(on behalf of the GEFE team) - Open Hardware … · (on behalf of the GEFE team) BE-BI-QP. Outline: •Introduction •The GEFE board •Application examples •Status •Summary

RadWG Meeting (02/07/2015)

Manoel Barros Marin

A new rad-hard acquisition system for beam instrumentation

(on behalf of the GEFE team)

BE-BI-QP

Outline:• Introduction• The GEFE board• Application examples• Status• Summary & Outlook


BE-BI-QP

• Introduction

BE-BI-QP


4

Introduction (1 of 5)

BE-BI-QPThe GEFE team• Andrea Boccardi• Christophe Donat Godichal

• Thibaut Lefevre• Tom Levens • Manoel Barros Marin

Acknowledgments• Pedro Leitao & other colleagues from my old group PH-ESE

• Slawosz Uznanski, Andrea Vilar Villanueva & other colleagues from TE-EPC• Felix Andreas Arnold, Stephane Burger & other colleagues from BE-BI-PM• Frank Locci, Stefano Magnoni, Erik Van Der Bij & other colleagues from BE-CO• Bartosz Przemyslaw Bielawski & other colleagues from BE-RF

• Juan Boix Gargallo, Thierry Bogey and the rest of my section (BE-BI-QP)

• Special thanks to Fernando Carrio Argos (PH-UAT) for his simulations of GEFE’s Power Distribution Network• Markus Brugger, Salvatore Danzeca & other colleagues from EN-STI and RadWG

• Jose Luis Gonzalez

• Tullio Grassi (PH-UCM)

5


What is the GBT-based Expandable Front-End (GEFE)BE-BI-QP

6


What is the GBT-based Expandable Front-End (GEFE)BE-BI-QP

• General purpose FPGA-based radiation tolerant board

• Features different components of the GBT-Versatile Link ecosystem from CERN PH-ESE

• FPGA Mezzanine Card (FMC) High-Pin Count (HPC) connector

• Clocks

• Upgradable:

• 2x GPIO low-pin count connectors (24 & 13 pins)

• Flexible schemes for:

• Resets

• FPGA programming

• Power• Slow Control (SC) E-link

Target Total Ionizing Dose (TID): up to 75 krad

• Optical & Electrical interfaces

• Rad-Hard FPGA ProAsic3 (ACLA3PE3000-FGG896) from Microsemi

7

Our motivation

(3 of 5)IntroductionBE-BI-QP

8

Our motivation

(3 of 5)IntroductionBE-BI-QP

9

Our motivation

This is a big

[3 of 5)IntroductionBE-BI-QP

Why a common Digital Front-End?

10


BE-BI-QP

Front-EndCards

Back-EndSystem

Timing/Trigger/Ctrl (TTC/BST)

&Data Acquisition

(DAQ)

Rad Hard

Why a common Digital Front-End?• Similar architecture in different beam instrumentation projects

11


BE-BI-QP

Front-EndCards

Back-EndSystem


&Data Acquisition

(DAQ)

Rad Hard

• New Back-End systems in beam instrumentation already unified

Why a common Digital Front-End?• Similar architecture in different beam instrumentation projects

12

IntroductionBE-BI-QP

VFC-HD Front-EndCards


&Data Acquisition

(DAQ)

Rad Hard

(4 of 5)

Front-EndCards

Back-EndSystem


&Data Acquisition

(DAQ)

Rad Hard


13




&Data Acquisition

(DAQ)

Rad Hard

GEFE

(4 of 5)


• Similar architecture in different beam instrumentation projects

Front-EndCards

Back-EndSystem


&Data Acquisition

(DAQ)

Rad Hard


14




&Data Acquisition

(DAQ)

Rad Hard

GEFE

(4 of 5)


• Similar architecture in different beam instrumentation projects

15

IntroductionOur approach

BE-BI-QP

(5 of 5)

16


BE-BI-QP

(5 of 5)

17


BE-BI-QP

(5 of 5)

• Use of active components already qualified in terms of radiation hardness:

- GBT-Versatile Link ecosystem (VTRx, GBTx, etc.)

- Microsemi ProAsic3 FPGA

- Other active components (BJT, Schmitt-Trigger, etc.)

• Use advise about radiation hardness from other groups (e.g. TE-EPC, BE-CO, RadWG, etc.)

• Follow typical procedures for rad-hard electronic devices (e.g. simple design, rad-hard components)

• The GEFE board

18


BE-BI-QP

• User Community

• Meetings with the different teams

• Open HardWare Repository (OHWR) Wiki

• Regular updates through mail list ([email protected])

• Specifications (User Guide)

(5 of 5)

• Use of active components already qualified in terms of radiation hardness:

- GBT-Versatile Link ecosystem (VTRx, GBTx, etc.)

- Microsemi ProAsic3 FPGA

- Other active components (BJT, Schmitt-Trigger, etc.)

• Use advise about radiation hardness from other groups (e.g. TE-EPC, BE-CO, RadWG, etc.)

• Follow typical procedures for rad-hard electronic devices (e.g. simple design, rad-hard components)

• The GEFE board

mailto:[email protected]

• The GEFE board

BE-BI-QP


20

GEFE boardBE-BI-QP

The GEFE at a glance

(1 of 9)

21

GEFE boardBE-BI-QP

GEFE

100mm

205mm

25mm

FMC

HPC

Conn

ecto

r

60mm


(2 of 9)

22

BE-BI-QP

FMC HPC

ProAsic3FPGA

GBTxVTRx

Rad-HardPowering

GEFE board

VTRx


(3 of 9)

Main Components

GEFE

FMC HPCGBTx FMC HPC (xN)

E-links (xN)VTRx

SCA E-link (x1)

E-links clocks (xN) FPGA (ProAsic3)

E-link Clock (x1)

FMC clocks (xN)

FEASTMP (DC/DC) 2.5V

Main PowerConnector

(5-12V) FEASTMP (DC/DC) 1.5V LHC4913 (LDO) 3.3V

Rad-Hard Powering

23

GEFE boardBE-BI-QP


(4 of 9)

Main Components

24

BE-BI-QP

FMC HPC

ProAsic3FPGA

Low-SpeedElectrical Link

TX

RX

GBTxVTRx

Rad-HardPowering

GEFE boardThe GEFE at a glance

Low-pin CountConnectors

(5 of 9)

Main ComponentsSecondary Components

GEFE

FMC HPCGBTx FMC HPC (xN)

E-links (xN)VTRx

SCA E-link (x1)

E-links clocks (xN) FPGA (ProAsic3)

E-link Clock (x1)

FMC clocks (xN)

SMASMA

Low-Speed Electrical Link

GPIO Connector A (13 user pins)

GPIO Connector B (24 user pins)


Main PowerConnector


Rad-Hard Powering

25

GEFE boardBE-BI-QP


(6 of 9)

Main Components Secondary Components

26

BE-BI-QP

FMC HPC

ProAsic3FPGA

LEDs(x6)

GPIO/CLKMMCX

Board IDConnector

GPIO Switch& Push Button

JTAG

GBTx

GPIOLemo

Rad-HardPowering

GEFE boardThe GEFE at a glance

VTRx

Low-SpeedElectrical Link

TX

RX

Low-pin CountConnectors

Main ComponentsSecondary ComponentsAuxiliary Components

(7 of 9)

GEFE


FMC HPCGBTx


LEDs

FMC HPC (xN)E-links (xN)VTRx

Main PowerConnector

(5-12V)

SCA E-link (x1)

PushButton

MMXC (LVDS)GPIO/Clk IO

JTAG

MMCX (LVDS)SecRefClk

E-links clocks (xN)

GPIO Connector B (24 user pins)Osc. (25MHz)

FPGA (ProAsic3)

MMCX GPIO (x4)

E-link Clock (x1)

FMC clocks (xN)

Board IDConnector

(8-bit)

GPIO SW(8-bit)

SMASMA


FEASTMP (DC/DC) 1.5V LHC4913 (LDO) 3.3V

Rad-Hard Powering

27

GEFE boardBE-BI-QP

Main Components Secondary Components Auxiliary Components


(8 of 9)

Tested Max. Radiation Levels

YESup to 50 Mrad 2x10^15 n/cm²

YESup to 100 Mrad

1.40x10^7 p/cm²

YES up to 75 krad

YESup to 200 Mrad(Si) 5.0x10^14 n/cm²

YESup to 500 krad

2.0*10^7 p/cm²

YES up to 300 krad

YESx > 50 krad(Si)

x > 9.31*10^11 p/cm²

YESx > 50 krad(Si)

9.31*10^11 p/cm²

YESx > 30.6 krad(Si)

3.73x10^11 p/cm²

YESx > 27.1 krad(Si) 6.0x10^11 p/cm²

NO

NO

NO

DescriptionActive Component

SPXO018077

BAV99

VTRx

GBTx

FPGA (ProAsic3)

FEASTMP

LHC4913

PMST2222A

SN74LVC2T45DCTT

NPN Transistor

SN74LVC14APW

BSR18A

BST82

SN65LVDS2DBVR

Optical Transceiver

Multi Gigabit Transceiver

A3PE3000-FGG896

DC/DC Regulator

LDO Regulator

High Speed Switching Diode

Dual-Bit Dual-Supply Bus Transceiver

Hex Schmitt-Trigger Inverter

PNP Transistor

N-CHANNEL MOSFET with Diode

High-Speed Differential Line Receiver

Crystal Oscillator (25MHz)

28

GEFE boardBE-BI-QP

Radiation Hardness

(9 of 9)

Qualified up to 75 kradQualified bellow 75 krad

Not Qualified

• Application examples

BE-BI-QP


30

Application Examples (1 of 2)

BE-BI-QP

Multi-Orbit POsition System SPS (MOPOS SPS) (BE-BI-QP)

Motor Controller with Optical Interface (MCOI) (BE-BI-PM)

STANDARD BACK-END (VFC-HD)FPGA

GBT-FPGAUSER LOGIC

GEFE

VTRx GBTx FPGA BPM ANALOG FE BPM

FMC

BPM DIGITAL FE

FMC

STANDARD BACK-END (VFC-HD)

FPGAGBT-FPGA

GEFE

VERSA EUROPE 3UBACKPLANE

MOTORUSER LOGIC

GEFE

VTRx GBTx FPGAFMC

PM DIGITAL FE

FMC

31


BE-BI-QP




GBT-FPGAUSER LOGIC

GEFE


FMC

BPM DIGITAL FE

FMC


FPGAGBT-FPGA

GEFE


MOTORUSER LOGIC

GEFE

VTRx GBTx FPGAFMC

PM DIGITAL FE

FMC

BPM Digital Front-End FMC(BDF)

32


BE-BI-QP




GBT-FPGAUSER LOGIC

GEFE


FMC

BPM DIGITAL FE

FMC


FPGAGBT-FPGA

GEFE


MOTORUSER LOGIC

GEFE

VTRx GBTx FPGAFMC

PM DIGITAL FE

FMC

BPM Digital Front-End FMC(BDF)

Motor Driver Interface(MDI) board

33

Application ExamplesBE-BI-QP

Advanced Wakefield Experiment BPM (AWAKE BPM) (BE-BI-QP)

New WorldFIP (BE-CO)


GBT-FPGAUSER LOGIC

GEFE

VTRx GBTx FPGAFMC

WorldFIPDIGITAL FE

FMC

WorldFIP FE

... ...

WorldFIP FE

WorldFIP FE

WorldFIP FE

(2 of 2)


FPGA

GEFE

FMC

DIGITAL FE FMC

USER LOGIC

SMA

GBTx FPGA

SMA

VTRx


BPM ANALOG FE BPM

• Status

BE-BI-QP


35

StatusBE-BI-QP

• Specification in version 0.8.5 (may be used as User Guide)

- New Multi-Orbit POsition System SPS (MOPOS SPS) (BE-BI-QP): Requested 300 pieces

• User Projects:

- Motor Controller Optical Interface (MCOI) (BE-BI-PM): Requested 25 pieces

- CLIC Acquisition and Control Module (CLIC-ACM) (BE-CO): Interested

- New WorldFIP (BE-CO): Interested

• Schematics finished• PCB layout finished at CERN design office by Pascal Vulliez

- Beam Wire Scanners (BE-BI-BL): Interested

• Waiting for slot at CERN design office for producing 4 PCB (2 mounted)

• The GEFE board

• Waiting for final comments from users for GEFE v1 (deadline 03/07/15)

• User community

- Advanced Wakefield Experiment BPM (AWAKE BPM) (BE-BI-QP): Requested 30 pieces

• Open HardWare Repository (OHWR) Wiki and Mail List

• Increasing the number of users

• Radiation hardness qualification required for some active components

- Function Generator Controller Lite (FGClite) (TE-EPC): Interested

• Summary & Outlook

BE-BI-QP


37

Summary & Outlook (1 of 2)

BE-BI-QP

Summary

• General purpose FPGA-based radiation tolerant board

Target Total Ionizing Dose (TID): up to 75 krad

• Specifications in version 0.8.5 (may be used as User Guide)

• Several projects interested (More than 350 pieces requested)`

• Open HardWare Repository (OHWR) Wiki and Mail List

• User community

• First 2 prototypes of GEFE v1 expected very soon

• The GEFE board

- Rad-Hard FPGA ProAsic3 (ACLA3PE3000-FGG896) from Microsemi

- Features different components of the GBT-Versatile Link ecosystem from CERN PH-ESE

- Optical & Electrical interfaces (FMC HPC, etc.)

• Increasing the number of users

38

BE-BI-QP

Outlook

Summary & Outlook (2 of 2)

38

BE-BI-QP

• Update specifications after assembly of first GEFE v1 prototypes

• Organise production of GEFE for the different projects

• Test functionality of the first 2 prototypes of GEFE v1 (Second half of 2015)• Test the GEFE v1 in terms of radiation tolerance (First half of 2016…)

• Design and implementation of a fully automated test bench for production testing

• The GEFE board

• User community

• Update Open HardWare Repository (OHWR) Wiki

• Increase the number of users

• Production stage (First half of 2017)

- Ph.D. Student (Christophe Donat Godichal) in charge of the radiation tests

• Organise periodical meetings

Thank you

Contact: [email protected]

http://www.ohwr.org/projects/gefe

mailto:[email protected]


40

BE-BI-QP

References

• The GBT project web page: https://espace.cern.ch/GBT-Project/default.aspx

• The VTRx application note: Application Note V2.4.pdf

• FEASTMP project web page: http://project-dcdc.web.cern.ch/project-dcdc/

• Microsemi web page: http://www.microsemi.com/

• Microsemi ProAsic3E FPGA Fabric user’s guide: PA3E_UG.pdf

• The GBTx ASIC manual: gbtxManual.pdf

• ST LHC4913 data sheet: http://atlas.web.cern.ch/Atlas/GROUPS/FRONTEND/documents/LHC4913.pdf

• ANSI/VITA specifications web page: http://www.vita.com/Specifications

• Microsemi ProAsic3E Flash Family FPGAs datasheet: PA3E_DS_v14.pdf

• Microsemi application note AC380: LPF_AC380_AN.pdf

• The GEFE project web page: http://www.ohwr.org/projects/gefe

• The VFC-HD project web page: http://www.ohwr.org/projects/vfc-hd

https://espace.cern.ch/GBT-Project/default.aspx

https://espace.cern.ch/project-versatile-link/public/Versatile%20Link%20Public%20Documents/Application%20Note/Application%20Note%20V2.4.pdf

http://project-dcdc.web.cern.ch/project-dcdc/

http://www.microsemi.com/

http://www.microsemi.com/document-portal/doc_download/130883-proasic3e-fpga-fabric-user-s-guide

https://espace.cern.ch/GBT-Project/GBTX/Manuals/gbtxManual.pdf

http://atlas.web.cern.ch/Atlas/GROUPS/FRONTEND/documents/LHC4913.pdf

http://www.vita.com/Specifications

http://www.microsemi.com/document-portal/doc_download/130701-proasic3e-flash-family-fpgas-datasheet

http://www.microsemi.com/document-portal/doc_download/129971-ac380-internal-power-on-reset-and-post-programming-reset-circuit-for-flash-based-fpgas-app-note


http://www.ohwr.org/projects/vfc-hd

GEFE boardBE-BI-QP

GEFE

FEASTMP 1.5V FEASTMP 2.5V

FMC HPCGBTx


SMASMA

LEDs

FMC HPC (160 pins)E-links

(40 Bidirectional)VTRx

Main PowerConnector

SCA E-link

GPIO SW(8-bit)

PushButton


JTAG

M2C clocks (x2)BIDIR clocks (x2)

SFP+Power

VTRxPower

Vadj

ESLT

MMCX (LVDS)SecRefClk

E-links clocks (x3)

LDORegulator

3.3V

Board IDConnector

(8-bit) GPIO Connector B (24 user pins)

Reset

RSSIGBT M2C clocks (x2)

Prog. clocks (x4)

Osc. (25MHz)

VioBM2c

FMC DP (40 pins)Std. IOs

Std. IOs

FPGA (ProAsic3)

MMCX GPIO (x4)

IOs (Hb)

IOs (La/Ha)Core

Prog. clocks (x1)

Detailed Block Diagram

GEFE boardBE-BI-QP

Test Bench

FPGA-basedFMC carrier

GEFESFP+

FMC Connector FMC Connector

VTRx

FPGA

FPGA

GBTx

Ethernet

FMC Cable

Optical LInk

GEFE boardBE-BI-QP

GBTx ASIC

17 mm

17 mm

VTRx

VTRx & GBTx• Main components of the new “Rad-Hard Optical Link for Experiments”

• Developed at CERN by PH-ESE

• VTRx

• Rad-Hard Optical Transceiver• Bidirectional Link at 4.8 Gbps (Versatile Link)

• GBTx

• Rad-Hard ASIC• Single Electrical Link with VTRx at 4.8 Gbps

• Multiple Electrical Links with Front-End Electronics (E-Links) - 40 Links @ 80 Mbps- 20 Links @ 160 Mbps- 10 Links @ 320 Mbps

• Widely used at CERN (Experiments & Accelerators) and External institutions (Desy, etc.)

GEFE boardBE-BI-QP

Particularities of the FMC connector in GEFE• High-pin count (HPC) socket

• The different control signals of the FMC standard are supported

• The targeted user-specific I/O data rate is up to 700 Mbps

• The high-speed lanes (DP) connected to user-specific I/Os

• Special functions of DP lanes:• Direct SC e-link between GBTx and the FMC HPC connector

• FPGA programming by JTAG master (e.g. SCA) placed on FMC

• Accessible from the rear of the board

• Up to 160 Single-Ended (or 80 Bidirectional) user-specific I/Os

• 6 differential clock lines (4 inputs and 2 bidirectional)

• Direct signals from GPIO connector A to FMC HPC connector

BDF

Single width conduction cooled FMC Module

45

GEFE boardBE-BI-QP

FPGA (ProAsic3)

46

GEFE boardBE-BI-QP

PoweringFEASTMP

47

GEFE boardBE-BI-QP

Slow Control (SC) E-Link• Single E-link @ 80 Mbps

GEFE

FMC HPC

GBTxVTRxGbtxElinkScXx_p/n

FPGA (ProAsic3)

ResistorsNetwork

FmcDpM2c_p/n[5:7]

GbtxElinkScXx_p/n_Fpga

FmcDpM2c_p/n_Fpga[5:7]

48

GEFE boardBE-BI-QP

Low-Speed Electrical Link• Tested up to 10 Mbps over 2 Km of coper cable

GEFE

FMC HPCFMC HPC (xN)

FPGA (ProAsic3)

FMC clocks (xN)

SMASMA



Main PowerConnector


Rad-Hard Powering


Osc. (25MHz)

MMCX GPIO (x4)

49

GEFE board(1 of 2)

BE-BI-QP

Clocking Scheme

GEFE

FMC HPC

VTRx


CLK_M2C[0:1]

CLK_BIDIR[2:3]

Osc. 25MHz

MMCX (LVDS)

DCLK[0:2]GBTCLK_M2C[0:1]

CLOCKDES[0:3]

FPGA (ProAsic3)

MMCX GPIO (x4)

Hb_cc[00,06,17]

Ha_cc[00,01,17,18]

La_cc[00,01,17,18]

GBTxCDR

Osc.40MHz

SCCLKREFCLK

FmcDpM2c[5]

CLOCKDES[4]

FmcDpC2m[8]

50

GEFE board(2 of 2)

BE-BI-QP

Clocking SchemeDCLK[0]

MmcxGpio[0]

CLOCKDES[0]MmcxGpio[5]

MmcxGpio[6]

MmcxGpio[7]

CLK_M2C[1]

La_cc[0]

La_cc[18]CLK_BIDIR[3]

La_cc[17]

Ha_cc[17]

GBTCLK_M2C[0]

La_cc[1]

Osc25MHz

CLK_BIDIR[2]

ClkFeedbackClkM2c[0]

GBTCLK_M2C[1]

Ha_cc[0]

Ha_cc[1]MmcxGpio[3]

MmcxGpio[2]

MmcxGpio[1]

Hb_cc[0]

Hb_cc[6]

Hb_cc[17]MmcxGpio[4]

CLOCKDES[3]

DCLK[2]

DCLK[1]

CLOCKDES[2]MmcxClkIo

CLOCKDES[1]

SCCLK

Clock Source A

Clock Source B

Clock Source C

Ha_cc[18]

51

GEFE boardBE-BI-QP

Resets Scheme

GEFE

FMC HPC

GBTx


GPIO Connector B (24 user pins)

Reset

FPGA (ProAsic3)

ResetButton

VTRx RSSIPOR/PPR

ResetLogic

52

GEFE boardBE-BI-QP

FPGA Programming Scheme

GEFEJTAG

ConnectorFMC HPC

FPGA (ProAsic3)

FpgaXxxFmcDpM2c_p[0:4]_Xxx

ConnXxx

VoltageTranslator

(Vadj from/to V3p3) FmcDpM2c_p_r[0:4]

FmcDpM2c_p_r_Fpga[0:4]

Jumpers

Jumpers

Std. IOs

JTAG Prog.