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8/9/2019 OPA2333-HT
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JD OR HKJ PACKAGE
(TOPVIEW)
OUT A
-IN A
+IN A
V- +IN B
-IN B
OUT B
V+
O P A 2 3 3 3 - H T
www.ti.com SBOS483B JULY 2009REVISED NOVEMBER 2009
1 . 8 -V M I C R O P O W E R C M O S O P E R A T I O N A L A M P L I F I E R
Z E R O -D R IF T S E R I E SCheck for Samples: OPA2333-HT
1FEATURES SUPPORTS EXTREME TEMPERATUREAPPLICATIONS Low Offset Voltage: 26 V (Max) Controlled Baseline 0.01-Hz to 10-Hz Noise: 1.5 VPP One Assembly/Test Site Quiescent Current: 50 A One Fabrication Site
Single-Supply Operation Available in Extreme (55C/210C)
Supply Voltage: 1.8 V to 5.5 V Temperature Range (1)
Rail-to-Rail Input/Output Extended Product Life Cycle
Extended Product-Change NotificationAPPLICATIONS
Product Traceability Down-Hole Drilling
Texas Instruments' high temperature products High Temperature Environments
utilize highly optimized silicon (die) solutionswith design and process enhancements tomaximize performance over extendedtemperatures.
(1) Custom temperature ranges available
DESCRIPTION/ORDERING INFORMATION(2)
The OPA2333 series of CMOS operational amplifiers uses a proprietary auto-calibration technique tosimultaneously provide very low offset voltage and near-zero drift over time and temperature. These miniature,high-precision, low-quiescent-current amplifiers offer high-impedance inputs that have a common-mode range100 mV beyond the rails, and rail-to-rail output that swings within 150 mV of the rails. Single or dual supplies aslow as 1.8 V (0.9 V) and up to 5.5 V (2.75 V) may be used. They are optimized for low-voltage single-supplyoperation.
The OPA2333 family offers excellent common-mode rejection ratio (CMRR) without the crossover associatedwith traditional complementary input stages. This design results in superior performance for drivinganalog-to-digital converters (ADCs) without degradation of differential linearity.
(2) Refer to Electrical Characteristics for performance degradation over temperature.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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a
b
c
d
Origin
O P A 2 3 3 3 - H T
SBOS483B JULY 2009REVISED NOVEMBER 2009 www.ti.com
Table 1. ORDERING INFORMATION(1)
TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
KGD OPA2333SKGD1 NA
55C to 210C JD OPA2333SJD OPA2333SJD
HKJ OPA2333SHKJ OPA2333SHKJ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIWeb site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
BARE DIE INFORMATION
BACKSIDE BOND PADDIE THICKNESS BACKSIDE F INISH
POTENTIAL METALLIZATION COMPOSITION
15 mils. Silicon with backgrind V- Al-Si-Cu (0.5%)
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OUT A
-IN A
+IN A
V- +IN B
-IN B
OUT B
V+
| ||
|
962 mm
1490
mm
38 mm
|
|
38 mm
O P A 2 3 3 3 - H T
www.ti.com SBOS483B JULY 2009REVISED NOVEMBER 2009
Table 2. BOND PAD COORDINATES
DESCRIPTION PAD NUMBER a b c d
OUT A 1 21.20 1288.50 97.20 1364.50
IN A 2 21.20 923.65 97.20 999.65
+IN A 3 21.20 533.05 97.20 609.05
V 4 31.30 172.20 107.30 248.20
+IN B 5 864.80 162.25 940.80 238.25
IN B 6 864.80 552.65 940.80 628.65
OUT B 7 864.80 897.10 940.80 973.10
V+ 8 854.70 1280.45 930.70 1356.45
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O P A 2 3 3 3 - H T
SBOS483B JULY 2009REVISED NOVEMBER 2009 www.ti.com
THERMAL CHARACTERISTICS FOR JD PACKAGEover operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
High-K board (2), no airflow 64.9Junction-to-ambient thermalJA C/Wresistance(1) No airflow 83.4
JB Junction-to-board thermal resistance High-K board without underfill 27.9 C/W
JC Junction-to-case thermal resistance 6.49 C/W
(1) The intent of JA specification is solely for a thermal performance comparison of one package to another in a standardized environment.This methodology is not meant to and will not predict the performance of a package in an application-specific environment.
(2) JED51-7, high effective thermal conductivity test board for leaded surface mount packages
THERMAL CHARACTERISTICS FOR HKJ PACKAGEover operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
Junction-to-case thermal resistance (to bottom of case) 5.7JC C/W
Junction-to-case thermal resistance (to top of case lid - as if formed dead bug) 13.7
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage 7 V
Signal input terminals, voltage (2) 0.3 (V+) + 0.3 V
Output short circuit (3) Continuous
Operating temperature range 55 210 C
Junction temperature 210 C
Human-Body Model (HBM) 4000ESD rating V
Charged-Device Model (CDM) 1000
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails shouldbe current limited to 10 mA or less.
(3) Short circuit to ground, one amplifier per package.
Electrical Characteristics: VS = 1.8 V to 5.5 VBoldface limits apply over the specified temperature range,TA = 55C to 210C. At TA = 25C, RL = 10 k connected to VS/2,VCM = VS/2, and VOUT = VS /2 (unless otherwise noted).
TA = 55C to 125C TA = 210C(1)
UNITPARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX
OFFSETVOLTAGE
Input offset vol tage VOS VS = 5 V 2 10 V
over temperature 22 26 V
vs temperature dVOS/dT 0.02 0.05 V/Cvs power supply PSRR VS = 1.8 V to 5.5 V 1 6 1.7 11 V/V
Long-term (2)stability(2)
Channel0.1 V/V
separation, dc
INPUT BIASCURRENT
(1) Minimum and maximum parameters are characterized for operation at TA = 210C, but may not be production tested at thattemperature. Production test limits with statistical guardbands are used to ensure high temperature performance.
(2) 300-hour life test at 150C demonstrated randomly distributed variation of approximately 1 V.
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Electrical Characteristics: VS = 1.8 V to 5.5 V (continued)Boldface limits apply over the specified temperature range,TA = 55C to 210C. At TA = 25C, RL = 10 k connected to VS/2,VCM = VS/2, and VOUT = VS /2 (unless otherwise noted).
TA = 55C to 125C TA = 210C(1)
UNITPARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX
Input bias current IB
70 200 pA
over150 5300 pA
Temperature
1060Input offset current IOS 140 400 pA0
NOISE
Input voltagenoise, 0.3 1.0 VPPf = 0.01 Hz to 1 Hz
Input voltagenoise, 1.1 1.5 VPPf = 0.1 Hz to 10 Hz
Input current noise,in 100 fA/ Hzf = 10 Hz
INPUT VOLTAGERANGE
Common mode (V) (V+) + (V) (V) +VCM Vvoltage range 0.1 0.1 0.25 0.25
Common-ModeCMRR (V) 0.1 V < VCM < (V+) + 0.1 V 102 130 91 dBRejection Ratio
INPUTCAPACITANCE
Differential 2 4.25 pF
Common mode 4 12.25 pF
OPEN-LOOPGAIN
Open-loop (V) + 100 mV < VO < (V+) 100 mV,AOL 104 130 85 93 dBvoltage gain RL = 10 k
FREQUENCYRESPONSE
Gain-bandwidthGBW CL = 100 pF 350 350 kHzproduct
Slew rate SR G = 1 0.16 0.25 V/ s
OUTPUT
Voltage outputRL = 10 k 30 50 mVswing from rail
over temperature RL = 10 k 85 150 mV
Short-circuitISC 5 mA
current
Capacitive loadCL
drive
(3)Open-loop f = 350 kHz, IO = 0 2 koutput impedance
POWER SUPPLY
Specified voltageVS 1.8 5.5 1.8 5.5 Vrange
Quiescent currentIQ IO = 0 17 25 Aper amplifier
over temperature 30 50 80 A
Turn-on time VS = 5 V 100 s
(3) See Typical Characteristics.
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1000
10000
100000
1000000
110 130 150 170 190 210 230
Continous TJ (C)
EstimatedLife(Hours)
Electromigration Fail Mode
O P A 2 3 3 3 - H T
SBOS483B JULY 2009REVISED NOVEMBER 2009 www.ti.com
Electrical Characteristics: VS = 1.8 V to 5.5 V (continued)Boldface limits apply over the specified temperature range,TA = 55C to 210C. At TA = 25C, RL = 10 k connected to VS/2,VCM = VS/2, and VOUT = VS /2 (unless otherwise noted).
TA = 55C to 125C TA = 210C(1)
UNITPARAMETER TEST CONDITIONS MIN TYP MAX MIN TYP MAX
TEMPERATURERANGE
Specified range -55 to 210 C
Operating range -55 to 210 C
Figure 1. OPA2333SKGD1 Operating Life Derating Chart
Notes:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Silicon operating life design goal is 10 years at 105C junction temperature (does not include packageinterconnect life).
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OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Popu
lation
10
9
8
7
6
5
4
3
2
1 0 1 2 3 4 5 6 7 8 9
10
Offset Voltage (V)
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Population
0
0.0
025
0.0
050
0.0
075
0.0
100
0.0
125
0.0
150
0.0
175
0.0
200
0.0
225
0.0
250
0.0
275
0.0
300
0.0
325
0.0
350
0.0
375
0.0
400
0.0
425
0.0
450
0.0
475
0.0
500
Offset Voltage Drift (V/_C)
OPENLOOP GAIN vs FREQUENCY
AOL
(dB)
10
120
100
80
60
40
20
0
20
Phase(_)
250
200
150
100
50
0
50
100
100k10k1k100
Frequency (Hz)
1M
COMMONMODE REJECTION RATIO vs FREQUENCY
CMRR
(dB)
1
140
120
100
80
60
40
20
0
100k10k1k10010
Frequency (Hz)
1M
POWERSUPPLY REJECTION RANGE vs FREQUENCY
PSRR
(dB)
1
120
100
80
60
40
20
0
10k 100k1k10010
Frequency (Hz)
1M
+PSRR
PSRR
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
OutputSwing(V)
0
3
2
1
0
1
2
3
1
Output Current (mA)
107 8 965432
40_C
40_C
40_C
+25_C
+25_C
+25_C
+125_C
+125_C
VS = 2.75V
VS = 0.9V
O P A 2 3 3 3 - H T
www.ti.com SBOS483B JULY 2009REVISED NOVEMBER 2009
TYPICAL CHARACTERISTICS
At TA = 25C, VS = 5 V, and CL = 0 pF (unless otherwise noted).
Copyright 2009, Texas Instruments Incorporated Submit Documentation Feedback 7
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INPUT BIAS CURRENT vs COMMONMODE VOLTAGE
IB(pA)
0
100
80
60
40
20
0
20
40
60
80
1001
CommonMode Voltage (V)
5432
IB
+IB
VS = 5V
INPUT BIAS CURRENT vs TEMPERATURE
IB(pA)
50
200
150
100
50
0
50
100
150
20025
Temperature (_C)
1251007550250
VS = 5.5V
VS = 1.8VIB
IB
+IB
+IB
LARGESIGNAL STEP RESPONSE
OutputVoltage(1V/div)
Time (50s/div)
G = 1
RL = 10k
0
20
40
60
-55 -25 0 25 50 75 100 1 25 1 50 1 75 2 00 2 10
Temperature (C)
IQ(A)
QUIESCENT CURRENT vs TEMPERATURE
m
POSITIVE OVER- VOLTAGE RECOVERY
2V/d
iv
0
1V/div
0
Time (50s/div)
Input
Output
10k
1k
OPA2333
+2.5V
2.5V
SMALLSIGNAL STEP RESPONSE
OutputVoltage(50mV/div)
Time (5s/div)
G = +1
RL = 10k
O P A 2 3 3 3 - H T
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TYPICAL CHARACTERISTICS (continued)
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NEGATIVE OVER- VOLTAGE RECOVERY
2
V/div
0
1V/div 0
Time (50s/div)
Input
Output
10 k
1k
OPA2333
+2.5V
2.5V
SETTLING TIME vs CLOSEDLOOP GAIN
SettlingTime(s)
1
600
500
400
300
200
100
0
10
Gain (dB)
100
0.001%
0.01%
4V Step
0.1Hz TO 10Hz NOISE
500nV/div
1s/div
SMALLSIGNAL OVERSHOOT vs LOAD CAPACITANCE
Overshoot(%)
10
40
35
30
25
20
15
10
5
0100
Load Capacitance (pF)
1000
CURRENT AND VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
VoltageNoise(nV//Hz)
1
1000
100
10
CurrentNoise(fA//Hz)
1000
100
101k10010
Frequency (Hz)
10k
Current Noise
Voltage Noise
Continues with no 1/f (flicker) noise.
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TYPICAL CHARACTERISTICS (continued)
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5k
OPA233310mA max
+5V
VIN
VOUT
IOVERLOAD
Current- limiting resistor
required if input voltage
exceeds supply rails by
0.5V.
O P A 2 3 3 3 - H T
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APPLICATION INFORMATION(1)
The OPA2333 is unity-gain stable and free from unexpected output phase reversal. It uses a proprietaryauto-calibration technique to provide low offset voltage and very low drift over time and temperature. For lowestoffset voltage and precision performance, circuit layout and mechanical conditions should be optimized. Avoidtemperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from
connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by ensuring theyare equal on both input terminals. Other layout and design considerations include:
Use low thermoelectric-coefficient conditions (avoid dissimilar metals)
Thermally isolate components from power supplies or other heat sources
Shield op amp and input circuitry from air currents, such as cooling fans
Following these guidelines will reduce the likelihood of junctions being at different temperatures, which can causethermoelectric voltages of 0.1 V/C or higher, depending on materials used.
Operating Voltage
The OPA2333 op amp operates over a power-supply range of 1.8 V to 5.5 V (0.9 V to2.75 V). Supply voltages higher than 7 V (absolute maximum) can permanently damage the device. Parametersthat vary over supply voltage or temperature are shown in the Typical Characteristics section of this data sheet.
Input Voltage
The OPA2333 input common-mode voltage range extends 0.1 V beyond the supply rails. The OPA2333 isdesigned to cover the full range without the troublesome transition region found in some other rail-to-railamplifiers.
Normally, input bias current is about 70 pA; however, input voltages exceeding the power supplies can causeexcessive current to flow into or out of the input pins. Momentary voltages greater than the power supply can betolerated if the input current is limited to 10 mA. This limitation is easily accomplished with an input resistor(seeFigure 2).
Figure 2. Input Current Protection
Internal Offset Correction
The OPA2333 op amp uses an auto-calibration technique with a time-continuous 350-kHz op amp in the signalpath. This amplifier is zero corrected every 8 s using a proprietary technique. Upon power up, the amplifierrequires approximately 100 s to achieve specified VOS accuracy. This design has no aliasing or flicker noise.
(1) At TA = 25C (unless otherwise noted).
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VOUT
RP = 20k
Op Amp V = Gnd
OPA2333
VIN
V+ = +5V
5VAdditional
Negative
Supply
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Achieving Output Swing to the Op Amp Negative Rail
Some applications require output voltage swings from 0 V to a positive full-scale voltage (such as 2.5 V) withexcellent accuracy. With most single-supply op amps, problems arise when the output signal approaches 0 V,near the lower output swing limit of a single-supply op amp. A good single-supply op amp may swing close tosingle-supply ground, but will not reach ground. The output of the OPA2333 can be made to swing to ground, orslightly below, on a single-supply power source. To do so requires the use of another resistor and an additional,
more negative, power supply than the op amp negative supply. A pulldown resistor may be connected betweenthe output and the additional negative supply to pull the output down below the value that the output wouldotherwise achieve (see Figure 3).
Figure 3. VOUT Range to Ground
The OPA2333 has an output stage that allows the output voltage to be pulled to its negative supply rail, orslightly below, using the technique previously described. This technique only works with some types of outputstages. The OPA2333 has been characterized to perform with this technique; however, the recommendedresistor value is approximately 20 k. Note that this configuration will increase the current consumption byseveral hundreds of microamps. Accuracy is excellent down to 0 V and as low as 2 mV. Limiting and nonlinearity occurs below 2 mV, but excellent accuracy returns as the output is again
driven above 2 mV. Lowering the resistance of the pulldown resistor allows the op amp to swing even furtherbelow the negative rail. Resistances as low as 10 k can be used to achieve excellent accuracy down to10 mV.
General Layout Guidelines
Attention to good layout practices is always recommended. Keep traces short and, when possible, use a printedcircuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible.Place a 0.1-F capacitor closely across the supply pins. These guidelines should be applied throughout theanalog circuit to improve performance and provide benefits, such as reducing the electromagnetic interference(EMI) susceptibility.
Operational amplifiers vary in their susceptibility to radio frequency interference (RFI). RFI can generally beidentified as a variation in offset voltage or dc signal levels with changes in the interfering RF signal. TheOPA2333 has been specifically designed to minimize susceptibility to RFI and demonstrates remarkably lowsensitivity compared to previous-generation devices. Strong RF fields may still cause varying offset levels.
Copyright 2009, Texas Instruments Incorporated Submit Documentation Feedback 11
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+ +
+
+
4.096V
0.1F
+5V
Zero Adj.
K- Type
Thermocouple
40.7V/ C
R2549
R9150k
R5
31.6k
R16.04k
R6200
+5V
0.1F
R22.94k
VO
R360.4
R46.04k
OPA2333
D1
REF3140
R1
VEX
VOUT
VREF
R1
OPA2333
RR
R R
+5V
O P A 2 3 3 3 - H T
SBOS483B JULY 2009REVISED NOVEMBER 2009 www.ti.com
Figure 4. Temperature Measurement
Figure 5 shows the basic configuration for a bridge amplifier.
Figure 5. Single Op-Amp Bridge Amplifier
A low-side current shunt monitor is shown in Figure 6. RN are operational resistors used to isolate the ADS1100from the noise of the digital I2C bus. Since the ADS1100 is a 16-bit converter, a precise reference is essential formaximum accuracy. If absolute accuracy is not required, and the 5-V power supply is sufficiently stable, theREF3130 may be omitted.
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OPA2333
ADS1100
Load
V
I2C
R14.99k
R34.99k
R448.7k
R249.9k
+5V3V
REF3130
R71.18k
RSHUNT1
R671.5k RN
56
RN56
(PGA Gain = 4)
FS = 3.0V
NOTE: 1% resistors provide adequate common- mode rejection at small ground- loop errors.
Stray Ground- Loop Resistance
ILOAD
OPA2333
Output
RSHUNT
Load
V+
V+
RG
RL
R1(2)
10k
RBIAS
+5V
zener(1)
Two zener
biasing methodsare shown.(3)
MOSFET rated to
stand- off supply voltagesuch as BSS84 forup to 50V.
(1) zener rated for op amp supply capability (that is, 5.1V for OPA2333).(2) Current- limiting resistor.(3) Choose zener biasing resistor or dual NMOSFETS (FDG6301N, NTJD4001N, or Si1034)
NOTES:
O P A 2 3 3 3 - H T
www.ti.com SBOS483B JULY 2009REVISED NOVEMBER 2009
Figure 6. Low-Side Current Monitor
Figure 7. High-Side Current Monitor
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OPA2333
3VNTC
Thermistor
1 M 60 k
100 k
1 M
V1In
V2+In
R1
R22
3
5
6
1
R2
OPA2333
OPA2333
INA152
VO
VO = (1 + 2R2/R1) (V2 V1)
O P A 2 3 3 3 - H T
SBOS483B JULY 2009REVISED NOVEMBER 2009 www.ti.com
Figure 8. Thermistor Measurement Figure 9. Precision Instrumentation Amplifier
14 Submit Documentation Feedback Copyright 2009, Texas Instruments Incorporated
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PACKAGING INFORMATION
Orderable Device Status (1) PackageType
PackageDrawing
Pins PackageQty
Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
OPA2333SHKJ ACTIVE CFP HKJ 8 1 TBD Call TI N / A for Pkg Type
OPA2333SJD PREVIEW CDIP SB JD 8 45 TBD Call TI Call TI
OPA2333SKGD1 ACTIVE XCEPT KGD 0 500 TBD Call TI Call TI
(1)The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please checkhttp://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak soldertemperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Nov-2009
Addendum-Page 1
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I M P O R T A N T N O T I C E
T e x a s I n s t r u m e n t s I n c o r p o r a t e d a n d i t s s u b s i d i a r i e s ( T I ) r e s e r v e t h e r i g h t t o m a k e c o r r e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m p r o v e m e n t s , a n d o t h e r c h a n g e s t o i t s p r o d u c t s a n d s e r v i c e s a t a n y t i m e a n d t o d i s c o n t i n u e a n y p r o d u c t o r s e r v i c e w i t h o u t n o t i c e . C u s t o m e r s s h o u l do b t a i n t h e l a t e s t r e l e v a n t i n f o r m a t i o n b e f o r e p l a c i n g o r d e r s a n d s h o u l d v e r i f y t h a t s u c h i n f o r m a t i o n i s c u r r e n t a n d c o m p l e t e . A l l p r o d u c t s a r e s o l d s u b j e c t t o T I s t e r m s a n d c o n d i t i o n s o f s a l e s u p p l i e d a t t h e t i m e o f o r d e r a c k n o w l e d g m e n t .
T I w a r r a n t s p e r f o r m a n c e o f i t s h a r d w a r e p r o d u c t s t o t h e s p e c i f i c a t i o n s a p p l i c a b l e a t t h e t i m e o f s a l e i n a c c o r d a n c e w i t h T I s s t a n d a r d
w a r r a n t y . T e s t i n g a n d o t h e r q u a l i t y c o n t r o l t e c h n i q u e s a r e u s e d t o t h e e x t e n t T I d e e m s n e c e s s a r y t o s u p p o r t t h i s w a r r a n t y . E x c e p t w h e r e m a n d a t e d b y g o v e r n m e n t r e q u i r e m e n t s , t e s t i n g o f a l l p a r a m e t e r s o f e a c h p r o d u c t i s n o t n e c e s s a r i l y p e r f o r m e d .
T I a s s u m e s n o l i a b i l i t y f o r a p p l i c a t i o n s a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n . C u s t o m e r s a r e r e s p o n s i b l e f o r t h e i r p r o d u c t s a n d a p p l i c a t i o n s u s i n g T I c o m p o n e n t s . T o m i n i m i z e t h e r i s k s a s s o c i a t e d w i t h c u s t o m e r p r o d u c t s a n d a p p l i c a t i o n s , c u s t o m e r s s h o u l d p r o v i d e a d e q u a t e d e s i g n a n d o p e r a t i n g s a f e g u a r d s .
T I d o e s n o t w a r r a n t o r r e p r e s e n t t h a t a n y l i c e n s e , e i t h e r e x p r e s s o r i m p l i e d , i s g r a n t e d u n d e r a n y T I p a t e n t r i g h t , c o p y r i g h t , m a s k w o r k r i g h t , o r o t h e r T I i n t e l l e c t u a l p r o p e r t y r i g h t r e l a t i n g t o a n y c o m b i n a t i o n , m a c h i n e , o r p r o c e s s i n w h i c h T I p r o d u c t s o r s e r v i c e s a r e u s e d . I n f o r m a t i o np u b l i s h e d b y T I r e g a r d i n g t h i r d - p a r t y p r o d u c t s o r s e r v i c e s d o e s n o t c o n s t i t u t e a l i c e n s e f r o m T I t o u s e s u c h p r o d u c t s o r s e r v i c e s o r a w a r r a n t y o r e n d o r s e m e n t t h e r e o f . U s e o f s u c h i n f o r m a t i o n m a y r e q u i r e a l i c e n s e f r o m a t h i r d p a r t y u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f t h e t h i r d p a r t y , o r a l i c e n s e f r o m T I u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f T I .
R e p r o d u c t i o n o f T I i n f o r m a t i o n i n T I d a t a b o o k s o r d a t a s h e e t s i s p e r m i s s i b l e o n l y i f r e p r o d u c t i o n i s w i t h o u t a l t e r a t i o n a n d i s a c c o m p a n i e d b y a l l a s s o c i a t e d w a r r a n t i e s , c o n d i t i o n s , l i m i t a t i o n s , a n d n o t i c e s . R e p r o d u c t i o n o f t h i s i n f o r m a t i o n w i t h a l t e r a t i o n i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r s u c h a l t e r e d d o c u m e n t a t i o n . I n f o r m a t i o n o f t h i r d p a r t i e s m a y b e s u b j e c t t o a d d i t i o n a l r e s t r i c t i o n s .
R e s a l e o f T I p r o d u c t s o r s e r v i c e s w i t h s t a t e m e n t s d i f f e r e n t f r o m o r b e y o n d t h e p a r a m e t e r s s t a t e d b y T I f o r t h a t p r o d u c t o r s e r v i c e v o i d s a l l
e x p r e s s a n d a n y i m p l i e d w a r r a n t i e s f o r t h e a s s o c i a t e d T I p r o d u c t o r s e r v i c e a n d i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r a n y s u c h s t a t e m e n t s .
T I p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e i n s a f e t y - c r i t i c a l a p p l i c a t i o n s ( s u c h a s l i f e s u p p o r t ) w h e r e a f a i l u r e o f t h e T I p r o d u c t w o u l d r e a s o n a b l y b e e x p e c t e d t o c a u s e s e v e r e p e r s o n a l i n j u r y o r d e a t h , u n l e s s o f f i c e r s o f t h e p a r t i e s h a v e e x e c u t e d a n a g r e e m e n t s p e c i f i c a l l y g o v e r n i n g s u c h u s e . B u y e r s r e p r e s e n t t h a t t h e y h a v e a l l n e c e s s a r y e x p e r t i s e i n t h e s a f e t y a n d r e g u l a t o r y r a m i f i c a t i o n s o f t h e i r a p p l i c a t i o n s , a n d a c k n o w l e d g e a n d a g r e e t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r a l l l e g a l , r e g u l a t o r y a n d s a f e t y - r e l a t e d r e q u i r e m e n t s c o n c e r n i n g t h e i r p r o d u c t s a n d a n y u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s , n o t w i t h s t a n d i n g a n y a p p l i c a t i o n s - r e l a t e d i n f o r m a t i o n o r s u p p o r t t h a t m a y b e p r o v i d e d b y T I . F u r t h e r , B u y e r s m u s t f u l l y i n d e m n i f y T I a n d i t s r e p r e s e n t a t i v e s a g a i n s t a n y d a m a g e s a r i s i n g o u t o f t h e u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s .
T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n m i l i t a r y / a e r o s p a c e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e T I p r o d u c t s a r e s p e c i f i c a l l y d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e o r " e n h a n c e d p l a s t i c . " O n l y p r o d u c t s d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e m e e t m i l i t a r y s p e c i f i c a t i o n s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t a n y s u c h u s e o f T I p r o d u c t s w h i c h T I h a s n o t d e s i g n a t e d a s m i l i t a r y - g r a d e i s s o l e l y a t t h e B u y e r ' s r i s k , a n d t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r c o m p l i a n c e w i t h a l l l e g a l a n d r e g u l a t o r y r e q u i r e m e n t s i n c o n n e c t i o n w i t h s u c h u s e .
T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n a u t o m o t i v e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e s p e c i f i c T I p r o d u c t s a r e d e s i g n a t e d b y T I a s c o m p l i a n t w i t h I S O / T S 1 6 9 4 9 r e q u i r e m e n t s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t , i f t h e y u s e a n y n o n - d e s i g n a t e d p r o d u c t s i n a u t o m o t i v e a p p l i c a t i o n s , T I w i l l n o t b e r e s p o n s i b l e f o r a n y f a i l u r e t o m e e t s u c h r e q u i r e m e n t s .
F o l l o w i n g a r e U R L s w h e r e y o u c a n o b t a i n i n f o r m a t i o n o n o t h e r T e x a s I n s t r u m e n t s p r o d u c t s a n d a p p l i c a t i o n s o l u t i o n s :
P r o d u c t s A p p l i c a t i o n s A m p l i f i e r s a m p l i f i e r . t i . c o m A u d i o w w w . t i . c o m / a u d i o D a t a C o n v e r t e r s d a t a c o n v e r t e r . t i . c o m A u t o m o t i v e w w w . t i . c o m / a u t o m o t i v e D L P P r o d u c t s w w w . d l p . c o m B r o a d b a n d w w w . t i . c o m / b r o a d b a n d D S P d s p . t i . c o m D i g i t a l C o n t r o l w w w . t i . c o m / d i g i t a l c o n t r o l C l o c k s a n d T i m e r s w w w . t i . c o m / c l o c k s M e d i c a l w w w . t i . c o m / m e d i c a l I n t e r f a c e i n t e r f a c e . t i . c o m M i l i t a r y w w w . t i . c o m / m i l i t a r y L o g i c l o g i c . t i . c o m O p t i c a l N e t w o r k i n g w w w . t i . c o m / o p t i c a l n e t w o r k P o w e r M g m t p o w e r . t i . c o m S e c u r i t y w w w . t i . c o m / s e c u r i t y M i c r o c o n t r o l l e r s m i c r o c o n t r o l l e r . t i . c o m T e l e p h o n y w w w . t i . c o m / t e l e p h o n y R F I D w w w . t i - r f i d . c o m V i d e o & I m a g i n g w w w . t i . c o m / v i d e o R F / I F a n d Z i g B e e S o l u t i o n s w w w . t i . c o m / l p r f W i r e l e s s w w w . t i . c o m / w i r e l e s s
M a i l i n g A d d r e s s : T e x a s I n s t r u m e n t s , P o s t O f f i c e B o x 6 5 5 3 0 3 , D a l l a s , T e x a s 7 5 2 6 5 C o p y r i g h t 2 0 0 9 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d
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