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Outline

Collaboration Meeting at National Central University, Taiwan, March 25th, 2019

Robert Pisani, Scientist

Michael Lenz, Sr. Mechanical Technician Donald Pinelli, Sr. Electrical Technician

Rachid Nouicer, Scientist

First INTT Prototype

Silicon module 2018

source test, beam test

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Outline

Dan Cacace,

Mechanical Engineer

Robert Pisani, Scientist

Rachid Nouicer, Scientist

Miracle Company

in Taiwan

Connor Miraval,

Mechanical Engineer

Michael Lenz, Sr. Mechanical Technician Donald Pinelli, Sr. Electrical Technician

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Outline

Robert Pisani, Scientist

Michael Lenz, Sr. Mechanical Technician Donald Pinelli, Sr. Electrical Technician

Rachid Nouicer, Scientist

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Facilities at BNL Physics Department

Electronics Support Lab. Machine Shop

Detector Support labMain Silicon Lab

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Silicon Assembly Facility: INTT Assembly lab

OGP Smart Scope alignment system

XY Stage Inspection scope

Automatic Sensor Probe Station

Main Silicon Lab at BNL

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Production Capability: Silicon Assembly INTT

Laser scan of the stave (flatness)

Modules alignmentLadder survey

Measure the reference

point of the stave

OGP Smart Scope alignment system

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Outline Two INTT Bench Tests of Ladders at Silicon Lab. BNL

Bench Test #1Radioactive source test, cosmic-ray, beam test

Bench Test #2 (FVTX Bench Test)

Student: Masuda Hidekazu

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Outline

New facility for wire-bonding and encapsulation at Instrumentation Division, BNL

Silicon wire-bonding and Encapsulation Facility: Inst. Div. BNL

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Outline

Automatic

Encapsulation

machine

Silicon wire-bonding and Encapsulation Facility: Inst. Div. BNL

Thermal Recycling

Chamber

Wire-bonding machines

Kent, a new hire

LSST Science Raft Final Design Review • Brookhaven National Laboratory, Upton NY • 2015 10

Cleanroom Layout: Physics Department BNL (Courtesy of Bill Wahl)

Layout developed by Matt Rumore

LSST Science Raft Final Design Review • Brookhaven National Laboratory, Upton NY • 2015 11

Views of Cleanroom Physics Department BNL (Courtesy of Bill Wahl)

Anteroom Gowning Room Log Book Sign-in Station

LSST Science Raft Final Design Review • Brookhaven National Laboratory, Upton NY • 2015 12

➢ Test Stand 1 (Hardware Receipt/Inspection)

• Hardware Registration

• Prepare for storage in Cleanroom

Status: Commissioning

➢ Test Stand 2 (Mechanical Metrology - OGP)

• Single Sensor & Raft Base Plate metrology

Tooling includes: MF-01, 02, 03, 04, 05 & 07

(Covered by Takacs talk)

Status: Commissioning

➢ Test Stand 3 (Sensor EO Testing)

▪ Single Sensor EO Testing

(Uses vendor supplied shipping Jig)

Status: Commissioning

Tooling and Test Stand Readiness(Test Stands 1, 2 & 3)

No tooling – eDocumentation Only

TS-3 developed by Justine Haupt

Physics Department BNL (Courtesy of Bill Wahl)

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Since 2016: Mike Lenz contributed significantly in the mechanical assembly of the INTT Silicons

modules for: source test, cosmic ray test, and beam test

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Outline

Robert Pisani

Beam Test and Thermal Study of the Half Stave

Setup placed in tube and

insulated

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Outline INTT Detector Design and Integration

Barrels Support

Barrels

INTT in TPC

Dan Cacace

Front View

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Outline Necessary Equipment for Ladder Assembly

• With a wingspan of 31.5 inches, the staves require a large measurement system to survey the flatness throughout assembly.

• BNL’s on-hand OGP Smartscope Flash 500 is the perfect tool for the job:

• Large travel bridge with a support span of 33.125 inches.

• Measurement platen can accommodate multiple assembly fixtures at once.

• Top-down laser optical measurement system with potential Z accuracy of 2 microns.

Connor Miraval,

Mechanical Engineer

from LSST joined INTT

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Outline FEA Analysis and Ladder Assembly Procedure (OGP 500)

Connor Miraval,

Mechanical Engineer

from LSST joined INTT

chips pickup fixtureSensors pickup fixtures

Chips and Sensors mounted on the HDI = Ladder

Mounting HDI on the CFC Stave

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- The INTT BNL team contributed significantly:

- Design of the silicon sensors,

- Design of the bus High Density Interconnect (HDI),

- Assembly of silicon modules prototypes (stave+ HDI + chips + sensors), and wire-bonding

- Source test, cosmic-ray test, and beam test

→ Faced many issues and overcome many challenges in the design and assembly of silicon modules

→ This was necessary and it is part of a long learning curve leading to a successful INTT detector

→ Outcome of learning curve: moving toward the pre-production ladder assembly and ready for the ladder mass production

At BNL, we desperately need students from universities to learn from the experts in the silicon detector

construction and carry out the leadership in the INTT detector construction and physics analysis in sPHENIX.

Outline Conclusion