAGE OUTLINE DRAWING ------------------------------- Ⅰ-40 QFN 16L-3x3x0.9-0.5mm PACKAGE OUTLINE DRAWING --------------------------------- Ⅰ-41 QFN 16L-4x4x0.75-0.65mm PACKAGE OUTLINE DRAWING ----------------------------- Ⅰ-42 QFN 16L-4x4x0.9-0.65mm PACKAGE OUTLINE DRAWING ------------------------------- Ⅰ-43 QFN 20L-4x4x0.75-0.5 mm PACKAGE OUTLINE DRAWING ------------------------------ Ⅰ-44 QFN 20L-4x4x0.9-0.5 mm PACKAGE OUTLINE DRAWING -------------------------------- Ⅰ-45 DFN 6L-2x2x0.75-0.65mm PACKAGE OUTLINE DRAWING -------------------------------- Ⅰ-46 DFN 8L-3x3x0.75-0.65mm PACKAGE OUTLINE DRAWING -------------------------------- Ⅰ-47 DFN 10L-3x3x0.75-0.5mm PACKAGE OUTLINE DRAWING -------------------------------- Ⅰ-48 DFN 12L-3x3x0.75-0.45mm PACKAGE OUTLINE DRAWING ------------------------------- Ⅰ-49 DFN 12L-3x3x0.75-0.5mm PACKAGE OUTLINE DRAWING -------------------------------- Ⅰ-50 DFN 12L-3x3x0.75-0.5mm (Without Heat Sink) PACKAGE OUTLINE DRAWING ----- Ⅰ-51 SC70-3L PACKAGE OUTLINE DRAWING ------------------------------------------------------- Ⅰ-52 SC70-5L PACKAGE OUTLINE DRAWING ------------------------------------------------------- Ⅰ-53 SC70-6L PACKAGE OUTLINE DRAWING ------------------------------------------------------- Ⅰ-54 TSOT-23 PACKAGE OUTLINE DRAWING ------------------------------------------------------- Ⅰ-55 TSOT-23-5 PACKAGE OUTLINE DRAWING ---------------------------------------------------- Ⅰ-56 TSOT-23-6 PACKAGE OUTLINE DRAWING ---------------------------------------------------- Ⅰ-57 TSSOP-8 PACKAGE OUTLINE DRAWING ------------------------------------------------------ Ⅰ-58

Page 4: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

4

TSSOP-16 PACKAGE OUTLINE DRAWING ---------------------------------------------------- Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING ------------------ Ⅰ-60

Part Ⅱ - Carrier Tape Outline Drawing SOP-8 CARRIER TAPE OUTLINE DRAWING -------------------------------------------------- Ⅱ-1 SOP-14 CARRIER TAPE OUTLINE DRAWING ------------------------------------------------- Ⅱ-2 SOP-16 CARRIER TAPE OUTLINE DRAWING ------------------------------------------------- Ⅱ-3 SOP-16W CARRIER TAPE OUTLINE DRAWING ---------------------------------------------- Ⅱ-4 SOP-20 CARRIER TAPE OUTLINE DRAWING ------------------------------------------------- Ⅱ-5 SOP-24 CARRIER TAPE OUTLINE DRAWIN --------------------------------------------------- Ⅱ-6 SOT-23/SOT-23-5/SOT-23-6 CARRIER TAPE OUTLINE DRAWING --------------------- Ⅱ-7 SOT-89 CARRIER TAPE OUTLINE DRAWING ------------------------------------------------- Ⅱ-8 SOT-143 CARRIER TAPE OUTLINE DRAWING ----------------------------------------------- Ⅱ-9 SOT-223 CARRIER TAPE OUTLINE DRAWING ----------------------------------------------- Ⅱ-10 MSOP-8/10 CARRIER TAPE OUTLINE DRAWING -------------------------------------------- Ⅱ-11 TO-252 CARRIER TAPE OUTLINE DRAWING ------------------------------------------------- Ⅱ-12 TO-263 CARRIER TAPE OUTLINE DRAWING ------------------------------------------------- Ⅱ-13 QFN 3x3x0.6 CARRIER TAPE OUTLINE DRAWING ----------------------------------------- Ⅱ-14 QFN 3x3x0.9 CARRIER TAPE OUTLINE DRAWING ----------------------------------------- Ⅱ-15 QFN 4x4x0.9 CARRIER TAPE OUTLINE DRAWING ----------------------------------------- Ⅱ-16 DFN 2x2x0.75 CARRIER TAPE OUTLINE DRAWING ---------------------------------------- Ⅱ-17 DFN 3x3x0.75 CARRIER TAPE OUTLINE DRAWING ---------------------------------------- Ⅱ-18 SC-70/SC-82 CARRIER TAPE OUTLINE DRAWING ----------------------------------------- Ⅱ-19 TSSOP-16 CARRIER TAPE OUTLINE DRAWING -------------------------------------------- Ⅱ-20

Part Ⅲ - Reel Outline Drawing REEL OUTLINE DRAWING --------------------------------------------------------------------------- Ⅲ-1 TO-92 TAPING SPEC. DRAWING ------------------------------------------------------------------ Ⅲ-1

Page 5: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-1

Part I Package Outline Drawing (unit:mm)

DIP-8 PACKAGE OUTLINE DRAWING

GAUGE PLANE

0.38

A

A1A2

L

D1A

b2

A

e

eB

eA

E1

D E

cWITH PLATING

SECTION A-ABASE METAL

b

2.54 BSCe

L

eB

eA

2.92

7.62 BSC

3.81

10.92

D 9.01

E

E1

D1

7.62

6.10

0.13

c

b2

b

0.20

1.14

0.36

10.16

8.26

7.11

0.35

1.78

0.56

MILLIMETERS

MIN.

SYMBOL

A1

A2

A

0.38

2.92

MAX.

4.95

5.33

DIP-8

Note: 1. Refer to JEDEC MS-001BA 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side . 3. Dimension "D1"and "E1" do not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 6: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-2

DIP-14 PACKAGE OUTLINE DRAWING

E

eB

eA

A2A1

A

b2D1

L

AA

e

D

E1

0.38

c

WITH PLATING

SECTION A-A

BASE METAL

b

GAUGE PLANE

2.54 BSCe

L

eB

eA

2.92

7.62 BSC

3.81

10.92

D 18.67

E

E1

D1

7.62

6.10

0.13

c

b2

b

0.20

1.14

0.36

19.69

8.26

7.11

0.35

1.78

0.56

MILLIMETERS

MIN.

SYMBOL

A1

A2

A

0.38

2.92

MAX.

4.95

5.33

DIP-14

Note: 1. Refer to JEDEC MS-001AA 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side . 3. Dimension "D1"and "E1" do not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 7: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-3

DIP-16 PACKAGE OUTLINE DRAWING

E

eB

eA

A2A1

A

D1

L

eb2

A A

D

E1

0.38

c

WITH PLATING

SECTION A-ABASE METAL

b

GAUGE PLANE

2.54 BSCe

L

eB

eA

2.92

7.62 BSC

3.81

10.92

D 18.66

E

E1

D1

7.62

6.10

0.13

c

b2

b

0.20

1.14

0.36

19.69

8.26

7.11

0.35

1.78

0.56

MILLIMETERS

MIN.

SYMBOL

A1

A2

A

0.38

2.92

MAX.

4.95

5.33

DIP-16

Note: 1. Refer to JEDEC MS-001BB 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side . 3. Dimension "D1"and "E1" do not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 8: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-4

DIP-18 PACKAGE OUTLINE DRAWING

2.54 BSCe

L

eB

eA

2.92

7.62 BSC

3.81

10.92

D 22.35

E

E1

D1

7.62

6.10

0.13

c

b2

b

0.20

1.14

0.36

23.37

8.26

7.11

0.35

1.78

0.56

MIN.

SYMBOL

A1

A2

A

0.38

2.92

MAX.

4.95

5.33

MILLIMETERS

DIP-18

eB

A2A1

A

D1

L

b2

AA

e

D

E1

0.38

c

WITH PLATING

eA SECTION A-A

BASE METAL

b

E

GAUGE PLANE

Note: 1. Refer to JEDEC MS-001AC. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side . 3. Dimension "D1"and "E1" do not include inter-lead flash or protru 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

sions.

Page 9: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-5

DIP-20 PACKAGE OUTLINE DRAWING

eB

A2A1

A

D1 eb2

A

L

A

D

E1

0.38

cWITH PLATING

eASECTION A-A

BASE METAL

b

E

GAUGE PLANE

2.54 BSCe

L

eB

eA

2.92

7.62 BSC

3.81

10.92

D 24.89

E

E1

D1

7.62

6.10

0.13

c

b2

b

0.20

1.14

0.36

26.92

8.26

7.11

0.35

1.78

0.56

MILLIMETERS

MIN.

SYMBOL

A1

A2

A

0.38

2.92

MAX.

4.95

5.33

DIP-20

Note: 1. Refer to JEDEC MS-001AD. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side . 3. Dimension "D1"and "E1" do not include inter-lead flash or protrusi 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

ons.

Page 10: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-6

SOP-8 Exposed Pad(Heat Sink)PACKAGE OUTLINE DRAWING

Note : 1. Refer to JEDEC MS-012E. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

A

D

LVIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATINGA1

B

C

eA A

HE

D1

E1

EXPOSED THERMAL PAD(Heat Sink)(BOTTOM CENTER OF PACKAGE)

h X

45°

SEE VIEW B

h

θ

L

D

e

H

E

C

B

A1

0° 8°

1.27 BSC

4.80

3.80

0.31

0.17

0.00

5.00

4.00

0.51

0.25

0.15

SYMBOL

A

SOP-8 Exposed Pad(Heat Sink)

MILLIMETERS

1.35

MIN.

1.75

MAX.

D1

E1

3.501.50

1.0 2.55

5.80 6.20

0.25 0.50

0.40 1.27

Page 11: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-7

SOP-8 PACKAGE OUTLINE DRAWING

A

θ

LVIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATINGA1

B

C

D

eA A

HE

h X

45°

SEE VIEW B

h

θ

L

D

e

H

E

C

B

A1

0.500.25

0.40

1.27

1.27 BSC

4.80

5.80

3.80

0.33

0.19

0.10

5.00

6.20

4.00

0.51

0.25

0.25

SYMBOL

A

SOP-8

MILLIMETERS

1.35

MIN.

1.75

MAX.

Note: 1. Refer to JEDEC MS-012AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 12: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-8

SOP-14 PACKAGE OUTLINE DRAWING

Note: 1. Refer to JEDEC MS-012AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side on. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. h

θ

L

D

e

H

E

C

B

A1

0.500.25

0.40

1.27

1.27 BSC

8.55

5.80

3.80

0.33

0.19

0.10

8.75

6.20

4.00

0.51

0.25

0.25

SYMBOL

A

SOP-14

MILLIMETERS

1.35

MIN.

1.75

MAX.

SEE VIEW B

A

LVIEW B

0.25

θ

SEATING PLANEGAUGE PLANE

WITH PLATING

BASE METAL

A1

B

SECTION A-AC

D

eA A

E H

h X

45°

Page 13: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-9

SOP-16 (150 mil) PACKAGE OUTLINE DRAWING

SEE VIEW B

A

LVIEW B

0.25

θ

SEATING PLANEGAUGE PLANE

A1

WITH PLATING

BASE METAL

B

SECTION A-A

C

D

eA A

E H

h X

45°

h

θ

L

D

e

H

E

C

B

A1

0.500.25

0.40

1.27

1.27 BSC

9.80

5.80

3.80

0.33

0.19

0.10

10.00

6.20

4.00

0.51

0.25

0.25

SYMBOL

A

SOP-16(150mil)

MILLIMETERS

1.35

MIN.

1.75

MAX.

Note: 1. Refer to JEDEC MS-012AC. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side on. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 14: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-10

SOP-16 (150 mil) Exposed Pad (Heat Sink)PACKAGE OUTLINE DRAWING

SEE VIEW B

D

eA A

E H

h X

45°

D1

E1

A

LVIEW B

0.25

θ

SEATING PLANEGAUGE PLANE

A1

WITH PLATING

BASE METAL

B

SECTION A-A

C

h

θ

L

D

e

H

E

C

B

A1

0.500.25

0.40

1.27

1.27 BSC

9.80

5.80

3.80

0.31

0.10

0.00

10.00

6.20

4.00

0.51

0.25

0.15

SYMBOL

A

SOP-16(150mil) Exposed Pad (Heat Sink)

MILLIMETERS

1.35

MIN.

1.70

MAX.

D1

E1

3.30 5.001.30 2.80

Note: 1. Refer to JEDEC MS-012AC. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side on. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 15: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-11

SOP-16 (300 mil) PACKAGE OUTLINE DRAWING

A

θ

LVIEW B

0.25

SEATING PLANE

BASE METAL

WITH PLATING

GAUGE PLANE

A1 B

C

SECTION A-A

D

Ae A

HE

h x

45°

SEE VIEW B

h

θ

L

D

e

H

E

C

B

A1

0.500.25

0.40

1.27

1.27 BSC

10.10

10.00

7.40

0.33

0.23

0.10

10.50

10.65

7.60

0.51

0.32

0.30

SYMBOL

A

SOP-16(300mil)

MILLIMETERS

2.35

MIN.

2.65

MAX.

Note: 1. Refer to JEDEC MS-013AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 16: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-12

SOP-20 PACKAGE OUTLINE DRAWING

A

θ

LVIEW B

0.25

SEATING PLANE

BASE METAL

WITH PLATING

GAUGE PLANE

A1 B

C

SECTION A-A

D

Ae A

HE

h x

45°

SEE VIEW B

h

θ

L

D

e

H

E

C

B

A1

0.500.25

0.40

1.27

1.27 BSC

12.60

10.00

7.40

0.33

0.23

0.10

13.00

10.65

7.60

0.51

0.32

0.30

SYMBOL

A

SOP-20

MILLIMETERS

2.35

MIN.

2.65

MAX.

Note: 1. Refer to JEDEC MS-013AC. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 17: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-13

SOP-24 PACKAGE OUTLINE DRAWING

SEE VIEW B

A

θ

LVIEW B

0.25

SEATING PLANE

BASE METAL

WITH PLATING

GAUGE PLANE

B

C

SECTION A-A

A1

D

Ae A

HE

h x

45°

h

θ

L

D

e

H

E

C

B

A1

0.500.25

0.40

1.27

1.27 BSC

15.20

10.00

7.40

0.33

0.23

0.10

15.60

10.65

7.60

0.51

0.32

0.30

SYMBOL

A

SOP-24

MILLIMETERS

2.35

MIN.

2.65

MAX.

Note: 1. Refer to JEDEC MS-013AD. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 18: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-14

SOT-23 PACKAGE OUTLINE DRAWING

cAA2

b

WITH PLATING

VIEW B

θ

L1

LSEATING PLANEGAUGE PLANE

0.25

A1

SECTION A-ABASE METAL

e1

eD

E

A A

E1

SEE VIEW B

0.90

0.30

1.50

2.60

2.80

0.08

0.30

0.00

e

θ

L1

L

e1

c

E

E1

D

b

A2

A1

0.95 BSC

0.60

1.90 BSC

0.60 REF

1.30

1.70

3.00

3.00

0.22

0.50

0.15

0.95

MIN.

SYMBOL

A 1

MAX.

SOT-23

MILLIMETERS

.45

Note: 1. Refer to JEDEC MO-178. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

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I-15

SOT-23-5 PACKAGE OUTLINE DRAWING

cAA2

b

WITH PLATING

VIEW B

θ

L1

LSEATING PLANEGAUGE PLANE

0.25

A1

SECTION A-ABASE METAL

e1

D

E

A A

E1

SEE VIEW B

e

0.90

0.30

1.50

2.60

2.80

0.08

0.30

0.00

e

θ

L1

L

e1

c

E

E1

D

b

A2

A1

0.95 BSC

0.60

1.90 BSC

0.60 REF

1.30

1.70

3.00

3.00

0.22

0.50

0.15

0.95

MIN.

SYMBOL

A 1.45

MAX.

SOT-23-5

MILLIMETERS

Note : 1. Refer to JEDEC MO-178AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

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I-16

SOT-23-6 PACKAGE OUTLINE DRAWING

cAA2

b

WITH PLATING

VIEW B

θ

L1

LSEATING PLANEGAUGE PLANE

0.25

A1

SECTION A-ABASE METAL

e1

D

E

A A

E1

SEE VIEW B

e

0.90

0.30

1.50

2.60

2.80

0.08

0.30

0.00

e

θ

L1

L

e1

c

E

E1

D

b

A2

A1

0.95 BSC

0.60

1.90 BSC

0.60 REF

1.30

1.70

3.00

3.00

0.22

0.50

0.15

0.95

MIN.

SYMBOL

A 1

MAX.

SOT-23-6

MILLIMETERS

.45

Note : 1. Refer to JEDEC MO-178AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 21: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-17

SOT-89 PACKAGE OUTLINE DRAWING

A

C

e1

e

BB1

D

D1

H

EL

0.36

0.89

3.94

2.29

1.50

4.40

0.35

0.44

e1

L

H

D

E

e

D1

C

B1

B

3.00 BSC

1.20

4.25

0.48

2.60

1.83

4.60

0.44

0.56

1.50 BSC

1.40

MIN.

SYMBOL

A 1

MAX.

SOT-89

MILLIMETERS

.60

Note: 1. Refer to JEDEC TO-243AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 22: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-18

SOT-89 5PIN PACKAGE OUTLINE DRAWIN

1.50 BSC

3.00 BSC

L 0.80

e

H

e1

E

D1

3.94

2.29

1.50

1.20

1.83

4.25

2.60

SOT-89-5

MILLIMETERS

SYMBOL

C

D

B

A

0.36

4.40

0.35

1.40

MIN.

1.60

MAX.

0.44

4.60

0.56

A

E

B

e1

e

L

D

D1 C

H

Note: 1. Refer to JEDEC TO-243AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 23: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-19

SOT-143 PACKAGE OUTLINE DRAWING

0.54 REFL1

0.60

0.80

1.401.20

1.92 BSC

SOT-143

θ 8°0°

0.20 BSC

1.070.75A2

MILLIMETERS

L

e1

e

E1

E

D

c

b2

b

A1

A

0.40

2.642.10

3.042.80

0.200.08

0.890.76

0.500.30

0.150.05

1.22

MAX.MIN.

SYMBOL

e1

D

e

EE1

cb/b2

A

A1

A ASEE VIEW B

SECTION A-A

WITH PLATING

BASE METAL

VIEW B

SEATING PLANEGAUGE PLANE

A2

L

L1

0.25

θ

Note: 1. Refer to JEDEC TO-253AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

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I-20

SOT-223 PACKAGE OUTLINE DRAWING

3.30

1.55

0.90

6.70

6.30

0.23

2.90

0.66

0.02

E1

θ

L

e1

e

b2

D

E

c

b

A2

A1

3.70

2.30 BSC

4.60 BSC

1.65

7.30

6.70

0.33

3.10

0.84

0.10

MIN.

SYMBOL

A 1.80

MAX.

SOT-223

MILLIMETERS

c

b

AA2

WITH PLATING

VIEW B

θ

0.25

LSEATING PLANEGAUGE PLANE

A1

BASE METALSECTION A-A

D

E

e1

eA A

b2E1

SEE VIEW B

Note: 1. Refer to JEDEC TO-261AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

.

Page 25: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-21

MSOP-8 PACKAGE OUTLINE DRAWING

A

A1A2

θ

LVIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATING

b

c

ED

Ae

A

E1

SEE VIEW B

e

θ

L

c

E

E1

D

A2

b

A1

0.65 BSC

0.40

0.70

4.90 BSC

0.13

2.90

2.90

0.75

0.25

0.00

0.23

3.10

3.10

0.95

0.40

0.15

SYMBOL

A

MSOP-8

MILLIMETERS

MIN.

1.10

MAX.

Note: 1. Refer to JEDEC MO-187AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 26: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-22

MSOP-8 Exposed Pad (Heat Sink) PACKAGE OUTLINE DRAWING

A

A1A2

E

D

Ae

AE1

SEE VIEW B

D1

E2

EXPOSED THERMAL PAD (Heat Sink)(BOTTOM CENTER OF PACKAGE)

θ

LVIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATING

b

c

e

θ

L

c

E

E1

D

A2

b

A1

0.65 BSC

0.40

0.80

4.90 BSC

0.08

0.75

0.22

0.00

0.23

0.95

0.38

0.15

SYMBOL

A

MSOP-8 Exposed Pad(Heat Sink)

MILLIMETERS

MIN.

1.10

MAX.

3.00 BSC

3.00 BSC

D1

E2

0.75

0.752.50

2.50

Note: 1. Refer to JEDEC MO-187AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 27: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-23

MSOP-10 PACKAGE OUTLINE DRAWING

A2 A

θ

L

VIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATING

A1

b

c

D

e A

E1 E

SEE VIEW BA

e

θ

L

c

E

E1

D

A2

b

A1

0.50 BSC

0.40

0.70

4.90 BSC

0.13

2.90

2.90

0.75

0.15

0.00

0.23

3.10

3.10

0.95

0.30

0.15

SYMBOL

A

MSOP-10

MILLIMETERS

MIN.

1.10

MAX.

Note: 1. Refer to JEDEC MO-187BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

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I-24

MSOP-10 Exposed Pad (Heat Sink) PACKAGE OUTLINE DRAWING

A2 A

A1

D

e B

E1 ESEE VIEW A

B

D1

E2

EXPOSED THERMAL PAD (Heat Sink)(BOTTOM CENTER OF PACKAGE)

θ

L

VIEW A

0.25

SEATING PLANE

SECTION B-BBASE METAL

GAUGE PLANE

WITH PLATING

b

c

e

c

E

E1

D

A2

b

A1

0.50 BSC

4.90 BSC

0.08

0.75

0.17

0

0.23

0.95

0.33

0.15

SYMBOL

A

MSOP-10 Exposed Pad (Heat Sink)

MILLIMETERS

MIN.

1.10

MAX.

θ

L 0.40

0.80

E2 0.75 2.50

D1 0.75 2.50

3.00 BSC

3.00 BSC

Note: 1. Refer to JEDEC MO-187E 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 29: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-25

TO-92 PACKAGE OUTLINE DRAWING

b SA

ED

j

e1

e

L

MILLIMETERS

TO-92

MAX.

5.33A

SYMBOL MIN.

4.32

0.47

4.19

2.66

1.39

5.20

2.66

b

D

E

e1

L

j

e

S

0.36

3.18

2.42

1.15

3.43

12.70

4.45

2.03

Note: 1. Refer to JEDEC TO-226. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "A" does not include inter-lead flash or protrusions 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

.

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I-26

TO-220 PACKAGE OUTLINE DRAWING

SECTION A-A

b

A2

L

L1

b2 e

A A

E

P

Q

DH

1

A

WITH PLATING

BASE METAL

A1

c

E1

D2

THERMAL PAD

2.54

5.85

1.15

3.54

12.70

2.04

0.51

2.54 BSC

6.86

14.23

0.35

0.38

H1

Q

P

L1

L

A2

D

e

A1

E1

c

b2

b

6.85

3.42

6.35

4.08

14.73

2.92

1.77

1.39

8.90

16.51

0.61

1.01

3.56

MIN.

SYMBOL

A 4.82

MAX.

TO-220

MILLIMETERS

D1 8.38 9.02

--

9.66E 10.66

D2 11.75 12.88

D1

Note: 1. Refer to JEDEC TO-220AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

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I-27

TO-220B PACKAGE OUTLINE DRAWING

E2

D2

THERMAL PAD

E

L L1

b

e1

e

dD

E1E1D

1F

A

CA1

A2

φ

11.75D2 12.88

6.86E2 8.90

3.556(REF)

2.743(REF)

1.524 2.032

9.880

3.708

0.304

1.143

8.250

4.250

9.906

8.480

0.690

L

F

e1

e

A2

D1

E1

A1

E

D

C

b

3.962

10.64

7.112

1.397

8.550

0.530

4.550

10.44

9.300

0.940

4.318

MIN.

SYMBOL

A 4

MAX.

TO-220B

MILLIMETERS

.826

d

6.604

L1 9.090 9.850

φ

4.953 5.220

Note : Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

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I-28

TO-220-5L PACKAGE OUTLINE DRAWING

D1

THERMAL PAD

φ

E

dD

E1E1A

L

F

A1e b C

E2

D2

11.75D2 12.88

6.86E2 8.90

13.589

3.708

0.304

1.143

2.032

9.779

7.620

0.635

L

F

e

D1

E1

A1

E

D

C

b

3.962

14.351

1.397

0.460

2.921

10.668

9.398

1.016

4.064

MIN.

SYMBOL

A 4.826

MAX.

TO-220-5L

MILLIMETERS

d

φ

4.953 5.220

1.524 2.032

3.429 3.683

2.620 2.870Note : Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 33: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-29

TO-252-3L PACKAGE OUTLINE DRAWING

c2

SEE VIEW B

A

H

b3

AAe

E

DL3

L4

c

BASE METAL

WITH PLATING

SEATING PLANE

b

SECTION A-A

VIEW B

A1

LL1

UGE PLANEGA

L2

THERMAL PAD

D1

E1

MILLIMETERS

TO-252-3L

MAX.

2.38A

SYMBOL MIN.

2.19

0.13

5.46

0.61

0.89

6.22

6.73

0.89

2.67 REF

0.51 BSC

10.41

1.78

2.03

1.02

2.28 BSC

A1

b

b3

c2

E

D

c

H

L

L1

L2

L4

L3

e

0.00

4.95

0.46

0.46

5.33

6.35

9.40

1.40

0.89

--

0.64

0° 8°

6.004.60

5.463.90

D1

E1

No

te: 1. Refer to JEDEC TO-252AA and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side .

3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch

dimensions are not necessarily exact.

Page 34: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-30

TO-252-4L PACKAGE OUTLINE DRAWING

L2

WITH PLATING

BASE METAL

c

L3D

E

e A A

b3

H

A

SEE VIEW B

c2

UGE PLANEGA

L1L

A1

VIEW B

SECTION A-A

b

SEATING PLANE

THERMAL PAD

D1

E1

L4

0.51

0.89

1.40

9.40

6.35

5.33

0.46

0.46

4.32

0.00

e

L3

θ

L2

L1

L

H

c

D

E

c2

b3

b

A1

1.27 BSC

2.03

1.78

10.41

0.51 BSC

2.67 REF

0.71

6.73

6.22

0.89

0.61

5.46

0.13

2.19

MIN.

SYMBOL

A 2

MAX.

TO-252-4L

MILLIMETERS

.38

4.90D1 6.00

4.32E1 5.33

0.6L4 1.0

Note: 1. Refer to JEDEC TO-252AD and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 35: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-31

TO-252-5L PACKAGE OUTLINE DRAWING

L2

GE PLANEGAU

L1L

A1

VIEW B

SECTION A-A

b

SEATING PLANE

WITH PLATING

BASE METAL

c

L3D

E

b3

e A A

H

A

SEE VIEW B

c2 THERMAL PAD

D1

E1

0.51

0.89

1.40

9.40

6.35

5.33

0.46

0.46

4.32

0.00

e

L3

Note: 1. Refer to JEDEC TO-252AD and AB. 2. Dimension "E" does not include mold flash, protrusions

or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch

dimensions are not necessarily exact.

θ

L2

L1

L

H

c

D

E

c2

b3

b

A1

1.27 BSC

2.03

1.78

10.41

0.51 BSC

0.71

6.73

6.22

0.89

0.61

5.46

0.13

2.19

MIN.

SYMBOL

A 2.38

MAX.

TO-252-5L

MILLIMETERS

2.67 REF

4.90D1 6.00

4.32E1 5.33

Page 36: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-32

TO-263-3L PACKAGE OUTLINE DRAWING

E1

D1

SECTION A-A

b

SEE VIEW B

c

L2

E

A A

H

DL1

A

c2

b2 e

LVIEW B

L3

GAUGE PLANE

A1

SEATING PLANE

WITH PLATING

BASE METAL

THERMAL PAD

0.51

--

1.78

14.61

9.65

8.38

1.14

0.38

1.14

0.00

Note: 1. Refer to JEDEC TO-263AB. 2. Dimension "E" does not include mold flash, protrusions

or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch

dimensions are not necessarily exact.

e

L3

θ

L2

L1

L

H

c

D

E

c2

b2

b

A1

2.54 BSC

1.68

1.78

2.79

15.88

0.99

10.67

9.65

1.65

0.74

1.78

0.25

4.06

MIN.

SYMBOL

A 4.83

MAX.

TO-263-3L

MILLIMETERS

0.25 BSC

6.86D1

6.23E1 --

--

--

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I-33

TO-263-5L PACKA GE OUTLINE DRAWING

e

LVIEW B

L3

GAUGE PLANE

A1

SEATING PLANE

WITH PLATING

BASE METAL

E1

D1

THERMAL PAD

SECTION A-A

b

SEE VIEW B

c

E

A A

H

DL1

A

c2

8.38

0.51

1.78

14.61

9.65

1.14

0.38

0.00

Note: 1. Refer to JEDEC TO-263BA. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions.

4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

H

θ

L3

L1

L

e

c2

E

D

c

b

A1

15.88

1.68

2.79

0.25 BSC

0.99

10.67

9.65

1.65

0.74

0.25

1.70 BSC

4.06

MIN.

SYMBOL

A 4.83

MAX.

TO-263-5L

MILLIMETERS

6.86D1 --

6.23 --E1

--

Page 38: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-34

QFN 12L-3x3x0.6-0.65mm PACKAGE OUTLINE DRAWING

D2

b

12

INDEX AREA(D/2*E/2)

A1

θ

A3

A

D

1

2

12 11

E

e

11

1

E22

L

120θ

E

e

L

E2

0.35

1.50

D2

D

b

1.50

0.25

0.45

1.80

1.80

0.35

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.55

MAX.

0.20 REF

0.05

0.65

QFN 12L-3x3x0.6-0.65mm

2.90 3.10

2.90 3.10

0.60 0.70

Note : 1. Refer to JEDEC MO-220 VEEC-1. 2. All dimensions are in millimeters, θ is in degrees.

Page 39: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-35

QFN 12L-3x3x0.75-0.5mm PACKAGE OUTLINE DRAWING

D2

b

12

INDEX AREA(D/2*E/2)

A1

θ

A3

A

D

1

2

12 11

E

e

11

1

E22

L

14 0θ

E

e

L

E2

0.35

1.25

D2

D

b

1.25

0.18

2.90 3.10

0.50 BSC

0.45

1.80

2.90 3.10

1.80

0.30

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.70

MAX.

0.20 REF

0.05

0.80

QFN 12L-3x3x0.75-0.5mm

Note : 1. Refer to JEDEC MO-220 WEED-3, 5 2. All dimensions are in millimeters, θ is in degrees.

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I-36

QFN 12L-3x3x0.9-0.5mm PACKAGE OUTLINE DRAWING

D2

b

12

INDEX AREA(D/2*E/2)

A1

A3

A

D

1

2

12 11

E

e

11

1

E22

L

θ

120θ

E

e

L

E2

0.35

1.50

D2

D

b

1.50

0.18

2.90 3.10

0.45 0.55

0.45

1.80

2.90 3.10

1.80

0.30

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.80

MAX.

0.20 REF

0.05

1.00

QFN 12L-3x3x0.9-0.5mm

Note : 1. Refer to JEDEC MO-220 VEED-3. 2. All dimensions are in millimeters, θ is in degrees.

Page 41: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-37

QFN 12L-4x4x0.75 -0.8mm PACKAGE OUTLINE DRAWING

D2

b

12

INDEX AREA(D/2*E/2)

A1

θ

A3

A

D

1

2

12 11E

e

11

1

E22

L

140θ

E

e

L

E2

0.47

0.75

D2

D

b

0.75

0.25

3.90 4.10

0.80BSC

0.63

2.35

3.90 4.10

2.35

0.35

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.70

MAX.

0.20 REF

0.05

0.80

QFN 12L-4x4x0.75-0.8mm

Note: 1. Refer to JEDEC MO-220 WGGB. 2. All dimensions are in millimeters, θ is in degrees.

Page 42: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-38

QFN 12L-4x4x0.9-0.8mm PACKAGE OUTLINE DRAWING

D2

b

12

INDEX AREA(D/2*E/2)

A1

A3

A

D

1

2

12 11

E

e

11

1

E22

L

θ

120θ

E

e

L

E2

0.35

0.75

D2

D

b

0.75

0.25

3.90 4.10

0.75 0.85

0.75

2.25

3.90 4.10

2.25

0.35

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.80

MAX.

0.20 REF

0.05

1.00

QFN 12L-4x4x0.9-0.8mm

Note : 1. Refer to JEDEC MO-220 VGGB. 2. All dimensions are in millimeters, θ is in degrees.

Page 43: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-39

QFN 16L-3x3x0.6-0.5mm PACKAGE OUTLINE DRAWING

D2

bINDEX AREA(D/2*E/2)

A1

θ

A3

A

D

1

2 E

e

1

E2

2

L

14 0θ

E

e

L

E2

0.30

1.05

D2

D

b

1.05

0.18

2.90 3.10

0.50 BSC

0.55

1.80

2.90 3.10

1.80

0.30

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.55

MAX.

0.20 REF

0.05

0.65

QFN 16L-3x3x0.6-0.5mm

Note: 1. Refer to JEDEC MO-220 WEED-4,6,7 2. All dimensions are in millimeters, θ is in degrees.

Page 44: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-40

QFN 16L-3x3x0.75 -0.5mm PACKAGE OUTLINE DRAWING

D2

bINDEX AREA(D/2*E/2)

A1

A3

A

D

1

2 E

e

1

E2

2

L

14 0θ

E

e

L

E2

0.30

1.05

D2

D

b

1.05

0.18

2.90 3.10

0.50 BSC

0.55

1.80

2.90 3.10

1.80

0.30

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.70

MAX.

0.20 REF

0.05

0.80

QFN 16L-3x3x0.75-0.5mm

Note: 1. Refer to JEDEC MO-220 WEED-4,6,7 2. All dimensions are in millimeters, θ is in degrees.

Page 45: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-41

QFN 16L-3x3x0.9-0.5mm PACKAGE OUTLINE DRAWING

D2

bINDEX AREA(D/2*E/2)

A1

θ

A3

A

D

1

2 E

e

1

E2

2

L

14 0θ

E

e

L

E2

0.30

1.05

D2

D

b

1.05

0.18

2.90 3.10

0.50 BSC

0.55

1.80

2.90 3.10

1.80

0.30

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.80

MAX.

0.20 REF

0.05

1.00

QFN 16L-3x3x0.9-0.5mm

Note: 1. Refer to JEDEC MO-220 VEED-4,6,7 2. All dimensions are in millimeters, θ is in degrees.

Page 46: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-42

QFN 16L-4x4x0.75-0.65mm PACKAGE OUTLINE DRAWING

14 0θ

E

e

L

E2

0.30

2.00

D2

D

b

2.00

0.25

3.90 4.10

0.65 BSC

0.65

2.80

3.90 4.10

2.80

0.35

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.70

MAX.

0.20 REF

0.05

0.80

QFN 16L-4x4x0.75-0.65mm

D2

b

16

INDEX AREA(D/2*E/2)

A1

θ

A3

A

D

1

2

16 15

E

e

15

1

E2

2

L

Note : 1. Refer to JEDEC MO-220 WGGC-4 2. All dimensions are in millimeters, θ is in degrees.

Page 47: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-43

QFN 16L-4x4x0.9-0.65mm PACKAGE OUTLINE DRAWING

D2

bINDEX AREA(D/2*E/2)

A1

θ

A3

A

D

1

2 E

e

1

E2

2

L

14 0θ

E

e

L

E2

0.30

2.20

D2

D

b

2.20

0.25

3.90 4.10

0.65 BSC

0.65

2.80

3.90 4.10

2.80

0.35

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.80

MAX.

0.20 REF

0.05

1.00

QFN 16L-4x4x0.9-0.65mm

Note: 1. Refer to JEDEC MO-220 VGGC-2,3,4 2. All dimensions are in millimeters, θ is in degrees.

Page 48: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-44

QFN 20L-4x4x0.75-0.5 mm PACKAGE OUTLINE DRAWING

20

INDEX AREA(D/2*E/2)

A1

A3

A

D

E

19

1

2

L

D2

E2

e b

θ

1

2

1920

14 0θ

E

e

L

E2

0.35

2.25

D2

D

b

2.25

0.18

3.90 4.10

0.50 BSC

0.45

2.80

3.90 4.10

2.80

0.30

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.70

MAX.

0.20 REF

0.05

0.80

QFN 20L-4x4x0.75-0.5mm

Note : 1. Refer to JEDEC MO-220 WGGD-1, 5 2. All dimensions are in millimeters, θ is in degrees.

Page 49: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-45

QFN 20L-4x4x0.9-0.5 mm PACKAGE OUTLINE DRAWING

14 0θ

E

e

L

E2

0.35

2.25

D2

D

b

2.25

0.18

3.90 4.10

0.50 BSC

0.50

2.80

3.90 4.10

2.80

0.30

MILLIMETERS

MIN.

SYMBOL

A1

A3

A

0.00

0.80

MAX.

0.20 REF

0.05

1.00

QFN 20L-4x4x0.9-0.5mm

1

2

L

D2

E2

e b

θ

1

2

INDEX AREA(D/2*E/2)

A1

A3

A

D

E

Note: 1. Refer to JEDEC MO-220 VGGD-5 2. All dimensions are in millimeters, θ is in degrees.

Page 50: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-46

DFN 6L-2x2x0.75-0.65mm PACKAGE OUTLINE DRAWING

e

L

D2

b

A3

TOP VIEW BOTTOM VIEW

SIDE VIEW

E

3 1

A

SEATING PLANE

6

PIN#1

D4

E2MILLIMETERS

MIN.

SYMBOL

A3

A 0.70

MAX.

0.20 BSC

0.80

DFN 6L-2x2x0.75-0.65mm

E

e

L

E2

0.25

0.55

D2

D

b

1.10

0.20

0.65 BSC

0.45

0.85

1.60

0.35

2.00 BSC

2.00 BSC

Note : 1. DIMENSION AND TOLERANCING CONFORM TO ASME Y14.5M-1994. 2.CONTROLLING DIMENSIONS:MILLIMETER,CONVERTED INCH DIMENSION ARE NOT NECESSARILY EXACT. 3.DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.10 AND 0.25 mm FROM TERMINAL TIP.

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I-47

DFN 8L-3x3x0.75-0.65mm PACKAGE OUTLINE DRAWING

8

PIN#1

D5

E2E

4 1

b

A

SEATING PLANE

L

D2

e

A3

MILLIMETERS

MIN.

SYMBOL

A3

A 0.70

MAX.

0.20 REF

0.80

DFN 8L-3x3x0.75-0.65mm

E

e

L

E2

0.25

1.40

D2

D

b

2.20

0.25

2.90 3.10

0.65 BSC

0.45

1.60

2.90 3.10

2.40

0.35

Note : 1. Refer to JEDEC MO-220K. 2.CONTROLLING DIMENSIONS:MILLIMETER,CONVERTED INCH DIMENSION ARE NOT NECESSARILY EXACT.

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I-48

DFN 10L-3x3x0.75-0.5mm PACKAGE OUTLINE DRAWING

10

PIN#1

D6

E2E

5 1

b

A3

A

SEATING PLANE

L

D2

e

MILLIMETERS

MIN.

SYMBOL

A3

A 0.70

MAX.

0.20 BSC

0.80

DFN 10L-3x3x0.75-0.5mm

E

e

L

E2

0.30

1.40

D2

D

b

2.20

0.18

2.90 3.10

0.5 BSC

0.50

1.80

2.90 3.10

2.70

0.30

Note : 1. DIMENSION AND TOLERANCING CONFORM TO ASME Y14.5M-1994. 2.CONTROLLING DIMENSIONS:MILLIMETER,CONVERTED INCH DIMENSION ARE NOT NECESSARILY EXACT.

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I-49

DFN 12L-3x3x0.75-0.45mm PACKAGE OUTLINE DRAWING

12

PIN#1

D7

E2E

6 1

b

A3

A

SEATING PLANE

L

D2

e

MILLIMETERS

MIN.

SYMBOL

A3

A 0.70

MAX.

0.20 BSC

0.80

DFN 12L-3x3x0.75-0.45mm

E

e

L

E2

0.30

1.40

D2

D

b

2.20

0.18

2.90 3.10

0.45 BSC

0.50

1.80

2.90 3.10

2.70

0.30

Note : 1. DIMENSION AND TOLERANCING CONFORM TO ASME Y14.5M-1994. 2.CONTROLLING DIMENSIONS:MILLIMETER,CONVERTED INCH DIMENSION ARE NOT NECESSARILY EXACT.

Page 54: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-50

DFN 12L-3x3x0.75-0.5mm PACKAGE OUTLINE DRAWING

12

PIN#1

D7

E2E

6 1

b

A3

A

SEATING PLANE

L

D2

e

MILLIMETERS

MIN.

SYMBOL

A3

A 0.70

MAX.

0.20 BSC

0.80

DFN 12L-3x3x0.75-0.5mm

E

e

L

E2

0.35

1.60

D2

D

b

2.20

0.18

2.90 3.10

0.50 BSC

0.45

1.80

2.90 3.10

2.40

0.30

Note : 1. DIMENSION AND TOLERANCING CONFORM TO ASME Y14.5M-1994. 2.CONTROLLING DIMENSIONS:MILLIMETER,CONVERTED INCH DIMENSION ARE NOT NECESSARILY EXACT.

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I-51

DFN 12L-3x3x0.75-0.5mm (Without Heat Sink) PACKAGE OUTLINE DRAWING

12

PIN#1

D7

E

6 1

b

A3

A

SEATING PLANE

L

e

TOP VIEW BOTTOM VIEW

SIDE VIEW

MILLIMETERS

MIN.

SYMBOL

A3

A 0.70

MAX.

0.203 BSC

0.80

DFN 12L-3x3x0.75-0.5mm (Without Heat Sink)

E

e

L 0.60

D

b 0.20

2.90 3.10

0.500 BSC

0.70

2.90 3.10

0.30

Note : 1. DIMENSION AND TOLERANCING CONFORM TO ASME Y14.5M-1994. 2.CONTROLLING DIMENSIONS:MILLIMETER,CONVERTED INCH DIMENSION ARE NOT NECESSARILY EXACT.

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I-52

SC70-3L PACKAGE OUTLINE DRAWING

0.70

0.26

1.10

1.80

1.85

0.08

0.15

0

e

L1

L

e1

c

E

E1

D

b

A2

A1

0.65 BSC

0.46

1.30 BSC

0.42 REF

1.00

1.40

2.40

2.15

0.25

0.40

0.10

-

MIN.

SYMBOL

A 1.10

MAX.

SC70-3L

MILLIMETERS

cAA2

b

WITH PLATING

VIEW BL1

LSEATING PLANEGAUGE PLANE

0.15

A1

SECTION A-ABASE METAL

e1

eD

E

A A

E1

SEE VIEW B

Note: 1. Refer to JEDEC MO-203. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusi 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

ons.

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I-53

SC70-5L PACKAGE OUTLINE DRAWING

cAA2

b

WITH PLATING

VIEW BL1

LSEATING PLANEGAUGE PLANE

0.15

A1

SECTION A-ABASE METAL

e1

D

E

A A

E1

SEE VIEW B

e

0.70

0.26

1.10

1.80

1.85

0.08

0.15

0

e

L1

L

e1

c

E

E1

D

b

A2

A1

0.65 BSC

0.46

1.30 BSC

0.42 REF

1.00

1.40

2.40

2.15

0.25

0.30

0.10

-

MIN.

SYMBOL

A 1.10

MAX.

SC70-5L

MILLIMETERS

Note: 1. Refer to JEDEC MO-203AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

.

Page 58: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-54

SC70-6L PACKAGE OUTLINE DRAWING

cAA2

b

WITH PLATING

VIEW BL1

LSEATING PLANEGAUGE PLANE

0.15

A1

SECTION A-ABASE METAL

e1

D

E

A A

E1

SEE VIEW B

e

0.70

0.26

1.10

1.80

1.85

0.08

0.15

0

e

L1

L

e1

c

E

E1

D

b

A2

A1

0.65 BSC

0.46

1.30 BSC

0.42 REF

1.00

1.40

2.40

2.15

0.25

0.30

0.10

-

MIN.

SYMBOL

A 1

MAX.

SC70-6L

MILLIMETERS

.10

Note: 1. Refer to JEDEC MO-203AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 59: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-55

TSOT-23 PACKAGE OUTLINE DRAWING

cAA2

b

WITH PLATING

VIEW B

θ

L1

LSEATING PLANEGAUGE PLANE

L2

A1

SECTION A-ABASE METAL

e1

eD

E

A A

E1

SEE VIEW B

0.70

0.30

0.08

0.30

0

e

θ

L1

L

e1

c

E

E1

D

b

A2

A1

0.95 BSC

0.60

1.90 BSC

0.60 REF

0.90

0.22

0.50

0.10

-

MIN.

SYMBOL

A 1

MAX.

TSOT-23

MILLIMETERS

.00

L2 0.25 BSC

2.80 3.00

2.60 3.00

1.50 1.70Note : 1. Refer to JEDEC MO-193C. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 60: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-56

TSOT-23-5 PACKAGE OUTLINE DRAWING

0.70

0.30

1.50

2.60

2.80

0.08

0.30

0

e

θ

L1

L

e1

c

E

E1

D

b

A2

A1

0.95 BSC

0.60

1.90 BSC

0.60 REF

0.90

1.70

3.00

3.00

0.22

0.50

0.10

-

MIN.

SYMBOL

A 1

MAX.

TSOT-23-5

MILLIMETERS

cAA2

b

WITH PLATING

VIEW B

θ

L1

LSEATING PLANEGAUGE PLANE

0.25

A1

SECTION A-ABASE METAL

e1

DE

A A

E1

SEE VIEW B

e

.00

Note : 1. Refer to JEDEC MO-193AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

.

Page 61: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-57

TSOT-23-6 PACKAGE OUTLINE DRAWING

0.70

0.30

1.50

2.60

2.80

0.08

0.30

0

e

θ

L1

L

e1

c

E

E1

D

b

A2

A1

0.95 BSC

0.60

1.90 BSC

0.60 REF

0.90

1.70

3.00

3.00

0.22

0.50

0.10

-

MIN.

SYMBOL

A 1.00

MAX.

TSOT-23-6

MILLIMETERS

cAA2

b

WITH PLATING

VIEW B

θ

L1

LSEATING PLANEGAUGE PLANE

0.25

A1

SECTION A-ABASE METAL

e1

D

E

A A

E1

SEE VIEW B

e

Note : 1. Refer to JEDEC MO-193AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 62: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-58

TSSOP-8 PACKAGE OUTLINE DRAWING

A1

A

θ

LVIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATING

A2

b

c

A

DE

e

e/2A

E1

SEE VIEW B

e

θ

L

c

E

E1

D

b

A2

A1

0.65 BSC

0.45

0.75

6.40 BSC

0.09

4.30

2.90

0.80

0.05

0.19

0.20

4.50

3.10

0.30

1.05

0.15

SYMBOL

A

TSSOP-8

MILLIMETERS

MIN.

1.20

MAX.

Note: 1. Refer to JEDEC MO-153AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 63: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-59

TSSOP-16 PACKAGE OUTLINE DRAWING

θ

LVIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATING

A1

AA2

b

c

D

e/2e

EE1

A A SEE VIEW B

e

θ

L

c

E

E1

D

b

A2

A1

0.65 BSC

0.45

0.75

6.40 BSC

0.09

4.90

4.30

0.80

0.05

0.19

0.20

5.10

4.50

0.30

1.05

0.15

SYMBOL

A

TSSOP-16

MILLIMETERS

MIN.

1.20

MAX.

Note: 1. Refer to JEDEC MO-153AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 64: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

I-60

TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWIN

D

e/2e

EE1A A SEE VIEW B

E2

D1

EXPOSED THERMAL PAD(Heat Sink)(BOTTOM CENTER OF PACKAGE)

θ

LVIEW B

0.25

SEATING PLANE

SECTION A-ABASE METAL

GAUGE PLANE

WITH PLATING

A1

AA2

b

c

e

θ

L

c

E

E1

D

b

A2

A1

0.65 BSC

0.45

0.75

6.40 BSC

0.09

4.90

4.30

0.80

0.00

0.19

0.20

5.10

4.50

0.30

1.05

0.15

SYMBOL

A

TSSOP-16 Exposed Pad (Heat Sink)

MILLIMETERS

MIN.

1.20

MAX.

D1

E2

2.00

1.80

4.00

3.40

Note: 1. Refer to JEDEC MO-153AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.

Page 65: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-1

Part II Carrier Tape Outline Drawing (unit: mm)

SOP-8 CARRIER TAPE OUTLINE DRAWING

P1

φD1

SECTION A-A

SECTION B-B

Bo

Ko

P2

AoB

φDo Po

T

F

W

B A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 12.00± 0.30

D1

W

1.50 min.

Ko

2.10± 0.20

P2

2.00± 0.05

6.30± 0.20 5.20± 0.20

4.00± 0.10

Po

8.00± 0.10

P1

Ao Bo

0.30± 0.05 1.50 +0.10

E1

5.50± 0.05

-0.00

F

T Do

1.75± 0.10

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 66: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-2

SOP-14 CARRIER TAPE OUTLINE DRAWING

φD1

SECTION A-A

SECTION B-B

T

Bo

Ko

P2 P1

AoB B

PoφDo

W

F

A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 16.0 ± 0.3

D1

W

1.50 min.

Ko

2.1 ± 0.2

P2

2.0 ± 0.1

6.5 ± 0.2 9.2 ± 0.35

4.0 ± 0.1

Po

8.0 ± 0.1

P1

Ao Bo

0.30 ± 0.05 1.5 + 0.1

1.75 ± 0.1

E1

7.5 ± 0.1

- 0.0

F

T Do

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 67: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-3

SOP-16 CARRIER TAPE OUTLINE DRAWING

φD1

SECTION A-A

SECTION B-B

T

Bo

Ko

P2 P1

AoB B

PoφDo

W

F

A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 16.0 ± 0.3

D1

W

1.50 min.

Ko

2.1 ± 0.2

P2

2.0 ± 0.1

6.5 ± 0.2 10.3 ± 0.2

4.0 ± 0.1

Po

8.0 ± 0.1

P1

Ao Bo

0.30 ± 0.05 1.5 + 0.1

1.75 ± 0.1

E1

7.5 ± 0.1

- 0.0

F

T Do

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 68: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-4

SOP-16W CARRIER TAPE OUTLINE DRAWING

φD1

SECTION A-A

SECTION B-B

T

Bo

Ko

P2 P1

AoB B

PoφDo

W

F

A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 16.0 ± 0.3

D1

W

1.50 min.

Ko

3.2 ± 0.2

P2

2.0 ± 0.1

10.9 ± 0.2 10.7 ± 0.2

4.0 ± 0.1

Po

12.0 ± 0.1

P1

Ao Bo

0.30 ± 0.05 1.5 + 0.1

1.75 ± 0.1

E1

7.5 ± 0.1

- 0.0

F

T Do

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 69: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-5

SOP-20 CARRIER TAPE OUTLINE DRAWING

Ko

Bo

Ao

P1 A

E1

AB

F

W

T

PoφDo

B

P2

SECTION A-A

SECTION B-B

φD1

24.00± 0.30

DoT

F

-0.00

11.50± 0.10

E1

1.75± 0.10

0.30± 0.05 1.50 +0.10

BoAo

P1

12.00± 0.10

Po

4.00± 0.10

10.90± 0.20 13.30± 0.20

Ko

3.10± 0.20

P2

2.00± 0.10

D1

W

1.50 min.

SYMBOL

SPEC.

SYMBOL

SPEC.

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocke to the top surface of the carrier

t

Page 70: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-6

SOP-24 CARRIER TAPE OUTLINE DRAWIN

Bo

Ko Ao

P1 A

E1

AB

F

W

T

PoφDo

B

P2

SECTION A-A

SECTION B-B

φD1

24.00± 0.30

DoT

F

-0.00

E1

1.75± 0.10

0.30± 0.05 1.50 +0.10

BoAo

P1

12.00± 0.10

Po

4.00± 0.10

10.90± 0.20 15.90± 0.20

Ko

3.10± 0.20

P2

2.00± 0.10

D1

W

1.50 min.

SYMBOL

SPEC.

SYMBOL

SPEC. 11.50± 0.10

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 71: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-7

SOT-23/SOT-23-5/SOT-23-6 CARRIER TAPE OUTLINE DRAWING

φD1

T

SECTION B-B

Bo

Ko

SECTION A-A

P2 P1

AoB B

PoφDo

F

W

A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 8.00± 0.30

D1

W

1.00 min.

Ko

1.45± 0.25

P2

2.00± 0.05

3.15± 0.20 3.20± 0.20

4.00± 0.10

Po

4.00± 0.10

P1

Ao Bo

0.22± 0.05 1.50 +0.10

1.75± 0.10

E1

3.50± 0.05

-0.00

F

T Do

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 72: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-8

SOT-89 CARRIER TAPE OUTLINE DRAWING

P1

φD1

SECTION A-A

SECTION B-B

Bo

Ko

P2

AoB

φDo Po

T

F

W

B A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 12.00± 0.30

D1

W

1.50 min.

Ko

1.80± 0.20

P2

2.00± 0.05

4.80± 0.20 4.50± 0.20

4.00± 0.10

Po

8.00± 0.10

P1

Ao Bo

0.30± 0.05 1.50 +0.10

1.75± 0.10

E1

5.50± 0.05

-0.00

F

T Do

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocke to the top surface of the carrier

t

Page 73: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-9

SOT-143 CARRIER TAPE OUTLINE DRAWING

Ko

Bo

Ao

A

E1

A

F

W

φDo Po

BB

P2 P1

SECTION A-A

SECTION B-B

T

φD1

8.00± 0.30

DoT

F

-0.00

3.50± 0.05

E1

1.75± 0.10

0.20± 0.03 1.50 +0.10

BoAo

P1

4.00± 0.10

Po

4.00± 0.10

3.20± 0.20 2.70± 0.20

Ko

1.35± 0.20

P2

2.00± 0.05

D1

W

1.00 min.

SYMBOL

SPEC.

SYMBOL

SPEC.

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 74: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-10

SOT-223 CARRIER TAPE OUTLINE DRAWING

P1

φD1

SECTION A-A

SECTION B-B

Bo

Ko

P2

AoB

φDo Po

T

F

W

B A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 12.00± 0.30

D1

W

1.50 min.

Ko

2.10± 0.20

P2

2.00± 0.05

6.90± 0.20 7.50± 0.20

4.00± 0.10

Po

8.00± 0.10

P1

Ao Bo

0.30± 0.05 1.50 +0.10

1.75± 0.10

E1

5.50± 0.05

-0.00

F

T Do

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocke to the top surface of the carrier

t

Page 75: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-11

MSOP-8/10 CARRIER TAPE OUTLINE DRAWING

Ko Ao

Bo

A

E1

AB

F

W

T

PoφDo

B

P2

SECTION B-B

SECTION A-A

P1

φD1

12.00± 0.30

DoT

F

-0.00

5.50± 0.05

E1

0.30± 0.05 1.50 +0.10

BoAo

P1

8.00± 0.10

Po

4.00± 0.10

5.20± 0.20 3.30± 0.20

Ko

1.60± 0.20

P2

2.00± 0.05

D1

W

1.50 min.

SYMBOL

SPEC.

SYMBOL

SPEC. 1.75± 0.10

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 76: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-12

TO-252 CARRIER TAPE OUTLINE DRAWING

φD1

SECTION A-A

SECTION B-B

T

Bo

Ko

P2 P1

AoB B

PoφDo

W

F

A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 16.00± 0.30

D1

W

1.50 min.

Ko

2.60± 0.20

P2

2.00± 0.10

6.90± 0.20 10.50± 0.20

4.00± 0.10

Po

8.00± 0.10

P1

Ao Bo

0.30± 0.05 1.50 +0.10

1.75± 0.10

E1

7.50± 0.10

-0.00

F

T Do

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 77: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-13

TO-263 CARRIER TAPE OUTLINE DRAWING

P1

φD1

SECTION B-B

Bo

SECTION A-A

Ko

P2

AoB

φDo Po

T

F

W

BA

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 24.00± 0.30

D1

W

1.50 min.

Ko

4.90± 0.20

P2

2.00± 0.10

10.60± 0.20 16.10± 0.50

4.00± 0.10

Po

16.00± 0.10

P1

Ao Bo

0.35± 0.05 1.50 +0.10

1.75± 0.10

E1

11.50± 0.10

-0.00

F

T Do

*Note6

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier 6. Ao and Bo must keep the lateral movement of the component within 1.0 mm in the pocket

Page 78: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-14

QFN 3x3x0.6 CARRIER TAPE OUTLINE DRAWING

Ko Ao

Bo

A

E1

AB

F

W

T

PoφDo

B

P2

SECTION B-B

SECTION A-A

P1

φD1

12.00± 0.30

DoT

F

-0.00

5.50± 0.05

E1

1.75± 0.10

0.30± 0.05 1.50 +0.10

BoAo

P1

8.00± 0.10

Po

4.00± 0.10

3.30± 0.20 3.30± 0.20

Ko

0.90± 0.20

P2

2.00± 0.05

D1

W

1.50 min.

SYMBOL

SPEC.

SYMBOL

SPEC.

Note : 1. 10 sprocket hole pitch cumulative tolerance ± 0.2 2. Material: conductive polystyrene 3. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 4 Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 79: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-15

QFN 3x3x0.9 CARRIER TAPE OUTLINE DRAWING

Ko Ao

Bo

A

E1

AB

F

W

T

PoφDo

B

P2

SECTION B-B

SECTION A-A

P1

φD1

12.00± 0.30

DoT

F

-0.00

5.50± 0.05

E1

1.75± 0.10

0.30± 0.05 1.50 +0.10

BoAo

P1

8.00± 0.10

Po

4.00± 0.10

3.30± 0.20 3.30± 0.20

Ko

1.20± 0.20

P2

2.00± 0.05

D1

W

1.50 min.

SYMBOL

SPEC.

SYMBOL

SPEC.

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 80: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-16

QFN 4x4x0.9 CARRIER TAPE OUTLINE DRAWING

Ko Ao

Bo

A

E1

AB

F

W

T

PoφDo

B

P2

SECTION B-B

SECTION A-A

P1

φD1

12.00± 0.30

DoT

F

-0.00

5.50± 0.05

E1

1.75± 0.10

0.30± 0.05 1.50 +0.10

BoAo

P1

8.00± 0.10

Po

4.00± 0.10

4.40± 0.20 4.40± 0.20

Ko

1.20± 0.20

P2

2.00± 0.05

D1

W

1.50 min.

SYMBOL

SPEC.

SYMBOL

SPEC.

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 81: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-17

DFN 2x2x0.75 CARRIER TAPE OUTLINE DRAWING

φDo

SECTION A-A

SECTION B-B

T

φD1

Po P2 P1

Ko

Bo

Ao

E1F

W

φDoT

F

-0.00

3.50± 0.05

E1

1.75± 0.10

0.26±0.04 1.50 +0.10

BoAo

P1

4.00± 0.10

Po

4.00± 0.10

2.30±0.10 2.30±0.10

Ko

1.15±0.10

P2

2.00± 0.05

φD1

W

SYMBOL

SPEC.

SYMBOL

SPEC.

-0.001.00 +0.25

8.00± 0.30

Note: 1. Refer to EIA-481-B

2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 82: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-18

DFN 3x3x0.75 CARRIER TAPE OUTLINE DRAWING

Ko Ao

Bo

A

E1

AB

F

W

T

PoφDo

B

P2

SECTION B-B

SECTION A-A

P1

φD1

12.00± 0.30

DoT

F

-0.00

5.50± 0.10

E1

1.75± 0.10

0.30± 0.05 1.50 +0.10

BoAo

P1

8.00± 0.10

Po

4.00± 0.10

3.30± 0.20 3.30± 0.20

Ko

1.15± 0.25

P2

2.00± 0.10

D1

W

1.50 min.

SYMBOL

SPEC.

SYMBOL

SPEC.

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 83: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-19

SC-70/SC-82 CARRIER TAPE OUTLINE DRAWING

Ko

Bo

Ao

E1F

W

φDo Po P2 P1

SECTION A-A

SECTION B-B

T

φD1

φDoT

F

-0.00

3.50 ±0.05

E1

1.75 ±0.10

0.254± 0.02 1.50 +0.10

BoAo

P1

4.00 ±0.10

Po

4.00 ±0.10

2.25 ±0.10 2.40 ±0.10

Ko

1.22 ±0.10

P2

2.00 ±0.05

φD1

W

SYMBOL

SPEC.

SYMBOL

SPEC.

-0.001.00 +0.25

-0.108.00 +0.30

Note: 1. Refer to EIA-481-B

2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 84: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

II-20

TSSOP-16 CARRIER TAPE OUTLINE DRAWING

P1

φD1

SECTION A-A

SECTION B-B

Bo

Ko

P2

AoB

φDo Po

T

F

W

B A

E1

A

SYMBOL

SPEC.

SYMBOL

SPEC. 12.00± 0.30

D1

W

1.50 min.

Ko

1.60± 0.20

P2

2.00± 0.05

6.80± 0.20 5.40± 0.20

4.00± 0.10

Po

8.00± 0.10

P1

Ao Bo

0.30± 0.05 1.50 +0.10

E1

5.50± 0.05

-0.00

F

T Do

1.75± 0.10

Note: 1. Refer to EIA-481-B 2. 10 sprocket hole pitch cumulative tolerance ± 0.2 3. Material: conductive polystyrene 4. Ao and Bo measured on a plane 0.3mm above the bottom of the pocket 5. Ko measured from a plane on the inside bottom of the pocket to the top surface of the carrier

Page 85: Part Ⅰ Package Outline Drawing Carrier Tape Outline … · 4 TSSOP-16 PACKAGE OUTLINE DRAWING Ⅰ-59 TSSOP-16 Exposed Pad(Heat Sink) PACKAGE OUTLINE DRAWING Ⅰ-60 Part Ⅱ - Carrier

III-1

Part III Reel Outline Drawing (unit:mm)

REEL OUTLINE DRAWING

Package Type

SOT-143SOT-23-x

TSOT-23-xSC-70SC-82

DFN 2x2

SOP-8TSSOP-16MSOP-8

MSOP-10SOT-223QFN 3x3QFN 4x4DFN 3x3

20.2 MIN.

20.2 MIN.

20.2 MIN.

12.4

24.4

12.4

16.4

178± 2 50 MIN.

330± 2

330± 2

330± 2

50 MIN.

50 MIN.

60 MIN.

+0.5-0.213.0-0.0

+2.0

-0.2+0.5

-0.2

+0.5-0.2

+0.5+2.0

+2.0-0.0

-0.0

13.0

13.0

+2.0-0.0 13.0

1.5 MIN.

1.5 MIN.

1.5 MIN.

A H W C d D

20.2 MIN.8.4178± 2 50 MIN. +0.5-0.2-0.0

+2.0 13.0 1.5 MIN.

TO-252-3LTO-252-5L

SOP-14(150mil)SOP-16(150mil)

SOP-16W(300mil)

TO-263-3LTO-263-5L

20.2 MIN.1.5 MIN.SOT-89-3LSOT-89-5L

A

φC

D

W d

H

Note: Refer to EIA-481-B

TO-92 TAPING SPEC. DRAWING

F

E

T

P1

B

φDP

A

W

e

F

1 9 .0 ± 0 .5

EB

1 6 .0 ± 0 .5

A

9 .0 ± 0 .2 6 .0 ± 0 .2 0

T

0 .6 ± 0 .1

e

2 .5 B S C

P 1

1 2 .7 B S C 4 .0 ± 0 .2

D

W

1 8 .0 ± 0 .2

S Y M B O L

S P E C .

P

1 2 .7 B S CS P E C .

S Y M B O L