Cationic Electrocoating Composition U.S. Patent 5,556,91X Sept. 17, 1996 K. Tabinaga et a/., assignors to Nippon Paint Co. Ltd., Osaka-b, Japan

A cationic electrocoating composition cbmprising a resinous component and an aqueous medium, which is free of blocked isocyanates and curable at a temperature of 100 to 14O”C, wherein the resin component comprises a vinyl polymer having 5 to 1,000 substituted acylamide groups. .

Printed Circuit Board U.S. Patent 5357,844. Sept. 24, 1996 AC Bhatt et al, assignors to Bhf Corp., Amonk, N.Y.

A method of preparing a printed circuit board having a film redistribution layer and selective, filled plated through holes in- cluding seeding with a palladium/tin col- loidal suspension to make the exposed sur- faces catalytic for electroless copper plating; and electrolessly plating copper over the exposed surfaces and in the plated through hole barrels to a thickness of 0.001 to 0.0012 in.

Paint Sprayer with Inlet Silencer U.S. Patent 5558,492. Sept. 24, 1996 J. W. Kieffer, assignor to Wagner Spray Tech Corp., Minneapolis

An assembly comprising an air com- pressor retained within a pressurizing en- closure, the air compressor having a pri- mary air intake port, and a silencer in direct fluid communication with the primary air intake port.

Polishing System U.S. Patent5,558,559. Sept. 24, 1996 Y. Noguchi et al, assignors to Sumitomo Metal Industries Ltd., Osaka, Japan

A polishing system for opposite edge faces of a plated steel strip wherein a plat- ing layer on opposite edge faces of the plated steel strip is removed.

Microcleaning Apparatus U.S. Patent 5,558,562. Sept. 24, 1996 C. Diat, Vigneux-de-Betagne, France

A method of microcleaning and of mi- croblasting a support comprising spray- ing a multitude of jets of compressed air charged with fine abrasive particles hav-

ing grain sizes, which lie mainly in the range 80-120 micrometers, the spraying step including the emitting of the jets via nozzles, and the displacing at high speeds of the jets to sweep the support with the jets, wherein the multitude of jets is at least ten, and wherein, at each nozzle, the respective jet has a cross-section lying in the range 400 micrometers to 4 millime- ters, thereby imparting very low kinetic energy to each jet.

Hot-Dip Apparatus U.S. Patent 5,558,715. Sept. 24, 1996 P Abed et a/., assignors to SOLLAC, Societe anonyme, Puteaux, France

An installation for coating steel products with a zinc alloy, comprising a tank con- taining a bath of a molten zinc alloy wherein the tank includes a partition for separating the bath into first and second compartments and includes circulation means for circulating dross-enriched alloy from the first compartment to the second compartment; a means for dipping steel products into a portion of the bath to coat the product with the zinc alloy; and means for accelerating the decantation of dross

m CUSTOM FABRICATIONS Anodizing systems, Automated hoist systems, Chemfi/m lines, Cleanroom pass throughs, CPVC tanks and liners, Nectroless nickel lines, Environmental enclosures, Etching lines, Exhaust hwds, Fume scrubbers, Labomtory hoods, Polypropylene tanks, PVC tanks and liners, PVDF tanks and liners, Secondaty containment sump& Selective go/d plating units, Stainless steel tanks, 7itanium tanks, and Wet stations.

e HEATERS & CONTROLS Heating coils, immersion heaters, Screw in heaters, Combination controllers and other process confro/s.

= RECTIFIERS A// types and sizes to meet any need.

= FILTERS Carbon, Cartridge, Filter bags, Filter chambers, and Filter presses.

= PUMPS Air diaphmgm pumps, VertM centrifugal pumps, and pumps for any process application

= TANKS A// types of plastic and steel, Bulk storage, Conical bottom, Cylindrical and Rectangular.

ALSO Service l Repairs l Installations l Used Equipment

1st in Quality & Customer Care

C. 241 N. Roosevelt,

Chandler, AZ 85229 (eo2) 940-1905

Fax (902) 9404079 (800) 888- 1898

Now you can Eliminate Racking of Semi-Conductors, Electronic Parts, etc. by Barrel Plating with CMC Plastic Balls. Balls are reuseable- designed for all types of metal.

l Completely Copper Plated l Contains No Lacquer l Every Ball is Perfectly Round-Has No Holes l Balls are Lightweight Easily Sifted Out CMC Plastic Balls make barrel plating of small parts possible-even flat discs and interlocking items! Because CMC Plastic Balls are copper plated, they can easily be mixed with other items to be plated or burnished. The balls are not lacquered and therefore are conductive, yet CMC Plastic Balls are so Ii ht in wei no problem at all. C ti

ht that sifting is C Plastic % alls pay for

themselves because they can be reused as well as refined for the gold or other precious metals used in plating.

0 clvl c CATHO-SPHERE, INC. 97 N. 18th St. l Brooklyn, NY 11211 Phone71 B-387-7927 l FAX 718-384- 881 B

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162 METAL FINISHING l JUNE 1997