IN THIS ISSUE Oscilloscopesampling systemreduces testingcosts for highspeed designs

AC/DC supplyheralds revolutionwith leading powerdensity & efficiency

NNeexxtt GGeenneerraattiioonn HHFFSSEEPPIICC//BBoooosstt CCoonnttrrooll lleerrTTaarrggeettss AAuuttoommoottiivvee

October 2012 / Volume 3, Issue 10

Wireless & Portables

Gain block amplifier hot onGaAs performance, p16

Active Components

USB MCU portfolioenhanced, p26

PowerOn-board compact PCIpower supply built to EN50155, p30

Passive ComponentsCircuit protectors shape upas low Rho SMDs, p38

Cables & Connection IDC wire to board designmakes reliable connection,p41

Opto & Displays Traffic light LEDs set to gogreen, p51

www.rs-components.com/teconnectivity

FIND IT. DESIGN IT. BUY IT.

We’re now stocking over 22,000 TE Connectivity products.

CONTENTS & COVER STORIES

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 3

On Semiconductor’s NCV898031 adjustable output,non-synchronous, singleended primary inductor con-verter/boost controller is tar-geted for automotive appli-cations. With a fixedswitching frequency of 2MHz,it almost doubles the fre-quency performance of mostcompeting devices.Covering a wide input

range of 3.2~40V, this con-troller uses peak currentmode control with internalslope compensation. It has abuilt-in regulator that suppliescharge to the gate driver, plusa 1.2V ±2% reference volt-age. Protection features in-clude internally set soft start,under-voltage lock-out, cycleby cycle current limiting andthermal shutdown. The AEC qualified NCV

898031 can cope with a 45V

load dump and operatesover −40~+150°C. In addition, its low

sleep mode current oftypically 10µA helps tokeep the total ignition offquiescent current budgetto a minimum.The higher frequency

operation of this deviceallows it to be used withsmaller and lower costinductors and output ca-pacitors, thereby loweringthe overall cost and takingup less PCB real estate. Withprotection mechanisms anda wide voltage range, it ishighly optimised for automo-tive applications such as in-strumentation clusters andinfotainment systems.“The enhanced frequency

performance exhibited bythe NCV898031 will be ofgreat benefit to design engi-

neers as they look to curbcosts and better utilise avail-able space, allowing smaller,less expensive passive com-ponents to be specified,”says On Director Jim Alver-naz. “In addition, its low qui-escent current level will helpto meet the demanding igni-tion-off requirements nowbeing expected within theautomotive industry.8 For full editorial

4 Commentary

6 NewsLine

12 Design & Embedded

16 Wireless & Portables

24 Active Components

28 Power

32 Test & Measurement

36 Cabinets, Racks &Enclosures

37 Passive Components

40 Cables & Connection

42 Comms, Computing & Control

46 Automotive

50 Opto & Displays

54 Distribution Focus

56 Tech Videos

CONTENTS

AC/DC Supply Heralds Power RevolutionBOASTING leading powerdensity and efficiency, the330W ac/dc XL330-54 powersupply from N2Power is just34.3mm high, open frameand sits in a 76x135mmspace. It delivers a power den-sity of 15W/in3 under 13cfmcooling, saving some 32%compared to typical 1U unitsof similar rating, most of whichhave a 102x152mm footprint.Maximum full load

efficiency is90%, viasynchro-nous recti-fication, OringMOSFETs and a newactive PFC design. ThePSU generates 23% less heatthan most comparable sup-plies, minimising cooling andincreasing system reliability.The high efficiency delivers en-ergy savings throughout theproduct’s life, providinggreater return on investment.XL330-54 has two primary

outputs: 54V/6.1A and

12V/9A, plus a 12V/1A auxil-iary output. The 54V output is2250Vdc isolated making itPoE compatible. The design al-lows active current sharing onthe 54V output for up to fourPSUs in parallel. N+1 opera-tion can also be configured.Features include universal

90~240Vac inputs and activeinrush current protection of10.5A at 240Vac.“Engineers now appreciate

that efficiency gains ofjust a few percent-age points deliversubstantial costbenefitsthroughout a

product’s operatinglife,” says N2Power VP

&General Manager RandyJohnson. “When a powersupply is 90% efficient, ratherthan 87%, that’s a 23% per-formance improvement andenergy saving. N2Power deliv-ers improvement withoutcompromise.” 8 For full editorial

Reducing HighSpeed Test Costs

Agilent’s N1045A 2/4 portelectrical remote samplinghead module is deemed eco-nomical in accurately charac-terising multi-lane designs innew and emerging standardssuch as IEEE 802.3 ba/bj/bm(40Gb/100Gb Ethernet) andOptical InternetworkingForum CEI 3.0.Users can configure up to

four N1045A modules in asingle Agilent 86100D DCA-Xwide-bandwidth mainframeto create a system with 16channels. The modules can beconfigured with 1.85mmmale or female connectors.8 For full editorial

Next Generation HF SEPIC/BoostController Targets Automotive

ElectronicSpecifier Ltd.Ellion House, 6 Alexandra RoadTonbridge, Kent TN9 2AA, UK

Editor:John Taylor BA, IEng, MIET

editor@electronicspecifier.comTel/Fax: +44 (0) 1843 866 607

Copy Editor: Raj Joshieditor@electronicspecifier.com

Publisher: Tim Ansteetim@electronicspecifier.comTel: +44 (0) 1732 366 624 Fax: +44 (0) 1732 366 052

Publishing Director: Steve Regniersteve@electronicspecifier.comTel: +44 (0) 1732 366 617 Fax: +44 (0) 1732 366 052

Subscriptions8 Subscribe to the Digital Editionof ElectronicSpecifier

Distribution Blog8 Find out what’s happening in the world of distribution

COMMENTARY

www.electronicspecifier.com4 | october 2012 | electronicspecifierproduct

Independents UnchainLED Phosphors Market

The LED phosphor marketis set to more than doublein the next five years, ac-cording to a new reportfrom Yole Développement.Phosphors, keystone ofLED technologies, enablethe conversion of mono-chromatic blue or near UVlight emitted by LED chipsinto a richer spectrum ofcolour approaching or ex-ceeding that of other artifi-cial light sources.

Early 200 saw the bulk ofthe LED phosphor industryunder the control of majorLED players who held key IP in the various domains and se-lectively granted licenses and cross-licenses.

“The landscape changed in the mid 2000’s,” says YoleDéveloppement Senior Analyst Dr Eric Virey, “with the emer-gence of phosphors that were IP-free credible alternatives toYAG and TAG, commercialized on the open market by inde-pendent phosphor manufacturers unaffiliated with LEDmanufacturers.”

This Yole report detailed over 50 companies involved in LEDphosphor manufacturing. Virey says, “More than 20 of themare located in China, where we’re observing the emergenceof vendors with improving quality and potentially credible IPto satisfy the tier one Chinese LED makers that have worldclass ambitions and who favour IP and performance vsprice.”

Overall, Yole expects the phosphor market to grow signifi-cantly during the next five years, potentially passing the$1bn. However, a significant fraction of this market will re-main captive, with technology still a key opportunity for dif-ferentiation to increase performance and design in the faceof a strong and limiting IP.

The combination of YAG phosphor + blue LED remains thesolution of choice for applications where high CRI and warmcolour temperature are not required. But Nichia’s strong IP,says Yole, limits access to YAG to selected partners and majorLED manufacturers that have been able to negotiate cross-li-cense agreements thanks to their own strong IP position.While still not on an equal footing with YAG in terms of per-formance, Silicates have improved significantly and are clos-ing the gap. However, as Nichia’s critical IP is set to expire inthe next few years, an increasing number of phosphor manu-facturers are offering YAG compositions as well.

Next battle in the LED phosphor industry stems from therapid growth of LED applications that require warm

colours and saturatedreds in display or residen-tial and retail lighting. Forthese, additional redand/or green phosphorsare added to the mix. Ni-trides and oxy-nitridesprovide excellent perform-ance but are controlled byDenka and MitsubishiChemicals, with strong IPobtained from NIMS.

Market price for these ma-terials is dome five to tentimes higher than that ofyellow phosphors. So mul-tiple organisations are

scrambling to develop better, cheaper and non-IP restrictedcompositions. Tungstates, molybdates, carbidonitrides,Green Aluminates and Selenides are being investigated. Inaddition, Quantum Dots are finally emerging as a crediblealternative to traditional phosphor in some applications.

“But phosphor composition is not the only key factor. Manu-facturing technology, deposition methods and system designall have significant impact on LED and overall system costand performance,” explains Dr Virey. The Yole report pro-vides a detailed list of established and emerging composi-tions and deposition technologies.

Remote phosphors offer significant benefits in terms of sys-tem performance and efficiency. However, they increase therequired amount of phosphor material and associated costby orders of magnitude. This constitutes the major roadblockfor adoption. With some applications though, remote phos-phors are the best option for reaching the required perform-ance, and the additional phosphor cost can be partially orcompletely offset at the system level by improving its overallperformance and reducing component count.

The adoption of remote phosphors is decided on a case-by-case basis depending on the application, performanceand cost targets. A rare earth shortage could impact theLED industry in the mid-term. While supply constraints onlight rare earth should ease soon, tension will persist forthe heavier elements, including Yttrium, Terbium and Eu-ropium, which are critical to fluorescent lamp and LEDmakers. Shortages could appear and persist even after2015. Fluorescent lamps are the major application com-peting with LED for these resources.

In the short term, as incandescent and other inefficient lightsources are phased out of the market in most countries, theconsumption of fluorescent lamps will increase significantly,putting additional strain on supply. 8 www.yole.fr

www.farnell.com

VISIT US TO SEE HOW WE’RE USING YOUR FEEDBACK TO BUILD A BETTER EXPERIENCE...

Over 3,500 industry leading suppliers

Innovative niche manufacturers as well as world class brands

Over 100 new technologies added online every day

LET’S TALK ABOUT TAKING THE HASSLE OUT OF PRODUCT SELECTION.

BECAUSE EASIER IS BETTER.

THE HASSLE OUT OF PRODUCT SELECTION.

“I want to be able to quickly buy all of the products I need, from the brands I know and trust, from one source.”

Hall A5 Stand 558

Electronica Ad_2_EN 239x309.indd 1 01/10/2012 13:51

www.electronicspecifier.com6 | october 2012 | electronicspecifierproduct

NEWSLINE

Electronic Specifier Product isoffering its readers the chanceto win a PIC32 USB Starter Kitll from Microchip.The PIC32 USB Starter Kit II

enables users to develop USBembedded host, device andOTG applications on the highperformance PIC32 microcon-troller family. The board con-tains an on-board program-ming/debugger, standard AUSB and micro A/B connectors,and an expansion header com-patible with the PIC32 StarterKit and expansion board suchas I/O Expansion Board(DM320002) or for prototyping your own. Host PC re-quires Windows based operating system.

The USB Starter Kit II has thesame form factor and expan-sion connector as other PIC32Starter Kits. It includes:

PIC32 USB Starter Board II Standard A to mini B cable

for debugger Standard A to micro B

cable for USB application de-velopment

Quick start card directingusers to web based instruc-tions for software downloadand installation.

For your chance to win aPIC32 USB Starter Kit ll, go to

http://www.microchip-comps.com/esp-usb2 and enteryour details on the on-line entry form.

Win A Microchip PIC32 USB Starter Board…

“In the future, if it com-putes, it connects,” saidIntel CTO Justin Rattnerin his Intel DeveloperForum keynote speech.“From the simplest embed-ded sensors to the most ad-vanced cloud data centres,we're looking at techniquesto allow all of them to con-nect without wires.”Rattner demonstrated for

the first time a working, all-digital WiFi radio, dubbed aMoore's Law Radio. The CTOexplained that an all-digitalradio follows Moore's Law byscaling in area and energyefficiency with such digitalchip processes as Intel's lat-est 22nm tri-gate technol-ogy. SoC designs for smart-

phones and tablet comput-ers would be the most likelyspot for the all digital radiosto be integrated. The small size and lower

cost of integrated digital ra-dios will enable a host ofnew applications fromwearable devices to The In-ternet of Things where de-vices such as home appli-ances with sensors cancommunicate with eachother, exchange data andcan be operated remotely.Rattner went on to de-

scribe a next generationwireless standard calledWiGig that operates in themillimetre wavelengths ofthe radio spectrum and de-livers bandwidths well over

5Gbps. The WiGig standardis an industry wide effort toconsolidate a number ofproprietary 60GHz wirelesstechnologies under the exist-ing WiFi standard.“WiGig is so fast it will let

you wirelessly dock yourenabled Ultrabook, tabletor smartphone withoutwires,” said Rattner. “Evenmultiple displays can bedocked at one time.”Users love the ability to re-

ceive email and social mediaupdates while their devicesare asleep. To bring this al-ways on, always connectedcapability to the Ultrabookplatform, Intel Smart Con-nect technology currentlywakes up the Ultrabook just

long enough to receive theincoming packet traffic andthen it goes back intostandby mode to ensurelong battery life.Showing how the benefits

of Smart Connect technol-ogy could be enhanced toinclude active operation forfile transfer and videostreaming, Rattner demon-strated Spring Meadow,which manages communi-cation between the cloudand the device more intelli-gently. By pre-processing in-coming network traffic andproactively managing trafficflow, Spring Meadow makesmore efficient use of the hostprocessor, allowing it to re-main in a low power statelonger without impactingsystem performance.8 For full editorial

Intel Tunes Into Wireless Future

Densitron's proprietary e-paper evaluation kit and Rip-Draw display and design so-lution promise to significantlyreduce product developmenttime and cost.RipDraw, launched with

Densitron’s cloud computingweb portal, is designed toenhance the rapid prototyp-ing of world class GUI de-

signs for TFT projects. Notonly does the portal includea seven layer, intuitive WYSI-WYG drawing tool, it alsocomes fully populated withover 8000 copyrighted, roy-alty-free images for cus-tomers to use with the Rip-Draw TFT product line. RipDraw removes the bar-

rier most mid-market cus-

tomers confront if they lackthe art department to fullyutilise a TFT display. This coupled with the re-

lease of the RipDraw TFTemulator and initial releaseof the RipDraw 7in WVGA1024x600 GPU assisted TFTdisplay greatly reduce timeto market and results in ex-traordinary cost-effective GUI

solutions for its customers.New e-paper evaluation

kits for 1.44, 2.0 and 2.7inscreens come with a con-troller board and a dataand power board. The dataand power board receivesdata and power from PCUSB interface and suppliesdata and power to the con-troller board via a UART orSPI interface.8 For full editorial

Design Solutions Reduce Development Time

IPM™µ ™

µIPM™ Power Modules Deliver up to 60% Smaller Footprint

Innovative Power ModuleReduces System Size

Part Number Size(mm) Voltage

IO(DC@ 25°C)

MotorCurrent** Motor Power

VO=150/75VRMS Topology

w/o HS w/HS

IRSM836-024MA 12x12 250V 2A 470mA 550mA 60W/72W 3P Open Source

IRSM836-044MA 12x12 250V 4A 750mA 850mA 95W/110W 3P Open Source

IRSM836-025MA 12x12 500V 2A 360mA 440mA 93W/114W 3P Open Source

IRSM836-035MB 12x12 500V 3A 420mA 510mA 108W/135W 3P Common Source

IRSM836-035MA 12x12 500V 3A 420mA 510mA 100W/130W 3P Open Source

IRSM836-045MA 12x12 500V 4A 550mA 750mA 145W/195W 3P Open Source

Specifi cations:

* IR’s iMOTION™ (ai mo shan), representing the intelligent motion control, is a trademark of International Rectifi er** RMS, Fc=16kHz, 2-phase PWM, TCA=70°C, TA 25°C

Features:

µIPM™ Advantages:

For more information call +49 (0) 6102 884 311or visit us at www.irf.com THE POWER MANAGEMENT LEADER

Visit us in Hall A5, Stand 320

www.electronicspecifier.com8 | october 2012 | electronicspecifierproduct

NEWSLINE

Hitachi has plumped forSynopsys'sDiscovery verifi-cation IP for the Arm AMBAAXI3 protocol for verificationof its virtual storage platform.Enabled by Synopsys's nextgeneration Viper architecture,Discovery VIP demonstrated aperformance advantage overother VIP, as well as deliveredprotocol-aware debug capa-bilities and advanced built-incoverage features, whichhave accelerated Hitachi'sstorage systems verificationclosure process.“Our advanced storage

technologies include variousadvanced system on chipsthat require complex verifica-tion environments where weutilise critical VIP to speed upthe verification process,” ex-plains Hitachi Manager YujiTakei. “After a comprehensiveevaluation, we selected Syn-

opsys' Discovery VIP for theAMBA AXI3 protocol for veri-fication of our advancedSoCs. We were impressed byits speed advantage andmemory efficiency comparedto other VIP, as well as bySynopsys' Protocol Analysertechnology and broad cover-age features.”The Discovery VIP, based

on next generation Viper ar-chitecture and implementedin 100% SystemVerilog, de-livers enhanced VIP perform-ance, configurability, porta-bility, debugging, coverageand extensibility. Discovery VIP supports

Synopsys's Protocol Analyser,a protocol-centric debug-ging environment with intel-ligent visibility into the VIPsource code. These capabili-ties substantially increaseuser productivity for one ofthe most difficult and timeconsuming aspects of func-tional verification.8 For full editorial

Hitachi ChoosesSynopsys For Verification IP

Robert Bosch has joined theAVX Solutions for Hope Proj-ect. And commenting on themove, AVX President PeterCollis Executive Vice says, "Weare very pleased to haveBosch, one of the world's pre-mier electronics suppliers tothe automotive sector partici-pate in our project."The Solutions for Hope Proj-

ect, established in July 2011,works with leading OEMssuch as Motorola Solutions,Intel, and HP to deliver aclosed-pipe process for deliv-ering conflict-free tantalummaterial from the DRC in ac-cordance with OECD due dili-gence guidelines and incorpo-rating the independentlyvalidated EICC and the Globale-Sustainability Initiative Con-flict-Free Smelter programme. Solutions for Hope remains

the only project to exclusivelyutilise EICC/GeSI validatedConflict-Free Smelters forprocessing tantalum ore intocapacitor-grade materials. AVX is the first in its industry

to validate a closed tantalum

pipe process, assuring allproducts contain only conflict-free tantalum in accordancewith the principles of theDodd-Frank legislation andthe current OECD guidelines.“AVX will continue its lead-

ing role by working with agrowing list of major elec-tronics companies like RobertBosch in the Solutions forHope programme,” says AVXDirector Bill Millman. “Thisprogramme demonstratesthat verifiably conflict-freetantalum material can bemined and shipped in amanner that is reliable, sus-tainable and expandable, al-lowing the DRC to be utilisedas a trusted regional sourcefor responsible minerals.”8 For full editorial

Bosch First In Automotive ToJoin Solutions for Hope Project

Zigor Tiber on-line uninter-ruptible power supplies boastsuperior power protection.They integrate double con-version and use two invertersto provide perfect clean sinewave power at all times with-out using the battery unlessthe mains fails.Available in 1kVA to 3kVA

versions, Tiber can be floor orrack mounted with an LCDthat provides informationabout input and output volt-ages, plus load and batterycharge status.Reviewer recently in PC Pro

Magazine, Dave Mitchell de-scribed the Tiber as a low coston-line UPS well suited toprotecting critical systems,rating it five out of five onvalue for money. He alsoawarded it four out of five forperformance, four out of fivefor features and design,achieving an overall score offour out of five.“On-line UPS models usu-

ally carry a price premium asthey provide electrical isola-

tion which helps to protectbusiness critical equipment,”says Mitchell, “but Zigor’s on-line 1.5kVA UPS costs lessthan £400.” Mitchell used theDell PowerEdge R515 serverwhich he says draws around140W when idle to test theTiber 1.5kVA model's batterytime and the UPS performedbetter than some of its rivals.“The UPS’s battery kept theserver running for 46 minuteswhich is seven minuteslonger than the Tripp-LiteSmartPro,” he adds.Zigor UK Sales Manager

Gavin Banks comments,“We’re delighted that such areputable magazine as PCPro has recognised that theZigor Tiber offers such goodvalue for money. It onlyserves to highlight Zigor’scontinuing commitment toproducing high quality unin-terruptible power supplies ataffordable prices.”The Zigor Tiber 1kVA starts

at £450 RRP and includes atwo year advanced replace-ment warranty as standard.8 For full editorial

UPS Highly Rated

Joining forces on a highly in-tegrated module are ToshibaElectronics Europe andPanasonic Industrial De-vices Sales Europe, to en-able users to add Bluetoothconnectivity to devices easilyand efficiently. Target applica-tions include industrial, au-tomation, medical, personalsport and fitness equipment.This module combines

Toshiba’s single chip TC35661 Bluetooth IC and soft-ware stack with Panasonic’sdesign and manufacturingexpertise in module produc-tion. The TC35661 is a highlyintegrated and compact Blue-tooth controller that delivershigh-speed operation atultra-low power. It signifi-cantly reduces external com-

ponent count and power con-sumption in applications re-quiring Bluetooth Classic andBluetooth Low Energy func-tionality. This provides thelow-power and rapid connec-tion and disconnection func-tions, needed by a widerange of applications usingsmaller form factor devices. Itwill round off Panasonic’smodule portfolio by offeringan easy to integrate modulewith various embedded,Bluetooth qualified profiles.“This co-operation will give

customers access to a highlyeffective Bluetooth solution,”comments Toshiba GeneralManager Armin Derpmanns,“that significantly reduces thedesign and integration effortrequired for incorporating thelatest Bluetooth technologyinto their products.”8 For full editorial

Bluetooth ModuleCo-operation

www.electronicspecifier.com10 | october 2012 | electronicspecifierproduct

NEWSLINE

With OLED lighting still in its in-fancy, IDTechEx says pricepoints are several orders ofmagnitude above those pro-jected by industry roadmapsand even more off cost targetsrequired for widespread mar-ket uptake. There is still no setof standards or consensus inthe industry on optimal devicearchitecture including stack ordouble layer, manufacturingtechnique including evapora-tion, solution processing or hy-brid, or manufacturing toolkit.It is not even clear how OLEDlighting can borrow from tech-niques developed and scaledfor the OLED display industry.With cost drivers today such

as integrated substrates, en-compassing the substrate, thetransparent conductor and ex-ternal light extraction layer,which constitute 45~50% ofthe overall cost and encapsula-tion issues, it is not yet clear

how and when costs are goingto come down to competitivelevels when compared to LEDs. LED technology on the other

hand is many years ahead ofOLED. It was already a $10bil-lion market in 2011. In 2001,there were only 38 manufac-turing sites globally; this rose to169 in 2012. Today, manufac-turing takes place mostly in farAsia. Indeed, China, Japanand Taiwan offer 52.2% of theglobal manufacturing capacity. Not all, however, is well with

the LED industry. Similar to thephotovoltaic industry, the mar-ket today is currently experi-encing a supply glut – Chinahas heavily subsidised manu-facturing capacity. The industryitself has created excess capac-ity in anticipation of marketpull from the LED-LCD industryand in addition to this, the de-mand is also expected to slow. Going forward, the most dif-

ficult challenge lies in meetingttough cost targets set by theincumbent technology. 8 For full editorial

OLEDs To OutshineLEDs In LightingApplications

Driving a critical phase of ve-hicle to vehicle, V2V, and ve-hicle to infrastructure, V2I,communications develop-ment, General Motors isproviding eight speciallyequipped vehicles for a yearof real world testing. V2Vequipped Buick and Cadillaccars will be part of a largerfleet of passenger cars, com-mercial trucks and transit ve-hicles participating in the USDepartment of Transporta-tion’s Connected VehicleSafety Pilot Model Deploy-ment Program.The University of Michigan

Transportation Research Insti-tute will conduct the pro-gramme, which is designedto determine the effective-ness of V2V and V2I safetytechnologies at reducingcrashes. In late 2013, theNational Highway Trans-portation Safety Administra-tion will use data collected bythese vehicles to measure

overall system benefits.Analysis of the data could re-sult in a wide-scale deploy-ment V2V technology beforethe end of the decade.“Safety is our number one

priority, and this researchcould save lives and preventinjuries across America,” saysUS Transportation SecretaryRay LaHood. “With morethan 30,000 people a yearkilled on our nation's roads,we need to keep looking fornew ways to improve safetyand reduce fatalities.” V2V communication allows

vehicles to send and receivefrom each other basic infor-mation such as location,speed and direction of travel.V2I communication sharesinformation about traffic sig-nal phase, road attributesand surface conditions. Eachtechnology has the potentialto mitigate traffic collisionsand congestion.8 For full editorial

Connected Vehicle Connections...

Dr Wolfgang Schäuble, Ger-many’s Federal Finance Minis-ter, opened TDK-Lambda’snew 2300m2 European Logis-tics and Supply Centre inAchern. The new facility rampsup the available space bysome 900m2 and will holdaround €5m worth of stock.The move to the new build-

ing follows strong growth bythe company in recent years:last year the European Ware-house supplied more than8000 customers with morethan a million products. Thenew logistics centre will enableTDK-Lambda to stock morepower supply products from itsproduction facilities in the UK,

USA, Israel and Asia to supplythe European market.“Our common Enterprise

Resource Planning systemprovides instant visibility ofour stock levels across Eu-rope,” says TDK-Lambda Lo-gistics Director Jürgen Spen-gler, “and random stockaccess will optimise our han-dling processes.”With this increased invest-

ment in additional stock,TDK-Lambda says it willmaintain high availability ofits products anywhere in Eu-rope, whether through directsales or distribution, thus op-timising delivery times.8 For full editorial

European Logistics& Supply Centre Opens

Michael Rayfield is the newVP for Wireless Solutions atMicron Technology. He takeson the responsibility for man-aging all aspects of Micron'sWireless Solutions Group thatprovides DRAM, NAND Flash,NOR Flash and PCM memorysolutions, including multi-chippackages, to the global mobiledevice market.With 15 years executive

management experience and

nearly 30 in the industry, Ray-field worked for tseven yearsas VP & General Manager ofNVIDIA's Mobile Business Unit.His team created advancedcomputer on a chip technologyand won key mobile industryreference designs.“Micron has the industry's

broadest set of innovativememory products,” says Mi-cron President Mark Adams.“Mike has the direct industryexperience, relationships andleadership skill set that willhelp us leverage this portfolio.”8 For full editorial

Rayfield Takes VPRole At MicronTechnology

NEWSLINE

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 11

The market for integrated circuits isforecast to post stronger average an-nual growth through to 2021 com-pared to the average market growthover the past 15 years, accord-ing to an analysis recently com-pleted by IC Insights. Though ICunit growth is expected to slow,the IC average selling price is ex-pected to jump into the positiverange, and help boost averageannual IC market growth to8.0% per year from 2011-2021,an increase of 54% compared tothe 5.2% annual growth the ICmarket averaged in the periodbetween 1996 and 2011.Clearly, says IC Insights, there

are significant obstacles facingthe industry including troubled globaleconomies and numerous technologyhurdles to improve the manufacturingprocess, yet IC Insights believes that ICmarket growth will improve despitethese and other challenges.IC unit shipments have been the foun-

dation for growth in the IC industry overthe past 15 years, averaging 9.5%pagrowth. Over the next ten years, the av-erage annual growth rate for IC units isforecast to slow to 7%pa as lacklustreglobal GDP cools demand for electronicsystems and integration results in morefunctions on a single chip.

Offsetting slower unit growth is anupward swing in the IC average sellingprice, which is forecast to be the driverfor IC market growth through 2021. ICaverage selling prices declined an av-erage of 4% annually from 1996 to2011. However, through 2021, IC

ASPs are forecast to increase by an av-erage of 1%pa, resulting in an 8.0%average IC market growth rate from2011 to 2021.Improving IC ASPs can be attributed

to several factors. With no new entrypoint opportunities, the IC industry isnow closed to new major manufactur-

ing start ups and this willhelp moderate over-invest-ment in new fabs. Moreover,the Fab-lite foundry move-ment should lead to lessoverspending for IC fabrica-tion capacity and Capex as apercentage of sales, afterreaching 21% in 2011, theratio is forecast to decline to19% in 2012 and to 15% bythe end of the decade.Delays in moving produc-

tion to 450mm will delay thenext cost reduction phase for

IC manufacturing, for example, 14nm,EUV, 3D transistor structure and so on.As a result of these and other industrytrends, longterm IC ASPs are forecast tostabilise and lead to IC market growthof 8.0% annually through to 2021.8 For full editorial

Longterm IC MarketForecast On The Up

www.electronicspecifier.com12 | october 2012 | electronicspecifierproduct

DESIGN & EMBEDDED

NI’s PXIe-8135 features thequad-core third generationIntel Core i7 processor andUSB 3.0 connectivity, makingit the industry's fastest PXI em-bedded controller. It can helpachieve shorter test times andincrease automated testthroughput, further advancingPXI instrumentation for highperformance test, measure-ment and control applications.“At NI, we are continuously

investing in the PXI platformand pairing it with the latestIntel processor offerings,”states NI R&D VP RobertCanik. “The NI PXIe-8135embedded controller is agreat example of how ourlong-standing collaborationwith Intel helps us give engi-neers advanced technology toaddress demanding test andmeasurement challenges.” Intel Marketing Director

Matt Langman adds, “The

third generation Core i7processor being used in theNI PXIe-8135 embeddedcontroller provides superiorperformance and next-gener-ation I/O technologies tohelp meet the intensive pro-cessing demands of the latestautomated test and controlapplications. Because ofIntel’s processor architectureadvancements, National In-struments can continue to de-liver the highest performancepossible for test engineers.”8 For full editorial

Embedded PXIe-8135Controller Built On Core i7

Denso reports significant qual-ity and productivity improve-ments on a low power mixedsignal IC design after switchingto Cadence custom/analogueand digital flows. After deploy-ing the Cadence EncounterRTL-to-GDSII flow on the digi-tal portion of the design,Denso achieved a 10% reduc-tion in area and a 20% reduc-tion in power compared toprevious vendor flows. On the analogue part of the

design, based on multiple testdata results, Denso achieved a30% percent improvement inproductivity using the CadenceVirtuoso custom/analogueflow and predicts the same im-provement in actual designs.The result for Denso is a signif-icant productivity and quality-of-results advantage.“In the highly competitive

automotive electronics market,reliability is a must,” commentsDenso Electronics Device Busi-ness Manager Yoichi Oishi.

“We needed to revamp ourdesign tools so we could de-velop chips more efficientlywithout compromising onquality. After adopting the Ca-dence Encounter and Virtuosoflows, we achieved our goalsin terms of chip quality andtime to market.” To achieve improved power,

performance and area on thedigital parts of advanced nodedesigns, Denso used the En-counter RTL-to-GDSII flow,which includes Encounter RTLCompiler for global synthesisand the Encounter Digital Im-plementation System for de-sign implementation. For the analogue sections,

Denso deployed VirtuosoSchematic Editor, VirtuosoLayout Suite and VirtuosoAnalog Design Environmentin a complete custom/ana-logue flow from spec drivenmulti-test environment withsensitivity analysis and circuitparameter optimisation forrobust, centred designsthrough full custom layout. 8 For full editorial

Cadence UpsDenso Productivity Latest Concurrent MicroTCA

development system is its SYAMC/235, a freestanding sixslot, single width AdvancedMCfast track application develop-ment system. For fast development, it

comes pre-installed with adual core processor SBC cur-rently supporting the secondand third generation Core i7processors with integrated highperformance graphics, an8Gbyte SATA flash drive, Mi-croTCA Carrier Hub and anoptional Mass Storage AMC.SY AMC/235 is based on an

EMC enclosure, incorporatingan integrated power supplyand cooling fans, providing theuser with a total of six slots:one reserved for the MicroTCAcarrier hub; one for the systemcontroller SBC and one sup-ports an optional mass storageAMC. The remaining singlewidth slots can be populatedwith either two full height orthree mid-height AMC mod-ules for system expansion.

The backplane connects

each of the five slots with theMCH via a PCI Express fat pipeon the data plane and two1000 Base-BX (SerDes) linkson the control plane.“The SY AMC/235 develop-

ment system provides our cus-tomers with a highly versatilesolution to reduce their timefrom development to deploy-ment,” says Concurrent Tech-nologies CEO Glen Fawcett.“In addition, the SY AMC/235allows users to quickly adoptthe latest technologies as theybecome available and imme-diately engage in developmentwithout the need for delay.”The company provides a

range of additional AMC mod-ules to further enable customi-sation of the SY AMC/235 de-velopment system, includingSBCs, graphics adapters andmass storage solutions.8 For full editorial

Development System Shapes Up With Six Slots

SafeTI design packages forsafety critical medical, indus-trial and energy motor controlapplications from TI, include15 new Hercules RM4x ARMCortex-R4 safety microcon-trollers and TI's complemen-tary TPS65381-Q1 multi-railpower supply. The HerculesRM4x microcontroller andPMIC safety chipset maximisefailure detection and mitiga-tion while minimising soft-ware overhead.The microcontrollers and

PMIC adhere to the SafeTI-61508 design package, help-ing customers more easilyachieve IEC 61508 certifica-tion and accelerate time tomarket with safety-criticalproducts.The addition of these Her-

cules RM4x safety microcon-

trollers expand the Herculesmicrocontroller product line,offering 35 configurationsfrom which customers canchoose to meet application-specific needs. The new Her-cules RM46x floating-pointsafety microcontrollers pro-vide additional memory andperformance configurationswith expanded motor controlcapabilities and pin-compati-bility with Hercules RM48xsafety microcontrollers, intro-duced last year. RM42x safety microcon-

trollers provide a smallerpackage, lower cost, entry-line solution with integratedmotor control interfaces whilealso meeting safety stan-dards. The compatible PMICcombines multiple powersupplies and safety featuressuch as voltage monitoring ina single device to reduce de-sign time and board space.8 For full editorial

Design PackagesSuit The SafetyCritical

www.electronicspecifier.com

DESIGN & EMBEDDED

Atollic has incorporated dualcore development and de-bugging support forFreescale's Vybrid controllersolutions in its latest TrueStu-dio release. IncorporatingArm Cortex-M4 Cortex-A5cores in a single Vybrid con-troller solutions device, TrueS-tudio v3.2 can debug bothcores at the same time usinga single IDE GUI instance,greatly simplifying the task ofdebugging a multicore appli-cation for embedded devel-opers using this new device.With its heterogeneous ar-

chitecture, one of the keystrengths of the Vybrid con-troller solutions device is itsability to partition tasks basedon their characteristics. For

tasks that need predictable in-terrupt management, for ex-ample, a typical need for realtime applications, the Vybridplatform has the Arm Cortex-M4 core with a Nested VectorInterrupt Controller while al-lowing graphical applicationsand connectivity stacks to berun on the ARM Cortex-A5applications processor.“We are pleased Atollic

TrueStudio now supports ournew family of Vybrid dualcore devices,” says FreescaleVP Geoff Lees. “Not only isthis an outstanding C/C++IDE for professional embed-ded development, but nowour customers can now get ahighly productive dual-coredebugging environmentwhich is increasingly critical tothe development of advancedembedded systems.”8 For full editorial

True Dual CoreDebugging ForVybrid Controller

Lattice is promoting its iCE-blink40 evaluation kits for$19. The iCE40, 40nm nonvolatile processed mobileF-PGA family, is optimised forconsumer and mobile applica-tions requiring low power, lowcost and small footprint PLDs.With two new iCEblink

evaluation kits, engineers caneasily evaluate andadopt non-volatileiCE40tech-nology.The iCE-blink40-HX highperformance kit comeswith an iCE40HX1K-VQ100device and 72 user I/Os. TheiCEblink40-LP low power kitcomes with an iCE40LP1K-QN84 device and 67 userI/Os. Both provide 1280 logiclook up tables and 64Kbits ofon-chip memory. The USB powered iCE-

blink40 evaluation kits in-clude 1Mbit of SPI Flashmemory, capacitive touchbuttons, LEDs and access toall user I/Os. The free iCE-cube2 development tool con-trols programming, accessesvirtual I/O functions and runsthe included demos.Designers of handheld,

battery based consumerproducts have long awaited aprogrammable logic solutionthat delivers design flexibilityand fast time to market ben-efits coupled with features

that address theirpower, logic ca-

pacity, costandsmall

form factorrequirements.

This solution isnow provided by Lat-

tice's ultra-low power iCE40mobileFPGA devices. Utilizingthe mobileFPGA platform,mobile designers can quicklybring new features and cus-tom functionality to market.8 For full editorial

Evaluation Kits atPromotionalPrices...

14 | october 2012 | electronicspecifierproduct

Broadcom is first up to inte-grate Community WiFi soft-ware on all DOCSIS 3.0 cablemodem and gateway plat-forms. Community Wi-Fi trans-forms residential WiFi modemsand gateways into hot spots,giving cable subscribers quickWiFi connections on the go.With Broadcom's new cablemodem platform, operatorshave networks of hot spotswithout having to deploy newequipment.“Broadcom's technology pro-

vided us with an essentialbuilding block in our approachto supply customers with WiFi

beyond their homes,” saysZiggo CTO Paul Hendriks.“We are currently running apilot to gain experience withlarger groups of customers in arealistic urban setting.”Broadcom VP Jay Kirchoff

adds, “This technology en-ables cable operators toquickly expand their serviceoffering to include wirelesshot spots, allowing sub-scribers to remotely accessthe services previously onlyavailable inside their homes.We see this strengthening op-erator's competitiveness.”8 For full editorial

Community Wi-Fi Software CreatesCommunity-Wide Hot Spots

LDRArules from LDRA is a pro-gramming rule checker thatbrings together rules from abroad spectrum of program-ming standards. This stand-alone product enables devel-opment teams to improvesoftware quality by selectingand adhering to relevant pro-gramming standards.Companies can easily con-

figure LDRArules for a specificprogramming standard orchoose to enforce in-houseprogramming templates andimprove their overall softwaredevelopment methodology. For nearly 40 years, LDRA

has developed and driven themarket for software that auto-mates code analysis and soft-ware testing for safety, missionand security critical markets.Because programming errorsare responsible for more than70% of software defects, LDRAhas actively worked on a num-ber of standards bodies andorganizations to develop pro-

gramming standards thatachieve early error identifica-tion and correction. As a result, LDRA offers con-

formance for more than adozen programming stan-dards, including MISRA-C:1998, MISRA-C:2004,MISRA AC, MISRA C++:2008,CERT C, CERT J, CWE, HIS, JPL,JSF++ AV, High IntegrityC++, SPARK Ada subset andthe Ravenscar Profile. The pro-gramming standards provideprogramming rules across theprimary languages used inembedded design: C, C++,Ada and Java. Developers can choose rules

for a specific industry standardor they can select a combina-tion of rules from a variety ofstandards, creating customisedtemplates tailored for theircompany and projects.LDRArules documents whichrules have been selected, en-suring complete transparencyof what programming ruleshave been implemented. 8 For full editorial

Abiding By Rules...

www.electronicspecifier.com16 | october 2012 | electronicspecifierproduct

WIRELESS & PORTABLES

Linear’s LTC6431-1515.5dB gain block achieveshigh dynamic range in a 50Ωenvironment of 20MHz~1GHz and beyond. It is SiGeprocessed and available intwo performance grades.At 240MHz, the A-grade

OIP3 is typically 47dBm andis fully tested and guaranteedto be a minimum of 44dBm.Noise Figure is 3.33dB, whichcorresponds to an input re-ferred amplifier noise of1nV/√Hz. Power consumptionis <450mW. This combina-tion of low noise and low dis-tortion provides the wide dy-namic range needed for highperformance intermediatefrequency communicationsand CATV applications.LTC6431-15 is easy to

use, deemed unconditionally

stable and the input andoutput are internallymatched to 50Ω: all that areneeded externally are dcblocking capacitors and anRF bias choke. The gainblock provides >2V linearoutput swing operating on asingle 5V supply. P1dB istypically 20.6dBm and lin-earity is maintained to17dBm output power.“LTC6431-15 is Linear

Technology’s first RF stylegain block and unique inachieving GaAs level per-formance using a SiGeprocess,” says Linear VP ErikSoule. “The result is outstand-ing ac performance, excellentrepeatability and stability overtemperature, supply voltage,frequency and output power.8 For full editorial

Gain Block Amplifier HotOn GaAs Performance

TI’s end to end Miracastsystem comprises sourceand display (sink) solutionsthat enable consumers tostream media, games, pho-tos and other digital contentfrom mobile devices tolarger screens.Based on the Omap plat-

form, DaVinci video proces-sors and WiLink connectivity,Miracast solutions delivervideo quality and exceptionallow latency over a secure Wi-Fi connection. Miracast solu-tions have shown compatibil-ity with the test bed requiredfor Miracast certification tointer-operate with WiFi Certi-fied Miracast devices.Optimised end to end, the

Miracast system uses proces-sor offload capabilities and

built-in accelerators as well asdedicated rate adaption andpower saving algorithms onthe WiLink solutions. Addition-ally, TI can help customersachieve Miracast certificationand get source and displayproducts to market quickly.“With the increasing de-

pendence on mobile devicesfor storage and entertain-ment,” says TI Director RamMachness, “consumers needan easy way to wirelesslyshare their videos, photos,games and other digital con-tent on a larger screen. TI'sMiracast source and displaysolutions deliver today's in-de-mand features, with the scala-bility to support tomorrow'smore advanced use cases.”8 For full editorial

Miracast Delivers WiFi EnabledSecure Digital Content

Qualcomm’sMDM9215Gobi 4G/LTE modem hasbeen implemented in the Soft-Bank 102Z mobile broadbandrouter for Japan. It is designedby Chinese telecommunica-tions provider ZTE and repre-sents the second generationof Gobi powered 4G/LTEproducts from SoftBank Mo-bile and the first to featureMDM9x15 chipsets built onthe 28nm fabrication process.“Fast, reliable wireless

connectivity has becomemore important than ever intoday’s mobile environ-ment,” says Qualcomm Sen-ior VP Alex Katouzian. “Gobiwireless modems are en-abling smaller, more efficientproducts and devices thatcan quickly and seamlesslyconnect across 3G and4G/LTE networks.”The MDM9x15 chipset, part

of Qualcomm’s Gobi modemrange, provides many bene-fits to device manufacturesand, in addition to the Soft-Bank 102Z, is being designedinto more than 90 products

from more than 30 differentOEMs worldwide. Qual-comm’s design and optimisa-tion in the MDM9x15 chipsetenabled ZTE to launch theproduct with SoftBank Mobilejust two months after Qual-comm delivered the commer-cial sample chipset.ZTE VP Di Ning adds, “In

addition to the SoftBank102Z, we are excited to becollaborating with Qual-comm to develop manyother important LTE dataproducts for leading car-riers worldwide.”The MDM9x15 chipset,

compared to previous gener-ation LTE solutions, uses 30%less power and enables prod-uct designs with 30% lessPCB area, allowing smallerand thinner form factorswhile its multimode capabilityenables seamless connectivitybetween LTE TDD and DC-HSDPA networks so devicescan connect locally or glob-ally on the fastest available3G or 4G/LTE network.8 For full editorial

LTE Chipsets Enable HighSpeed Wireless Connectivity

Agilent has signed a memo-randum of understanding withCATR, the China Academy ofTelecommunication Research.Both have agreed to work to-gether on TD-LTE MIMO overthe air test research.The companies will focus

collaboration on MIMO OTAstandardisation using an in-novative TD-LTE MIMO OTAtwo stage test method, takingadvantage of the strength andexpertise of Agilent and CATR.Agilent boasts in-depthknowledge and experience inwireless test solutions, MIMOOTA test solutions and MIMOOTA performance simulation.

CATR has long established ex-pertise in OTA test standardsand OTA certification test.Researchers from both or-

ganisations plan to develop atwo stage MIMO OTA testsystem in CATR's OTA laband perform the measure-ments using the two-stagetest method based on Agilentinstruments. CATR will pro-vide support and access totheir test chamber resourcesand expertise, providing Agi-lent researchers in the Beijingresearch lab an opportunityto develop the OTA test tech-niques and methods.8 For full editorial

Agilent Collaborate s WithCATR On TD-LTE MIMO

www.electronicspecifier.com18 | october 2012 | electronicspecifierproduct

WIRELESS & PORTABLES

Broadcom’s BCM51030 Ver-saLine digital pre-distortion de-livering wide bandwidth sup-port for wireless base stationsand emerging HetNet radioapplications. The new solutionprovides full functionality of adigital front end platform on asingle chip with up to x10wider bandwidth support toaddress fragmented spectrum.BCM51030 utilises Broad-

com's VersaLine digital pre-dis-tortion to adapt in real time toany combination of wirelessprotocols, including 2G, 3Gand 4G combinations, poweramplifiers and frequencybands. This enables radio ac-cess network OEMs to quicklyaddress diverging spectrum al-locations and protocol combi-nations demanded by opera-tors worldwide whilesupporting the widest band-width and highest power am-plifier efficiency for macro cell

wireless base stations in the in-dustry, saving power consump-tion by up to 80%.Speedily adopting new pro-

tocols and PA technology canshave months to years off de-velopment time compared tocustom DFE implementationsrequiring extensive optimisa-tions to DPD algorithms.Analysts predict an average

of six connected devices perperson by 2016, resulting inan exponential growth in wire-less traffic that continues tochallenge current networkswhile spectrum, an already fi-nite and regulated resource,will become even more lim-ited. Broadcom's BCM51030devices improve the efficiencyof existing macro-cell infra-structure and promote the re-use of spectrum in non-adja-cent cells through small cells,remote radio heads and activeantenna systems while deliver-ing the wider bandwidth re-quired to support a frag-mented spectrum.8 For full editorial

Universal DigitalFront End SuitsWireless Base

Exploding IP traffic rates andthe proliferation of smarter,bandwidth hungry consumerdevices are dramatically in-creasing demands on theworld's networks. To help ad-dress these challenges, wire-less infrastructure equipmentmanufacturer Dialogic hasselected high performanceprocessing solutions fromFreescale Semiconductor topower a range of sessionbandwidth optimisation prod-ucts designed to boost datathroughput and reducepower requirements for wire-less network operators.Freescale is a key provider

of processing technology forDialogic’s I-Gate 4000 line ofsession bandwidth optimisers.I-Gate solutions are engi-neered to reduce capital andoperating expenditures forwireless carriers by support-ing additional subscribersand services across currentlydeployed networks. The latest

I-Gate SBO products inte-grate Freescale’s QorIQP4080 processor and Star-Core MSC8156 DSP, and fu-ture-generation Dialogic of-ferings are slated toincorporate Freescale’s flag-ship QorIQ T4240 multicoreprocessor.“The power, performance

and integration of Freescale’sprocessing and DSP productsrepresent an excellent fit forour highly advanced I-Gatesolutions,” says Dialogic VP &General Manager YairHevdeli. “We have success-fully worked with Freescalefor several years and devel-oped a great synergy be-tween [its] technologies andour customers’ needs. Thissynergy, combined with thecompany’s unparalleled cus-tomer support, pointedclearly to Freescale as thechoice for Dialogic’s new I-Gate products.”8 For full editorial

Powering Advanced SessionBandwidth Optimisers

Embedded WF111 andWF121 WiFi modules fromBluegiga Technologies areideal for embedded applica-tions requiring small, reliable,long range WiFi connectivity inan easy to integrate surfacemount package. Both modulesutilise Cambridge SiliconRadio's UniFi CSR6031 chipsetwhich has excellent RF per-formance, low power con-sumption and compact size.“Bluegiga is very excited to

expand our product portfolio toinclude our two new WiFimodules,” says Bluegiga Sales& Marketing VP Tom Nord-man. “Bluegiga has leveragedits extensive experience in de-veloping robust, easy to inte-grate Bluetooth modules tocreate what we think will be acompelling alternative to exist-ing WiFi solutions on the mar-ket today.”WF121 is a standalone WiFi

module, providing a fully inte-

grated 2.4GHz 802.11 b/g/nradio and IP stack in a 15.4x26.2mm footprint. It is de-signed for embedded applica-tions requiring simple, low costand low power wireless TCP/IP connectivity with flexible in-terfaces for a wide variety ofperipherals. It also comes withBluegiga WiFi software.WF121 also supports

Bluegiga's BGScript program-ming language enabling de-velopers to embed applicationsdirectly onboard the WF121 inmatter of hours.WF111 is a fully integrated

2.4GHz 802.11 b/g/n mod-ule, providing a low cost, smallWiFi solution for devices run-ning Linux on Arm or x86processors with an SDIO inter-face. It provides the benefits ofa small, optimised wirelessmodule, great performanceand excellent range, in a cost-effective SM package.8 For full editorial

WiFi Modules Are EmbeddedImpulse’sAdam-2000 serieswireless remote I/O sensormodules are a combination ofadvanced input sensors andthe reliable IEEE 802.15.4 Zig-Bee wireless communicationstandard. They provide a flexi-ble and cost-effective distrib-uted sensor monitoring system.Due to the low powered na-

ture of the Adam -2000 series,with sensors only updating atone minute intervals, eachsensor module can be pow-ered by two AA alkaline batter-ies for up to a year. Five mod-ules comprise the range:Modbus/RTU gateway; wire-less router node and three I/Omodules. Sensor input typesinclude temperature, humidityand voltage/current.The Adam-2520Z is a gate-

way module that allows thewireless Adam-2000 networkto communicate with a wiredRS-422/485 network. Utilisingthe Modbus/RTU communica-tion protocol, the Adam-

25020Z can be easily inte-grated into an existing RS-422/485 network.Routers such as the the

2510Z are designed to extendthe coverage of an Adam-2000 network. With IEEE802.15.4 protocol, it can reacha distance of up to 1000m, de-pendant on environment.Devices such as the Adam-

2031Z, 2017Z and 2051Z areused to collect and convert dig-ital and analogue signals fromdevices such as sensors andactuators. Adam -2000 sensormodules can be powered bytwo AA batteries allowing foradded flexibility in deploymentand maintenance.8 For full editorial

Wireless Remote I/O Sensor ModulesDeliver Cost-Effective Monitoring

Circuit Note CN-0271

Engineered and Tested.Ready to Integrate.

For more information and/or support, visit www.analog.com/CN0271

Devices Connected/Referenced

AD8495 Full K-Type Range 0°C to 50°C Thermocouple Amplifier with Cold Junction Compensation

AD8476 Low Power, Unity-Gain Fully Differential Amplifier and ADC Driver

AD7790 16-Bit, Single-Channel, Ultralow Power, Sigma-Delta ADC

ADR441 Ultralow Noise, 2.5 V, LDO, XFET Voltage Reference with Current Sink and Source

Circuits from the Lab™ circuits from Analog Devices have been designed and built by Analog Devices engineers. Standard engineering practices have been employed in the design and construction of each circuit, and their function and performance have been tested and verified in a lab environment at room temperature. However, you are solely responsible for testing the circuit and determining its suitability and applicability for your use and application. Accordingly, in no event shall Analog Devices be liable for direct, indirect, special, incidental, consequential or punitive damages due to any cause whatsoever connected to the use of any Circuits from the Lab circuits. (Continued on last circuit note page) www.analog.com

K-Type Thermocouple Measurement System with Integrated Cold Junction Compensation

EVALUATION AND DESIGN SUPPORT Circuit Evaluation Boards

CN-0271 Circuit Evaluation Board (EVAL-CN0271-SDPZ)

System Demonstration Platform, SDP-B (EVAL-SDP-CB1Z)

Design and Integration Files

Schematics, Layout Files, Bill of Materials (zip file)

CIRCUIT FUNCTION AND BENEFITSThe circuit shown in Figure 1 is a complete thermocouple signal conditioning circuit with cold junction compensation followed by a 16-bit sigma-delta (∑-∆) analog-to-digital converter (ADC). The AD8495 thermocouple amplifier provides a simple, low cost solution for measuring K type thermocouple temperatures, including cold junction compensation.

A fixed gain instrumentation amplifier in the AD8495 amplifies the small thermocouple voltage to provide a 5 mV/°C output. The high common-mode rejection of the amplifier blocks common-mode noise that the long thermocouple leads can pick up. For additional protection, the high impedance inputs of the amplifier make it easy to add extra filtering.

The AD8476 differential amplifier provides the correct signal levels and common-mode voltage to drive the AD7790 16-bit, ∑-∆ ADC.

The circuit provides a compact low cost solution for thermocouple signal conditioning and high resolution analog-to-digital conversion.

CIRCUIT DESCRIPTIONThe thermocouple is a simple, widely used component for measuring temperature. It consists of a junction of two dissimilar metals.

These metals are connected at one end to form the measurement junction, also called the hot junction. The other end of the thermocouple is connected to the metal lines that lead to the measurement electronics. This connection forms a second junction: the reference junction, also called the cold junction. To derive the temperature at the measurement junction (TMJ), the user must know the differential voltage created by the thermocouple. The user must also know the error voltage generated by the temperature at the reference junction (TRJ).

Compensating for the reference junction error voltage is called cold junction compensation. The electronics must compensate for any changes in temperature at the reference (cold) junction so that the output voltage is an accurate representation of the hot junction measurement.

The circuit uses the AD8495 thermocouple amplifier on a single 5 V supply. The output voltage of the AD8495 is calibrated for 5 mV/°C. On a single 5 V supply, the output is linear between approximately 75 mV and 4.75 V, corresponding to a temperature range of 15°C to 950°C. The output of the AD8495 drives the noninverting input of the AD8476 unity-gain differential amplifier, which converts the single-ended input to differential outputs for driving the AD7790 16-bit, ∑-∆ ADC.

A low-pass differential and common-mode filter before the input of the AD8495 prevents RF signals, which, if allowed to reach the AD8495, can be rectified and appear as temperature fluctuations. The two 100 Ω resistors and the 1 μF capacitor form a differential filter with a cutoff frequency of 800 Hz. The two 0.01 μF capacitors form common-mode filters with a cutoff frequency of 160 kHz. A similar filter is used at the output of the AD8476 differential amplifier before the signal is applied to the AD7790 ADC.

Figure 1. K-Type Thermocouple Measurement System with Integrated Cold Junction Compensation (Simplified Schematic: All Connections Not Shown)

Circuit Note CN-0271

The noise performance of the system is also important to the accuracy of the circuit. Figure 3 shows a histogram of 1,000 measurement samples. This data was taken with the CN-0271 evaluation board connected to the EVAL-SDP-CB1Z System Demonstration Platform (SDP-B) evaluation board.

Details of the setup are described in the Circuit Evaluation and Test section.

The measured peak-to-peak noise is approximately 6 LSBs (1 LSB = 4.9 V ÷ 65536 = 74.8 μV), corresponding to 0.449 mV p-p and 13.4 bits of noise free resolution.

This shows that the converter does not decrease the noise free resolution because the measured resolution of a fixed thermocouple input voltage results in approximately the same number of noise free bits as predicted by the theoretical output noise of the AD8495.

A complete design support package for this circuit note can be found at www.analog.com/CN0271-DesignSupport (zip file).

COMMON VARIATIONSTo measure negative temperatures, apply a voltage at the reference pin to offset the output voltage at 0°C. The output voltage of the AD8495 is

VOUT = (TMJ × 5 mV/°C) + VREF

The complete K type thermocouple range of −200°C to +1250°C can be measured by modifying the circuit to run on dual supplies. When operating the AD8495 on a single supply, measurement of temperatures less than ambient become nonlinear because the output starts to saturate close to the supply rail.

To maintain accuracy at lower temperatures, use dual supplies or level-shift the output by applying the appropriate offset voltage to the reference pin.

The AD8494 is calibrated for J type thermocouples. Both the AD8494 and AD8495 are optimized for reference junctions between 0°C and 50°C.

The AD8496 (J type) and AD8497 (K type) are optimized for reference junctions between 25°C and 100°C.

The circuit is proven to work with good stability and accuracy.

The AD8495 inputs are protected from input voltage excursions up to 25 V from the opposite supply rail. For example, in this circuit, with a 5 V positive supply rail and the negative supply rail tied to GND, the part can safely withstand voltages at the inputs from −20 V to +25 V. Voltages at the reference and sense pins should not go beyond 0.3 V of the supply rails. This feature is of particular importance in applications with power supply sequencing issues that can cause the signal source to be active before the supplies to the amplifier are applied.

The theoretical resolution of the system can be calculated from the bandwidth, voltage noise density, and gain of the AD8495. The peak-to-peak (noise free code) resolution in bits is

The AD8476 is a very low power, fully differential precision amplifier with integrated thin film, laser trimmed 10 kΩ gain resistors for unity gain. It is an ideal choice for this application because it presents a relatively high impedance load to the AD8495.

The AD7790 is a low power, complete analog front end for low frequency measurement applications. It contains a low noise, 16-bit, ∑-∆ ADC with one differential input that can be buffered or unbuffered.

Test ResultsAn important measure of the performance of the circuit is the amount of linearity error. The AD8495 output is accurate to within 2°C from −25°C to +400°C. To achieve even greater accuracy when operating at or outside of this range, a linearity correction algorithm must be implemented in software. The CN-0271 evaluation software uses NIST thermoelectric voltage lookup tables to achieve an output error within 1°C from 15°C to 950°C.

Figure 2 compares the performance of the AD8495 with the CN-0271 system, and the result of applying the linearization correction to the ADC output. For details on how the algorithm was implemented in the software, see the AN-1087 Application Note, Thermocouple Linearization When Using the AD8494/ AD8495/AD8496/AD8497.

Figure 2. Output Error of AD8495, Total CN-0271 Circuit Error, and Total CN-0271 Circuit Error with Thermocouple Nonlinearity Correction

Figure 3. Histogram of Codes for 1,000 Samples at 120 Hz

Circuit Note CN-0271

Circuits from the Lab circuits are intended only for use with Analog Devices products and are the intellectual property of Analog Devices or its licensors. While you may use the Circuits from the Lab circuits in the design of your product, no other license is granted by implication or otherwise under any patents or other intellectual property by application or use of the Circuits from the Lab circuits. Information furnished by Analog Devices is believed to be accurate and reliable. However, Circuits from the Lab circuits are supplied “as is” and without warranties of any kind, express, implied, or statutory including, but not limited to, any implied warranty of merchantability, noninfringement or fitness for a particular purpose and no responsibility is assumed by Analog Devices for their use, nor for any infringements of patents or other rights of third parties that may result from their use. Analog Devices reserves the right to change any Circuits from the Lab circuits at any time without notice but is under no obligation to do so.

©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. www.analog.com

CIRCUIT EVALUATION AND TESTThis circuit uses the EVAL-CN0271-SDPZ circuit board and the System Demonstration Platform (SDP-B) controller board (EVAL-SDP-CB1Z). The two boards have 120-pin mating connectors, allowing for the quick setup and evaluation of the performance of the circuit.

The EVAL-CN0271-SDPZ contains the circuit to be evaluated, as described in this note, and the SDP-B controller board is used with the CN-0271 evaluation software to capture the data from the EVAL-CN0271-SDPZ circuit board.

Equipment Needed

The following equipment is needed:

Windows® 7 (32-bit)

EVAL-CN0271-SDPZ circuit evaluation board

EVAL-SDP-CB1Z) or the SDP-S controller board (EVAL-SDP-CS1Z)

CN-0271 SDP evaluation software

Getting Started

Load the evaluation software by placing the CN-0271 evaluation software CD in the CD drive of the PC. Using My Computer, locate the drive that contains the evaluation software.

Functional Block Diagram

See Figure 1 of this circuit note for the circuit block diagram and the EVAL-CN0271-SDPZ-SCH-RevA.pdf file for the circuit schematics. This file is contained in the CN-0271 Design Support Package (zip file).

Setup

Connect the 120-pin connector on the EVAL-CN0271-SDPZ circuit board to the CON A connector on the SDP-B controller board (EVAL-SDP-CB1Z). Use nylon hardware to firmly secure the two boards, using the holes provided at the ends of the 120-pin connectors.

With power to the supply off, connect the EVAL-CFTL-6V-PWRZ plug to the barrel connector designated by J5 on the board. If this is unavailable, connect the +6V and GND pins to the provided two pin screw of J4 on the board. Also, connect the USB cable supplied with the SDP-B board to the USB port on the PC. Then, connect a K type thermocouple connector to J1 on the board and the other end to the test equipment.

Test

Launch the evaluation software and connect the USB cable from the PC to the mini-USB connector on the SDP-B board. Once USB communications are established, the SDP-B board can now be used to send, receive, and capture serial data from the EVAL-CN0271-SDPZ board.

Figure 4 shows a screenshot of the CN-0271 SDP-B evaluation software interface, and Figure 5 shows a photo of the EVAL-CN0271-SDPZ evaluation board and the SDP-B board. Information regarding the SDP-B board can be found in the UG-277 user guide.

Figure 5. EVAL-CN0271-SDPZ Evaluation Board Connected to the SDP-B BoardFigure 4. CN-0271 SDP-B Evaluation Software Interface

www.electronicspecifier.com22 | october 2012 | electronicspecifierproduct

WIRELESS & PORTABLES

Expanding its growing portfolioof wireless charging technol-ogy for portable electronics,TI’s bq500211 wireless powertransfer controller allows con-sumers to operate a Qi com-pliant charging pad from anyUSB port or 5V power adapter.Designed for 5V systems, the

transmitter circuit allows thecharging pad to safely engagewith a Wireless Power Consor-tium Qi compliant device, suchas a smartphone or otherportable electronics device, re-ceive packet communicationand efficiently manage thepower transfer. bq500211 alsofeatures TI’s Dynamic PowerLimit to optimise availablepower from a limited source.8 For full editorial

Wireless PowerTransmitter Is 5V,Qi Compliant

SPDT PE42421 RF switchesfrom Peregrine Semicon-ductor come in a miniature,six lead SC-70 package,boasting small size, 2kV ESDperformance on the RFCport, low voltage supportdown to 1.8VDD and 9µApower consumption thisswitch suits battery poweredportable as well as automo-tive telematics applications.The 50Ω reflective ultra-

CMOS PE42421 exhibits ahigh linearity of 50dBm IIP3and features on-chip, lowvoltage CMOS control logic.It can be controlled using ei-ther single pin or comple-mentary control inputs.

Insertion loss is low at0.35dB at 1GHz and 0.5dBat 2GHz, with a high isolationof 30dB at 1GHz and 20dBat 2GHz. Using a nominal+3V supply, a typical input1dB compression point of+33.5dBm can be achieved.“Customers continue to

push for low power and highESD performance in thesmallest package size possi-ble, in order to deliver opti-mal RF performance in theirportable device, and auto-motive telematics designs,”says Peregrine SemiconductorMarketing Director MarkSchrepferman. “The PE42421switch meets these needs,and also makes customers’manufacturing processesmore reliable.”8 For full editorial

SPDT RF SwitchAre Tiny HighPerformers

LPRS’s eRA-Arduino-S900shield or stacked modulesallow Arduino boards to com-municate wirelessly with othereRA module equipped Arduinoboards or PC hosts, using pro-prietary 868~915MHz ISMband easyRadio technology.Host Arduino boards can

now easily send and receiveup to 180Bytes of half-duplexdata/packet, seamlessly deliv-ered to all other hostsin range.There is no need for any com-plicated ‘bit balancing’ or elab-orate coding schemes. Ad-dressing and implementationof wireless networking (point topoint and peer to peer) can behandled by Arduino applica-tion software proving providingflexibility without sacrificingsimplicity of operation.The eRA-Arduino-S900 typi-

cally provides 200m range andconsumes less power than

similar WiFi or Bluetooth de-vices in the overcrowded2.4GHz bands. Frequency,bandwidth, power output, anddata rate can optionally beconfigured to allow multipledevices to communicate freefrom interference from eachother and other RF devices.An incorporated eRA900TRS

wireless module provides sim-ple to use, out of the-box wire-less serial communication as aCOM port. No complex RFprotocol software is required tocreate an instant bidirectionallink. Measuring just 68.5x50x10mm, eRA-Arduino-S900 ispowered by the host Ardui-no’s 5V, consuming 25/35mAin idle/transmit. An integralSMA connector allows for useof an off-board antenna. Txand Rx LEDs confirm commu-nication operation.8 For full editorial

easyRadio Arduino Shield Is Low Cost

Toshiba has expanded itsline-up of small signal,medium power Schottky bar-rier diodes and MOSFETs forwireless power transfer appli-cations. The range covers sin-gle and dual n and p channelMOSFETs as well as SBDs. These miniature devices are

optimised for low power con-sumption in a compact formfactor. Among the new de-vices, the 30V SSM6N55NUMOSFET suits load switchingin a wireless charging trans-mitter circuit. It is reckoned tobe the industry’s highest per-formance dual channel MOS-FET in a UDFN6 packagemeasuring just 2x2x0.75mm. A 4A drain current and a

maximum RDSON down to

46mΩ ensure high efficiencyoperation. The device joins acomprehensive family of MOS-FETs that combine low RDSON

with ultra-compact packaging.Toshiba’s latest single and

dual SBDs are rated for re-verse voltages of 30V andfeature very low forward volt-age ratings down to just0.45V. Ultra-miniature pack-aging options range fromUSC (SOD-323) with dimen-sions of 2.5x1.25x0.9mm toCST2B options measuring1.2x0.8x0.6mm.Applications for the new

MOSFETs and diodes includeload switching, low voltagerectification, bridge circuits andreverse current protection.8 For full editorial

Schottky Barrier Diodes & MOSFETsSuit Wireless Power Transfer

GreenPeak’s GP710 dualprotocol ZigBee communica-tions controller has simultane-ous support for ZigBee RF4CEand ZigBee IP/ZigBee PROprotocols. The GP710 com-munication controller is tar-geted for set-top boxes, gate-ways and Smart Homecontrollers and designed forsupporting simultaneously

ZigBee RF4CE applicationssuch as remote controls, aswell as ZigBee IP or ZigBeePRO Smart Home applicationssuch as security, home careand energy management.Benefits of this dual proto-

col communication chip in-clude simpler product de-sign, reduced materials costand a less complex PCBand antenna that makes itsimpler and faster for devel-opers to integrate ZigBeeinto their set-top box orgateway designs.8 For full editorial

Dual-ProtocolZigBee NetworkSuits Set-Top Box& Gateway

WIRELESS & PORTABLES

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 23

The DE9941 is a credit card sized demonstration platform for a complete Software Defined Radio (SDR) for wireless data applications. It is designedto be small and low-cost with minimal components/values.

The board integrates CML’s market-leading RF devices: · CMX998 Cartesian Loop Transmitter · CMX994 Direct Conversion Receiver · CMX7164 Multi-mode Wireless Data Modem

Features and Benefits: · Demonstration of an SDR Wireless Data Modem · On-board PLL and VCO for 452MHz to 467MHz operation · Only one serial interface (CBUS/SPI) required for control and data transfer · 1W Transmitter Operation · Nominal +3.6V Supply · Small 83mm x 55mm size

SDR Demonstrator for Wireless Data Systems

V isit our website www.cmlmicro.com for further information or

Search for ‘DE9941’ OnlineA CML Microsystems Plc Company

Two new LISA 3G productsjoint he u-blox range. Lisa-U260 supports frequencybands II and V used mainly inthe Americas and Lisa-U270supports bands I and VIIIused mainly in EMEA andmost of Asia. The modemsprovide high speed data andvoice connectivity in diverseM2M applications.“Lisa-U260 and U270 ex-

pand our modem series toallow customers to choose amodule that precisely meetstheir cost/feature require-ments”, says u-blox VP ThomasNigg. “The modules provide alow cost option for UMTS con-nectivity for devices meant tofunction in specific regions andoperator networks.”These modules complement

u-blox’s Lisa-U200/U230 uni-versal UMTS modules whichsupport all six global UMTS

bands, and the Lisa-C200CDMA modem dedicated fordevices operating in the USA.The modems are targeted at

m2m solutions like security sys-tems, fixed wireless terminalsand metering, as well as auto-motive applications such as in-car infotainment, connectednavigation, emergency call,fleet management, and anti-theft systems. Other applica-tions include mobile Internetterminals, tablet computersand personal tracking devices.Lisa’s LCC form factor en-

ables easy manufacturing andquality control, and supportssimple migration from u-blox’sLeo GSM/GPRS modules. Sup-port for A-GPS and its CellLo-cate positioning is embeddedfor advanced telematics includ-ing indoor positioning. Fea-tures include compatibility withquad-band GPRS/Edge, lowpower with an idle mode of1.5mA and an operating tem-perature of –40~+85°C.8 For full editorial

Modules WidenLisa FrequencyBand Coverage

PRS1021 low power, 60GHztransceivers from PerasoTechnologies target emerg-ing mobile applications suchas multi-Gigabit wireless I/Oand HD wireless display.The device is said to resetprevailing perceptions of60GHz technology.Devices are 7x7x0.6mm

with integrated antennas. Tx

power consumption is 310mWat 16.5dBm EIRP and Rx powerconsumption is 270mW.The device, as part of a

complete 60GHz solution, fa-cilitates energy efficiency bet-ter than 300pJ/bit. Thismakes it ideal for high band-width mobile applicationssuch as screen mirroring infull 1080p HD, which usingconventional wireless tech-nology can quickly drain asmartphone battery.8 For full editorial

Fully Integrated60GHz TransceiverIs Smallest

An eight channel version ofLink Microtek’s Azdec mo-bile infrared communicationssystem provides totally se-cure, wire-free, short rangevoice communications for civilor military use.Designed to give personnel

freedom to roam from theirbase positions, the robust sys-tem comprises a compactbase station, a number offixed infrared antennas and achoice of headsets. The eightchannel configuration allowsup to eight completely inde-pendent conversations totake place simultaneously,

with operators either speak-ing to each other or linkinginto a central communica-tions system via the Azdecbase station. Using the optional split

ear facility, an operator caneven listen to different chan-nels on each side of theheadset, which could be aparticularly important featurein an ATC environment. Other suitable applications

for the eight channel systeminclude naval short-rangecommunications and high-security control rooms. 8 For full editorial

IIRR SSyysstteemm SSuussttaaiinnss EEiigghhttCCoonnvveerrssaatt iioonnssSSiimmuullttaanneeoouussllyy

High performance 8bitC8051F39x/7x microcon-trollers from Silicon Labsherald a mixed signal break-through with an integratedtemperature sensor, high ac-curacy and extended temper-ature operation without theneed for calibration.With a mix of integrated

high performance analogueperipherals and a fast 8051CPU in a compact package,these MCUs provide optimalsolutions for optical trans-ceiver modules, sensor inter-faces and brushless dc motorapplications for fans, dryers,vacuum cleaners and remotecontrol toy vehicles.Many consumer and indus-

trial applications require highly

accurate temperature sensorsto adjust for behaviour shiftsover temperature for on-board components like sen-sors, lasers or power sources. C8051F39x/7x's on-chip

temperature sensor provides±2°C accuracy at up 105°Cwithout calibration. Accuracyis said to be five times higherthan competing MCUs, im-proving temperature com-pensation routines and endproduct reliability.C8051F39x/7x MCUs

shape up some 30% smallerthan competing solutions,making them ideal for appli-cations such as optical trans-ceiver modules. High integra-tion eliminates the need forexternal components such astemperature sensor, crystal,differential ADC, voltage ref-erence and two DACs.8 For full editorial

MCUs Shape UpFor OpticalTransceivers

Extending its aerospace anddefence portfolio, ADI’s threenew high performance 16 and14bit transmission DACs fea-ture an extended operatingtemperature range. They comehigh reliability packaged forradar, secure communications,avionics and other defenceelectronics applications.The 14bit dual channel

AD9117, 16bit dual channelAD9122 and 14bit singlechannel AD9739 devices aredesigned for signal synthesis,including pulse modulatedwaveform generation and forsynthesising the modulated

carrier in quadrature digitalarchitectures.In addition to extended

temperature ranges, someaerospace and defence ap-plications require an alter-nate solution to matte tin forlead-frame packages in orderto eliminate the concern withthe whiskering associatedwith the tin plating process.These DACs are available inNiPdAu lead frame or PbBGA packaging, as applica-ble, to avoid the issue ofwhiskering. The NiPdAu leadframe package is assembledwith low halogen/halogen-free RoHS compliant materi-als and the entire lead frameis pre-plated.8 For full editorial

High Speed DACsSuit Aerospace &Defence

www.electronicspecifier.com24 | october 2012 | electronicspecifierproduct

ACTIVE COMPONENTS

First NVM Express enterpriseflash memory controllercomes from IDT completewith native support for PCIeGen 3. The company’s NVMeflash controller family pro-vides a standards based, solidstate drive solution, enablingstorage and server originalequipment manufacturers toovercome latency andthroughput bottlenecks inher-ent to legacy SAS/SATA-based SSD designs.Two versions comprise the

range: the 16 channel 89HF16P04AG3 with PCIe x4 Gen3 and the 32 channel 89HF

32P08AG3 with PCIe x8 Gen3. Both are NVMe compliant.The standard defines an

optimised register interface,command and feature setsfor PCIe SSDs, providing ascalable interface that re-alises the performance po-tential of SSD technology. Iteliminates the need for OEMsto qualify multiple SSD driv-ers, facilitating the wide-spread use of PCIe SSDs andhelping bring to market dra-matic improvements in stor-age latency, throughput,power consumption and cost.8 For full editorial

Flash Controllers ProvideStandard NVMe SSD Solution

Next generation secure micro-controllers from STMicroelec-tronics are for transport, bank-ing and e-ID applications. Thesecure micros utilise the com-pany’s 90nm processing to en-hance security and support forpreferred smartcard standardsin major territories worldwide.The devices are heralded as

currently the only secure MCUsto distinguish between ISO14443 Type A or B contactlessreaders automatically and re-spond using the correct proto-col. This dual protocol flexibilityallows ST to target importantmarkets, enabling convenience

in creating one software appli-cation that can be used witheither standard. Mass transit,e-payment or e-ID cards usingST’s latest chips will also offerextra convenience for users byoperating smoothly with anyinstalled reader.ST23ZR secure microcon-

trollers include dual interfacedevices supporting ISO 14443-A/B contactless protocols aswell as the ISO 7816-3 stan-dard for contact type cards. The chips also support Ca-

lypso and Tmoney e-ticketingin mass transit systems world-wide. ST23ZC devices alsoprovide purely wireless com-munication for contactlessonly applications.8 For full editorial

Secure MCUsTarget Transport& Banking

ACTIVE COMPONENTS

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 25

40GBase-LR4 QSFP+ 40Gtransmitter chipsets fromMaxim provide data centreswith x4 data throughput at lowpower and in little more spacethan conventional single chan-nel alternatives. This four chan-nel chipset comprises a Max3948 dc coupled laser driverand DS4830 optical MCU.Data centres and data com-

munication networks need tosignificantly increase data den-sity while staying within theiralready constrained powerbudgets. Maxim’s QSFP+transmitter addresses the chal-lenges. The four times fasterQSFP+ modules shape up atjust x1.5 larger in area than asingle channel SFP+ solution. The chipset enables 4x10

Gbps QSFP+ modules toconsume less power/channel

than single SFP+ modulesthus the benefits of a lowpower solution that extendssystem life can be reaped, re-ducing operational expenseand conserving valuable en-ergy resources.Max3948 consumes <2W

for four transmission chan-nels, enabling <3.5WQSFP+ module power con-sumption. The dc coupledlaser interface reduces powerconsumption and externalcomponent count.8 For full editorial

Four ChannelTransmitterSlashes PowerConsumption

Semtech’s SMI10022 multi-plexer supports 100Gbpsultra-long haul network ap-plications and features soft-decision forward error correc-tion, improving optical

transmission reach for ultra-long haul and submarine op-tical links. This BiCMOS sili-con germanium proce4ssedand ceramic BGA packageddevice boasts high reliability,high performance and re-duced cost.“DP-QPSK is the industry’s

technology of choice for

100G long haul applica-tions,” says Semtech VP &General Manager SameerVuyyuru. “While early sys-tems were largely based onhard decision FEC, newerdesigns are leveraging theSMI10022’s ability to sup-port the data rates requiredfor soft decision FEC, which

enables increased transmis-sion reach. Leveraging ourproven high speed designarchitecture, we continue tooffer the industry’s mostcomplete high performanceproduct solutions for de-manding 40 and 100Gbpslong haul applications.”8 For full editorial

100Gbps Mux IsUp For TheUltra-Long Haul

verotec1/3p stripnew ad sent

nxtbook to strip in

New radiation hardened opamps from Intersil include thequad precision ISL70417 SEHboasting low noise, low powerconsumption, high precisionand high dc accuracy. The de-vice expands the company’sradiation hardened op ampportfolio beyond similarly per-forming ISL70218SRH andISL70227SRH dual op amps.Applications include sensor

signal processing demandinghigh dc accuracy and ac per-formance. ISL70417SEH inte-grates four high precision am-

plifiers that feature low offsetvoltage, low bias current andlow temperature drift. The device operates up to

40V, supporting most ana-logue and split supply require-ments. It is pin for pin compati-ble with industry standard opamps and available on a DLAapproved 5962-12228 SMD.Wafer by wafer radiation

hardness assurance testing at300krad high dose rate and50krad low dose rate reducescost and time typically requiredfor radiation lot acceptancetesting. By guaranteeing per-formance over high and lowdose rates, most satellite pro-grammes are said to have theassurance that this product willperform in the natural spaceenvironment. ISL70417SEH’s performance

over radiation significantly in-creases incoming signal in-tegrity because of minimalshifts in critical parameters thateffect dc signal accuracy.8 For full editorial

Precision Quad Op Amp Is RadHard For Space

www.electronicspecifier.com26 | october 2012 | electronicspecifierproduct

ACTIVE COMPONENTS

Fujitsu has unleashed its fifthwave of FM3 32bit RISC micro-controllers based on Arm’sCortex-M3 processor core. Intotal, the company is releasing93 new products, which incre-mentally are available in sam-ple quantities from now.Two groups are available.

The basic group includes 72devices such as the MB9B520M Series and MB9BF524MPMC. The low powergroup of 21 devices includesthe MB9A150R Series andMB9AF156RPMC.The FM3 family combines

the Cortex-M3 core with pe-ripheral functions developedfor FR microcontrollers. The ad-dition of 72 products in thebasic and 21 in the low powergroups brings the FM3 familyto a total of 463 products, pro-viding a comprehensive line-up for the global marketplace.The basic group has been

designed to enable simple in-verter control, making productsfrom the group ideal forhousehold appliances, officeautomation equipment, andindustrial equipment. The low power group meets

the demand for low powerconsumption and contains anoptimal range of products forthe low power demands ofconsumer devices, includingbattery powered mobile prod-ucts, digital home appliances,and healthcare products.8 For full editorial

FM3 32bit MCUs In Legion...

Three enhanced mid-range8bit families join Microchip’sfull speed USB 2.0 device PICmicrocontroller portfolio,comprising 15 scalable14~100 pin devices with upto 128KB of Flash.All feature internal clock

sources with the 0.25% clockaccuracy necessary for USBcommunication, saving, saysthe company some $0.15 byeliminating the need for anexternal crystal. Additionally,all three families are eXtremeLow Power compliant, withpower consumption down to35µA/MHz active and 20nAin sleep mode.The 14 and 20 pin PIC16

F145X MCUs shape up asMicrochip’s lowest cost andsmallest form factor USBMCUs to date. They come inpackages down to 4x4mmand feature a wide array ofintegrated peripherals.PIC18F2X/4XK50 devices,

available in 28 and 40/44pin versions, provide a cost-

effective, pin compatible mi-gration option from legacyPIC18 USB MCUs. They fea-ture 1.8~5V operation andintegrate a charge timemeasurement unit for higherperformance cap touch sens-ing as well as measurementin applications such as audiodocks and data loggers.The PIC18F97J94 family is

the first from Microchip to pro-vide integrated LCD control,RTCC with Vbat, and USB on asingle 8bit PIC MCU. Availablein 64, 80 and 100 pin alterna-tives, the nine member familyintegrates a 60x8 LCD con-troller, for a total of 480 seg-ments, eliminating the needfor an external controller inapplications with large seg-mented displays. It also inte-grates a real time clock/calen-dar with battery back-up forend products such as homeautomation/security panels,hand-held scanners and singlephase energy meters.8 For full editorial

Linear’s LTM2883 six chan-nel SPI/Digital or I²C digitalµModule isolator deliverstriple rail regulated power for3.3V and 5V systems. In industrial applications,

ground potentials can varywidely, often exceeding thetolerable range, which caninterrupt communications oreven destroy components.LTM2883 breaks groundloops by electrically separat-ing communications signals,isolating the logic level inter-face on each side of an inter-nal inductive isolation barrierthat withstands a very largecommon-mode voltagerange up to 2500VRMS. LTM2883’s low EMI iso-

lated dc/dc converter powersthe communications interfaceand provides adjustable 5V,+12.5V, and -12.5V supplyoutputs to power data con-verters in data acquisitionsystems. With 2500VRMS ofgalvanic isolation, onboardsecondary power and a com-munications interface operat-

ing at up to 20Mbps, this de-vice needs no external com-ponents and provides a sim-ple µModule solution for iso-lated data communications.LTM2883 is available in two

communications interface ver-sions. LTM2883-I is I²C compli-ant up to 400kHz with bidirec-tional serial data plus clockand three additional isolatedCMOS logic signals that oper-ate at up to 20Mbps. LTM2883-S is SPI compliant andprovides six CMOS digital iso-lator communication channels.All operate at up to 20Mbpsand include three forward andthree reverse signals.8 For full editorial

µModule Isolator Comes In Six ChannelSPI/Digital or I2C digital Versions

ADI’s integrated triple differ-ential receiver and adjustablecable equaliser boasts the in-dustry's highest equalisedbandwidth at 300m and thelowest power consumption.AD8122 is designed for use inhigh resolution analoguevideo distribution systems,providing 60MHz of equalisedbandwidth, with 16mVrmsnoise and a short settling timeof 70ns to 1% at the maxi-

mum cable length of 300m.High speed and fast settling

enable UXGA and 1080pvideo to be transmitted overlong distances, maintainingimage sharpness and clarity,says ADI. This high perform-ance is achieved while con-suming only 0.93W, allowingthe AD8122 to draw 13% lesspower than competitors. Applications range from

keyboard video mouse to digi-tal signage and professionalvideo projection/distribution.8 For full editorial

Cable EqualiserHas 300m Reach

USB MCU Portfolio EnhancedUSB MCU Portfolio Enhanced

ACTIVE COMPONENTS

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 27

Kilopass’s new embeddedVertical Cross-point MemoryNVM IP bit cell is said toquadruple the density of cur-rent anti-fuse NVM IP bitcells, enabling data/programstorage where embeddednon-volatile memory is cost-prohibitive or unavailable atcapacities of 4~32Mb.eNVM can store permanent

data or software on a stan-dard chip processed via in-dustry standard CMOS logicmanufacturing. The integra-tion of eNVM helps to reducecost, footprint and power ofthe chip. However, until now,says the company, eNVM hasbeen limited to 4Mb upperlimit capacity and limitederase cycles. With the VCMbit cell technology, Kilopasssays it will dramatically scalethis limit to 32Mb with capa-bility to scale beyond, thusproviding higher endurance. “The VCM bit cell is an en-

tirely new memory bit cell,”says Kilopass TechnologyCTO Harry Luan, “giving usan unprecedented memorydensity in standard logicprocesses from 180nm to theleading edge 20nm and be-yond. Our R&D team fabri-cated the patent pending

VCM bit cell technology,which reduces the siliconarea of the bit cell four fold,while contributing to im-proved performance, reduceddynamic power requirements,and greater endurance. De-veloped after more than fouryears from the inception ofthe concept in 2008 totoday’s announcement, thenew VCM bit cell will enableNVM IP to replace SerialFlash/EEPROM in applicationsthat require execute-in-placeand that must harvest poweror run for extended periodsbetween battery charges.” The VCM bit cell technology

differs from that of the currentKilopass NVM IP which re-quires a planar lateral selec-tion transistor to form memorybits. VCM bit cell technologyuses one single P-MOS tran-sistor to store and control thememory content. This com-paction method reduces thefootprint of the single bit cellfrom about 75 F2 for Kilo-pass’s current XPM memory to12 F2 for VCM memory,where each F describes amanufacturable feature. By comparison, a typical

embedded flash memory hasan area of about 50 F2, and

the state of the art NANDflash bit cell with a fully cus-tomised memory processtechnology and extra cost canonly achieve 6F2, about halfof the area of the VCM bitcell. The VCM bit cell is thedensest eNVM that exists instandard logic process. VCM bit cell technology

adds a simple processingstep/mask that needs no newmaterials, equipment, or addi-tional thermal cycles. An addi-tional relatively coarse grademask is used, which is inex-pensive and easy to manufac-ture. Indeed, the VCM bit cellmemory technology has beendesigned into a 110nm ana-logue/mixed signal process inthree different test shuttleswith successful results. VCMbit cell technology is currentlyready to be integrated into theupcoming Numera product inearly 2013. “We are excited about the

potential of the VCM memorybit cell,” comments KilopassVP Linh Hong. “VCM bit celltechnology is a quantum stepforward in the developmentof anti-fuse NVM IP in stan-dard logic process. We be-lieve it’s the next natural stepto deliver the relentless cost,power, performance and in-tegration improvements theindustry demands.”8 For full editorial

Embedding Non-Volatile Data inSoCs Quadruples Memory Capacity

hammond1/3p strip

nxtbook to strip inrepeat ESP sept p31

Delivering up to 150mA con-stant, AL5812 60V linear LEDdrivers from Diodes Incorpo-rated enable simplified circuitsolutions for accurately con-trolling 1/2W LEDs in low cur-rent illumination and signage.Small footprint, thermally

enhanced SM packaged, thisdriver meets power handlingrequirements over wide sup-ply voltage and ambienttemperature ranges.LED current is set via a high

value resistor on the driver’slow voltage, 0.5VRSET pin, en-abling the specification of alower cost, smaller footprintresistor to reduce total systemcost. A standard low valuedecoupling capacitor is theonly other external compo-nent required, with the drivermaintaining LED current ac-curacy to within 3%.8 For full editorial

Compact LinearLED Drives LowCurrent Lighting

www.electronicspecifier.com28 | october 2012 | electronicspecifierproduct

POWER

Powersolve’s TEP160WIRSeries high performancedc/dc converter modulesoutput up to 182W. EN50155approval allows the convert-ers to be used in railway ap-plications with an ultra-wide4:1 input voltage range up to160Vdc. Efficiency is up to91% and adjustable outputvoltages make the new con-verters suitable for a widerange of applications.Fifteen models comprise the

range with output rangingfrom 12~48Vdc. Versions canbe PCB, chassis or DIN railmounted with adaptor plate,making them ideal for indus-

trial environments. Connec-tion is by screw terminals forchassis and DIN Rail versions.Housed in a shielded metal

case with an aluminium base-plate, the converters suit oper-ation over –40~+75°C withan optional heatsink. Manufactured by Traco,

TEP160WIR converters meetEN 55022 Class A/B EMI re-quirements without externalcomponents. They featureinput under-voltage lockout,reverse input and over tem-perature protection as well asthermal shutdown and re-mote on/off.8 For full editorial

All Emerson configurableac/dc power supplies featuremedical safety approvals andare now compliant with thethird edition of the ANSI/AAMIES60601-1:2005 / IEC60601-1 medical safety stan-dard. This allows designers ofequipment for medical appli-cations to continue to specifyand build-in these highly flexi-ble power supplies, secure inthe knowledge that they aretaking an uncompromised, fu-ture-proof route.All Emerson configurable

ac/dc power supplies thatcomplied with the second edi-tion of the standard now alsofully comply with the require-ments of the third edition, andinclude at least two means ofpatient protection. The im-provements cover factors suchas increased creepage dis-

tances and clearance on mainsconnectors, better insulation ofisolation transformer windingsand reduced capacitance be-tween input and outputs.Emerson produces a diverse

range of medically approvedconfigurable ac/dc powersupplies, with outputs up to4920W. The range includesiVS, µMP and iMP series, all ofwhich provide electronicequipment designers with ahighly flexible means of ac-commodating multiple dcsupply needs. The suppliesare designed as a cost-effec-tive alternative to custompower supplies.Power supplies pre-ap-

proved to the IEC 60601-1 en-able designers of medicalequipment to accelerate com-pliance testing, minimise therisk of unexpected powersafety issues and reduce theirtime to market.8 For full editorial

AC/DC PSUs Up ToMedical Standard

Verotec’s 3U 4HP versionsof the Eplax VeroPower 19insub-rack pluggable ac/dcswitched mode power sup-plies add further capabilityto its KM6 sub-rack andmetal enclosure range. Atonly 4HP (0.8in) wide and astandard 160mm deep,these units are the slimmestavailable from any manu-facturer, leaving the maxi-mum possible space in thesub-rack for active systemboards.The units are available

with power rails that suit therequirements of many em-bedded computing applica-tions. The completeVeroPower range consists ofpluggable PSUs with powerratings of 20~150W.Output power levels of

20, 40 and 50W are avail-able. The 20 and 40W ver-sions have 94~253Vacauto-ranging inputs. The50W has a 115/230Vacswitchable input and themonovolt 20W unit has sin-gle voltage rail outputs of5V/4A, 12~15V/1.4A or24V/0.8A. Three trivolt 40W versions

provide either 5V/4A,+12~15V/0.6A and –12~15V/0.6A, +12~15V/1.4A,+12~15V/0.6A and –12~15V/0.6A or 24V/0.8A,+12~15V/1.4A and –12~15V/0.6A. The monovolt50W unit gives 5V/10A,12V/4.2A ~ 15V/3.3A or24VV/2.1A. All versions use the indus-

try standard H15 connectorwith the pin-out followingthe convention establishedby Vero Electronics when itfirst developed the plug-gable PSU in 1976.8 For full editorial

Sub-Rack Pluggable PowerSupplies Are Super-Slim

AC/DC power supplies fromPower Partners provide upto 150W output from acompact 2x4in footprint,achieving a power densityof 18.75W/in3. PPWA150Bseries is RoHS compliant,meets EN60950-1 and FCCClass B emissions limits andis approved to UL, CSA, andEuropean safety standards.The series features active

power factor correction andoperates from a universal90~64Vac input. Singleoutput voltages range from12~48Vdc. The supplies

come in U channel or openframe styles. This series features

3000Vac input to outputisolation. Comprehensiveprotection circuitry, includ-ing over-voltage and shortcircuit, is inherent in thedesign which also featuresan MTBF >100,000h atfull load.PPWA150B is said to suit

a wide variety of applica-tions including test andmeasurement, communi-cations and peripherals. 8 For full editorial

AC/DC Power Supply IsHigh On Power Density

Converters Suit EN50155Railway Applications

POWER

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 29

TDK-Lambda has extendedits Z+ Series programmabledc power supplies with theaddition of the lower powerZ+200 range. It is CE mark-ed according to the Low Volt-age Directive, with conductedand radiated EMI conformingto EN55022-B, FCC part-15-B, VCCI-B. Safety approvalsinclude UL/EN/IEC61010-1and all models carry a fiveyear warranty.With the same flexibility

and features as the higherpower Z+400 range, these200W units address the needfor high quality benchtopunits for R&D. They also suitATE and OEM rack mountedor integrated applicationssuch as test & measurement,semiconductor burn-in, com-ponent test, laser diode,heater supplies, RF amplifiersand electromagnets.Models in the 200W Z+

Series are available with out-

puts up to 100Vdc and 20A.They operate in constant cur-rent and constant voltagemodes and accept85~265Vac inputs. Higher power systems can

be achieved by connecting upto six identical units in paral-lel with active current sharing.To increase the output volt-age or to provide a bipolaroutput, two units can be con-nected in series.8 For full editorial

ProgrammableSupplies DeliverDC Quality

Vicor’sWestcor MicroPAC PFcorrected ac/dc power systemprovide up to 1300W of con-tinuous power at up to 92% ef-ficiency and 1.53 W/cm3power density in a compact102x44x190mm package.Delivering semi-regulated

outputs of 12, 24, 36 and48Vdc via four factory config-urable isolated outputs, thenew MicroPac supports a widerange of power requirementsand suits distributed powerarchitectures in industrialand automation, Mil-COTS,telecom and renewable en-ergy applications.System designers seeking

the flexibility to partition multi-ple voltage outputs rather thanuse two separate power sup-plies can configure MicroPACswith a combination of fourhigh performance VI ChipBCM high-voltage bus convert-ers, which may be configured

as single outputs, parallel out-puts, or a series output with in-tegrated current sharing. Forapplications requiring higherpower levels, MicroPACs canbe configured in arrays withbox to box current sharing.Energy Star compliant Mi-

croPACs provide advancedeco-mode operation settingsfrom which the individualBCMs are powered on only asneeded, further enhancingpower efficiency over a wideload range. During standby, total power

dissipation is <8W, which is ex-ceptional for a power supplyrated up to 1300W. MicroPACsoperate at full load over –40~+55ºC and are ruggedised forharsh environments.8 For full editorial

AC/DC Power System Delivers1300W Continuous

ADI’sADP1851 wide inputrange, synchronous, step-down dc/dc controller featuresvoltage tracking and synchro-nisation. It expands the com-pany’s configurable controllerseries following the recently in-troduced ADP1853.ADP1851/53 can be config-

ured to work as a voltagemode controller with inputfeed forward or as a currentmode controller, depending onthe application and customerpreference. They are designedfor high efficiency, high cur-rent, fast, transient point ofload applications in a broadrange of communications net-working, industrial, medical,and consumer applications.

ADP1851/53 can be con-nected in parallel for currentdelivery up to 50A, dependingon the external FETs. TheADP1851 features a synchro-nisation input eliminating trou-blesome beat frequencies andreducing system input capaci-tance when multiple deviceswith phase-shifted synchroni-sation are used. 8 For full editorial

DC/DC Switching Controllers ProvideVersatility In High Current Applications

TEN8-WI series dc/dc con-verters from Powersolveoutput 8W from a32x20.3mm, DIP-24 metalpackage. Height off theboard is just 10.2mm. Bymeeting EN50155, theseconverters can be used acrossa wide variety of railway ap-plications.Manufactured by Traco,

these converters have a wide,4:1 input voltage ranges ofeither 9~36, 18~75 or43~160Vdc. Output range is3.3~±15Vdc, operating over–40~+100ºC, with deratingabove 80ºC. Typical efficiencyacross the load range is 86%.

The dc/dc converters fea-ture short circuit protection,remote on/off, input/outputisolation specified to1500Vdc and EMC approvalto EN 55022, class A. Thedevices also meet EN 61373requirements for thermalshock and vibration.TEN8-WI converters are

housed in a five sided,shielded metal case with in-sulated baseplate.8 For full editorial

Converters Output8W From DIP-24Housing

AE-800 Series single output,800W, low profile ac/dcpower supplies from PowerSources Unlimited include12V, 15V, 24V, 30V, 36V, 48Vand 60Vdc versions with effi-ciency up to 93%.Each model features a uni-

versal ac input range of90~264Vac at 47~63Hz,with active power factor cor-rection and programmableoutput voltage and current.

Additional features include:intelligent LED indicators,built-in I²C serial data bus,forced current sharing at par-allel operation, power OKsignal, remote on-off and re-mote sensing. Protection includes OVP,

OLP, OTP and fan failure. Thesupplies are CE, TUV and ULapproved and measure249x127x41mm.8 For full editorial

Universal Input Supplies...

www.electronicspecifier.com30 | october 2012 | electronicspecifierproduct

POWER

AlpsGLMH Series Liqualloypower inductors are ideal formobile devices used for longperiods. Mobile computingdevices such as Ultrabooks,other types of notebook PCand tablets are now essen-tial. A recent requirement ofthese devices, besides lightweight and advanced func-tionality, is the ability to runfor long periods.Enabling mobile equip-

ment to run for a long timeentails lowering the powerconsumption of not only theCPU and the various devicesbut also the dc/dc converter,used to supply power afterconverting voltage. This cre-ates a need for high effi-ciency power inductors,which are used inside dc/dcconverters. However, anissue with power inductorsso far has been power con-version efficiency during lowload CPU operation. Alps has responded by de-

veloping the high efficiencyGLMH. The Liqualloy inductor’s core

material is a magneticamorphous alloy createdthrough joint research be-tween Alps Electric and To-hoku University. It is drawinginterest as a new magnetic

material to use in place ofthe most common core ma-terial, ferrite, and the secondmost common, iron powder.Using Liqualloy as the induc-tor’s core material allowsminimization of power lossduring conversion, therebyenabling high efficiency es-pecially during low load op-eration. GLMH also employs an in-

tegrated coil terminal struc-ture, applying original tech-nology for high precisionforging of thin coil wire.With the coil wire doublingas the terminals, dc resist-ance is reduced by 10~20%compared to conventionaltypes with the same level ofinductance. This structurekeeps dc resistance toler-ance to a narrow ±5% andreduces heat generationduring high load operation,thereby further improving onthe high current compatibil-ity of earlier products. 8 For full editorial

Liqualloy Power Inductor GivesLong Battery Life To MobilesMartek Power’s Powertron

CPCIR series dc/dc convertersfeature 100W maximum out-put power. They are designedto EN 50155 requirementsand will interest customerswho need to power on-boardcomputer applications.As standard, the triple out-

put CPCIR supplies operatefrom 72/110 and 24/36Vdcinputs and provide outputs of–5.1, 3.3 and 12V. They con-form to the standard cPCIprofile and are convection

cooled, operating over –40~+70ºC and up to +85ºC for10min without derating ac-cording to EN50155 Temper-ature Class TX.Key features include high

efficiency, a hold up time of10ms from nominal voltage,input and output protection,thermal protection andinput/output status indication.With a height of 3U, the seriesincorporates a conformalcoated PCB and includes anEMC screened front paneland lower ejector as standard.An optional ventilated IP20enclosure is also available.8 For full editorial

On-Board CompactPCI Power SupplyBuilt To EN 50155

Intelligent Power Vault LithiumIon multi-battery power sys-tems from Accutronics are formedical and industrial appli-cations. This new battery sys-tem can be used to powermedical and industrial deviceswhen high energy density, reli-ability and functionality arecritical requirements. Available in configurations

of 126~1.42kWh, each IPVdraws power from multiple63Wh or 89Wh VR420Lithium-Ion smart batteries inthe IPV's innovative rackingsystem. DC power is avail-

able either as raw batteryvoltage or regulated to suitcustomer requirements. The IPV also provides a

wealth of vital battery data toits host equipment via its USBand serial interfaces, ensur-ing that data such as remain-ing runtime is reported accu-rately and efficiently.8 For full editorial

Intelligent PowerVault Launches...

dSPACE’s new electronicload module emulates motorand generator currents at upto 60V for HIL electric motorsimulation. As a result, me-chanical test benches are nolonger needed to test ECUs.With voltage up to 60 V, themodule is also ideal for usewith higher in-vehicle volt-ages of 42 and 48V or withnumerous electric compo-nents running in parallel.Three phase real currents

are emulated, and energy re-cuperation is also included toboost the energy efficiency ofthe overall system. Typical testapplication areas are electri-cally supported steering,starter and generator sys-tems, and mild hybrid drives.

The electronic load moduleuses the same supply voltageas the device under test andincorporates bi-directionalworking voltage regulators sothat the current that is sunkon one pin can be sourced toanother pin. This means that the effec-

tive power which is simu-lated on the Load pins canbe much higher than thepower consumption of theelectronic load.These modules can be op-

erated in three differentmodes. Current controlmode is typically used formotor applications but notBLDC. Voltage control modeis typically for general pur-pose applications and mixedcurrent and the voltagecontrol mode is for BLDCmotor applications.8 For full editorial

Electronic LoadModule EmulatesUp To 60V

<<<54<+7841;+)4:0

" " ! !

$ 2'/18'1+854<+7841;+)4:0

?%3/;+78'1/35:9</9.')9/;+!4<+7')947477+)9/43?%3/;+78'1/35:9</9.')9/;+!4<+7')947477+)9/43?4:95:9&419'-+:77+39574-7'22'(1+4,342/3'1?4:95:9&419'-+:77+39574-7'22'(1+4,342/3'1?24*+18</9.342/3'14:95:984,&&& & &&&?24*+18</9.342/3'14:95:984,&&& & &&&?&47& #9'3*(>&419'-+?&47& #9'3*(>&419'-+?&+7>./-.+,,/)/+3)>:594 ?&+7>./-.+,,/)/+3)>:594 ?39+11/-+39/3*/)'9478,4754<+78:551>89'9:8?39+11/-+39/3*/)'9478,4754<+78:551>89'9:8?47)+*):77+398.'7/3-,475'7'11+145+7'9/43?47)+*):77+398.'7/3-,475'7'11+145+7'9/43?!4<+7 8/-3'1!4<+7 4-/)?!4<+7 8/-3'1!4<+7 4-/)?"+249+ 3 ,,"+249+#+38+,:3)9/43?"+249+ 3 ,,"+249+#+38+,:3)9/43? ;+714'*4;+7;419'-+4;+79+25+7'9:7+5749+)9/43? ;+714'*4;+7;419'-+4;+79+25+7'9:7+5749+)9/43?:/19/3@8+7/'1*'9'(:8,47574-7'22/3-243/947/3-?:/19/3@8+7/'1*'9'(:8,47574-7'22/3-243/947/3-?:11%#$%&2+*/)'18',+9>'5574;'18?:11%#$%&2+*/)'18',+9>'5574;'18?425')9*/2+38/4384,== 22?425')9*/2+38/4384,== 22?&+7>)425+9/9/;+57/)/3-,47 6:'39/9/+8?&+7>)425+9/9/;+57/)/3-,47 6:'39/9/+8

www.electronicspecifier.com32 | october 2012 | electronicspecifierproduct

TEST & MEASUREMENT

JTAG Technologies has ex-panded its high performanceboundary scan IEEE Std1149.1 controller range. Dat-aBlaster JT 37x7/PXIe supportsthe PXIe/Compact PCI-expressslot format that now featuresin some of the latest ATEbased on the PXI(e) standards.Keeping pace with industry

demands, JTAG has devel-oped the new controller to forhigh speed In-system pro-gramming for flash and serialmemory, as well as CPLDsand complex digital circuits.DataBlaster JT 37x7/PXIeprovides sustained test clockspeeds up to 40MHz viaJTAG’s ETT system and fea-tures an on-board flashimage buffer memory.Supplied with the comple-

mentary QuadPOD system,DataBlaster/PXIe incorporatesfour synchronised TAPs sup-porting multi-TAP test targetsand gang programming four

single TAP targets. QuadPODcan also house the full rangeof JTAG SCIL modules, allow-ing users to deploy custom testinterfaces or the mixed signalDAF measurement module.8 For full editorial

Boundary Scan ControlsPXIe/Compact PCI(e)

Samsung has demonstratedclear reception capabilitiesfor LTE Broadcast servicesusing evolved MultimediaBroadcast Multicast Servicetechnology using Anritsu'sRapid Test Designer andMD8430A to simulate the LTEnetwork environment.eMBMS technology allows

the LTE network infrastructureto be used for the delivery ofbroadcast services such as TV.It enables carriers to adjustcoverage and capacity asneeded, allowing for moreefficient use of network re-sources. Samsung Electronicsand Anritsu have collabo-rated to bring this new tech-nology to market. Anritsu’s RTD delivers a rich

set of test features using itsfast and flexible flowchartinguser interface. The Samsungengineers were able to createthe eMBMS demonstration

using RTD’s graphical scriptdesign to drive the executionof the test simulation on anAnritsu MD8430A LTE sig-nalling tester.Says Anritsu Executive VP

Kenji Tanaka. “Samsung’sdemonstration shows how An-ritsu’s RTD helps LTE devicemakers prove their leadingedge technology in an in-tensely competitive marketwhere reducing the productlaunch cycle time is critical.”8 For full editorial

Samsung Uses Anritsu To DemonstrateLTE Broadcast Capabilities

Pentek’s ultra wide-bandTalon RTS 2709 RF/IF rackmounting recorder using12bit, 3.6GHz A/D convertersand advanced SSD storage. Itcan achieve sustained record-ing rates up to 3.2Gbps andcan be configured as a oneor two channel system. It canrecord sampled data, packedas 8-bit or 16- bit wide con-secutive samples.As a complete recording

system, Talon RTS 2709 isideal for capturing highbandwidth RF/IF signals withfrequencies up to 2.8GHz.The Windows 7 workstationand Core i7 processor resultin a platform that allows theuser to install post-processingand analysis applications di-rectly on the recorder. Signalviewing and analysis toolsare provided as part of theSystemFlow recording soft-ware for monitoring signalsprior to, during and after arecording session.

“These recorders are idealfor capturing wideband sig-nals for communications orradar applications,” explainsPentek VP Rodger Hosking.“Now we can satisfy thegrowing number of customerswho need to digitize andrecord these signals withbandwidths as high as 1.5GHz. Previously, if a verywideband signal needed to becaptured, you had to break upthe signal into smaller bands,each covering an adjacentslice of the spectrum. Now,with the Talon 2709, engi-neers can capture the wholespectrum in a single channelfor the entire bandwidth.”RTS 2709’s ADCs digitise

HF signals at sample rates upto 3.6GHz. It streams digitiseddata to files created on therecorder’s built-in RAID. Filesare time stamped and record-ing parameters and optionalGPS information stored in thenative Windows NTFS format,for immediate use by PCs andapplications without the needfor file conversion.8 For full editorial

Rack MountingRecorder SamplesAt 3.2GHz

EB’s Propsim FS8 radiochannel emulator is for test-ing wireless performance inmobile devices and chipsets.With eight RF channels andthe capability to perform upto 4x4 bi-directional MIMOtesting, this compact MIMOemulator tests 2G, 3G and4G LTE solutions.FS8 is compatible with con-

formance and operator spe-cific test cases. The ability toeasily evaluate true productperformance against opera-tor requirements in the labo-ratory with the EB PropsimFS8 decreases the amount offield testing needed, which

often yields to remarkablesavings in the product devel-opment process.Increased demand for mo-

bile broadband requires net-work operators and productdevelopers to update theirproducts from 2G and 3G to4G LTE using MIMO. MIMO is expected to pro-

vide higher data capacity tothe end user and so thechallenge for these productdevelopers is to make surethat the ultimate MIMO gainis achieved. In MIMO solutions, the

radio channel characteristicsare heavily exploited there-fore requiring sophisticatedradio channel emulation in4G LTE mobile device andchipset development. Propsim FS8 provides accu-

rate and realistic MIMO radiochannel modelling for 4G LTEproduct developers seekingto create mobile devices thattruly meet both operator andconsumer expectations.8 For full editorial

Radio ChannelEmulator Puts 4GLTE To The Test

www.electronicspecifier.com34 | october 2012 | electronicspecifierproduct

TEST & MEASUREMENT

IZT’s frequency hopping mod-ule joins its S1000 signal gen-erator platform, combining 31virtual signal generators in oneplatform for testing radio re-ceivers and for creating com-plex mixed signal RF scenarios.Frequency hopping spread

spectrum is used in militarycommunications, Bluetoothand consumer devices in theunregulated 2.4GHz band.With this method the carrierfrequency is rapidly changedacross a wide range of fre-quency channels. If the hop-ping sequence is chosen prop-erly, frequency hoppingprovides additional security tothe communication and pro-tection against jamming, whichmakes frequency hopping es-pecially suitable for military

communication systems.S1000-FHS is designed to

reduce interference, increasetransmission security and en-hance available bandwidth useefficiency in communicationsand wireless connectivity. Utilis-ing S1000’s full profile func-tionality, the frequency hop-ping module IZT S1000-FHSefficiently generates hoppingnetworks with a hop rate of>2000 hops/s. Content comesfrom an analogue modulationtool or from the user as narrowband I/Q data.One hopper requires one

virtual signal generator andcan hop within a range of120MHz. Two VSGs have a240MHz spread. The overallbandwidth required for fre-quency hopping is much widerthan that required to transmitthe same information usingonly one carrier frequency.8 For full editorial

Frequency HopperJoins Platform OfSignal Generators

Fourteen FieldFox hand heldanalysers from Agilent de-liver benchtop instrument ac-curacy for field test environ-ments. They are designed forharsh conditions and hard toreach locations and coversatellite communications, mi-crowave backhaul, militarycommunications, radar sys-tems and a wide range of ad-ditional applications.FieldFox microwave analy-

sers can be configured ascable and antenna analy-sers, spectrum analysers,vector network analysers, orall-in-one combinationanalysers. Each compact,3kg package is available infour frequencies of 9, 14, 18and 26.5 GHz.To ensure durability in

harsh field environments, thecompletely sealed enclosureis compliant with US Mil-PRF-28800F Class 2 require-ments. To enhance ease ofuse, the instrument has a ver-tical, or “portrait,” orientationand large buttons, allowing

users to easily operate theunit with their thumbs, evenwhile wearing gloves.FieldFox microwave vector

network analysers provide fulltwo port S parameter meas-urements with a remarkablylow trace noise of ±0.004dBand superior dynamic rangeof 94dB at up to 18GHz over–10~+55 °C. QuickCal functionality en-

ables hassle-free calibrationwithout external accessories.With any other instrument,adding devices such asjumper cables to the test portrequires recalibrating with anexternal calibration kit.8 For full editorial

Handhelds Analyse WithBenchtop Accuracy

Test solutions for 802.11acWLAN and low energy Blue-tooth from National Instru-ments combine its graphicalsystem design software andmodular, FPGA based PXI in-strumentation to provide highperformance, user-program-mable test capabilities.These test solutions, along

with other cellular, navigationand wireless connectivity so-lutions, are said to help engi-neers thoroughly test their

devices on a single high-per-formance platform.“Using the software de-

signed vector signal trans-ceiver and the WLAN meas-urement suite,” saysQualcomm Atheros DirectorDoug Johnson, “we improvedour test speeds by more than200 times compared to tradi-tional rack-and-stack instru-ments while also significantlyimproving test coverage.”8 For full editorial

Keithley’s economical 21105.5 digit dual display digitalmultimeter is optimised for avariety of general purposesystem and bench design ap-plications. Compared toleading 5.5 digit DMMs, the2110 boasts superiorthroughput – said to be up toten times faster. It also prom-ises twofold improved dc volt-age accuracy and lower pur-chase price and greaterintegration flexibility.The multimeter features ex-

ternal triggering, built-inreading buffer and an op-tional GPIB interface. Meas-urement capabilities includedc voltage up to 1000V andcurrent up to 10A, ac voltageup to 750V and current up to10A. It also provides two andfour wire resistance up to

100MΩ, temperature, fre-quency over 10Hz~300kHzand period, and capacitancerange measurements of1nf~100µf. A variety ofmathematical functions anddiode and continuity testfunctions are also included. Programmable ADC and

filter settings simplify opti-mising the 2110’s SNR toimprove measurement accu-racy. At the fast 4.5 digitsetting, it takes up to 50,000readings/s.8 For full editorial

DMM Line Built On Economy &Performance

WLAN & BluetoothLow EnergyTesting...

TEST & MEASUREMENT

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 35

Aeroflex’s 3550 digital radiotest system features an industryfirst colour touch screen andenhanced specifications toprovide users with a light-weight, easy to use, and reli-able digital radio test system.Designed for PMR, public

safety and other land mobileradio applications, 3550quickly isolates problems andassesses performance inAM/FM radios, with options forP25, DMR, NXDN and dPMRradio systems.The test system is weighs

3.8kg including battery andoperates continuously for 4.5h.Users can test all aspects of theradio system, including trans-mitter, receiver, cables, and an-tennas, using powerful fea-tures typically found only inbenchtop equipment. 3550 also meets Mil-PRF-

28800A specifications for hu-midity, shock, and vibration,

and operates over 0~+50ºC.“The market has been wait-

ing for a radio test system likethe 3550,” states Aeroflex Di-rector Rob Barden. “Featuringa new colour touch-screen, the3550 is easy to operate, reli-able, and it tests the entireradio system, including cablesand antennas. The 3550 offersa tough, ruggedised packagefor field service, with the fea-tures, accuracy, and RF spec-tral performance required totest today’s radio equipment.”8 For full editorial

DRT Adds Colour Touch

LinkTest Dual E1 is a hand-held, battery operated, E1 testand measurement device from

GL for digital voice and datatesting, jitter and wandermeasurement, and pulse maskcompliance. It can be used formaintaining and trouble-shooting PDH, synchronisation,

and datacom links.“With support for

more software optionsfor E1 services and sub-rate multiplexing,” CEOVijay Kulkarni says, “thisunit provides scalabletest for E1 and datacomtesting. It features alarge, clear screen witha full set of physical layer

tests for E1 balanced and un-balanced circuits includingBERT, VF, round trip delay andsignal level.”The tester is simple to use

and rugged, and deemed per-fect for installing, commission-ing and maintaining digitalnetworks, and managing fixedand mobile networks that areusing E1 and datacom back-haul circuits.8 For full editorial

E1 Tester IsPortable

Viscom’s X8011 PCB fea-tures Haran linkage to theverification station for X8011PCB x-ray inspection systems.Now, analysis results can beverified with ease and un-specified defects can be au-tomatically pinpointed and

re-examined in detail.X8011, developed for as-

sembly inspection, providesmaximum granularity andhighest image quality. TheXMC analysis software allowsfor convenient operation,containing several automaticanalyses such as BGA, QFNand inspection, as well asvoid calculation.8 For full editorial

Inspection Integrates Verification Link

www.electronicspecifier.com36 | october 2012 | electronicspecifierproduct

CABINETS, RACKS & ENCLOSURES

Renowned, says Rittal, morefor enclosure cooling equip-ment in climate control, thecompany also supplies chillersto the industrial market.TopTherm packaged chillersare suitable for water as thecooling medium and are in-tended for internal applica-tions such as wall mounted,roof mounted or floorstandingand modular variants.TopTherm wall mounted

chillers can be installed di-rectly to an enclosure. Cool-ing capacity is up to 4kW, al-though roof mounted andfloorstanding variants areavailable with 6kW coolingoutput. The modular chiller iscapable of removing up to40kW of heat, utilising the TS8 frame so that it can beseamlessly integrated into asuite of enclosures.

Construction of theTopTherm modular chiller al-lows the simple replacementof refrigerant and hydraulicmodules. In the event of fail-ure, modules of the same typecan be exchanged quickly.Those of different capacitiescan be substituted should agreater amount of cooling berequired, effectively making itpossible to upgrade the chillerin situ rather than replace it inits entirety.Packaged chillers from the

Rittal floorstanding range aresuitable for internal or externalapplications and for a coolingmedium of either water or oil.The robust, yet highly adapt-able platform ensures thatthere is a solution from thisrange that can satisfy mostproject specific requirements.8 For full editorial

Ramping UpThe IndustrialChill Factor

RolecmobilCASE handheldenclosures now have new casecombinations and accessories.These robust enclosures cannow be used in even more ap-plications for either cable con-nected or battery poweredequipment such as data collec-tion units, machine controllers,robot programmers and testand measurement devices.The new configurations in-

clude portable models withshoulder straps and bump pro-tection. There are also desktopmodels with a tilt stand whichcan be set at different angles,and display models with swivelbrackets which can be fitted toa desktop, wall or controlpanel. A new holder also al-lows the mobilCASE enclo-sures to be stationed on a poleor bracket when not in use.Construction features a sin-

gle or two piece anodised alu-minium case body, with inter-nal guides rails. Two black diecast aluminium end panels arefitted to the extrusions by self-tapping screws. The cases can be sealed up

to IP 65 protection class.The design incorporates a

round edge section, which isvery easy to hold, and also actsas a battery compartment. AnM16 cable gland can be fittedin place of the battery com-partment, allowing for cableconnection to the host ma-chine. The extended rangenow consists of twelve stan-dard sizes.8 For full editorial

Handheld Enclosures GetNew Combinations

Custom designed enclosuresfrom Cyntech for the Rasp-berry Pi computer are avail-able with a full kit of ca-bles and power supply.“Our aim is to make

life easierfor ourcustomers,”says CyntechMD Dave Mellor,“especially educa-tional users who just wantto get up and running withtheir Raspberry Pi computeras quickly as possible andwith the minimum of fuss.This is why we are offeringthe case with a full comple-ment of cables ensuring theyhave everything they couldpossibly need.”

The compact, low cost caseis tailored to fit the RaspberryPi board and provides open-ings for all connectors. In-

cluded is an exit slot in theside of the case al-

lowing a ribboncable to befitted to theboard’s 40

pin GPIOheader. Another

neat feature is the lightpipe window for viewing theboard’s LED indicators. The case, supplied in dis-

tinctive Raspberry colourand printed with the Rasp-berry Pi logo, provides an at-tractive solution for protect-ing the PCB. 8 For full editorial

Raspberry Enclosure & Cable KitCustom Designed For Raspberry Pi Six inch, energy efficient ac

fans from Orion Fans incor-porate smart thermal controls.OA172 Series temperaturecontrolled smart ac axial fansincorporate a ball bearing de-sign that delivers air-flows of 105~200cfmat significantly re-duced noise levels of37.5~50.8dB.Similar in function

to the company’s dcsmart fans, OA172’ssmart thermal control reducespower consumption by in-creasing or decreasing fanspeed according to the ambi-ent air temperature. This re-sults in up to a 30% energysavings versus similar sized sin-gle speed fans. Additionally,the 6in OA172 ac fan only re-

quires a simple ac input, ratherthan additional power supplyrequirements for a dc fan.“The smart thermal control

included in the fans makesthem the most energy efficientfans available on the market,”says Orion Fan MarketingManager David Luna. “In ad-ditional to its superior perform-

ance, the ball bearingdesign provides signifi-cant noise reductionwithout affecting thecooling power of thefan, making it moredesirable for a numberof applications.”

Measuring 172x51mm,these axial fans feature an im-pedance and thermally pro-tected motor, as well as an alu-minium alloy frame with aUL94V-0 plastic impeller. Thefans come with AWG 18,UL1015 leads.8 For full editorial

Smart AC AxialFans Save 30% Energy

PASSIVE COMPONENTS

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 37

TCMOV34S, SMOV34 andSMOV25 Series varistors fromLittelfuse are designed to pro-tect high energy circuits. TCMOV34S are 34mm

square format varistors thatcombine high maximum surgeup to 40kA with an integratedthermally active element. Itprotects high energy circuitsfrom short circuits and abnor-mal over-voltage intermediatecurrent conditions according tothe third edition of UL1449,clamping them to a safe level.The devices also disconnectfrom the circuit in the event ofover-heating from abnormalover-voltages. A built-in micro-switch can be used to indicatewhen the Varistor is discon-nected from the circuit.The lead-free varistors can

be wave soldered without theneed for special or expensiveassembly processes.SMOV25 and SMOV35

varistors are 25 and 34mmsquare MOV devices respec-tively. Each has a thermal dis-connect designed to open inthe event of overheating dueto abnormal over-voltage, tothird edition UL1449. The closeproximity of the integratedthermal element to the MOVbody ensures a quick thermalresponse. These devices havea separate microswitch thatcan be used to indicate whenthe MOV is disconnected. Both varistors are designed

to disconnect safely in sus-tained over-voltage, limitedcurrent conditions. Operatingrange is 115~750Vac.8 For full editorial

Varistors ProtectHigh EnergyCircuits

Belden has expanded itsHirschmann Spider familywith the addition of two newunmanaged Gigabit Ethernetswitches. Spider II Giga EECPro comes with either fivetwisted pair ports for10/100/1000Mbit/s or twoadditional SFP slots for fibreop-tic 1000 Base-SX/LX trans-ceivers, QoS e compliant withIEEE 802.1D.This allows prioritisation of

data packages and means thatthe switch can be used forProfiNet applications in me-chanical engineering for exam-ple. Spider II Giga EEC Jumbois also available in two differ-ent five port versions, with orwithout SFP slots.Both versions handle Jumbo

Frames with up to 9014bytesof user data. They are suitablefor video applications. All switch versions conform

to relevant industry standardsfor shock and vibration resist-

ance as well as electromag-netic compatibility, and arebuilt to comply with cUL508safety requirements. A 12/24Vpower supply is included alongwith IP30 protection, fanlesscooling and a temperaturerange of –40~+70 °C. The switches can be cas-

caded as often as required,permitting implementation oflocally structured networks withshort transmission paths to theterminating equipment Thetwisted pair ports have RJ45sockets, and support auto-crossing, auto-negotiation andauto-polarity. The fibreoptic transceivers

can bridge distances of upto 0.5 km multimode or120km single mode, andsupport auto-negotiationand full duplex.The plug&play switches are

designed for mounting on DINrails and can be rapidly set up.8 For full editorial

Unmanaged Gigabit EthernetSwitches Give Prioritisation

Low cost mini-SMD quartzcrystals from Petermann-Technik come in 3.2x2.5mmceramic housing with verynarrow frequency tolerancesfor all manufacturers of Blue-tooth low energy chipsets.These crystals are produced

with basic sound frequenciesof 12~60MHz ±10ppm andcan be supplied for operationover 0~+40°C – 40~+125°C, and to AECQ200 automo-tive standard.The Petermann-Technik

range enables solutions for32.768kHz clocking Blue-tooth low energy chipsets.The 32.768 quartz crystal ina 3.2 x 1.5 mm ceramichousing, for example ex-hibits a frequency toleranceof ±20ppm and standardload capacitances of 7, 9and 12.5pF. The mini-32.768kHz crystals can alsobe supplied with frequency

tolerances of ±10ppm. For even smaller quartz

crystal requirements, thecompany supplies2x1.6x0.45mm packageddevices such as the cerami-cally housed SMD02016/4series providing 24~50MHzin a 1.6x1.2x0.3mm housing.Pendants for 32.768kHz canalso be supplied in a2.05x1.2x0.6mm housing asseries SMD02015.8 For full editorial

Mini-Quartz Crystals DeliverLow Cost Bluetooth Clocking

16MM & 20MM CONDUCTIVE POLYMERTRACK POTENTIOMETERS

Call for samplesMade in the UK

You specify itand we’ll make it

Power Ratings0.25W – 16 mm pots (linear laws)0.40W – 20 mm pots (linear laws)Log, antilog and special non-linear laws willhave lower power ratings.

Mounting BushChoice of glass filled nylon or diecastzinc alloy.

SpindleChoice of 4 mm, 6 mm and 1⁄4" diameter,various lengths, with or without flats.

Rotational FeelChoice of centre or multi-position clickstops if required.

Resistance RatingsLinear resistance laws : 1k – 1MΩ Non-linear laws : 4k7 – 470kΩ

PROTOTYPE SERVICE TO FULL PRODUCTION QUANTITIES

TerminationsChoice of solder tags orpcb pins.

OMEG LIMITED IMBERHORNE INDUSTRIAL ESTATE,EAST GRINSTEAD, WEST SUSSEX, RH19 1RJ Web: www.omeg.comTel: +44(0)1342 410420 Fax: +44(0)1342 316253 Email: sales@omeg.com

A growing number of USBICs are keeping time using a48MHz basic sound fre-quency quartz crystal insteadof a quartz oscillator. Peter-mann-Technik’s inexpensivecrystal boasts a host of tech-nical services too.SMD03025/4 quartz crys-

tals exhibit a basic sound fre-quency up to 60MHz andnow come with the most in-expensive mini-SMD ceramichousing on the market, saysthe company. They measure

just 3.2x2.5mm and areslated as the preferred crystalin the automotive industry. The ceramic body has a

welded Kovar cover andcan be used to cheaplyadd frequency tolerancesof ±8ppm with a degrada-tion of ±1ppm/yr. Operat-ing temperature range is–40~ +125°C.For Bluetooth applications,

the company can supply48MHz crystals with a stan-dard load capacitance of 10,12, 18 or 20 pF, or accordingto customer specs. The lowcost, high performance se-ries meets AECQ200. Appli-cation and circuit analyses,circuit development and sim-ulations as well as design-insupport can all be providedby the company.8 For full editorial

48MHz Crystals Target USB

www.electronicspecifier.com38 | october 2012 | electronicspecifierproduct

PASSIVE COMPONENTS

Nine low resistance, surfacemounting SMD circuit protec-tors from TE Connectivityare designed for space con-strained mobile applications.They provide over-currentand over-temperature pro-tection for battery pack pro-tection circuit modules usedin compact consumer devicesincluding smartphones,MP3/4 players and portableGPS units.This low rho SMD series

addresses a need in the con-sumer driven mobile devicemarket for a low cost, lowpower consumption and flexi-ble solution for today’s in-

creasingly compact products.Manufacturers of handheld

consumer products requirethe smallest possible compo-nents that occupy the leastamount of board space whilehelping reduce productioncosts. Fulfilling these de-mands, the low rho SMDproducts provide low resist-ance in industry standard1210, 1206 and 1812 formfactors, meeting board spacerequirements. The devicescan also be reflow solderedDevice resistance is just

10~25mΩ after reflow andthis helps reduce power con-sumption and improve bat-tery efficiency. All nine de-vices in the series aredesigned to operate on >2A.8 For full editorial

Circuit Protectorsshape Up As LowRho SMDs

Fused A18 Series automotiverelays from CIT Relay &Switch exhibit a switching ca-pacity up to 40A. The sealeddevice ships standard with a30A fuse and accepts indus-try standard automotivebladed fuses. It has an LEDindicator and metal mountingtab with a socket available.Contact arrangement is

1A SPST NO and 1C SPDTwith a contact rating of 40Aat 14Vdc NO and 30A at14Vdc NC. Contact resist-ance is <50mΩ and contactmaterial is AgSnO2. Tested

electrical life is to 100kcycleswith a mechanical life of10million cycles. Dielectric strength is

1500Vrms minimum coil tocontact and contact to con-tact. Insulation resistance is100MΩ minimum at 500Vdcwith shock resistance at98m/s2 for 11ms. Vibrationresistance is 1.5mm doubleamplitude over 10~40Hz.Operating and storage tem-perature range is –40~+85°C, with a solderabilitywithstand of 260°C for 5s. A18 is ideal for bus, tractor,

off-road recreational vehicleand other heavy duty auto-motive uses.8 For full editorial

Automotive FusedRelays Switch Up To 40A

RoHS compliant USSP1217-LF VCOs from Z-Communi-cations target L band appli-cations. They operate at1210~1230MHz with a tun-ing voltage range of0.5~3Vdc. The miniature VCOs fea-

ture a phase noise of –102dBc/Hz at 10kHz offsetwhile operating from a3.3Vdc supply, typically draw-ing just 13mA.USSP1217-LF outputs

3±3dBm into a 50Ω loadwhile operating over –40~+85ºC. This robust VCOsuppresses the second har-monic to better than –13dBc

and covers the frequencyrange with a tuning linearitybetter than 1.1:1. The USSP1217-LF comes in

Z-Comm's standard0.2x0.2x0.06in USSP pack-age and is available taped &reeled for production. TheVCOs suit mobile radio andsatellite communication ap-plications requiring minimalpower consumption as wellas low phase noise.8 For full editorial

Compact VCOConsumes Little Power

PolyZen CE series of compactcircuit protection devices fortablet PCs and other portableconsumer electronics fromTE Circuit Protection protectsensitive electronics fromover-voltage and over-currentevents.The 1mm high devices are

rated at 2.6A, providing an in-novative solution with signifi-cant performance advantagesover discrete fused Zener andother passive device solutions.PolyZen CE provides plug&play

over-voltage protection.PolyZen products integrate a

precision 5.6V or 13.2V Zenerdiode and a PolySwitch poly-meric positive temperature co-efficient device in a single, sur-face mounting assembly. The Zener diode protects

against voltage transients, re-verse bias and the incorrectuse of power supplies. ThePolySwitch PPTC element shutsout excessive current while thefault condition remains andhelps shield the Zener diodeand downstream electronicsfrom damage.8 For full editorial

Devices IntegrateCircuit Protection

PASSIVE COMPONENTS

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 39

Four new ranges of low volt-age crystal oscillators fromEuroquartz come in minia-ture surface mount packages.XO22, XO32, XO53 andXO91 devices operate fromsupplies of 5~1V, enablingcurrent consumption as lowas 2mA for battery poweredapplications.XO22 oscillators are low

profile 2.5x2x0.9mm surfacemount packaged with a fre-quency range of0.5~75MHz. XO32 devices

are 3.2x2.5x0.95mm SMDpackaged with frequencyrange of 0.5~54MHz. XO53clock oscillators are 5x3.2mmsurface mounting devices for1~125MHz. XO917x5x1.4mm miniature clockoscillators are hermeticallysealed with a frequencyrange of312.5kHz~160MHz.All four ranges are avail-

able with supply options of1.0, 1.2, 1.8, 2.5, 3.3 or 5.0Vand provide HCMOS/LSTTLoutput logic. Tristateenable/disable functionality isstandard on all ranges.8 For full editorial

Miniature CrystalOscillators AreLow Voltage

AVX says it is committed tothe global effort to excludetantalum sourced from anyarea in which insurgents orsimilar groups benefit fromthe mineral sales.As part of its on-going com-

mitment to a conflict-free sup-ply chain, AVX has been at theforefront of industry’s efforts indeveloping standards for thesupply of tantalum from themine to the ultimate customerand is an active participant inthe Electronic Industry Code ofConduct and the Global E-Sustainability Initiative Con-flict-Free Smelter programmeand the Tantalum-NiobiumInternational Study Centreto avoid the use of tantalumore which directly or indirectly

finance or benefit armedgroups in the DemocraticRepublic of the Congo or ad-joining countries and fullysupports the position of theElectronic Components,Assemblies and MaterialsAssociation toward thesame result.Since December 1st, 2011,

AVX has exclusively sourcedtantalum powder and wire tomanufacture its tantalum ca-pacitors from smelters whosecompliance with the ElectronicIndustry Code of Conduct andthe Global e-Sustainability Ini-tiative Conflict-Free Smelterprogramme has been verified.Now, the exclusive use ofEICC/GeSI validated smeltersis expected to be the corner-stone of pending SEC regula-tions concerning the Dodd-Frank legislation.8 For full editorial

AVX AnnouncesConflict-Free Tantalum Policies

CIT Relay & Switch’s A17Series robust automotive re-lays come in a small packagewith high current/in-rush ca-pabilities. The plug-in devicesare rated at 20A maximumand sealed. The single polesingle throw design has coilsuppression options of resis-tor or diode.Contact arrangement is 1A

SPST NO with a contact rat-ing of 20A 14Vdc NO. Con-tact resistance is <50mΩ andcontact material is AgSnO2.Tested electrical life is 100kcy-cles with a mechanical life of10 million cycles. Dielectric strength is

750Vrms minimum coil tocontact and 500Vrms mini-mum contact to contact. In-sulation resistance is quptedat 100MΩ minimum at500Vdc.8 For full editorial

Relays Withstand High Inrush Current

TE’s Vesa vacuum circuitbreaker is all electro-magnet-ically operated for 25kV and15kV vehicles. It is part of theVesa system solution for highvoltage technology in trainsand the company's answer tothe increasing trend of oper-ating electric passengertrains. It is positioned to leadthe way into the next genera-tion of the electric rail market.Passenger train electrifica-

tion is top of the agenda forpublic transportation aroundthe world as demand in-creases for green technolo-gies and efficiently engi-neered railway solutions.With a transition from pneu-matic to electro-magnetic ac-tuation, train manufacturers

are provided with a loweroverall cost solution due toreduced maintenance needsand minimised train energyconsumption, further enhanc-ing the economic benefit forthe operator. TE is leading the VCB tech-

nology shift and is currentlyone of the few suppliers with asubstantial quantity of electro-magnetically operated VCB´sin the field. A proven technol-ogy, the first unit was installedover five years ago and thereare now more than 800 unitsin service on four continents. “Through close co-operation

with our customers,” says TERail General Manager PeterVan Loo, “our research teamhas developed a system withbreakthrough benefits for therailway sector. Providing themarket with a solution exhibit-ing lower total installed costwhile dispensing with bulkypneumatic systems makes thisinnovative TE solution an excit-ing and reliable product forboth new designs and refur-bishment programmes.”8 For full editorial

Vacuum Circuit Breaker TargetsElectric Passenger Trains

www.electronicspecifier.com40 | october 2012 | electronicspecifierproduct

CABLES & CONNECTION

Souriau'smicro38999 circu-lar connectors, available fromLane Electronics, are de-signed to meet increasing de-mand for more compact,lighter connection solutionsfor military, aerospace andindustrial applications.Built for the most extreme

environments and offeringconsiderable performanceadvantages over even thesmallest Mil-DTL38999 SeriesIII units, micro38999 connec-tors enable size and weightsavings as much as 50% com-pared to regular Mil-DTL38999 Series III connectors.These circular connectors

come in three different fas-tening systems: screw; bayo-net and push-pull. Although

size has been dramaticallyreduced, performance hasnot been compromised, saysLane. For example,micro38999 features a tem-perature range of –55~+175ºC continuous and bet-ter than IP 68 rating whenused with the appropriatecable termination.The new connectors have

removable crimp contacts en-abling wiring or unwiring on-site and up to 26 contactscan be accommodated in achoice of five configurations.Lane can supply versions gal-vanically coated and non-re-flective black zinc nickel pro-tected to satisfy the latestRoHS directives.8 For full editorial

Mil-DTL38999 Series IIIConnectors Are Smaller & Lighter

Molex’s Brad Ultra-LockM12 EX connection systemenables process automationinstallers to safely and quicklyconnect instrumentation andcontrol devices in potentiallyexplosive and hazardousareas. As with other BradUltra-Lock connectors, thisnew device features a push tolock mechanism for simpleand secure operator inde-pendent connection.Ultra-Lock M12 EX also in-

cludes an integral isolatingring that limits access to therelease mechanism of theconnector, allowing the con-nector to be pushed on butrequiring a screwdriver to dis-connect. Because the connec-tion point is considered non-arcing it is suitable for use ina Class I, Division 2 and Zone2 classified areas.“Molex understands the ex-

treme challenges associatedwith operating in potentiallyexplosive and hazardous lo-cations,” says Molex ProductManager Jimmy Adjunta,“and our products are devel-oped to take into accountsafety, reliability and produc-tivity in the toughest environ-ments. The innovative isolat-ing ring on the Ultra-LockM12 EX is another exampleof our dedication to safety.And by making the lockingmechanism integral to thecord set there are no extra in-stallation steps, helping to re-duce costs and increase pro-ductivity withoutcompromising safety.”8 For full editorial

Connectors MakeFor Safe, Secure &Reliable Solutions

FCI’s PwrBlade Series powerdistribution connectors are formedical equipment such asautomated medication dis-pensers. The rugged designhandles power and highspeed data, providing an in-telligent solution that enablesadvanced medication inven-tory management, patientmonitoring and medicalrecord management.The integration of Pwr-

Blade power distributionconnectors within crucial op-erations of the automatedmedical dispensers helpeliminate the issue ofhuman error in the distribu-tion of medicine to patients.These connectors are mod-

ular in design, enabling easyupgrades to medical equip-ment. The robust contact sys-tem is designed to handle thehigh forces of plugging andunplugging into a chassis.With moulded guide posts onthe header to properly en-gage with receptacles, Pwr-

Blade aligns during blindmating, eliminating potentialcontact and connector com-ponent damage.PwrBlade also simplifies

medical equipment designsby satisfying power and datarequirements in one connec-tor, reducing the number ofconnectors required in thedesign. Mating options forpower distribution make itideal for medical equipmentmanufacturers that needvertical and/or co-planarmating options within a sin-gle design.PwrBlade was initially

developed to implementserver system infrastructurestandards for distributedpower, mid-range and highend power supplies. “Incor-porating PwrBlade technol-ogy into these new medicalapplications speaks to theversatility of this productline,” comments FCI Direc-tor Tom Scannell. 8 For full editorial

Connectors Power Data RequirementsFor Advanced Medical Equipment

Two hands often aren't quiteenough in electrical installa-tion, so Hylec-APL haslaunched its new range ofKwik-Snap terminal stripsthat can be reduced down tothe required size in seconds.Most common terminal

block strips are manufac-tured using polyamide nylonthat provides a suitable andsecure bed to form a connec-tion. However it is so strongthat cutting to length on sitecan prove troublesome andtime consuming.Polyethylene, far more

flexible, provides an easilyseparated alternative butcan be a safety hazard withits low melting point. And in

the event of arcing from theconnection, it has been sus-pected of causing fires.Hylec-APL’s Kwik-Snap

polypropylene terminalblock combine the tough-ness of one alternative andthe time saving benefits ofthe other. The polypropy-lene construction eliminatesthe risk of fire which is con-nected to polyethylene andallows the terminal block tobe securely fastened to apanel without distortion. The space dividers are de-

signed to be easily separatedby a simple twist of the hand;something that is not possi-ble with polyamide.8 For full editorial

Polypropylene ProvidesEasy Twist For Terminal

Block Installation

CABLES & CONNECTION

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 41

AVX’s expanded 9159 Se-ries SMT connectors now in-clude IDC wire to boardplug and socket connectors.They provide easy, reliable,and cost-effective termina-tion of AWG 22~24 discreteor cabled power and signalwires into standard 9159Series two piece connectorssystems, maximising flexibil-ity by providing wire toboard capabilities.Designed to solve packag-

ing issues in the broad in-dustrial and solid state light-ing markets, these miniatureIDC plug and socket con-nectors carry up to 5A/con-tact and operate at up to125°C for extended periods.They enable co-planar

PCB mating, characteristic ofthe PCB arrangement in lin-ear strip lighting used in ap-plications ranging from of-fice lighting to harsh

environment transportationapplications. Other applications include

portable commercial and in-dustrial handheld terminals,scanners, and meters, med-ical devices such as patientmonitoring and drug dis-pending, and industrial elec-tronic modules and controls.“The new 9159 Series

IDC wire to board connec-tors,” comments AVX Prod-uct Manager Tom Ander-son, “maximise size andperformance with highersignal and mating integrity,a higher maximum operat-ing temperature, andhigher current carrying ca-pacity than many of thecompeting products on themarket, most of which aretin plated and feature amuch smaller range ofproduct family offerings.”8 For full editorial

IDC Wire To Board DesignMakes Reliable Connection

Binder’s extensive IP67, M16connectors in nickel platedbrass and black polyamideare now UL approved.Both series have internal

seals at the mating face andare tough, robust and ratedto IP67 when mated, makingthem ideal for a wide varietyof applications includingANPR systems, gas and water

meters, temperature sensors,pressure gauges, torque sen-sors and similar equipment.Available in two to 24 pole

versions, Series 723 is un-shielded while Series 423comes in shielded and un-shielded versions. Solder andscrew termination for wiresup to 0.75mm2, AWG 20are available. Series 423contacts are gold and 723silver. Cable size range is4~10mm.8 For full editorial

IP67 M16 Connectors Get UL Approval

www.electronicspecifier.com42 | october 2012 | electronicspecifierproduct

COMMS, COMPUTING & CONTROL

CEM100 low power COM Ex-press Type 2 modules fromAxiomtek are powered byeither a single core AMD G-Series APU T40R at 1.0GHzor the dual core T56N at1.65 GHz paired with theA50M FCH chipset. The plat-form comes with two DDR31066 MHz SO-DIMM slotsfor up to 8 GB of systemmemory and four SATA portswith RAID 0, 1, 10, 5.With a Radeon HD 6250/

HD 6320 graphics controllerand support for DirectX 11and OpenGL 4.0, CEM100boasts an outstanding visualexperience and features twoDDI, 18/24bit single/dualchannel LVDS and VGA dis-play interfaces. Moreover, thissmall form factor embeddedboard also provides four 32-bit PCI plus eight PCIe x1Gen 2.0 slots for I/O expan-sion. For applications lookingfor more security protection,TPM 1.2 is also integratedinto this board. The CEM100is ideal for applications in re-tail, medical, gaming, digitalsignage and many more.“Powered by the newest

AMD G-Series APU with AMDA55E FCH, Axiomtek’s

CEM100 provides the latestgraphics features and deliversnew user experience,” says Ax-iomtek VP Joseph Chou. “Evenwith high graphics perform-ance, the optimized energy ef-ficiency enable system devel-opers to design the applianceswith tight power and thermalrestrictions. The CEM 100comes with multiple displayoutputs: 18/24bit single/dualchannel LVDS, VGA, and twoDDI displays. The developercan operate modern Display-Port, HDMI, DVI, and DPOgraphical interfaces throughthe DDI on this board.”8 For full editorial

COM Express Module DeliversOn Graphics Performance

Acrosser’s high end AR-R6102 series network securityplatform is built on Intel’sC206 Cougar Point platform.It delivers dependability andproductivity by providing newlevels of cost effective dataprotection, performance, ex-panded security, virtualiza-tion, and power manage-ment options.AR-R6102A and AR-

R6102B support a scalablerange of Intel Xeon, Core i,Pentium and Celeron proces-sors. Besides six on-board Gi-gabit Ethernet ports, it alsoprovides two network inter-face card slots for flexibility inaccommodating up to two 4

port Gb Ethernet, 4 port Gbfibre or 2 port 10Gb fibreNICs. The 2U version AR-R6102B has five more diskbays to support the RADI0/1/5 function and providesthe option of redundantpower supplies. The ECCmemory modules are sup-ported for better reliabilitywhen Xeon processor is used.AR-R6102 also features

two USB ports, one RJ-45console port, a LCD displayand LED indicators thatmonitor power and storageactivities for local systemmanagement, maintenanceand diagnostics. Its highdensity I/O features makethe AR-R6102 series ideal fornetwork appliance needs intoday’s IT and server farms.8 For full editorial

Network SecurityPlatform Is RackMounting

Boasting the highest densityof digital signal processingcores of any commerciallyavailable blade, EmersonNetwork Power says its newAdvancedTCA media pro-cessing blade has up to 576DSP cores and runs sophisti-cated media processing soft-ware. ATCA-8320 enablescommunications equipmentcompanies to simplify andaccelerate the developmentand deployment of very highdensity IP media processingapplications.The blade is the first result

of collaboration betweenEmerson and Octasic, featur-ing Octasic’s asynchronousDSP and Vocallo MGW voiceand video software. ATCA-8320 can significantly

reduce hardware footprint inthe telecom central office by

replacing many traditionalserver or other media pro-cessing blades when addingvoice or video functionality toa communications system.The blade can offload voiceand video processing from anX86-based system at resolu-tions up to 1080p. The gateway on a blade ar-

chitecture makes this bladesuitable as a standalone gate-way element, allowing highscalability from small systemsto the very large. In additionto a bank of up to 24 OctasicOCT2224M DSPs, ATCA-8320 features an eight coreFreescale QorIQ P4080 de-vice for advanced IP flowmanagement and distributionand a dual core Core i7processor for local control andmanagement applications.8 For full editorial

Highest Density ATCA MediaProcessing Blade Unleashed

Brad PC based network inter-face cards from Molex en-able intelligent and cost-ef-fective communicationsolutions in connecting vari-ous computer bus formatssuch as PCI Express, PCI,PC/104, USB and VME,to industrial net-works.“In addi-

tion tothemanyform factorssupported, BradNICs also support differ-ent industrial communica-tions protocols, such as De-viceNet, EtherNet/IP, Profibusand more,” explains MolexProduct Manager GeorgeKairys. “The purpose of thecards is to transfer informa-tion back and forth betweencomputers and industrial fielddevices connected on the var-ious networks. These criticalmachine and process controlapplications demand sophis-

ticated, high speed communi-cation transmissions and theBrad NICs fulfil that needwith utmost accuracy and re-liability. Our modules areused in applications ranging

from manufacturing com-puter chips, to high-

speed roboticcontrollersused for in-

dustrial au-tomation in the

automotive, aero-space and defence in-

dustries.”Applications include PC

control, I/O emulation,HMI/SCADA control systems,PLC programming, networkconfiguration, networkequipment diagnostics andtroubleshooting. Both single-and dual channel cards areoffered for system flexibility,and software available forthe NICs enables fast inte-gration into each user’s spe-cific application.8 For full editorial

Network Interface CardsDeliver Intelligent Solutions

www.electronicspecifier.com44 | october 2012 | electronicspecifierproduct

COMMS, COMPUTING & CONTROL

Concurrent’sAdvancedMChigh performance processorboard features third genera-tion Intel Core processors.AM 90x/x1x provides config-urable on-board storage in adouble width AMCform fac-torandwithoptionalsupport forMTCA.4, it ex-tends the Mi-croTCA architec-ture to applicationsrelated to physics research.AM 90x/x1x SBCs feature

Core i7 processors alongwith up to 16GB of DDR3-1600 ECC SDRAM. By utilis-ing these Intel processors,the SBC benefits from im-proved power efficiency andprocessing performancecompared to previous gener-ations of processors. TheCore processor also extendssupport for computer inten-sive applications by providingsupport for OpenCL.AM-90x/x1x is designed in

compliance to AMC.0,

AMC.1 Type 8 (x8 PCI Ex-press, Gen 1, Gen 2 or Gen3), AMC.2 Type E2 (2 x Giga-bit Ethernet) and AMC.3Type S2 (2 x SATA ports). Theboard features a range of in-terfaces including serialports, USB 2.0/3.0 ports, Gi-gabit Ethernet interfaces,DVI-D and a DisplayPort in-

terface. Complementaryto this, the AM-

90x/x1x also offersflexible on-

boardstorageoptions

that can ac-commodate an on-

board flash drive, a 2.5inHDD/SDD and up to twohalf-slim SDDs. The boardcan be configured to beSCOPE Alliance compliantand MTCA.4 compatible. “The MicroTCA for

Physics, MTCA.4, standardprovides rear I/O and preci-sion timing extensions tothe MicroTCA architecture,”says Concurrent Technolo-gies CEO Glen Fawcett. “Bysupporting this, the AM-90x/x1x delivers the per-formance of third genera-tion Intel Core i7 processorsin new application areas.” 8 For full editorial

SBC Has ThirdGeneration IntelOn Board

Altera’s single chip, multi-rate OTN muxponder solu-tion for 100G network aggre-gation is based on its 28nmStratix V FPGA. It provides aproven single chip solutionthat expands the capabilitiesof current networks by en-abling developers to inte-grate emerging client typesinto their networks, such as16G Fibre Channel. The proliferation of 10G

ports and the acceleration ofnetworks from 40G towards100G is driving operators tolook for ways to minimiseoperational complexity, saysAltera, by aggregating bothlegacy clients as well as10G and 40G feeder net-

works into 100G for highcapacity transport. This muxponder solution

addresses data centre andtransport aggregation by flex-ibly supporting emergingclients, such as 16G fibrechannel and 40G Ethernetalong with various 10Gclients. A flexible FPGA basedimplementation allows net-work developers to reducedevelopment risks, create dif-ferentiation and future-prooftheir designs.The multi-rate OTN mux-

ponder is a fully integrateddigital core providing clientadaptation with forwarderror correction, ODUTG4multiplexing of up to 100Gof client traffic, OTU4 map-ping and framing and line-side FEC. 8 For full editorial

OTN MuxponderDelivers Via 28nm FPGA

Lexar’sMulti-Card 25 in 1USB 3.0 reader is a versatile,all in one solution for quickand reliable file transfers from25 of the most popular mem-ory card formats. The readerprovides five slots compati-ble with popularcard for-mats suchas Com-pactFlash,Secure Digi-tal, including newlyadded support for Secure Digi-tal Extended Capacity cards,Mobile, Memory Stick and xD-Picture cards.The reader is also backwards

compatible with USB 2.0 ports,

can read multiple cards simul-taneously, and provides card-to-card file transfer. It is her-alded as an excellent choicefor anyone with various mem-ory card formats looking toquickly and easily transfer mul-tiple files. The reader utilises Super-

Speed USB 3.0 for high speedfile transfer, witha USB interface

read speed ofup to500MB/s. It isup to five times

faster than USB 2.0and also features a conven-ient pop-up mechanism toprotect card slots when thereader is not in use. The readercomes with a USB 3.0 cableand blue LED activity.8 For full editorial

Multi-Card 25 inOne1 Reader IsUSB 3.0

Two new modulator driversfrom M/A-COM Tech for100G Ethernet applicationscome in 4.7x6.5mm SMDpackaging.MAOM-002108 is a high

performance MZ modulatordriver operating up to28Gbps. The driver IC has avery low power consumptionof 1.3W at 6.0Vpp output,low RMS jitter, and a typicalrise and fall time of 11ps.MAOM-002204 is a high

performance quad channelelectro-absorption modulatordriver IC for 100GigE applica-tions. Available in a 14x8mmpackaging, each port is drivenwith differential input signalthat can range from250mVpp to 500mVpp toprovide an output that can becontrolled from 1.0Vpp to2.5Vpp for each channel. Themodulator driver exhibits verylow power consumption of0.75W per channel at 2.5Vpp,low RMS jitter, and a typicalrise and fall time of 12.5ps 8 For full editorial

Driver Modulates100G Applications

AMB-QM77T1 is Acrosser’slatest Mini-ITX industrialmainboard, supporting thirdand second generation IntelCore i7/i5/i3 mobile proces-sors via the QM77 chipsetand FCPGA 988 socket.Third generation Intel mobile

processors supported featurean integrated GPU capable ofsupporting graphical librarieslike DirectX11, OpenGL4.0and OpenCL1.1. Targeting onmultimedia and gaming appli-

cations, AMB-QM77T1 bringsenhanced graphics perform-ance by supporting 3 inde-pendent displays in any combi-nation of VGA, HDMI, LVDSand DVI output.AMB-QM77T1 has two

DDR3 SO-DIMM sockets tosupport up to 16GB of systemmemory. Onboard 24-bit dualchannel LVDS interface sup-port big size LCD panel di-rectly made it suitable for digi-tal signage and panel PCapplications. It also featuresadvanced technologies includ-ing four USB 3.0 and twoSATA III connectivity to deliverhigh speed data transmission.8 For full editorial

Mini-ITX IndustrialMainboard Supports LatestIntel Devices

COMMS, COMPUTING & CONTROL

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 45

AMD’s SeaMicro SM15000server heralds revolution incomputing with the inven-tion of Freedom Fabric Stor-age, extending FreedomFabric beyond the SeaMicrochassis to connect directly tomassive disk arrays, en-abling a single ten rack unitsystem to support more thanfive petabytes of low cost,easy to install storage.The SM15000 server com-

bines density, power effi-ciency and bandwidth with anew generation of storagetechnology, enabling a singlerack to contain thousands ofcores, and petabytes of stor-age, ideal for big data appli-cations like Apache Hadoopand Cassandra for public andprivate cloud deployments. SeaMicro SM15000 is

available today supportingthe Intel Xeon Processor E3-1260L. In November, it willsupport the next generationof AMD Opteron processorsfeaturing the Piledriver core,as well as the newly an-nounced Intel Xeon ProcessorE3-1265Lv2. In addition tothese latest offerings, theAMD SeaMicro fabric tech-nology continues to deliver akey building block for AMD'sserver partners to build ex-tremely energy efficient microservers for their customers.8 For full editorial

Server Heralds BigData & Cloud Revolution

Kontron’s new on-boardcomputer brings buses, com-mercial vehicles, mobile con-struction, agricultural and in-dustrial machinery to thecloud. With application readycellular connectivity, flexibleprocessor options and vari-able I/O interfaces, therugged MicroSpace MPCX60vehicle computers can beused for a multitude of widelydiffering tasks in public trans-port vehicles, fleet manage-ment, and commercial vehi-cle control systems.These computers are scala-

ble with different low powerprocessors, providing industrystandard PCI/104-Express orCompactPCI expansion slotsfor a variety of interface exten-sions. This enables customisa-tion to help meet OEM specifi-cations. At the same time, allcommon on-board vehiclecomputer interfaces are avail-able off-the-shelf, includingGPS, GSM, WLAN and CANand other serial interfaces. So-lutions such as passenger in-

fotainment and passengersafety systems can be quicklyrealized as fleet managementsystems including connectionsto the complete commercialvehicle electronics. Designed as a rugged, in-

vehicle computer, the MPCX60 has the ECE type approval(E1) for use in buses and com-mercial vehicles, as well as,agricultural and forestry work-ing vehicles. The wide rangepower supply is designed forindustrial battery of 12~48V. The system design is fanless

and shock and vibration-resis-tant, suitable for the condi-tions of the railroad traffic, au-tomotive and mobilemachinery sectors. 8 For full editorial

Vehicle Computers Driving The Cloud

PCIe flash LSI NytroMegaRAID cards from LSI,provide simple, transparentand cost-effective applicationacceleration for directly at-tached storage. NytroMegaRAID cards integratePCIe flash technology and in-telligent caching softwarewith enterprise RAID dataprotection using leading LSIdual core RAID on chip.The increased availability of

the LSI Nytro MegaRAID prod-uct family coincides with agrowing data deluge that ischallenging data centre man-agers to reassess ways to bal-ance application performance,storage and data protectionrequirements in the most cost-effective way possible.“Our worldwide channel

partners,” says LSI DirectorBrent Blanchard, “are seeingpent-up demand for afford-able application accelerationsolutions given the dauntingamount of data stressing thecapacity and data protectioncapabilities of storage infra-structures. With its unique in-tegration of technology on asingle card and sub-$2Kprice point, we believe theNytro MegaRAID family is agame-changer that canmake the dramatic applica-tion acceleration benefits ofPCIe flash solutions accessi-ble and economical for alltypes of data centres.”Nytro MegaRAID cards use

intelligent caching to identifyapplication “hot spots” of fre-quently accessed data and au-tomatically move the data be-tween integrated flash storageand hard drives to blend high-performance and high-capac-ity storage, resulting in im-proved cost per gigabyte andcost per transaction.8 For full editorial

Acceleration Cards SpeedPCIe Flash Nytro MegaRAID

AdLink’s ETX-CV CoMfamily is based on the dualcore 32nm Intel Atomprocessor and NM10 Ex-press chipset. It is targetedat replacing current entrylevel and older high per-formance ETX modules, upto Intel Core Duo ProcessorL2400. Power consumptionrange is 6~12W, lowerthan that of previous gener-ation products.ETX-CV is an entry level

module for generic systemsbut also for systems requir-ing full graphics features. Itcomes with integrated sup-port for VGA up to1920x1200 resolution, sin-gle/dual channel 18/24bitLVDS and an on-board Dis-playPort connector. Conforming to the ETX

3.02 specification, ETX-CVprovides two additional on-

board SATA connectorswhile maintaining full back-wards compatibility with ear-lier ETX standards. OS sup-port includes Windows XP,Windows XP Embedded,Windows 7, WinCE, andLinux. Primary focus is forapplications in Medical Di-agnostics and Imaging,Gaming, Industrial Automa-tion, Test and Measurement,POS, and Industrial Control.Dual core Atom N2000

and D2000 series proces-sors on the ETX-CV replaceprevious generationN4xx/N5xx processors. 8 For full editorial

CoM ConsumesLittle Power

www.electronicspecifier.com46 | october 2012 | electronicspecifierproduct

AUTOMOTIVE

The DS90UB913Q serialiserand DS90UB914Q deseri-aliser join TI’s FPD-Link IIIautomotive chipset family.This SerDes chipset providesa seamless video and datainterface to megapixel driverassist camera modules, withno software overhead andfewer wires, resulting in re-duced power consumption,cost and weight. System level SerDes en-

hancements are acceleratingthe adoption of camera safetysystems in the mid and entrylevel vehicle segments. Appli-cations include front viewcamera for collision avoidanceand traffic sign/pedestrian

recognition, rear view camerafor backup protection and sur-round view cameras for park-ing assistance.Camera systems have be-

come an important automo-tive safety component, typi-cally combining multiplecamera modules with ad-vanced image analysis tohelp drivers monitor roadconditions, detect hazardsand avoid collisions. Automo-tive safety system designerscan use TI’s FPD-Link IIISerDes chipsets to connectcameras and displays to anECU with thinner, more flexi-ble cabling. 8 For full editorial

Chipset Streamlines CameraVideo & Data Interface

Peregrine Semiconductor’sSPDT PE42421 RF switch isminiature, six lead SC-70packaged. And with 2kV ESDperformance on the RFC port,low voltage support down to1.8VDD and low power con-sumption of typically 9µA, thisswitch suits battery poweredportable, as well as automo-tive telematics applications,such as vehicle entry systemsand emergency calls.The 50Ω reflective UltraC-

MOS PE42421 switch fea-tures a high linearity of50dBm IIP3 and on-chip, lowvoltage CMOS control logic.It can be controlled using ei-ther single pin or comple-mentary control inputs. Addi-tionally, it features a lowinsertion loss of 0.35dB at1GHz and 0.50dB at 2GHz,with a high isolation of 30dBat 1GHz and 20dB at 2GHz.Using a nominal +3V supply,a typical input 1dB compres-

sion point of +33.5dBm canbe achieved.“Customers continue to

push for low power and highESD performance in thesmallest package size possi-ble, in order to deliver opti-mal RF performance in theirportable device, and auto-motive-telematics designs,”explains Peregrine MarketingDirector Mark Schrepferman.“The PE42421 switch meetsthese needs, and also makescustomers’ manufacturingprocesses more reliable.”Peregrine has also intro-

duced PE42421 evaluationkit which includes USB inter-face board and cable.8 For full editorial

SPDT RF SwitchSuits Powered &Automotive Telematics Apps

Notching up another highvolume design win for itsFlexRay transceiver family,AMS’s AS8222 transceiverwas designed for extendedhigh temperature operation,and will be used in a trans-mission control module man-ufactured by a top tier-oneautomotive supplier. Themodule will be used in afamily of cars manufacturedby one of Europe's largest carmanufacturers.AS8222 was selected to

provide the network interfacein the harsh powertrain envi-ronment because of its ex-tremely high temperature rat-ing. It is the only FlexRaytransceiver on the market tobe specified for operation ata junction temperature as

high as 165°C.The module manufacturer

also requires the part to besupplied as a bare die, anoption that AMS is able toprovide while meeting theautomotive industry’s strin-gent quality specificationsfor unpackaged devices. The part is also available

in an SSOP20 packagequalified up to 150° ambienttemperature.The AS8222 transceiver,

which provides the interfacebetween the digital logic andthe copper cable transmissionlines, conforms to the FlexRaystandard v2.1 rev B. Withtransmission rates up to10Mb/s, FlexRay provides 20times the speed of the un-shielded twisted copper cableused in cars today. FlexRay isfault tolerant and time trig-gered, providing dependabledelivery of messages forsafety applications.8 For full editorial

Automotive DesignWin Landed ForAS8222 FlexRayTransceiver

Green Hills Software’sMultitoolchain is certified to indus-trial IEC 61508:2010, railwayEN 50128:2011 and automo-tive ISO 26262:2011 func-tional safety standards. Thecompany says its Multi IDE isthe only commercially avail-able toolchain certified to sat-isfy both SIL 4 (Safety IntegrityLevel) and ASIL D (AutomotiveSafety Integrity Level) toolqualification requirements.Built on proven products

and processes, developerscan rely on Green Hills Soft-ware’s safety and certificationexperience and utilise its cer-tified tools to build safety sys-tems up to SIL 4 and ASIL D.The company has invested

significant time and effort tomeet the new tool qualifica-tion requirements included inthe latest releases of thesefunctional safety standards.“Green Hills Software con-

tinues to lead the embeddedsoftware community in deliv-ery of safety-certified prod-ucts coupled with unparal-leled safety expertise,”comments Greenhills CEODan O’Dowd. “Our deepworking knowledge of thesestandards, our proven designand development practices,and our collaborative en-gagement with the certifica-tion bodies were key to thesuccessful certification thatconfirms our support toolsqualification and comple-ments our existing IntegrityRTOS certified offerings.”8 For full editorial

Multi Toolchain UpToo FunctionalSafety Standard

AUTOMOTIVE

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 47

Three phase BLDC motorapplications make for higherefficiency and improved per-formance for electromechani-cal actuation in automotivesystems such aspumps,powersteering,enginecoolingfans and fastpositioning drivetrain actuators.Melexis’sMLX83203 pre-driver ICdeploys EEPROMmemory and com-bined bootstrap andcharge pump blocks andwhereas traditional BLDCpre-drivers require complex,large packages with many ex-ternal components, this devicedelivers a flexible pre-driversolution in a space saving,standard, 5x5 QFN32.The IC drives six 250nC

NFETS up to 25kHz, whilekeeping 10V gate down to

7V battery voltage. In linewith the needs for such fail-safe torque control applica-tions, MLX83203 features ex-tensive diagnostics as well asa high speed, low noise am-plifier. Rather than configur-ing the pre-driver by applyingexternal resistors, 6 bytes ofon-chip EEPROM offer wide-ranging configuration optionswhile minimising pin count. Low self heating and smallpin count means

MLX83203 delivers thesmallest footprint for

comparable threephase pre-dri-vers. The benefitis a smaller fin-

ished size,fewer com-ponentsand moreflexibility for

design re-use. Additional family members

are also planned to followMLX83203 which will be re-leased for operation up to150°C. Notably, qualificationto 175°C is planned for thenear future. 8 For full editorial

NFET Pre-Driver Is EEPROM Configurable

Maxim’sMax16962 high ef-ficiency, synchronous step-down converter operates with2.7~5.5V inputs and pro-vides a 0.8~3.6V outputrange. The wide input/outputvoltage range and the abilityto provide up to 4A to loadcurrent make this device idealfor on-board point-of-loadand post-regulation applica-tions. The device achieves–3.7%/+2.6% output errorover load, line and tempera-ture ranges. Max16962 features a

2.2MHz fixed frequency PWMmode for better noise immu-nity and load transient re-sponse, and a pulse frequencymodulation mode for in-creased efficiency during lightload operation. The 2.2MHzoperation enables use of theall-ceramic capacitors and

minimises external compo-nents. The optional spread-spectrum frequency modula-tion minimizes radiatedelectromagnetic emissions. Integrated low RDSON

switches improve efficiencyat heavy loads and makethe layout a much simplertask with respect to discretesolutions, says Maxim.Max16962 is available

with factory preset or ad-justable output voltages.Factory preset versionsachieve –3.7%/+2.6% out-put voltage accuracy withoutusing external resistors,while the adjustable outputvoltage version provides theflexibility to set the outputvoltage to any desired valuebetween 0.8~3.6V using anexternal resistive divider. 8 For full editorial

Synchronous Step-Down DC/DCConverter Is Automotive First

Volatile MCP47A1 DACs fromMicrochip Technology boastlow power and low cost whilefeaturing a 1.8~5.5V operat-ing range. Packaging is in sixpin SC70s.The device suits applica-

tions in automotive, audioand industrial markets suchas portable, handheld batteryoperated products, as well asset point or offset trimmingand sensitive mechanical-trimpot replacement applications.The extended temperature

range of –40~+125°Cmakes for use in high tem-perature automotive and in-dustrial applications. Addi-tionally, SC70 packaging

allows for more portable andspace constrained consumerapplications. MCP47A1 DAC also pro-

vides 65 taps, through an I2Cinterface, including taps tofull and zero scale, providingadditional functionality. Lowpower consumption extendslifetimes in applications withfinite power supplies, and thelow cost is suitable for cost-sensitive applications. “The MCP47A1 is opti-

mised for system power re-duction and cost reduction,”comments Microchip VPBryan J Liddiard. “Because ofits extended temperaturerange, this new DAC can alsobe used in high-temperatureautomotive and industrial ap-plications.”8 For full editorial

Volatile DACKeeps Power &Cost Low

Now functionally safe auto-motive electronics systemscan be developed in com-pliance with ISO 26262standard following theexida certificationQorivva’s MPC5643L 32bitMCU. And it’s the first semi-conductor product toachieve the certification. This Power Architecture

MCU is designed for a widerange of automotive applica-tions requiring high levels ofsafety integrity including elec-tric power steering, activesuspension, anti-lock brakingand radar based advanceddriver assistance systems. It is

suitable for use for all auto-motive safety integrity levels,up to and including the strin-gent ASIL D.MPC5643L is designed to

specifically address the ISO26262 safety standard up toASIL D. It is said to reducedesign complexity and com-ponent count by putting keyfunctional safety features ona single chip with a dualcore, dual issue architecture,that can be staticallyswitched between lockstepmode - redundant process-ing and calculations - to de-coupled parallel mode - in-dependent core operation. MPC5643L MCU provides

a SafeAssure functionalsafety solution.8 For full editorial

MCU IS First ToAchieve ISO 26262Certification

www.electronicspecifier.com48 | october 2012 | electronicspecifierproduct

AUTOMOTIVE

TDI’s 2.7kW liquid cooledconverter is a 2700W environ-mentally sealed power mod-ule designed for use in electricor hybrid vehicles. It providesan isolated interface betweena 400Vdc bus and a tradi-tional 12V electrical system.The LiquaCore heart of the

system has an outstandinghistory, says the company.Electro-magnetic and envi-ronmental qualification tests

have shown that integratedLiquaCore solutions meet anarray of vehicle requirements.Features include liquid

cooling, IP67 and IP6k9k en-vironmental protection, with180~450Vdc input and10~15Vdc output voltageranges. Efficiency is rated upto 94%. The device comeswith CAN bus interfacing andcan be bulkhead mounted.8 For full editorial

Liquid Cooled Converter SuitsElectric & Hybrid Vehicle Apps

Oslon Black Flat LEDs fromOsram Opto Semiconduc-tors provide a high perform-ance lightsource for automo-tive front lighting systems,with high light output at highcurrents, uniform light distri-bution, thermal stability andexceptionally good contrastfor seeing and being seen. With advanced chip and

packaging technology and aC2 processed ceramic con-verter, this new LED is the lat-est Oslon Black compact, ro-bust LED for automotive andindustrial applications. It wasintroduced as a prototype inSeptember 2011.The Oslon Black Flat LED

features UX:3 chip technol-ogy to deliver high light out-put even at high currents.With a power draw of 2.3Wand an operating current of700mA, it achieves a typicalluminous flux of 200lm at25°C. If operated at 1.2A, itcan achieve up to 270lm,even with an application tem-

perature of 100°C in the chip. Thermal management is

simpler with this LED due togreater thermal stability ofthe luminous flux, even underhot application conditions,and also to new temperatureoptimised packaging. Typicalthermal resistance has beenreduced to a just 4kW.The thermal coefficient of

expansion of the LED’s blackQFN package is ideallymatched to the coefficient ofexpansion of the metal coreboard. All these propertiesmake the Oslon Black Flatfully AECQ101 automotivequalified, particularly stableand extremely durable:>100,000h at 700mA and achip temperature of 60°C. Oslon Black Flat is de-

signed without a lens andwith a low profile and flat de-sign that maximises opticalincoupling by allowing mini-mal distance between a lightguide or lens.8 For full editorial

Nexcom’s 10.4 ruggedisedVMC 3000 series vehiclemount computer is designedfor use in heavy duty vehiclesand can increase productivityand safety within harsh envi-ronments. The 3000 seriesfeatures scalable computingpower, 10.4 touch screen andvarious wireless communica-tion technologies. Combining robust design

and an IP65 compliant enclo-sure, VMC 3000 can gather,display, transmit and receiveinformation to help optimiseroute planning, increase situ-ational awareness, and mon-itor vehicle status. It is there-fore ideal for use within avariety of rugged vehicleswith locations such as con-struction sites, mines, quar-ries or warehouses.VMC 3000 series provides

computing performance ontwo levels. The 3500/3501

version is based on secondgeneration Intel Core i7-2610UE processors and in-tended for computing andgraphics intensive intelligentsystems. The 3000/3001 ispowered by Intel’s AtomD2550 processor and de-signed as a energy efficientsolution for in-vehicle telem-atics applications.All models have a 10.4in,

XGA touch screen, supportingup to 1000nit brightness. Theycan clearly show informationoutdoors, says Nexcom, evenin direct sunlight.8 For full editorial

Ruggedised Vehicle ComputerRamps Up Workplace Safety

OpenECU OBD infrastruc-ture software from Pi Innovoguides ECU developersthrough the complexities ofimplementing on-board di-agnostics and creating appli-cation software to managefault and diagnostic informa-tion handling. A frameworkis supplied that enables sys-tems engineers to focus ondefining system specific testsand fault definitions. TheOBD In-frastruc-turesoftwarethen cre-ates the in-frastructureto manage,store and report diagnosticdata conforming to selectedlegislated requirements frommajor emissions regulatorsincluding CARB, EPA and Eu-ropean Union.Once a fault condition has

been detected, OBD legisla-tion precisely defines howthe fault and associated in-formation should be storedand reported using definedconstructs, such as diagnostictrouble code lifecycles, in-useperformance ratios and com-munication protocols for lightand heavy duty vehicles ac-cording to ISO 15765 & SAE

J1939. The

productfeatures

libraries of eitherC code or config-

urable Simulinkblocks with interactive

dialogues that prompt forcorrect data, given the legis-lated compliance selected.An intelligent software buildsystem enables the systemsengineer to define each of,typically, hundreds of testscompletely independently.8 For full editorial

On-Board Diagnostics Implementation Accelerates

AAuuttoommoottiivvee FFrroonnttLLiigghhttiinngg LLEEDD DDeelliivveerrss

LLooww TThheerrmmaall RReessiissttaannccee

AUTOMOTIVE

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 49

VPT’s new triple output dc/dcconverter is designed to powerelectronics in military vehicles,ships, weapons, and otherrugged systems. VPT30-2800Tdelivers up to 30W and meetsseveral military standards andfeatures three outputs, en-abling engineers to powermultiple loads from a single,small, cost-saving module.“For ground systems, de-

mand is increasing for COTStype dc/dc converters that pro-vide flexible output power at

an affordable price,” explainsVPT VP Monty Pyle. “Our newVPT30 offers three independ-ent and isolated outputs with apower capability of up to 15Weach supporting multiple loadsfrom one module. Addition-ally, built-in compliances re-duce the component countand cost in power systems forarmoured vehicles, for exam-ple, where space is at a pre-mium yet military standardsare imperative. The triple out-puts plus the included compli-ances make the VPT30-2800Ta very cost-effective solutionfor demanding applications.”8 For full editorial

Triple Output Converters JoinHi-Rel COTS Line

Vishay Intertechnology isunleashing ten new IHLP lowprofile, high current inductorswith extended temperatureranges up to +155 °C for au-tomotive and commercial ap-plications. These 51 and 5Aseries devices come in 2525,3232, 4040, 5050 and 6767case sizes, with low profilesdown to 3mm and induc-tances of 0.22~33µH.With a frequency range up

to 1MHz, the devices serve ashigh performing, space andpower saving solutions forvoltage regulator module anddc/dc converter applications.The AEC-Q200 qualifiedIHLP-2525CZ-5A, IHLP-3232DZ-5A, IHLP-4040DZ-

5A, IHLP-5050FD-5A andIHLP-6767GZ-5A are de-signed for high-temperatureautomotive applications, in-cluding engine and transmis-sion control units, diesel injec-tion drivers, entertainmentand navigation systems, noisesuppression for motors, andpower seats and mirrors. The IHLP-2525CZ-51, IHLP-

3232DZ-51, IHLP-4040DZ-51, IHLP-5050FD-51, andIHLP-6767GZ-51 are in-tended for high temperaturecommercial applications, in-cluding next generation mo-bile devices, personal multi-media devices, distributedpower systems and FPGAs.8 For full editorial

Low Profile, High CurrentInductors Operate Up To +155°C

First SMD safety Y2 capacitorcomes from Murata and isdesigned for automotive ap-plications, with IEC 60384-14approval pending. With thegrowing demand for electricand hybrid electric vehicles,KCA capacitors are ideal aspart of an ac power line filterin a battery charger or as adc line filter of a dc/dc con-verter/inverter.Construction of the KCA se-

ries also incorporates im-proved longterm resilience tovibration and bendingstresses. Included is the useof metal terminals as protec-tion against substrate expan-sion and contraction forces

that can cause solder crackfailure as a result of the widetemperature changes experi-enced. The series also provides

higher reliability compared todiscrete capacitor elementssince they are designed to ac-commodate the higher levelsof mechanical shock andmovement encountered inany automotive environment.KCA is certified to AEC-

Q200 stress testing for pas-sive components. Rated at630Vdc working voltage, theseries is available in 2200,4700 or 10,000pF capaci-tance values.8 For full editorial

Surface Mount Safety CapacitorTargets Automotive Applications

NXP’s TDF8599C automo-tive stereo Class D amplifiertargets sound systems in pre-mium cars where high poweroutput and efficiency are re-quired. The device provides asupply range up to 48V, en-abling high output powerand the flexibility for sounddesigners to drive high ohmicload speakers. Such speakerscan be lighter, smaller andmore cost efficient, resultingin vibrant automotive soundfor the best sensory experi-

ence in the car.With audiophile quality

sound, TDF8599C is specifi-cally designed for automotiveapplications. The solution isdeemed energy efficient andenvironmentally friendly as itproduces little waste heat. With potent 48V sound

power, the amplifiers allowhigh supply voltages enablingdesigners to increase the im-pedance of the load speakersat high output power. Highimpedance of the speakersenables compact speaker de-sign, saving weight and cablediameters.8 For full editorial

Class-D AmplifierTakes Car StereoTo New Dimension

Analogue solutions for lownoise receivers used in highsensitivity RF automotive high-way tag applications fromSkyworks Solutions includetoll tag transponder systems.Devices are being deployedacross 40 million transponderssupporting small signal RF ap-plications where primary dcpower is not available.Skyworks solutions are

deemed ideal for other RFmixer and power detectionwireless applications includ-ing 802.11 wireless network-ing, CATV/Satcom, infrastruc-ture, medical, military andtest/measurement. SMS7630-079LF is a sur-

face mountable, plastic pack-aged silicon device for RF andmicrowave mixers and detec-tors. The series includes lowbarrier diodes and zero biasdetectors that combine Sky-works’s semiconductor tech-nology with low cost packag-ing. All solutions are 100% dctested and deliver tight pa-rameter distribution, whichminimises performance vari-ability. Wiring configurationsinclude singles, commoncathode, series pairs, uncon-nected pairs and dual-seriespairs. They may be used forfrequencies up to 10GHzgiven their low capacitance.8 For full editorial

Analogue Solutions SuitAutomotive Toll Tag Systems

DX4 embedded multi-touchdisplay modules from ander-sDX comprise a high per-formance PCAP multi-touchdesign pre-integrated with anOmap DM3730 based com-puter. The flexible and scala-ble embedded displays in-clude an optional MVA TFTdisplay, touch-screenandopti-callybondedcover lens. Touchscreen options

include 4.3in WQVGA orWVGA and 7in WVGA orWVGA, in single and multi-touch alternatives. Speciallydesigned for rigorous indus-trial, HMI and medical use,DX4 embedded boast hightouchscreen durability, trans-parency and overall opticalperformance. Moreover, theembedded displays are fullycompatible with decoratedcover glass or PMMA for en-hanced front panel styling, andoffer custom cut-out options for

speciality functionality.Heart of the DX4 is a pow-

erful, fanless SBC, based onthe TI DM3730 processorand running Linux Angstrom.With two CPU cores in a sin-gle package, the DX4 em-bedded computer supports2D/3D graphics with Open-GL and can handle even themost graphic-intensive appli-cations. DX4 also featuresmultiple interfaces and com-munication port options in-

cluding UART, SPI,I2C, USB,

Ether-net, SD-

CARD,WiFi and

Bluetooth.DX4 is heralded

as the fastest, easiestand most cost-effective

way for non-consumer devicemanufacturers to implement anext generation PCAP multi-touch display interface, opti-mised for and pre-integratedwith a powerful embeddedLinux computer. It promiseslongterm availability, hightechnical support, functionalupgrades and a form factor in-dependent design.8 For full editorial

Embedded ModuleIntegrates Multi-Touch Display

Densitron’s Mono OLED dis-plays include screen sizes of0.66~5.5in. And compre-hensive technical support isreadily available.Mono OLED benefits in-

clude a thin profile and lowpower consumption. Specifi-cally, displays in the rangehave up to 150,000h half lifeat 80cd/m2, 170° viewingangle, 2000:1contrast ratioand an operating tempera-ture range of –40~80°C.They readily make for indus-trial interfaces such as 8bit,three or four wire SPI and I2C.Several Mono OLEDs arebased on the SSD1306 driverIC, with a built in dc/dc circuitto minimise current con-sumption and materials costs.OLED displays in the range

are ideal for a wide variety ofapplications, ranging from in-strumentation and industrial

equipment in general to DABradio and PoS systems. Cus-tom display colours are avail-able to specific requirements.Samples and supporting

evaluation kits for MonoOLED displays are in stock atDensitron. Its plug&play eval-uation kit allows quick importof menu structured bit mapsdirectly from a PC to the dis-play. This user friendly kit alsoprovides direct access to thedisplay registers, enablingreal-time modifications to thedisplay properties. Only the included USB

cable is required for power-ing and interfacing with thekit. Working example codescan be supplied to help kickstart development and sup-port on hardware checks andcode debugging are providedat the initialisation stage.8 For full editorial

OLED Displays Shape UpWith Design Support

www.electronicspecifier.com50 | october 2012 | electronicspecifierproduct

OPTO & DISPLAYS

Nokia’s Lumia 920 and 820are first up among smart-phones to use advancedmulti-touch based on theSynaptics ClearPad capaci-tive touchscreen.The ClearPad Series 3 smart-

phone mobile touch solution isreckoned to raise the perform-ance on the Lumia 920 andLumia 820 with its support forgloves and fingernails.Until now, gloves and fin-

gernails have hamperedsmartphone touchscreen use.ClearPad Series 3 instantlyoptimises touch by automati-cally detecting the presenceof skin, gloved fingers oreven fingernails, providing

seamless multi-touch regard-less of input method.“With Synaptics’s continu-

ous innovation on touch, weare able to pioneer new tech-nologies,” says Nokia SeniorVP Kevin Shield. “Nokia hasbeen a leader in display tech-nology, and we are setting anew standard with Super Sen-sitive Touch technology on theNokia Lumia 920 and NokiaLumia 820.”Nokia’s flagship Windows

Phone 8 Lumia 920’s display,based on its PureMotion HD+boasts better than HD resolu-tion, overdrive technology forkeeping moving images pixelperfect and sunlight enhance-ments for easy viewing even inthe brightest sunlight.8 For full editorial

Synaptics Has Fingernail Touch

Cool white large LED panelindicators join the Marl port-folio for instrumentation andcontrol panel applications.Complementing red, yellow,green and blue LEDs in the671 Series, the new energyefficient cool white versionhas a luminous intensity of890mcd from a current ofjust 20m/A. High optical performance

and a forecast lifetime of100,000h will reduce main-tenance requirements, in-cluding replacing lamps anddowntime, to improve appli-cation reliability.The domed, colour diffused

20mm lens makes off-axisviewing easy to see if the LEDis truly on and not just catch-ing ambient light or sunlight.

The IP67 rated durable blackanodised housing providestotal protection against dustand the effects of temporaryimmersion into liquid. 671 Series LEDs have a

25.4mm mounting hole andare available as standard orhigh intensity, operating over24~230Vac/dc and –40~+85°C. A RIA 12/EN50155type approval version is alsoavailable on request for railindustry applications. 8 For full editorial

Durable Panel Indicator RangeAdds Cool White

OPTO & DISPLAYS

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 51

Oslon Signal LEDs fromOsram Opto Semiconduc-tors now include brilliantgreen and they are excep-tionally suitable in trafficlights, meeting major interna-tional standards. The semi-conductor IC based brilliantgreen stays clearly visibleeven in bright sunshine.Ask motorists around the

world their favourite trafficlight colour, says the com-pany and the obvious isgreen. Delivering an evenshade, this 503nm green,traffic lights will become evenmore vibrant in future usingthis high performance LED, intandem with existing red andyellow LEDs in the sameOslon family.The edge length of individ-

ual LEDs is 3 mm. A lens witha radiation angle of 80°guarantees focused lightemission, ensuring light onlyshines in the required direc-tion. Based on the Oslonplatform, the green LED canalso be incorporated into ex-isting traffic light systems atlow cost, says Osram.High performance ThinGaN

chip processing enables oper-ation at very high currents andhigh voltage. Rapid or pulsedsignal changes in traffic lightscan be implemented withoutproblem. The Oslon SignalVerde LED is equipped withan insulated heat sink makingit easy and convenient to in-stall, especially when FR4 cir-cuit boards are used.8 For full editorial

Out to develop and commer-cialise advanced OLEDs,STMicroelectronics hassigned a strategic agreementwith MicroOLED and investedsome €6million in the com-pany. With exceptionally highresolution and extremely lowpower consumption, said to bethe most power efficient on themarket, OLEDs are ideally formicro-displays in a wide rangeof portable applications.At around half the power

consumption of competitivedisplays, MicroOLED OLEDsboast superior pixel density forenhanced image quality. Itproduces OLEDs with doublepixel densities of alternativedisplays and contrast ratios10~100 times better.ST brings manufacturing and

broad consumer market ex-pertise to the table, along with

a wide IP portfolio covering de-sign, development and supplyservices for new micro-dis-plays, targeting a broaderrange of customers and appli-cations with the next genera-tion of the technology. ST owns several fully inte-

grated CMOS processes thatwill be used to develop a com-plete product roadmap. With alarge portfolio of design IP, STwill contribute to better inte-grate micro-display functionsthat today are on external con-trollers, which add cost andcomplexity to the final solution. 8 For full editorial

Partnership Set To Revolutionise High Resolution Micro-Displays

Cree’s XLamp XP-E2 LED de-livers higher lumens/Wattand lumens/£ to lower sys-tem costs for existing XP-Eand XP-G designs. It can in-crease lumen output of XP-Edesigns for the same cost andpower or lower system costwith fewer LEDs, enablinglighting manufacturers to de-liver a better lighting systemwith minimal redesign.“The price to performance

ratio is an important consider-ation for our design process,”explains Terralux VP Erik Milz.“Since many of our productsare based on Cree XP-E LEDs,the new XP-E2 LED is a signifi-cant upgrade in performance,helping to keep design costsdown and speeding time-to-market for our solutions.”XP-E2 occupies the same

3.45x3.45mm XP footprintand is optically compatiblewith all XP LED designs, in-cluding XP-E and XP-G. The

new LEDs also enable abroad range of high lumenapplications, from indoor andoutdoor lighting to portableand lamp retrofits.The SC3 based XP-E2 deliv-

ers up to 128lm/W at 350mA,85°C or 143lm1W at 350mA,25°C in 6000K cool white. TheSC3 platform, built on Cree’sadvanced silicon carbideprocess, integrates advances inLED chip architecture andphosphor and showcases anew package design.Luminaire makers seeking

Energy Star qualification, saysCree, will have access to spec-ification and performancedata, including LM-80 reports,which can speed time to mar-ket. XP-E2 LEDs succeed theoriginal XP-E LED for LM-80data, accelerating qualifica-tion of luminaires using just3000h of LM-80 data, insteadof the normal 6000h.8 For full editorial

Brighter, More Efficient LEDsShine In Development Too

TTrraaffffiicc LLiigghhtt LLEEDDssSSeett TToo GGoo GGrreeeenn

Vishay’s new super red,soft orange, yellow, yellowgreen, blue and white ultra-bright LEDs come in tiny SM0402 ChipLED packagingThey measure just 1x0.5x0.35mm and provide highbrightness with a luminousintensity of up to 180mcd.VLMx1500-GS08 series

blue and white LEDs areInGaN based and super red,soft orange, yellow, and yel-low green devices are All-nGaP, increasing output by afactor of three. The devices

are ideal for reliable per-formance in indicator andAV backlighting, to officeequipment and outdoormessage boards.Super red, soft orange, yel-

low, yellow green, and bluedevices are grouped by lumi-nous intensity, wavelength,and forward voltage. Beamangle is 130°. The white LEDsare chromaticity co-ordi-nated categorised accordingto CIE 1931, per packingunit, with typical co-ordinatesof 0.294 (x) and 0.286 (y)and a typical colour tempera-ture of 7000K.VLMx1500-GS08 LEDs

are available in 8mm tapedfor IR reflow soldering.8 For full editorial

Ultra-Bright Colour LEDs Compact ChipLEDPackaged

www.electronicspecifier.com52 | october 2012 | electronicspecifierproduct

OPTO & DISPLAYS

Heralding an industry first isLumex for its QuantumBriteshapeable LED backlight. Andholes can even be cut in thebacklight in virtually any shape.This combination of flexibleand shapeable LED backlighttechnology opens the door toa broad new range of LEDbacklight applications com-pletely customisable in shape,size and colour on flat andcurved surfaces. This backlightprovides a brightness of up to20cd/m2 for applicationswhere non-jarring, natural,soothing lighting is required.The ultra-thin QuantumBrite

has a profile thickness of just0.125mm, up to 97% thinnerthan traditional LED backlightsand up to 79% thinner than al-ternative flexible LED backlightoptions. The ultra-thin surfaceis textured with patterns spe-cially designed for enhancedlight distribution, resulting inup to 30% more uniform lightdistribution compared to alter-

native flexible backlights.This shapeable LED backlight

also boasts savings at prices upto 30% less expensive than ELand 50% less expensive thanfibreoptic backlights.“The introduction of Lumex’s

first generation of flexible LEDbacklight technology in late2010 represented an excitingnew generation of LED back-lighting and opened the doorto new applications on bothflat and curved surfaces,” com-ments Lumex Product DesignEngineer Steve Sievers. “Thetechnology provides enhancedperformance, an even thinnerprofile and completely un-precedented design flexibilityas engineers can now quitesimply cut the backlight aroundany obstacles they might haveon their circuit boards.”8 For full editorial

First ShapeableLED Backlight Shapes Up

iWatt’s iW3616 and iW3617digital ac/dc SSL LED driverswiden the capability of its flick-erless driver, increasing outputto 25W or higher, loweringmaterials costs by 10~20%and providing compatibilitywith an even wider range ofinstalled dimmers, includingresidential TRIAC and moresophisticated digital dimmers.This new SSL LED driver

platform is finding earlyadopter acceptance at keycustomers such as GreatechIndustrial where it alreadydesigned into its next-genera-tion LED lighting fixture line.“Product and light quality

are important to us,” explainsShenzhen Greatech Technical

Director Brian Wu. We choseiWatt’s iW3616 as it enabledus to produce the best SSLdriver with excellent perform-ance that meets all regula-tions worldwide with out-standing dimmer compatibilityand absolutely no flicker. Im-portantly, we were able to dothis cost effectively, enablingus to hit the price point thatconsumers demand.”Both devices are designed

to meet or exceed 85% effi-ciency for most new LEDdriver designs. For 120V/230Vac off-line LED lighting bulbsand fixtures, iW3616 andiW3617 output up to 12Wand 25W, respectively.8 For full editorial

Flickerless, Digital Dimming SSLLED Drivers Power Up To 25W

LED Engin’s LZ9 LuxiGenemitters output 2.5 times thelumens of existing LZ4 prod-ucts within the same 7x7mmfootprint. They more than dou-ble the Lux on Target, makingit ideal for directional lightingfixtures such as spot, accentand downlighting in re-tail and com-mercial ap-plications. The com-

pany also hasavailable afamily of secondary total inter-nal reflection lenses in spot,narrow flood and flood beamscompatible with the LZ9 series. The single emitter and single

lens combination, in colourtemperatures of 2700K warmwhite to 6500K cool white,provides the equivalent per-formance of a 75W PAR20 orPAR30 halogen source.

In addition to standard CRI80 products, LZ9 is the firstLuxiGen series with a CRI 90option for applications de-manding high colour render-ing. CCT binning of 3 Mac-Adam Ellipses is also availableas a standard option for uni-form colour emitter to emitter.

With 1350lm at 3000K and1600lm at 6500K, LZ9 incor-porates nine die in a compact,3x3 series parallel configura-tion package. Like other Luxi-Gen devices, a multi-layer ce-ramic substrate minimisesstress on the die.8 For full editorial

7mm LED EmittersBoost Lumen Output

Finisar and Xyratexdemon-strated, in conjunction withHuber+Suhner, vario-op-tics, and LSI Corporation, em-bedded optical connectivity in a12Gb/s enabled data storageenclosure. It shows how opticallinks carry 12G SAS traffic be-tween internal controllers viapolymer optical waveguides. Embedded optical intercon-

nect solutions, designed tomeet burgeoning demand indata capacity, bandwidth andaccessibility in future cloud andenterprise data centres, are ex-pected to overcome projectedperformance bottleneck indata storage sub-systems.The demonstration utilises

Finisar's board mounted opticalassemblies, new optics tech-nology mounted on a boardmuch like an IC, providing ex-tremely low power and highbandwidth density. The BOA isprotocol agnostic and supportsup to 24 lanes of SAS, PCIe,InfiniBand, and Ethernet aswell as proprietary protocolsenabling an entirely newecosystem of backplane appli-cations, as well as high speedinterconnects for supercomput-ers, servers, and switches.The prototype focuses on

how optical interconnects aresuccessfully implemented inSAS architectures, showcasingXyratex's next generation 12GSAS controllers, Finisar's opticalengines, vario-optic's polymerwaveguides, Huber+Suhner’soptical backplane connectors,and LSI's 12G expanders.8 For full editorial

Embedded 12G SAS OpticalInterconnectionDelivered

OPTO & DISPLAYS

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 53

To switch and dim lighting inresponse to hand gesturesand proximity without theneed for physical contact,touchless sensor modulessuch as Fara’s touchlessmodular system, availablefrom Rapid Electronics, addmultifunctional capabilities toLED lighting. The single and two channel

device sensors are IR oper-ated at up to 15cm away. Thetwo channel sensors provide2PWM: the proximity functionenables different colours tobe mixed and reset accordingto hand gesture. Colour temperatures can

be mixed and bespokeshades created.When used in conjunction

with LED lighting, thesetouchless modules are idealfor health and medical envi-ronments where a sterile at-mosphere is key. They canalso operate in bright sun-light and behind glass. No

switches are required, andthe modular nature of thetechnology means that allcomponents can be used in-dependently of each other. Various options enable tai-

lored systems to specific re-quirements for a wide rangeof applications such as gen-eral lighting, light mixingmodules, motor controls. They are also useful in con-

taminated environments suchas the food industry and forsanitary fittings or hospitals,waterproof switches, controlof multi-channel systems viaPWM or static outputs.The 2PWM module is

supported by a program-ming adaptor that enablesseven different firmwarefunctions such as dimmingand colour mixing.8 For full editorial

Touchless SensorHas Diming Under Control

GL-DL06D LED high per-formance 12W flicker-freedownlights from Glacial-Light come with a dimma-ble driver for adjustment tosuit preferred lighting. Theselightweight, all in onedownlights combine the LEDsource with a slim,sleek, and fash-ionable circu-lar fixturefor easy in-stallation.Energy ef-ficient andrequiringalmost zeromainte-nance; theyprovide a quickand easy, moneysaving replacement for tra-ditional lighting.GL-DL06D series is

deemed ideal for most in-door applications, fromcommercial lighting toshopping mall and house-hold. The CRI of up to 80makes it an especially suit-

able for residential, retailand food outlet lighting.

With its 120º beam angleand bundled dimmabledriver, GL-DL06D accepts awide range of input voltagesfor applications worldwide.The downlight is compact

and lightweight foreasy and eco-nomical instal-lation andmainte-nance.Three

colourvariantsare avail-able: GL-

DL06DA-WWis 3000K warm

white; GL-DL06DA-NW is 4000K and neutralwhite and GL-DL06DA-CWis 6000K and cool white.The series provides a powerfactor of at least 0.88 at120Vac and least 0.8 at240Vac. Rated life is30,000h.8 For full editorial

NanoScan v2 fromPhoton is its latest scan-ning, NIST calibrated slitbeam profiler. It usesmoving slits to measure beamsizes from microns to centime-tres at beam powers from mi-crowatts to kilowatts, with littleto no attenuation. This new version adds an

enhanced GUI with supportfor the Microsoft Windowsribbon toolbar. Dockable andfloatable windows plus con-cealable ribbon toolbars en-able users to make the mostof any size display, from smalllaptops to large, multi-moni-tor desktops.“NanoScan is ideal for pro-

filing CO2 beams in materialprocessing,” says Ophir Pho-tonics General Manager GaryWagner. “The scanning slit

technology provides the easiestto use profiling because it canmeasure most high powerbeams without the need forcomplicated attenuationschemes. Combine that withthe new user interface andnow users can see their laserbeams as never before.”NanoScan v2 supports 64

and 32bit Windows 7, enhanc-ing system configuration op-tions and increasing processingspeed. The beam profiler com-bines speed with flexibility. Sili-con, germanium, and pyro-electric detector optionstechnologies enable wave-length measurement from ul-traviolet to the far infrared. 8 For full editorial

Scanning SlitLaser Beam Profiler Gets Enhanced GUI

Avago Technologies has en-hanced its Versatile Link plasticoptical fibre range for indus-trial communications and con-trol links. POF provides infinitevoltage isolation and EMI im-munity, said to far exceed thatof copper cable. Solutions areup to 75% lighter than coppercables and provide similar orgreater performance with a50% tighter bend radius atcomparable cost.“The enhanced POF product

family is already an industrystandard for robust industrialcommunications,” extolsAvago Marketing DirectorBernd Luecke. “The enhance-ments Avago has releasednow give designers more ca-pability to integrate their de-signs and achieve lower costwithout compromising on per-formance or circuit isolation.”Designed for robust indus-

trial networking applications,

communications over plasticoptical fibre provides key ben-efits versus copper based im-plementations. Since opticalfibre has no metal in its con-struction, the communicationlink has infinite isolation be-tween nodes at the same timeand since light is used to trans-mit the signals there are no ef-fects from or creation of EMIon the transmission line. Additional copper cable

challenges include longer as-sembly time and productioncosts in cable preparation andtermination. Testing an assem-bled copper cable is alsoslightly more complex thanPOF as copper requires testsfor continuity, shorts, opensand breakdown voltage.8 For full editorial

Versatile LinkPlastic OpticalFibre Scores High

12W Dimmable LEDDownlight Suits

WorldwideApps

www.electronicspecifier.com54 | october 2012 | electronicspecifierproduct

DISTRIBUTION FOCUS

ELK series from Matrix Or-bital is a lightweight,durable, plastic enclosurebased on the popular LK204-7T-1U-USB display series. This complete display solu-

tion is designed to decreasedevelopment time by integrat-ing simple input, output, anddisplay interfaces into a robustexternal enclosure. Power andcommunication are providedby the attached USB cable forquick and easy setup.With USB communication

speeds of up to 115.2kbpsand a convenient rear

threaded camera mountpoint, the ELK series providesthe perfect interface solutionfor any project.The simple command struc-

ture permits easy softwarecontrol of many settings in-cluding backlight brightness,screen contrast, and baudrate. User input on is avail-able through a built-in, back-lit seven key tactile keypad.Three bi-colour LEDs providevisual outputs, and the built-in USB cable provides amulti-platform interface.8 For full editorial

Enclosure Turns Display...

eRA-Connect2-PI from LPRS isa USB module that provides asimple wireless bridge be-tween two Raspberry Pis or aRaspberry Pi and a PC, or in-deed any other devices thatsupports USB serial communi-cations. Both Linux and Win-dows drivers are provided tofacilitate system development.Utilising seamless easyRadio

technology at 868/915MHz,eRA-Connect2-PI providesconsiderably greater rangeand less power consumptionthan similar WiFi or Bluetoothmodules operating in the over-crowded 2.4GHz bands. Fre-quency, bandwidth, power out-put and data rate canoptionally be configured toallow multiple devices to com-municate free from interfer-ence from each other and anyother RF devices.eRA-Connect2-PI incorpo-

rates an eRA900TRS wirelessmodule which provides sim-ple-to-use, out-of-the-boxwireless serial communicationas a COMport. eRA-Connect2-PI features include allowingusers to change the radio

bandwidth from 150kHz downto a remarkable 12.5kHz, pro-viding narrow-band perform-ance at a wide-band budget.Internal temperature compen-sation insures less than 1.5kHzfrequency drift from ambient20ºC over a range of –40~+85ºC. This new feature mayalso be output as a tempera-ture measurement for the enduser equipment, accurate towithin 1ºC.No complex RF protocol soft-

ware is required to create aninstant bidirectional link. Thelow consumption eRA-Con-nect2-PI can be powered di-rectly from Raspberry Pi’s USBport. An integral SMA antennaconnector allows use of an off-board antenna. Transmit andReceive LEDs confirm commu-nication operation.Host devices can send and

receive half duplex communi-cations of up to 180bytes ofdata per packet, seamlesslydelivered to other hosts withinrange. There is no need forcomplicated ‘bit balancing’ orelaborate coding schemes.8 For full editorial

Wireless Modules BridgeRaspberry Pi Phenomenon

New co-operation betweenRutronik and emtrion bringsRutronik customers evenmore benefits followingemtrion and Triadem Solu-tions joining forces to in-crease the range of high end32bit CPU modules whichsupport QNX for industrialproducts. The companies alsowant to increase the qualityand reliability of the BSPs.Customers of Rutronik,

emtrion’s distribution partner,will also benefit from the widerproduct range, the shorter de-velopment times for QNXbased products, greater flexi-bility and better support.The first joint product from

emtrion and Triadem Solutionsis the QNX 6.5 BSP for em-trion’s DIMM-MX53 modulefor which development kits arealready available via Rutronik.Two additional BSPs for TIAM335x and Freescale i.MX6will also be available shortly.Rutronik has been

emtrion’s distribution partner

since June. Consequently, thedistributor has expanded itsrange of RISC based solu-tions for the embedded mar-ket: Industrial system integra-tors and system builders cansource all their requirementsfor RISC-based solutions –from low performance com-puter on modules via single-board computers to customerspecific baseboards – from asingle source Europe-wide.Rutronik customers also haveaccess to the comprehensivesoftware support offered byemtrion for Windows Embed-ded, QNX, Linux and An-droid, enabling them to re-duce their time to market to aminimum.8 For full editorial

SG-210S*H series SPXOsfrom Epson and availablefrom Rutronik, come in2.5x2mm packaging. Out-put frequency range is80~170MHz and oscillat-ing in fundamental mode,the MESA type structure de-livers low jitter and lowpower consumption atcompetitive cost. Epson’s photolithographic

QMEMs process enables ex-cellent control of the blankstructure, resulting in a highyield and low variations inthe production process. Typi-cal applications are in thenetworking field like Ether-net, fibre optics and anyprotocol requiring high datarate transmission with stan-dard frequencies of100MHz, 106.25MHz,125MHz, 133.33MHz,

150MHz and 156.25MHz.Depending on the prod-

uct, supply voltage is 1.8V,2.5V or 3.3V with a toler-ance of 10%. Phase jitter istypically 0.3ps with an offsetbetween 12kHz and20MHz. The frequency toler-ances are B: ±50x10–6and C: ±100x10–6 in atemperature range of – 20~+70°C. At temperatures be-tween –40 and +85°C, theyare L: ±50x10–6 and M:±100x10–6. Current consumption is

6mA maximum for the SG-210SEH, 7mA for the SG-210SDH and 9mA for theSG-210SCH at 80~125MHz with no load. At fre-quencies between 125.1MHz and 170MHz, maxi-mum current consumptionis 8mA for the SG-210SEH,9mA for the SG-210SDHand 11mA for the SG-210SCH version.8 For full editorial

Low PowerSPXOs Boast Low Jitter

Rutronik Web Widens ToQNX Portfolio From Emtrion

DISTRIBUTION FOCUS

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 55

Hypertac REP high reliability,rectangular, plastic connec-tors are now available fromAercowith no minimumorder quantities. The connec-tors are suitable for any envi-ronment requiring quick andsecure connection, in particu-lar demanding applicationsas found in the rail and de-fence industries. Aerco canalso provide complete, fullytested, pre-cabled assembliesto customer requirements.Available with 2~12 way

pin layouts, REP features Hy-pertac’s high performance hy-perboloid contacts that en-sures low contact resistanceand a high current of up to13A continuous, meeting 18Aaccording to NFF61-030.Shock and vibration proof

according to EN61373, resist-ant to salt spray and fire and

smoke with low toxicity emis-sion, REP connectors use aninnovative contact design thatallows for a lower matingforce thereby increasing thelife of the contacts up to 500mating cycles thus reducingservice costs. Interfacial sealsand integral rear grommetsensure environmental sealingto IP66 and IP67. The operat-ing temperature range isfrom –40~+100°C.Only one size of contact is

used to crimp across a wirerange of 0.5~2.5mm² andthis reduces supply chaincosts and means that onlyone set of tools is requiredover the range of insert lay-outs. Customers can polarisethe connectors by configuringthree coding keys thus simpli-fying the part number system.8 For full editorial

Connectors Make FastFor Demanding Applications

As a response to the increas-ing thermal problems, Pana-sonic’s Pyrolytic highly orien-tated graphite sheet has astructure close to a single crys-tal. It combines high thermalconductivity with a thin, lowweight structure. PanasonicPGS is available from Rutronik.Thermal problems increase

with the miniaturization andthe high density mounting ofdevices. Effective thermal solu-tions are becoming more andmore important to reach thewanted performance of appli-cations and enable the designstandards. The PGS fromPanasonic provides two mainthermal functions: Firstly, ittransfers the heat energy fromthe heat source to the heatsink. This allows a design posi-tioning the heat sink not di-rectly at the heat source. Sec-ondly, the PGS acts as athermal interface dispatchingthe heat to the heat sink, thusimproving the efficiency of theheat sink. One of the effects is

the reduction of hot-spots.The PGS spreads the heat

energy and improves the relia-bility of the semiconductor thatproduces the heat. These fea-tures make the PGS the idealthermal solution for LED light-ing solutions, automotive light-ing equipment, medical, in-dustrial and optical equipment,telecom, communication,handheld and portable de-vices, semiconductor manufac-turing equipment, embeddedand PC applications, batterycooling, the temperature re-duction of housing of devicesand all miniaturized anddownsized devices.The PGS thermal conductiv-

ity is 700~1750W/mK and it isthin at 17~100µm, light at1~2g/cm3 and highly flexiblein bending and shaping.8 For full editorial

Cool GraphiteSheet Solutions...

New technology websiteMouser.com homes in onharsh environments. It con-tains technical informationthat aids the thoughtprocesses of design engi-neers in developing and de-signing new solutions thatmeet the most stringent, rig-orous operating conditions.While electronic compo-

nents are primarily designedfor stable, controlled environ-ments, the real world oftendictates extreme conditions.For example, dust, water, andeven corrosive atmospheresoccasionally factor into thedesign and present otherchallenges that push compo-nents to the nth degree.The high temperature of

down hole applications is ahuge challenge to electroniccomponents. Temperaturesupwards of 200°C are not un-

common and even exceed themelting point of some solders.Driven by our endless quest fornatural resources and energy,it’s an area that exemplifiescontinual advancement andremains a key focus for downhole engineers worldwide.Other areas covered are

IEC 60529 IP Code andNEMA Type Number. Theseratings designate the varioustypes and degrees of protec-tion afforded to electricalequipment by a housing orenclosure against water, dust,corrosive agents, and more. Inaddition, the site providesextra resources to help spear-head design developmentsuch as in-depth industry arti-cles, white papers and a com-prehensive library of technicalresources that can be re-viewed by topic or supplier.8 For full editorial

Mouser Weaves Technology WebFor Harsh Environments

Richardson RFPD is heraldingfull design support capabilitiesfor metallised polypropylene dclink capacitors from Kendeil.The two series of devices, des-ignated K31 and K32, arerated for voltages ranging from600 to 1300V.K31 series is designed for

low and medium frequencyswitching (less than 15 kHz),while the K32 series is de-

signed for high frequencies ex-ceeding 15 kHz. Kendeil’s K32 series also

uses segmented metallisedpolypropylene, with theadvantages of controlled ca-pacitance loss and open cir-cuit protection.Kendeil produces high qual-

ity screw terminal and snaptype aluminium electrolytic ca-pacitors and dc link polypropy-lene film capacitors. All capaci-tors meet CECC, DIN, IECrequirements and most re-cently, Kendeil achieved ISO9001:2008 certification.8 For full editorial

MetallisedPolypropylene DCLink CapacitorsFully Supported

www.electronicspecifier.com56 | october 2012 | electronicspecifierproduct

Designing LED LightingWith Custom Flashing

Stellaris ARM Cortex-M4F MCUsTI’s Stellaris FPU delivers excellent power performance withhigh analogue integration.

Power Conversion ElectronicSwitching

Amantys CEO Bryn Parry talks to Arm about the company'sinnovative power conversion electronic switching productsand the use of Cortex-M3 MCUs in the products.

Electromagnetic Circuit Breaker

TECH VIDEOS

Barracuda DC/DCPower Conversion Modules

Digi-Key previews GE Energy's Barracuda dc/dc PTM powerconversion modules.

Heart of TE Connectivity’s Vesa system solution is the Vesavacuum circuit breaker, providing the first completely elec-tromagnetically operated system for high voltage vehicles.

Constant current control for multiple high power LED chan-nels and support for custom flashing sequences and strob-ing reviewed in configuring this ASSP.

www.electronicspecifier.com electronicspecifierproduct | october 2012 | 57

LED Lighting With Colour MixConfiguring LED embedded drivers graphically.

Starter Kit ProvidesEasy Development

TI’s AM335x Starter Kit makes it easy and cost effective todevelop the Sitara AM335x Arm Cortex-A8 processor.

Ready for ISO 26262? IEC 61508?

TECH VIDEOS

Chip Monitors High Voltage Apps

Linear's LTC6803 multicell battery stack monitor is key inbattery management.

ASSP Is Easy To Configure

Freescale’s SafeAssure functional safety programme helpssimplify achieving system compliance with functional safetystandards in the automotive and industrial markets.

See how easy it is to initialise and configure the new Rene-sas lighting ASSP RL78/I1A for generating the completeDMX512 protocol stack using the dedicated function withinthe AppliletEZ GUI.

Board Mounted Power

1 to 3 Watts• SIP & DIP packages• Regulated & unregulated versions• ±10%, 2:1 & 4:1 inputs• 500 V to 6 kV isolation

2 to 60 Watts• 1 x 1”, 1 x 2”, 2 x 2” & DIP-24 footprints• Regulated single, dual & triple outputs• Wide 2:1 & 4:1 inputs• Up to 3.5 kV isolation

Medical safety approvals• 3 to 10 Watts• Meets IEC60601-1 3rd edition• 4000 VAC reinforced insulation• 2µA patient leakage current

LED drivers• 5 to 48 Watts• Up to 1000 mA output• Constant current output• 95% efficiency

Surface mount power• 1 & 2 Watts• Regulated & unregulated versions• ±10, 2:1 & 4:1 inputs• Single & dual outputs

ECE series• 5 to 40 Watts• Ultra compact from 1” x 1”• Encapsulated• Single and dual outputs• <0.3 Watts no load input power

ECL series• 5 to 30 Watts• Ultra compact size• Single & multi outputs• Open-frame & encapsulated• <0.3 Watts no load input power

AC-DC low power board mounted ranges

Visit our website to request acopy of our latest Power SupplyGuide and see our complete lineof power products.

Industry standard DC-DC ranges

Low cost

High reliability

Short lead times

Industry standard footprints

Highest power density

Download FREEinteractive guides to help select your

AC-DC & DC-DC products at:

www.xppower.com/literature_downloads

GREEN•POWER Selector AppAvailable

AC-DC low power board mounted ranges

Industry standard DC-DC ranges

5WACDCin 1”x1”

20WDCDCin 1”x1”

Also available from www.farnell.com