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FOR CONVENTIONAL & NEW SPACE MARKET
OPERATIONS SERVICES
OPERATIONS OVERVIEW
Rapid Prototyping
Hybrid Microwave Assy
Automatic Placement
RF Functional Test
Production Control
Optical Products
Magnetics & Windings
RF Tuning & Test
Thermo Vacuum Test
Production LogisticsIndustrial Engineering
EMC TestTest Facilities
PCB Manufacturing
RF Assembly
Power Applications
RF System AIT
Calibration ServicesTechnology Engineering
Vibration & Shock
AIT of LCTs & Payloads
Equipment Assembly
Digital LF
OPERATIONSENGINEERING
MODULES &OPTICS
MANUFACTURING EQUIPMENT
TUNING &TEST
ACCEPTANCETEST
INTERNATIONAL STANDARDS
• ECSS-Q-ST-70-08: Manual soldering of high-reliability electrical connections
• ECSS-Q-ST-70-38: SMT soldering
• ECSS-Q-T-70-18: RF cable assembly
• ECSS-Q-ST-70-26: Crimping of high-reliability electrical connections
• MIL-STD-883: Test method standard microcircuits
• ECSS2049000: Internal visual inspection of integrated circuits
• Visual inspection of active and passive satellite equipment and MIP activities for customers
• Training for quality inspectors
VISUAL INSPECTION & MIP-ACCEPTANCE SERVICE
QUALITY INSPECTION SERVICE
In space industry but also for aviation and high-end commercial applications, the supervision of quality standards through quality and product assurance is essential. We at TESAT are committed to the highest quality standards. An in-depth quality and product assurance therefore is an integral part of our production chain. Furthermore, all of our products are manufactured in-house, thus bearing the label „Made in Germany“.
OPERATIONS ENGINEERING
INDUSTRIAL ENGINEERING TECHNOLOGY ENGINEERING
RAPID PROTOTYPING
PRODUCTION LOGISTICS
PRODUCTION CONTROL
CALIBRATION SERVICES
As your experienced partner in manufacturing and test of high-end products, TESAT covers all management and en-gineering skills to guarantee a fast and high quality transition from product development to product manufacturing. Our knowledge and competences support fast product development cycles and ensure a reliable basis for high quality manufacturing and test.
INDUSTRIAL ENGINEERING
PROCESSEVALUATION
DESIGN TOCOST
PRODUCTIONSCHEDULING
CALIBRATION SERVICES
LOGISTICS
PRODUCTION DIGITIZATION
RAPID PROTOTYPING
PROCUREMENTSUPPORT
TECHNOLOGY ENGINEERING
VALUE STREAM DESIGN
20 40 60 80 100 120 140 160 180 200Temperatur /°C
-1.5
-1.0
-0.5
0.0
0.5
1.0
DSC /(mW/mg)
-305.4 J/gKompl.Peakausw: Fläche:
Peak: 148.6 °C
121.1 °C0.207 J/(g*K)
Glasübergang*: Midpkt.:Delta-Cp*:
[1.2]
[1.5]
↓ exo
FACILITIES & SKILLS
FACILITIES & SKILLSTHERMAL CYCLING OVEN
• Industrialisation planning according APQP process
• Value stream analysis / cost analysis
• Value stream design• Manufacturing flow design• 3D layout planning• Test lab for manufacturing
digitization (e.g. virtual reality, digital assistants, robotics)
• Ovens for thermal cycling• Vacuum ovens• Ovens for humidity tests• Rheometer for viscosity
determination• Differential scanning calorimetry• Drop Shape Analyser• Thermo-Gravimeter for material
property measurements
INDUSTRIAL ENGINEERING TECHNOLOGY ENGINEERING
VR INDUSTRIALIZATION PLANNING
DIGITIZATION ELEMENTS MATERIAL PROPERTY MEASUREMENTS
• Support of design to cost process with DfM/DfT toolset
• Identification of industrialisation needs, setup and implementation of industrialisation plans
• Setup of standard work schedules and related cost elements
• Digitization of manufacturing, tuning and test facilities
• Continuous improvement and cost reduction projects
• Identification, evaluation and qualification of materials and manufacturing processes
• Measurement and evaluation of material properties
• Technology support in product development process
• Specification, procurement support and approval of manufacturing machines
• Conduction of qualification campaigns according ESA/MIL
PRODUCT PORTFOLIO
Value Stream Analysis & Design 3D-Layout Adhesive Testing GAP Welding Vibration Loads Solder Joints Evaluation
SMARTDecisionMaking
SMARTValue Stream
Design
SMARTPlanning
SMARTMachines
SMARTData
Visualization
SMARTAuthentication
SMARTHMI
SMARTData
SMARTTesting
SMARTTracking
SMARTLearning
SMARTObjects
SMARTAssembly
(SAM)
SMARTInstructions
FACILITIES & SKILLS
• PCB circuit and layout design• Procurement of PCBs, parts and
mechanical components• Semi-automated SMD / THT
assembly• Soldering machines (vapor
phase / oven / hot air system)• ESA / MIL qualified soldering
staff• 5-axis milling / turning centre• 3D-printing, welding, bonding
RAPID PROTOTYPING
3D-INLINE PROCESS CHECK 5-AXIS CNC MILLING PRODUCTION DASHBOARD PRODUCTION DASHBOARD3D-PRINTING
SMART ASSEMBLY (SAM)HOT AIR SYSTEM• One-stop-shop for prototypes and proof-of-concept hardware
• All tasks from sketch to hardware delivery are covered
• Electrical or mechanical prototypes, harness, jigs or tools
FACILITIES & SKILLS
• Planning, preparation and sustaining of production orders
• Processing of 3D-data into paperless work sequence
• Setup of product or module specific work schedules
• Support availability of components and information
• Derive work backlogs for production teams from central production planning
PRODUCTION CONTROL
3D-MANUFACTURING DATA
PRODUCT PORTFOLIO
Special SetupMilling Parts Dashboard Workplan3D-Print
FACILITIES & SKILLS
FACILITIES & SKILLS
• Warehous shop floor 600 m2
• Cleanroom class ISO 8.3• Nitrogen racks for sensitive
EEE parts
• Calibration laboratory: 150 m2
• Calibration & repair of measurement devices
• Maintenance• Gauge management and control
PRODUCTION LOGISTICS
COMPONENT KITTING POWER SENSOR RACKCAMPUS PNEUMATIC DELIVERY CALIBRATION KIT
WAREHOUSE AREA
NITROGEN STORAGE RACKS OSCILLOSCOPIC CALIBRATION
• Just-in-time material supply for all manufacturing modules
• Production order specific kitting of parts and components
• Provide and store EEE parts for TESAT manufacturing as well as for external customers
• Supply of consumables• Goods incoming inspection• Warehouse management
CALIBRATION SERVICES
• TESAT is DIN EN 9100:2018 certified, an expansion of the DIN EN ISO 9001:2015, dedicated to the particular needs and requirements of aerospace
• The laboratory calibration is accredited according to DIN EN ISO/IEC 17025
• The metrological confirmation system of measurement equipment complies with DIN ISO 10012
• Results of calibration are traceable to national or international standards
MODULES & OPTICS
One of our key strengths is the development and production of microwave modules in multilayer technology, optical elec-tronic modules, photonic microsystems as well as assembly, integration and test of laser terminals and payloads. With „Automated Hybrid Microwave Assembly“ we own the capability to manufacture complex highly integrated modules within the frequency range up to 77 GHz in man-less ghost-shifts overnight and at very high volume. These services are offered to internal and external customers.
AUTOMATED HYBRID MICROWAVE FACTORY
OPTICAL MODULES PCB MANUFACTURING
SURFACE PLATINGAIT OF LCTs & PAYLOADS
AUTOMATED HYBRID MICROWAVE FACTORY OPTICAL MODULES
DIE ATTACH LINES, WIRE-BONDING LINE, FINAL ASSEMBLY & ELECTRICAL TEST
FACILITIES & SKILLS
• 200 years accumlated experience in hybrid microwave manufacturing
• Production experience of 80,000 complex LTCC modules
• Magazine loader• Plasma cleaner• Epoxy dispenser• Pick & placer
• The facility covers a clean room area of 400 m2 (ISO class 8)
• Man-less ghost-shift capability• Capacity more than
15,000 hybrids / month• ESA-qualified hybrid line
according to ESCC 2566000
DIE ATTACH LINE WIRE-BONDING LINE
DIE ATTACH LINE /w AuSn STATION
AUTOMATED PICK & PLACE LASER WELDING & SOLDERING
FACILITIES & SKILLS
• Precision pick & place of electronic, electro-optical, optical and photonic chips and components
• Precision pick & place of ceramic substrates and metal submounts in a package (optional 3D built up)
• Precision wire bonding (Au, AlSi, wire diameter from 17 to 32 µm)
• Ribbon Gap-Welding (Au) from 75 µm to 300 µm
• Hermetic laser seam welding and laser soldering of Kovar, steel, titanium, AlSi and ceramic HTCC packages
• Laser marking on different materials (metal, ceramics, organic)
3-LASER ALIGNMENT & WELDING
• ESA-qualified production line for hermetic HTCC and MHIC module assembly & packaging
• Cleanroom class ISO 5 and 6• Shop floor: 560 m2
The core competence is in conception, development, assembly, packaging and qualification of optoelectronic modules, photonic microsystems and optical components (optionally with fiber coupling).
The department has the expertise and the respective production facilities in the required clean rooms to manufacture and qualify optic and photonic modules at an ESA-certified level.
PRODUCT PORTFOLIO
Examples of Optical ProductsLTCC System in Package Modules
ASSEMBLY, INTEGRATION & TEST OF LASER COMMUNICATION TERMINALS PCB & PLATING
FACILITIES & SKILLS
• Various optical & communications measurements possible
• Micro-Vibration set-up in TV chamber to simulate satellite vibration levels
• Artificial sun to demonstrate error-free laser communication in the presence of background light
• Unique facility, equipment & processes used for successful LCT AIT
• Cleanroom class ISO 5 and 8• Shop floor: 500 m2 • Capacity: up to 3 complex optical
systems per year
PCB ENIPIG LINETHERMAL VACUUM CHAMBER PCB COPPER PLATING LINESmartLCT IN TEST
MANUFACTURING EQUIPMENTFACILITIES & SKILLS
• Cu-plating lines & ENIPIG line• Direct Imaging• X-ray Drilling / pico sec. laser &
mech. drilling (/milling) machines• Flying probe tester• AOI Automated Optical
Inspection• Micro-section laboratory /
SEM / X-ray (XDAL)• IST Tester (PWB) / Group 6 test /
therm. cycl.• Integr8tor SW for direct
respond with external customer
• Single and double sided rigid-flex or flex PCBs
• Rigid-flex PCBs with thermo-mechanical adaption
• Multilayer up to 24 layers in core-foil technique, sequential or semi-sequential build-ups and metal core
• Buried and / or blind via laser or mechanically drilled
• Surface finishes in tin / lead hot oil reflow with or without tin-diffusion layer, mixed surface tin / lead or ENIPIG
• Base material Htg FR4 IS420 (Isola), polyimide VT-901 (Ventec), Megtron-7N (Panasonic) and flex PI (Dupont AP)
SURFACE PLATINGLASER TERMINAL TEST
LCT S/C INTEGRATION
TESAT supplies a wide range of surface treatments for mechanical and electromechanical parts by chemical and electroplating, e.g. silver, gold, nickel on different base materials. Several cleaning and treatment processes for alumiminum based materials, e.g. surtec, anodized.
Beside this we offer varnishing of parts with several conductive, highly emmisive coatings with very low outgassing rates. Our service with highly experienced experts includes documented processing as well as precise control and measurement of properties with certified quality conformance.
• Assembly, Integration & Test (AIT) of optical communication and laser instruments / payloads, including Laser Communication Terminals (LCTs)
• Ultra-clean production lines for laser/optical space instruments, including dedicated laser protection areas for high-power lasers (laser class 4)
• Cleanrooms class ISO 5 (400 m2) and ISO 8 (100 m2)
• Optical system testbeds & instrument-size TV chambers in ultra-clean environment; TV chambers with optical windows for access to beam
PRODUCT PORTFOLIO
LCT135 Printed Circuit Boards (PCBs)Plating partsTOSIRISSmartLCT
In order to fulfill the high requirements of our customers, it is paramount for TESAT to keep all processes that are neces-sary for the manufacturing of space products in-house. The combination of manufacturing in compliance with the high standards of the aviation and space industry as well as our expertly trained long-time employees enables TESAT to work on a very high level of expertise. Our long-term manufacturing experience in PC Board manufacturing, plating, SMD Board assembly, magnetics manufacturing, potting, RF and equipment assembly result in customer expected high quality.
AUTOMATIC PLACEMENT
EQUIPMENT ASSEMBLY
MAGNETICS & WINDINGS
RF-ASSEMBLY
MAGNETICS | PC BOARD / EQUIPMENT / RF EQUIPMENT ASSEMBLY
MANUFACTURING EQUIPMENT
AUTOMATIC PLACEMENT MAGNETICS & WINDINGS
FACILITIES & SKILLS
• Full automatic screen printer• 3 automatic pick & place
machines• 480 different components online
available• Vapour phase soldering
machines, tin / lead & lead-free• In-Circuit Test (ICT) of
components (flying probe)• Automated Optical Inspection
(AOI) of the board• Degolding and pre-tinning of
components• Tape & reel SMD components• Lead forming of SMD & THT
components
• ESA-qualified production line• Cleanroom class ISO 8• Shop floor: 600 m2 • Capacity: > 3,000 boards p.a.
POTTING FACILITY /w TV CHAMBER
AUTOMATIC PARTS PREPARATION WITH 4 ROBOT CELLS
X-RAY ANALYSES
X-RAY TERMINAL
IN-CIRCUIT TEST OF COMPONENTS
FACILITIES & SKILLS
• Semi-automated winding equipment
• High manufacturing flexibility for huge family of various geometrical types of transformers
• Screening under vacuum & critical pressure for HV coils
• X-ray analysis• Potting• Operating temperature:
-30 / +100 C• Storage temperature:
-55 / +125 C
WINDING EQUIPMENTSMD LINE
• ESA-qualified production line• Cleanroom class ISO 8• Shop floor: 350 m2 • Capacity: > 30,000 transformers
& coils per year
PRODUCT PORTFOLIO
Customized Products
RF ASSEMBLY COMPLEX EQUIPMENT & SYSTEMS ASSEMBLY
FACILITIES & SKILLS
• Full automatic RF- Pick and place machine
• 1 Laser trimming system• 3 automatic Wire-Bonder• 2 Geb-Welding systems• Automatic Polimeric Bonder
• ESA-qualified production line• Cleanroom class ISO 7 and 8.1• Shop floor: 800 m2 • Capacity: 500 units per year
RF ASSEMBLY LINE ASSEMBLY IN DEDICATED PRODUCTION LINESWIRE-BONDER
FACILITIES & SKILLS
• Robotic system for screwing of waveguide applications with torque and angle controlled precision
• Shopfloor adaptable to process needs
• Further processes: lapping of flanches / glueing and soldering processes / dimensional check with measurement arm
MANUAL ASSEMBLYPICK & PLACE EQUIPMENT
• ESA-qualified production line• Cleanroom class ISO 7, 8 and 8.1• Shop floor: 900 m2 • Capacity: 500 units per year
AUTOMATED TORQUE 6-ANGLE CONTROLLED SCREWING
PRODUCT PORTFOLIO
IMUXe
An essential step on the way to deliver a high performance product is the tuning and functional testing of all RF, power and digital devices. After the assembly, the units are turned on for the first time (IPTO) and subsequently tuned and tested over temperature. This process ensures a save operation and that the optimal performance for the required ap-plication is reached.
RF TUNING & TEST
TUNING & TEST POWER
TUNING & TEST DIGITAL LF
TUNING & TEST
EPC
POWER APPLICATIONSRF APPLICATIONS
FACILITIES & SKILLS
• Initial operational test• Mechanical & electrical
RF-Tuning• Temperature tuning and
temperature testing of RF-Products:• LCAMP – SSPA(PAU) – LIN –
CAMP – MHIC / MMIC• Input & Output Multiplexer,
Di- / Triplexer, Filter, Dielectric & Waveguide Technology
• Frequency: L- / S- / C- / X- / Ku- / Ka- / Q- / V-Band
• Programming & development of internal test software in C
• Development & optimization of automatic test systems for RF-measurements
• Highly qualified engineers and technicians
• Cleanroom class ISO 8.1• Shop floor: 400 m2 • Capacity: up to 1,500 units p.a.• 12 automated & 4 manual
temperature test benches• 14 ambient tuning setups
TEMPERATURE TEST BENCHMULTIPLEXER
GRAPHS
IMUX
Q-BAND LCAMP FACILITIES SKILLS
• Initial power-up test, electrical tuning tests, functional tests and temperature testing of power converters for low and high voltages up to 18,000 volts
• 14 test stations for high voltage and 5 test stations for low voltage power converters for manual and automated tests
• 14 thermal chambers or ovens for thermal testing of high voltage and low voltage power converters
• Integration test of TWTAs
• Software development for test automation in C, Python, Labview & Powerstar
• Development & optimization of automatic test systems for low and high voltage power converters
• Test of pulsed power conditioners for radar applications
• Preparation of test procedures and test reports
TEST BENCHTEST BENCH
• Highly qualified engineers & technicians
• Cleanroom class ISO 8.1and 8.2, • Shop floor: 400 m2 • Capacity: up to 1,000 units p.a.
PRODUCT PORTFOLIO
LCAMPMultiplexer SSPA EPC TWTA /w stand-alone LCAMP
DIGITAL & LF APPLICATIONS
FACILITIES & SKILLS
• Multi-purpose high-frequency test benches for tuning & test of RF- and digital units for modulators and TTC
• Modular modulator test bench (MoMoT)
• Fully automated performance and acceptance test setups
• Ambient and space environment up to 40 GHz (Thermal & TVac)
• Different modulations: QPSK, 8PSK, 64QAM,…
• All tests applicable over temperature
• Highly flexible team for realisation of small series and complex measurement tasks
• Programming skills in C, Labview & Powerstar
• Development & realisation of complex tests incl. automatisation
• Cleanroom class ISO 8.1• Shop floor: 300 m2 • Capacity: up to 200 units p.a.
TEST BENCH MODULATOR
LCAMP TUNING SSPA THERMAL TESTING
EMC TESTINGEPC TEST BENCH & TV CHAMBERSTEMPERATURE TEST BENCH
PRODUCT PORTFOLIO
Laser ElectronicsModulator TTC
ACCEPTANCE TEST
TEST FACILITIES EMC TEST
VIBRATION & SHOCK
THERMO VACUUM TEST
RF FUNCTIONAL & POWER TEST
RF SYSTEM AIT
Whether thermal at ambient or in vacuum atmosphere, radio frequency measurements, EMC, vibration or shock: TESATprovides you with qualified test facilities in order to perform tests independently. Testing is affected in accordance withthe valid regulations of the space, aviation or highly specialized industry as well as customer specific requirements.
FACILITIES & SKILLS
• 3 EMC chambers (shielded anechoic chamber):
• 2 x 36 m2 and 1 x 56 m2 cleanroom iso 8
• RE, E-field, up to 50 GHz• RS, E-field up to 50 GHz
(20 V/m)• 200 MHz - 18 GHz (100 V/m),
18 GHz - 40 GHz (40 V/m)• CE FD up to 500 MHz• CS, sine wave injection up
to 500 MHz• CS, arbitrary transients with
falling and rising edge slopes up to 50 V/µs
• ESD-test up to 20 kV and 100 A with different pulse shapes
• CS06: 10 µs, 5 µs, 150 ns• RE: H-Field 30 Hz - 300 kHz• RS: H-Field: DC - 300 kHz• CE: Inrush current / initial bus
application up to 200 A
ELECTROMAGNETIC COMPATIBILITY
EMC CHAMBER
TVAC FEEDTHROUGH
RADIATED MEASUREMENTS DEFINITION OF EMC-TEST PROCEDURE
PREPARATION OFTEST EQUIPMENT
CONDUCTED EMISSION TESTS
CONDUCTEDSUSCEPTIBILITY TESTS
RADIATEDEMISSION TESTS
RADIATEDSUSCEPTIBILITY TESTS
TESTREPORT
CONDUCTED MEASUREMENTS
• EMC tests in accordance with • MIL-STD-461(A-G), MIL-STD 462
• ECSS-E-ST-20-07C
• based on customer requirements
• Cleanroom class ISO 8• Shop floor: 300 m2 • Capacity: > 100 active units p.a.
TEST FACILITIES – DESIGN & MANUFACTURING OF VARIOUS MEASUREMENT & TEST EQUIPMENT
FACILITIES & SKILLS
Design, production & verification of: • TVAC Feedthroughs for various
applications:• High / low voltage, digital
signals & optical connections• Liquids & gases• Flange types: ISO KF40,
ISO K 63/100/160/250• Impermeability better
1xE-7 mbar• Harnesses for ambient and
vacuum application:• Verification via automated test
station (1000 V isolation test, 2 A continuity test)
• Electronics for specialized test applications (e.g. LISNs for EMC)
• SPS applications incl. software development
• Design, procurement and commissioning of TVAC chambers and nitrogen boxes
LISN FOR EMCHARNESS MANUFACTURING & VERIFICATION
Test Equipment Facilities & Test Equipment
ESD TESTS
Test Facilities Test Bench Details
TECHNICAL DETAILS (UNHOLTZ-DICKIE SHAKER) FACILITIES & SKILLS
3x SAI90-R16C-3 / ST Shaker:
• Specimen length / dia max. [mm]: 711,2
• Mass max. [kg]: 680 • Frequency [Hz]: 5-2000• Acceleration sine max. [g]:
118 bare table• Acceleration random
max. [g rms]: 50 • Force sine max. [kN]: 60• Force random max. [kN rms]: 60• Displacement max. [p/p mm]:
76,2 • Data acquisition: SD Jaguar
38 Channels
1x T1000 Shaker:
• Specimen length / dia max. [mm]: 1115
• Mass max. [kg]: 680• Frequency [Hz]: 5-2000• Acceleration sine max. [g]:
200 bare table• Acceleration random
max. [g rms]: 60 • Force sine max. [kN]: 89• Force random max. [kN rms]: 80• Displacement max. [p/p mm]:
50,8 • Data acquisition: SD Jaguar
78 Channels
Two equivalent and independent shock rooms available:• Equipped with ringing plates• m+p VibRunner control systems• Incl. transient capture • 16 channels• Equipment for mechanical
adaptation• Bolt guns for generation of
mechanical impact
VIBRATION TEST PYRO SHOCK TEST
SINE, RANDOM, SHOCK TEST BENCHUD T1000 SHAKER RINGING PLATEUD R19 SHAKER BOLT GUN
• Features mechanical: Sine, Random, Shock
• Cleanroom class ISO 8• Project heritage: This facility is
used and certificated for the test of space equipment
• Cleanroom class ISO 8• Shop floor: 500 m2
MICROWAVE POWER TEST
FACILITIES & SKILLS
• 20 test setups for ambient pressure RF-measurements
• Highly automated test environment as well as manual measurements
• Standardized RF test stations for various measurement types
• Highly optimized software support
• Broadband capability: 1- 70 GHz
• High measurement accuracy• Thermal cycles in nitrogen
atmosphere
RF FUNCTIONAL TEST
AMBIENT PRESSURE TEST SETUP WAVEGUIDE SWITCH JIG MULTIPLEXER AMBIENT TEST
• ESA-qualified test environment• Cleanroom class ISO 8• Shop floor: 900 m2 • Capacity: up to 1,500 units p.a.
MultiplexerWaveguide Switch
FACILITIES & SKILLS
POWER HANDLING TEST• Operation of devices under
nominal power and failure modes• Determination of electrical and
thermal performance• Record of temperature spots to
verify thermal analysis
PASSIVE INTER-MODULATION PRODUCT• Generation of frequency
products by two or more carriers on a non-linear surface
MULTIPACTION• Avalanche breakdown of
secondary electrons, effect appears only in vacuum
• Several detection methods established
• Verification by gap samples• Stimulation by free electron
sourcesCRITICAL PRESSURE TEST• Arc discharge caused by a
combination of pressure, gap width and RF power
• Equipment prevented from damage by arc detectors
WAVEGUIDE RING ASSEMBLY POWER TEST RACK HIGH POWER TEST
• ESA-qualified test environment• Cleanroom class ISO 8• Shop floor: 1,150 m2 • Capacity: up to 1,000 units p.a.
Facilities for different operating requirements under high microwave power, usually applied on qualification of flight equipment. The extensive experience in this field offers a comprehensive test service from single components to more complex and highly integrated devices.
TEST OVER TEMPERATURE
RF SYSTEM AIT
FACILITIES & SKILLS FACILITIES & SKILLS
• 59 vacuum chambers for RF-measurements
• Vacuum: Pressure < 1E - 5 mbar• Temperature range:
+120 °C / -80 °C• Highly automated test
environment• Broadband capability: 1-70 GHz• High measurement accuracy• Interfaces via standard
ISO flanges: KF40, K63 / 100 / 160 / 250
• Unit footprint up to 1.50m x 1.30m
SYSTEM-INTEGRATION & INSPECTION• Payload and subsystem
integration• Flight harness integration• Test equipment installation• Payload and subsystem
inspection
SYSTEM TEST• Complete payload and
subsystem test (manually, semi-automatically, automatically) including sat-level tests
• Test strategy for payload and subsystem verifications
• Test system development for payload & subsystem verifications
EGSE• Development and realization of
complex payload test systems usable on all system AIT levels
• RF-SCOE development• TM/TC SCOE development• PDU SCOE development• Test report database
AIT MANAGEMENT• AIT planning, integration and
test strategy• AIT implementation from module
to sat-level • MGSE & EGSE planning and
realization
THERMO VACUUM TEST
THERMAL VACUUM CHAMBERS
• ESA-qualified test environment• Cleanroom class ISO 8• Shop floor: 1,200 m2 • Capacity: up to 1,000 units p.a.
• Highly qualified engineers & technicians
• Cleanroom class ISO 8• Shop floor: 450 m2 • Capacity: 5 to 8 MGSE/EGSE p.a.
PAYLOAD INTEGRATION & TEST
THERMAL VACUUM CHAMBER
SCOE DEVELOPMENT SUBSYSTEM AIT
TESAT – THE ONE-STOP-SHOP FOR YOUR PROJECTS TESAT – ALL ON ONE SITE
MANUFACTURING
CUSTOMER SUPPORT
TEST
PROJECT MANAGEMENT
SERVICES
DEVELOPMENT
Tesat-Spacecom GmbH & Co. KGGerberstraße 4971522 Backnang
Germany+49 7191 930 - 0
© Copyright Tesat-Spacecom GmbH & Co. KG 2020Produced in Germany, March 2020
Photos © Tesat-Spacecom 2020 All Rights Reserved.
