PACKAGING SOLUTIONS

PACKAGING SOLUTIONS

Christian GanningerProduct Manager MicroTCA, Backplanes and PSUEMEA : +49-7082-794-633@ : [email protected]

Rugged MicroTCARugged MicroTCA

2 19.10.2008

Agenda

Rugged MicroTCA: Introduction, explanation of MicroTCA.1 & MicroTCA.3, StatusupdatePresented by Christian Ganninger, Schroff GmbH

Rugged MicroTCA Connector testsPresented by Michael Burger, ept Gmbh & Co. KG

Rugged MicroTCA ApplicationsPresented by Irene Hahner, Kontron AG

3 19.10.2008

MicroTCA.0 (Micro Telecommunications Computing Architecture Base Specification)

MicroTCA.0 as defined provides support for requirements such as NEBS, ETSI and ITUspecifications, which are focused on the central office telecommunication environment.

Shock & Vibration requirements:

Item Vibration Shock Specification

Connector Contact Only 10-500 Hz, 10g, 3x 8 hours 30g, 11ms, 18 shocks GR-1217-CORE

With Module 5-100Hz, 1g, 3x 8 hours 15g, 11ms, 3 shocks/axis GR-1217-CORE

Shelf, Cube, Pico

Subrack / Module

2-9 Hz / 9-200 Hz, 0,5g sinusodial, > 10 min / axis

7g, 11ms, 18 shocks IEC 61587-1

Subrack / Module

NEBS Zone 4 IEC 61587-2 / ANSI T1.329

4 19.10.2008

Rugged MicroTCA

The Rugged Micro Telecommunications Computing Architecture specifications defines the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in MicroTCA.0.

MicroTCA.1 (Air Cooled Rugged MicroTCA): this first sub-specification of MicroTCA describes rugged air-cooled systems for industrial applications.

MicroTCA.2 (Hardened Air Cooled MicroTCA): the second sub-specification of MicroTCA; it describes rugged air-cooled systems for military applications.

MicroTCA.3 (Hardened Conduction Cooled MicroTCA): the third sub-specification of MicroTCA; it describes rugged conduction-cooled systems for military applications

Adopted 19-Mar-09

Not started

In work

5 19.10.2008

MicroTCA.1 (Air Cooled Rugged MicroTCA)

Shock & Vibration requirements :Item Vibration Shock Module Retention Specification

Connector Contact Only XR1 XR1 - EIA-364-28D

XR2 XR2 - EIA-364-28D

With Module XR1 XR1 AMC.0 Locking Latch IEC 61587-1

XR2 XR2 Additional Retention Device mandatory ANSI/VITA 47

Shelf, Cube, Pico

Subrack with Plug-in Unit

XR1 XR1 AMC.0 Locking Latch IEC 61587-1 DL3

XR2 XR1 Additional Retention Device mandatory ANSI/VITA 47 V2 & DL3

XR1: Vibration 3g Sinusoidal (MicroTCA.0 = 0,5g) (2-9 Hz, amplitude 10 mm, 9-200 Hz, acceleration 30 m/s², 1 octave/min, 3 axes / 10 cycles each axis)

Shock 25g (MicroTCA.0 = 7g) (250 m/s² / 18 ms half-sine, 3 axes, 3 shocks, two directions each axis (18 shocks)

In accordance to IEC 61587-1:2007 Performance level DL3

XR2: Vibration 8g Random (5-2000 Hz, 0.04 g²/Hz, 3x1h)

In accordance to VITA 47 Class V2

Shock 25g (250 m/s² / 18 ms half-sine, 3 axes, 3 shocks, two directions each axis (18 shocks))

In accordance to IEC 61587-1:2007 Performance level DL3

Resistance shall not increase more than 10 Ohms for longer than 10 ns per contact pair. See GR-1217-CORE section 5.4.4, objective O5-81

6 19.10.2008


Thermal requirements :

3 different Levels: Ambient (MicroTCA.0) and 2 Extended Temperature ranges XT1 & XT1L

MicroTCA.0: - 5°C to + 55°CXT1L: - 40°C to + 55°CXT1: - 40°C to + 70°C

Additional requirements: Drop test, RoHS, Acoustic, Surface temperature are defined as application specific

For other requirements like Earthquake, Flammability, Atmospheric, Module insertion cycles, ESD, EMC, Safety MicroTCA.1 refers to the MicroTCA.0 base specification

-> actions: Electronic parts with enhanced temperature range, System cooling has to be adopted

7 19.10.2008


Shock & Vibration requirements :Item Vibration Shock Module Retention Specification

Connector Contact Only XR1 XR1 - EIA-364-28D

XR2 XR2 - EIA-364-28D

With Module XR1 XR1 AMC.0 Locking Latch IEC 61587-1

XR2 XR2 ANSI/VITA 47

Shelf, Cube, Pico

Subrack with Plug-in Unit

XR1 XR1 AMC.0 Locking Latch IEC 61587-1 DL3

XR2 XR1 ANSI/VITA 47 V2 & DL3

Additional Retention Device mandatory

Additional Retention Device mandatory

Rugged MicroTCA Retention Device

8 19.10.2008

Rugged MicroTCA Retention Device

AdvancedMC.0front panel

MicroTCA.1front panel( XR2 )


front panel with flange

additionalretention

screw

9 19.10.2008

Why is a special Retention Device needed?

Gap between Faceplate / attachment plane due to tolerances of the module and the subrack

0,0mm min.


1,6mm max.

10 19.10.2008

Why is a special Retention Device needed?

Standard AdvancedMC Module

Is plugged into the slot until the module is seated on the bottom of the backplane connector body

Fixed in this position by the locking mechanism of the handle.

Rugged AdvancedMC Module

Inserted into the slot until the module is seated on the bottom plate of the backplane connector

Fixed in this position by the locking mechanism of the handle.

Gap between the front panel flange and the subrack, worst case: 1.6 mm


11 19.10.2008

Why is the Retention Device needed?

F

Face plate deflection

F

F

When the Rugged MicroTCA Module is screwed to the subrack…

… the face plate will be deflected…

… and the force will be applied to the connector. The module bare board and the connector bottom side will be stressed.

Conclusion:A locking method is needed, that fixes the module in the chassis in position without applying force into direction of the connector.


12 19.10.2008

Solution (patented, part of the MicroTCA.1 specification):

Gap 0.0 mm Maximum gap ( 1.60 mm )*

µTCA chassisµTCA chassis Front panel flangeFront panel flange µTCA chassisµTCA chassis Front panel flangeFront panel flange

1.60

* Based on 185,85 subrack depth* Based on 185,85 subrack depthCollet

Screw M3


Welded sleeve

13 19.10.2008

Solution for Rugged MicroTCA & AdvancedTCAMicroTCA.1 (Air Cooled Rugged MicroTCA)

Easily exchangeable! Only the stainless steel front panel is different from a standard AMC.0 module. Bare board, die cast parts and handle are the same.

With a special Rugged AdvancedMC Carrier the MicroTCA.1 Modules can also be used in a AdvancedTCA environment

14 19.10.2008

Result:Force max. = 1,3 N

TestScrew fasteners tightened using a torque screwdriver to the DIN prescribed 0,67Nm (for an M3 screw).

Three front panel flange to chassis distances were tested: 0.5mm, 1.0mm and 1.5mm. The measurement was repeated for the three distances, a minimum of five times each.

0.5; 1.0; 1.5

Verifications: Test 1: Force effect to backplane and connector cont.MicroTCA.1 (Air Cooled Rugged MicroTCA)

IssueTest to determine if loads are transferred through the AMC Module PCB to the chassis backplane and connector when fixing an AMC module with the SCHROFF supplemental RµTCA screw fastener in a µTCA chassis.

15 19.10.2008

ResultF

Face plate

deflection

Face plate deflection in mm

0,0 0,5 1,0 1,5 2,00

200

400

600

800

Weg in mm

Kra

ft in N

For

ce in

N

0.1 0.2

100

175

0.14

Verifications: Test 2: Face plate stiffeness cont.MicroTCA.1 (Air Cooled Rugged MicroTCA)

16 19.10.2008

Verifications: Test 3: Shock and VibrationMicroTCA.1 (Air Cooled Rugged MicroTCA)

Standard Schroff MTCA.0 guide rails and die-cast latch retainer

Test Jig for Multiple Slots (3 x Mid-size AdvancedMC.0 Double Modules)

Backplane with ConCardMicroTCA connectors

AdvancedMC.0Mid-size Module, Double height, 700g

Result: Passed! (Electrically and mechanically)

17 19.10.2008

MicroTCA.3 (Hardened Conduction Cooled MicroTCA)

Shock & Vibration requirements :

Test 1:Random vibration - 50 Hz to 100 Hz increasing at 6 dB/octave - 100 Hz to 1000 Hz PSD = 0.2 g²/Hz

- 1000 Hz to 2000 Hz decreasing at 6 dB/octave - 3 axis each axis 60 minsNo contact discontinuity exceeding 10Ω/10 ns

Mechanical shock - 40g/11 ms half sine - 3 axis/two directions each 3 shocks

No contact discontinuity exceeding 10 Ω/10 ns

Test 2:Random vibration - 50 Hz to 100 Hz increasing at 6 dB/octave

- 100 Hz to 1000 Hz PSD = 1.5g²/Hz - 1000 Hz to 2000 Hz decreasing at 6 dB/octave

- 3 axis each axis 60 minsNo contact discontinuity exceeding 10Ω/10 ns

Mechanical shock - 50g/11 ms half sine- 3 axis/two directions each 3 shocks No contact discontinuity exceeding 10 Ω/10 ns

preliminary

18 19.10.2008


Demands other kind of chassis

The AdvancedMC Module must be secured with a Wedge-LOK to the chassis

The Wedge-LOK has two tasks:- Securing the AdvancedMC module in extreme conditions- Transfering the heat from the hot spots to the outer side of the chassis

19 19.10.2008


Intention is: don‘t change the AMC module

The module will be inserted into a clamshell

The Clamshell will be special for the different AdvancedMC modules

The Clamshell will contect the hot spots (with thermal paste)

20 19.10.2008


Intention is: don‘t change the AMC module

The module will be inserted into a clamshell

The Clamshell will be special for the different AdvancedMC modules

The Clamshell will contect the hot spots (with thermal paste)

Heat transfer will be from the hot spot through the clampshell and the Wedge-LOK to the chassis

The chassis might have heat sinks, cold plates or forced air cooling.

21 19.10.2008


Status:

The PICMG is planing shock & vibrational tests to proof this concept!!!

Rugged MicroTCA

Thank you for your attention!

PACKAGING SOLUTIONS

Christian GanningerProduct Manager MicroTCA, Backplanes and PSUEMEA : +49-7082-794-633@ : [email protected]

Rugged MicroTCARugged MicroTCA

Documents

PACKAGING SOLUTIONS