OVERVIEW OF ADVANCED MATERIAL DEPOSITION Sol gel deposition Sputtering deposition MEMS actuators High

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  • Prototyping Pilot Line Workshop | ANDRE Bernard | 28/06/2019

    OVERVIEW OF ADVANCED MATERIAL DEPOSITION CAPABILITIES

  • | 2

    300mm & 200mm Si components Platforms  ~270@200mm equipments  ~105@300mm equipments

     5600 square meters Cleanroom - ISO3-5

     24/7 operations

    200mm MEMS Platform  ~130@200 mm equipments  2200 square meters - ISO 4-5

     24/7 operations

    Substrates

  • | 3

    Mature Processes & Technologies

    Wafer service thru LETI 3S (Silicon Specialities Solutions)

    IP licensing

    Technology Transfer

    New products & applications

    Collaboration thru LETI’s Silicon Product Divisions (DCOS, DOPT, DTBS)

    New Materials & Process

    Development

    Collaborative bilateral research on specific project

    Common laboratories

    Affiliation program

    New Equipement Engineering

    Specific Joint Development Program

    A full range of business models to meet our partner’s needs

    OUR COLLABORATION OFFER

  • | 4

    • Our Motto : Developing Advanced Materials Solutions for Industrial

    Applications

    Advanced PCRAM Multilayer Optical filters for imagers Interco : Pillars 10µm pitch 3 MoS2 monolayers on 12’’

    substrate

    ADVANCED MATERIAL DEPARTMENT

  • | 5

    - 100 permanent positions

    - 10 PhD students

    - 7X24 hrs Shift time PVD,CVD, ECD

    - 40 Tools

    - > 100 process chambers

    - 200 and 300 mm Field of applications

    - Microelectronics

    - Photonics

    - Sensors

    IDENTITY CARD of the Advanced Material Deposition

    department : Some Figures

  • | 6

    Engineering

    Developments

    Process tuning on known

    basis

    « Longer » developments

    (typically < week)

    Directly related to the

    programs needs

    Chalenged in term of delay

    Daily Operations Longer term R&D

    New Material Developments

    New Deposition Technique

    New Material Functionalities

    In collaboration with

    Academics and Tool

    Suppliers

    Known Process

    Recurent Batches

    Higher Level of Maturity

    Chalenged in terme of

    delay (typically

  • | 7

    Magnetron sputtering

    Wet deposit.

    ECD

    Muli-Cathode co-sputtering

    E-beam evaporation

    Ion Beam deposition

    CVD/ALD

    Ionfab 200mm

    Centura 200mm

    Volta lineri-Sprint SSW

    Sigma 200mmEndura 300mmEndura 200mmClusterline 200mmLLS EVO

    EVA 760

    Versalis 300mm

    Polygon 300mm

    W

    Alta 300mm &

    in-situ metro Raider

    300mm

    Producer 300mm

    Planar 300mm

    CAPABILITIES OVERVIEW

  • | 8

    • Our Motto : « From Material to Device » : fast Proof Of Concept demonstration

    mainly for Photonic Applications.

    • Our Skills : Crystal growth & Thin Film epitaxy

    Technology & processes on

    Non « CMOS standard » substrates & materials

    II-VI Crystal Growth & epitaxy

    GaN epitaxy for Native

    Coloured LED (RGB) Lasers, 3-5 Photonic Display 3-5, GaN

    PHOTONIC MATERIAL & TECHNOLOGY DEPARTMENT

    Array Detector III-VIGaN epitaxy Power Devices

    HgTe HgCdTe

  • | 9

    Substrates & Surface prep

    Thin Film Epitaxy

    1µm contactless lithography

    Plasma & Ionbeam Etching

    PVD / CVD / ALD

    Physical Characterization

    CAPABILITIES OVERVIEW

  • | 10

    • From Surface Preparation to Contact Plug and Integration

    Quasi in-situ XPS

    AFM

    InP surfaces

    Impact of preclean on surface properties Study of solid-state reaction

    Contact Plug Development Integration of contacts

    Ni / GeSn system

    W Liner and W Filling

    1 4 .5

    µ m

    III-V / Si Lasers

    EXAMPLE 1/6

    Advanced Contact Technologies for Electronics and Photonics

  • | 11

    Cosputtering capability for

    composition fine-tuning

    Memory cell on

    300mm MAD300 test

    vehicle

    Ti/TiN

    Top electrode

    Surface

    preparation

    Top electrode

    PCM 1

    1

    2

    2

    3

    3

    Industrial

    pDC GST

    chamber

    Multicathode

    chamber

    Si

    PCM full stack deposition:

    EXAMPLE 2/6

    Phase Change Memories

    Quasi in-situ metrology

    connectivity via Single wafer

    vacuum carrier (XPS,

    Raman,Ellipso w/o air break)

    Si

    Multi-layer deposition and

    ultra thin film control

  • | 12

    Applications

    • RGB filter on top of photosites matrix • Colored picture (Bayer Matrix)

    • IRCUT / IRPB filters defined under RGB filter • IRCUT : suppress RGB filter rejection in IR • IRPB : optimization of transmittance in IR

    AMAT PRODUCER GT1

    In Operando metrology

    EXAMPLE 3/6

    Filters for CMOS Image Sensors

  • | 13

    TSV

     Barrier and seed deposition Versalis (MOCVD TiN, iPVD Cu)

     eGseed (Direct on Barrier / seed repair) Raider ECD4- aveni chemistry

     TSV filling Raider ECD4- Dow IL9200

     Anneal Oven Cu1-2

    DAMASCENE

     Barrier & seed layer Endura 300B (iPVD TaN, Cu)

     ECD filling Raider ECD4- NP52000

     Anneal Raider ECD1

    RDL, µbumps, µpillars

     Ti, Cu undelayer Versalis

     ECD metal deposition Raider ECD3 (Cu, Ni, SnAg, Au)

    Cobalt ECD Raider ECD3 (aveni Kari chemistry)

    advanced “zip filing” process developed with

    iPVD

    Ti/TiN iPVD

    Cu

    MOCVD

    TiN

    SPTS Versalis

    AMAT Raider ECD3

    AMAT Raider ECD4

    Cu Cu

    Cu Cu

    Cu

    Example 4/6

    Interconnects for 3D integrations

    1x10 µm (AR 10:1)

    HD TSV

  • | 14

    PZT (Pb(Zr,Ti)O3) AlN

    Sol gel deposition Sputtering deposition

    MEMS actuators

    High K, High piezo coef

    NEMS sensors,

    Acoustic Wave Devices

    EXAMPLE 5/6

    Piezoelectric materials

    expertise in piezo material

    LiNbO3 AlN:Sc (K,Na)NbO3

    Pulsed Laser Deposition Starting 2020

  • | 15

    12’’

    EXAMPLE 6/6

    2D materials

    To Léti 12’’ demos

    Patent process

    S. Cadot & al

    300mm

    - 3 MoS2 monolayers on 12’’ substrates - ~50nm domains size

    From proof of concepts And Joint Developments with

    Industrial Equipment Suppliers

  • | 16

    PEOPLE

    - 100

    - 24 hours shift organisation

    CAPABILITIES

    ~ 100 [PVD CVD ALD ECD]

    tool chambers

    Industrial config or Dev Tools

    OUR GOAL

    speed up your innovations in

    material sciences

    and bringing them to industry

    Takeaways

  • | 17

    Leti, technology research institute

    Commissariat à l’énergie atomique et aux énergies alternatives

    Minatec Campus | 17 rue des Martyrs | 38054 Grenoble Cedex | France

    www.leti-cea.com

    THANK YOU FOR YOUR ATTENTION

    Contact : ANDRE Bernard

    Head of Advanced Material Deposition Department

    Next related talks :

    - Advanced Metal Contact : Philippe Rodriguez

    - 2D materials : Cécile Moulin

    - Piezo materials : Guillaume Rodriguez

    - AVENI solutions for 3D : Céline Doussot

    - GaN Material : Bérangère Hyot

    - Materials for Topologic Isolation : Philippe Ballet

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