Packaging and Characterization of Silicon Carbide Thyristor

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  • 8/9/2019 Packaging and Characterization of Silicon Carbide Thyristor

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    Packaging andCharacterization of SiliconCarbide ThyristorPower Modules

    Presented by,

    Sanjay B.R

    M.Tech

    S!"C

    Mangalore

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    C#$T"$TS

    %ntroduction

    Module &abrication

    Results and 'iscussions

    Conclusions

    References

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    . %ntroduction

    Advantagesof SiC de(ices o(er their Sicounter)arts

    SiC is a wide bandga) se*iconductor *aterialwhich allows it to be used at te*)eratures abo(e+-C, the *ai*u* o)erating te*)erature of Side(ices

    /igher ther*al conducti(ity/igher breakdown electric 0eld strength/igher Saturation drift (elocity

    /igher Ther*al stability/igher che*ical inertness1olu*etric reduction of SiC2based P" syste*sSi*)ler ther*al *anage*ent syste*s

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    3hy )ackaging4

    &or Parallel con0guration of SiC de(ices Current yield of large2area SiC de(ices is low

    )ri*arily due to *aterial defects.

    To )ro*ote better ther*al cou)ling.

    %t is i*)ortant that these )arallel2con0gured

    SiC de(ices share current e5ually to reducethe )otential for failure.

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    3ork6

    7 SiC thyristor de(ices with di*ensions of8**98**98.:** were )ackaged into asingle *odule on a direct bond co))er ;'BC