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OPPORTUNITIES FOR PIC’S ON INPOCT 29, 2019
AGENDA
§ What is Integrated Photonics?§ Addressable markets§ Introduction to SMART Photonics§ Value chain and way of working§ Some concrete applications§ Conclusions
2
CONVENTIONAL PHOTONICS
3Photonics Market size (2018): ± $ 650 Billion
BUILDING A CIRCUIT WITH ONLY 3 BASIC ELEMENTS
4
Photonic integration3 basic elements
Waveguide
Phase
Amplitude
j
ASOA
PHM
PWD
Electronic integration3 basic elements
Electronic chips InP Photonic Integrated Chips
PHOTONIC INTEGRATION RESEMBLES ELECTRONIC REVOLUTION
Photonic integration will change the world again!
5
Electronic integration has changed the world
INP INTEGRATION PLATFORM
§ Photonic integration needs active and passive components § Light sources and amplification can only be realized in Indium Phosphide (InP)§ Monolithic integration of all functionalities!§ Mature technology§ Butt-joint integration: no compromise between active and passive
components§ Full on-wafer electrical testing§ Enabler for low-cost integrated circuits!
6
waveguides phase modulators gratings Amplifiers/ laser gain section
COMPARISON PHOTONIC TECHNOLOGIESIntegrated Photonics platform technologies
Technique InP Si Photonics Hybrid Si.
Schematic view
Integrated full InP based chip
Silicon based chip with
connected InP laser
Silicon based chip with InP based lasers
bonded
Maximum bandwidth1 > 1,000 Gb/s 100 Gb/s 400 Gb/s
Integration level Full - Limited
Passive components
Activ
e co
mp. Lasers
Phase modulators
Required production facilitiesInP Fab
(eg SMART) InP Fab
(eg SMART)Si Fab
InP Fab (eg SMART)
Si FabInP/Si bonding
Fab
Key: Poor performance High performanceSource:
1 At competitive size and cost
Silicon element
InP element
INTEGRATED INP CHIPS MORE COST-EFFICIENT THAN HYBRID SILICON
8
HybridSilicium
A more efficient process flow and better scalability… Lower mask cost
Mask cost comparison (EUR’000)
0 1,500
InP~EUR 20k
Hybrid Silicon~EUR 1,000k
~50x more expensive
!
INDICATIVE
Process flow comparison
Si Waveguide litho and etch
Epitaxial growthEpitaxial growth
InP Waveguide litho and etch
Assembly: die attach
Back-end processing
InP Waveguide litho and etch
Back-end processing
Hybrid Silicon
InP
Fully scalable wafer-scale
process
No continuous flow,
individual dies per functional
material: Limited
scalability
Not required
Not required
INP PLATFORM CAPABILITIES
9
KEY MARKET OPPORTUNITIES IN COMMUNICATION AND SENSING
10
Communication applications
Sensing appications
Aviation
Big Data
5G Wireless
Energy
Healthcare
Automotive
High tech
Packaging
ChipManufacturing
design§ Communication applications key trends:
§ Ongoing transition to higher network speed § Access networks are migrating from DSL towards Fiber (FttX )§ 5G§ Ongoing rise in data traffic§ Increasing cloud based storage capacity (datacenters) required§ Transition towards advanced coherent optical to technology
§ PICs on InP create disruptive sensing solutions for many sectors:§ Health & Medical§ Automotive§ Aerospace / Aviation§ Machinery§ Energy§ Consumer Electronics
This leads to strongly improved and completely novel functionalities:
§ Smaller, faster, better performance and lower power
§ Photonic IC’s (PIC’s) can be used to address major problems in society
INTEGRATED PHOTONICS WILL HELP SOLVE MAJOR SOCIETAL ISSUES
Faster data rates and reduced power consumption
Mobility: Autonomous drivingEye safe LIDAR systems
IoT
Medical diagnostics: portable and close to patient
With Integrated Photonics we use IC’s that operate on the basis of light instead of electronics.
11
STRONG MARKET GROWTH, DRIVEN BY INP INTEGRATED PHOTONICS
-
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024
PIC market estimates 2024 (USD B)
Roland BergerMarkets&MarketsStratistics MRCKn owle dge Sourcing Intell ige nce LLPBCC Research
$0
$2,000
$4,000
$6,000
$8,000
$10,000
$12,000
2017 2018 2019 2020 2021 2022 2023 2024
InP Photonics development 2017-2024 (USD M)
Telecom Datacom Sen sing
Application value, driven by PIC PIC value itself
THE WORLD IS PAYING ATTENTION!
13
Source Photonics opens new InP laser fab
26 Feb 2019 - Facility in China will double production capacity of
lasers and other photonic components
Source: Optics.org Synopsys and SMART Photonics Expand InP-Based PIC Design AutomationDevelopment of SMART Photonics PDK for Synopsys’ PIC Design Suite Enables a Complete and Seamless InP-Based Design FlowSource: Million Insights
“Silicon Photonics Market
to Exhibit Huge Growth
Based on Rising Usage of
Photonic Technology and
Increasing Demand for
Optical Multiplexers Till
2025”Source: Bloomberg
Cisco to acquire silicon photonics
chip maker Luxtera for $660 million
Source: TechCrunch
SMART IS BUILDING ON >30 YEARS TECHNOLOGY HERITAGE
14
2012 2013 >2022Early1980’s
1994
First Multi Project Wafer produced
2017
Achieve full control
Scale up toserve globalcustomers asstate of theart photonicsfoundry
Origin Spin-off SMART Photonics
Round
New fab
Onboarding TU/e
First production
NanoLab establishedEstablished first shared facility for integrated Photonics prototyping
2002
Total investment in fundamental InP and Photonics research estimated at €300M
1991
Acquisition First commercialization components POEC acquired
by Uniphase for €1.2B
1998
Move to HTC andinstallation of tool setin HTC facility (50% ofprocess)
First step in control
2020
OUR FACILITIES
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• SMART Photonics @High Tech Campus– > 900m2 Production facility
• 570m2 3” Production cleanroom (Class 1000)– Processing and epitaxy
• SMART Photonics @NanoLab cleanroom Eindhoven– 850m2 Fully equipped R&D facility
SMART PHOTONICS BUSINESS MODEL
§ We are the first player offering production of InP integrated photonic chips as a foundry§ The foundry model is well established in the Semiconductor industry and currently accounts for more than 40% of the market§ Our customers are predominantly OEMs and system companies§ We use a generic process to support customers in a very broad set of application areas§ We sell our IC’s to large global companies as well as rapidly growing start-ups§ Market demand is presently exceeding our current capacity and is growing
16
DESIGN PICs PACKAGING MODULE SYSTEM
DESIGN HOUSES OEMsSYSTEM
COMPANIES(E.G. CISCO)
END USERS
GOOGLE, FACEBOOK,
AIRBUS, PHILIPS HEALTHCARE
§ We are the first player offering production of InP integrated photonic chips as a foundry§ The foundry model is well established in the Semiconductor industry and currently accounts for more than 40% of the market§ Our customers are predominantly OEMs and system companies§ We use a generic process to support customers in a very broad set of application areas§ We sell our IC’s to large global companies as well as rapidly growing start-ups§ Market demand is presently exceeding our current capacity and is growing
VALUE CHAIN FULLY EMBEDDED IN THE NETHERLANDS
17
DESIGN PICs PACKAGING MODULE SYSTEM END USERS
DESIGN TOOLS
18
Mask Generator
Designer
Design KitFoundry
Circuit SimulatorPhysical Simulations
LAYOUT-AWARE SCHEMATIC DESIGN FLOW
§ Functional design using parameterized building blocks§ Fast and accurate modeling of large-scale PIC designs§ Automatically sweep and optimize parameters§ Orientations and connections are kept and passed to the mask generation software
19
GENERIC PROCESS DEPLOYED THROUGH DESIGN KIT (PDK)
20
• Key Intellectual Property of the company resides in the broadest set of building blocks for Integrated Photonics
• Releasing building blocks take extensive effort. PDK thus represents a strong unfair competitive advantage for the long term
• Process Design Kits are available:– Access via state of the art software tools– Design manual and Functional building block
description– Full layout-aware design flow– Circuit simulation and Mask design
Process Design Kit with our Building blocks is key IP ...and is offered via the design software of:
EXAMPLE: 2.5 GHZ MODE LOCKED LASER
21
S. Tahvili and S. Latkowski, COBRA
1550.75 1551.00 1551.25 1551.50 1551.75-70
-65
-60
-55
-50
-45
-40
-35
-30
Pow
er d
ensi
ty (d
Bm/re
s)
Wavelength (nm)0 2 4 6 8 10 12 14
-80
-70
-60
-50
-40
-30
-20
2.40 2.45 2.50 2.55 2.60 2.65-80
-75
-70
-65
-60
-55
-50
-45
Spec
tral p
ower
(dBm
/Hz)
Frequency (GHz)
ISOA=115mA, USA=-2.7V
Spec
tral p
ower
(dBm
/Hz)
Frequency (GHz)
• Frequency comb laser for gas sensing• 30 mm cavity• < 4mm2
EXAMPLE: COMB LASER FOR GAS SENSING
22
OUTLOOK: LIDAR THE EYES OF THE FUTURE
23
Source: website Luminar
Advantages InP PIC technology
• Eye-safe wavelengths• Robust and small• Non-mechanical• High sensitivity
4 PRODUCT CATEGORIES THAT FULFILL ALL CUSTOMER NEEDS
24
Discrete components Discrete + components PICs MPW
§ Standardized industrial integration process
§ Design using generic building blocks to create integrated chips
§ PDK streamlines design process for generic PICs process
§ Combines several discrete components onto one chip, e.g:§ Laser + Modulator§ Laser Arrays§ Laser + Spot Size Converter
§ Facilitates Si Photonics integration
end components Connected to passive photonic
§ Low threshold access to new technology
§ Combines multiple projects on single wafer
§ Generic building block approach
§ Single high-end components § Connected to passive photonic
chips
SMART POSITIONED TO ACCELERATE INP PHOTONICS INDUSTRY
Photonic Integrated Chips (PIC’s) based on Indium Phosphide (InP) will play a key role in the lives of many people as they enable new and improved functionalities, ultimately making our world better, greener and safer
25
Extending technology leadership
Foundry will continue to fuel innovation
Accelerating scale-up process
Developing full photonics ecosystem
Continuous reinforcement
cycle
CONCLUSIONS
§ Integrated photonics has huge potential to have a very broad application range and to have strong societal impact
§ Dutch Integrated Photonics ecosystem built on years of investment in R&D, provides great opportunity for future economic strength in the Netherlands
§ SMART Photonics is playing a key role in the ecosystem, by supplying high performance InP integrated circuits through a foundry model
§ InP combines active and passive components in the best way
26