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© 2011 ANSYS, Inc. April 27, 2015 1 New features for ANSYS Electromechanical products ——ANSYS电磁产品新功能 Marius Rosu PhD Lead Product Manager ANSYS Inc. Vincent Delafosse Senior Product Manager ANSYS Inc. Lee Johnson Product Manager ANSYS Inc.

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Page 1: New features for ANSYS Electromechanical products ——ANSYS ...register.ansys.com.cn/ansyschina/EV_HEV/11_seminar/5_ANSYS机 … · Lamination stacked in Z d. direction . x. z

© 2011 ANSYS, Inc. April 27, 2015 1

New features for ANSYS Electromechanical products ——ANSYS电磁产品新功能

Marius Rosu PhD Lead Product Manager ANSYS Inc.

Vincent Delafosse Senior Product Manager ANSYS Inc.

Lee Johnson Product Manager ANSYS Inc.

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© 2011 ANSYS, Inc. April 27, 2015 2

Introduction: Electromechanical Perspective 简介:电磁产品研发愿景

ANSYS has a comprehensive portfolio of simulation packages. Our goal is to provide tools that enable Electric Engineers to solve their problems in the most efficient way

ANSYS focus:

- Developing cutting-edge technology solving real world problems faster

- Enabling couplings between 3D physics solvers where it is relevant

- Leveraging the high-fidelity of 3D simulations into the “0D” system simulation design

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Typical Electromechanical System 典型机电系统组成

CPU, ASIC, Memory Controller

Power Electronics

Controller

Electro-mechanical Device Power

- +

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Maxwell 2-D/3-D Electromagnetic Components

Field Solution

Model Generation

HFSS

ANSYS

Mechanical Thermal/Stress

ANSYS CFD Fluent

PExprt Magnetics

RMxprt Motor Design

Maxwell Design Flow – Field Coupling Maxwell设计流程-场耦合

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© 2011 ANSYS, Inc. April 27, 2015 5

Simplorer System Design

PP := 6

ICA:

A

A

A

GAIN

A

A

A

GAIN

A

JPMSYNCIA

IB

IC

Torque JPMSYNCIA

IB

IC

TorqueD2D

HFSS, Q3D, SIwave

ANSYS CFD Icepak/Fluent

Maxwell 2-D/3-D Electromagnetic Components

ANSYS

Mechanical Thermal/Stress

PExprt Magnetics

RMxprt Motor Design

Simplorer Design Flow – System Coupling Simplorer设计流程—系统耦合

Model order Reduction

Co-simulation

Push-Back Excitation

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© 2011 ANSYS, Inc. April 27, 2015 6

ANSYS Maxwell Applications • Linear or rotational actuators • Relays • Magnetic recording heads • Coils • Permanent magnets • Sensors • Transformers • Converters • Bus bars • Electrostatic discharge • Electromagnetic shielding • EMI/EMC • Semiconductor • Biomedical

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Maxwell - New Vector Hysteresis Model Maxwell-矢量磁滞模型

Magnetic Field Decomposed into a Reversible and an Irreversible Components Recoil Lines

Hre

M

H

M

2Hir H

Hre

Hs

Hre Hir

+=+=+=

irreirre

irre

HHMBBBHHH

00 )( µµ

)()( 00 cre HHMHHB −=+−= µµH

B

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• Some electromechanical devices rely on Vector Hysteresis to function Hysteresis motors

• Some Electromechanical devices have some remanent behavior that

only a Vector Hysteresis formulation can capture Sensors/Actuators

• Loss accuracy - Captures both alternating and rotational fields. The

global trend of designing more energy efficient power devices pushes us to provide better loss accuracy. The traditional method (Steinmetz) has limitations are removed by the new Vector Hysteresis Modeling.

Why Vector Hysteresis in Maxwell 为什么要在Maxwell中添加矢量磁滞模型

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First Introduced in Maxwell R14.5

→ Formulation considering Major Loop

Extended in Maxwell R16

→ Formulation considering Minor Loop

Vector Hysteresis Modeling 矢量磁滞材料建模

-8

-4

0

4

8

-20 -10 0 10 20

B (k

G)

H (O)

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© 2014 ANSYS, Inc. April 27, 2015 10

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Vector Hysteresis Modeling Description 矢量磁滞材料建模简介

First Magnetizing Curve & Hc

When the Hysteresis is defined by

H

time H

B

Hc

New in R16

-0.8

-0.6

-0.4

-0.2

0

0.2

0.4

0.6

0.8

-1500 -1000 -500 0 500 1000 1500

B (

T)

H (A/m)

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Alternating Field

Rotational Field

Hystereis Simulation Need – Losses 磁滞仿真分析需求-损耗计算

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12 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Vector Hysteresis Parameter Identification 磁滞材料建模参数设置

→ Enter B-H Curve

→ Select Hysteresis Model

→ Enter Hci

→ Enter Kc (Eddy Current losses)

New in R16

6/22 dkc ⋅⋅= σπLamination Conductivity Lamination Thickness

σ

d

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» Je due to Bt is being realized through kc coefficient

Enhanced Core Loss 铁芯损耗计算功能提升

Lamination stacked in Z direction d

x

y z

Bt

6dk 22c /⋅⋅= σπ

tn

c ∂∂

−=×∇×∇BH σ A post processing step in terms of Bn

» Introduce an algorithm to take into account Je due to Bn

Bn

Je

Je

Consider Eddy Loss Due to Lamination Bn

New in R16

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In R15 and Before: → User input data points will be used to construct analytic function derived from curve fitting based on minimum least- square approach → It is desirable if the sampling points are close-to evenly distributed along H-axis, not B-axis

In R16: → Maxwell uses the actual points that are entered by user → More accurate representation of BH characteristic if measurements are used

More accurate B-H handling 更精确的B-H曲线处理方法

• Best Practices to Better and Faster Convergence – BH data should be smooth (including derivatives) and enough datapoints

• To provide low-field data as well as high-field data

High-Field Data

Low-Field Data

B-H Data

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→Symmetry support in 3D translation motion with sliding interface

→ Reduce the domain space and speed up the FE analyses

→ No remeshing at each time step

Linear Motor support 直线电机设计功能提升

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R15 Mesh for Induction Machine

→ Mesh size 95,000 Elements

→ 3min 15 on average per time steps

R16 Clone Mesh for Induction Machine

→ Mesh size 50,000 Elements

→ No Mesh Operations are needed

→ 1min 15 on average per time steps

Clone Mesh reduces problem size 克隆网格降低模型网格量

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Enhanced 3D Solver Performance 3D求解器功能提升

2006

Maxwell 3D v11

240,000 Tets

75mins per time step

About 19.5 days total

2011

Maxwell 3D v14

95,000 Tets

13mins per time step

About 4 days total

2014

Maxwell 3D R15

95,000 Tets

3mins per time step

About 20hours total

2015

Maxwell 3D R16

50,000 Tets

75 sec per time step

About 8hours total

R16 solves 60 times faster than v11

ANSYS Ansoft

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Enhance 2D Solver Performance 2D求解器功能提升

2011

Maxwell 2D v14

4,300 triangles

10 mins to solve

2014

Maxwell R15

4,300 triangles

6 mins to solve

2015

Maxwell R16

1,800 triangles

3:15 mins to solve

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Enhanced Simplorer co-simulation Performance Simplorer协同仿真分析功能提升

FE Simulator

2D and 3D transient solvers support larger time-steps ensuring convergence (applying roll-backs) when external circuit coupling is present → Enable usage of larger time steps → Ensure much better convergence for very complex models with close loop controls

Circuit Simulator

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New method to create ROM (or e-model) out of Maxwell using dedicated Circuit element

→ Set up transient Analysis as usual

→ Add dedicated circuit elements

→ Specify Machine characteristics (Max currents, poles, …)

→Run the transient analysis

→ Maxwell automatically sweep angles and currents in transient with no remeshing in DQ or ABC format

e-Model Extractions of Electric Machines 电机等效电路模型提取

ECEW

ECE3

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Market Voice/Demand: MIL, SIL, HIL (Potential extention to systems via Model-Based Design)

Maxwell Capability: ECE (Equivalent Circuit Export)

Model-Based Design FEA 基于“模型”的FEA设计

Controller

ETAS

, NI,

Opa

l-RT

e-dr

ive

plat

form

s

Maxwell e-model

10-20kHz 100-50µs

850ns

FPG

A b

ased

e-m

odel

(ET

AS,

NI)

SIL (Software-In-The-Loop)

Embedded Software

Sim

plor

er e

-driv

e sy

stem

sim

ulat

ion

HIL (Hardware-In-The-Loop)

ECU-Hardware

Will be extended to Transformers and actuators in R17

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22 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Template-Based Magnetic and Thermal Analysis 基于“模板”的电磁、热分析 →Template-based electrical machine

design

→ Fast analytical calculations for popular electric machine topologies

→ One-click setup for Maxwell 2D and 3D finite element Solutions

→ Network analysis dedicated to thermal analysis

→ Heat transfer data calculated automatically

→ Detailed cooling systems & facilitates optimisation

RMxprt

Motor-CAD

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23 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Template-Based Magnetic and Thermal Analysis 基于“模板”的电磁、热分析

→ Electromagnetic performance calculated in RMxprt → Default housing in RMxprt has axial fins which are suitable for TEFC cooling → Geometry and power losses are exported to Motor-CAD

RMxprt

Motor-CAD

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24 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Template-Based Magnetic and Thermal Analysis 基于“模板”的电磁、热分析

→ Winding also exported from RMxprt → Motor-CAD updates winding to account for wire size available, enamel on wire and slot liner available

RMxprt

Motor-CAD

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Magnetic Field →Extend support to non-rotational applications

→Add more user control regarding the FFT input parameters

→Add support for stress induced bending

→Add link for LMS’s Virtual Lab for acoustic

Improvements in the Harmonic Stress Coupling 谐响应、应力耦合仿真分析功能提升

Structural Dynamics Acoustic Field

Forces Displacements

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26 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Modeling the System系统建模 Powerful Capabilities for Assembly and Reuse 强大的系统集成与复用能力

Reduced Order Model Creation

Functional Mockup Interface (FMI)

3rd Party System Modeling tools

(AMESim, Simulink, Dymola, GT Suite etc.)

Embedded Software Integration

ANSYS SCADE

Simulink C Code

Co-simulation with 3D Physics

ANSYS 3D Physics

Mech EM Thermal Fluid

Multi-Domain Model Libraries

Language-Based Modeling

VHDL-AMS C/C++ SPICE SML

Modelica

Analog

Digital

Multi-Domain

App-Specific

Power Systems

Manufacturers

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27 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Simplorer R16 Highlights Simplorer R16亮点功能

New and Improved Links with ANSYS 3-D for: • Electromagnetics • Fluids • Thermal

Libraries for Aerospace and

Automotive Systems

Improved support for SCADE &

Modelica via FMI • Solver Speedups (15-30%) • GUI and post-processing

improvements

New Libraries containing 100s of

Devices and Controllers

Analysis Replay

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Manufacturer Component Libraries供应商器件库 New Power Management Ics新增电源管理芯片

High and Low Side Switches • International Rectifier

Linear Regulators • Texas Instruments

Power Factor Correction • International Rectifier • Texas Instruments

Three Phase Bridge Drivers • International Rectifier

High and Low Side Drivers • Analog Devices • Intersil • International Rectifier • Texas Instruments

PWM Controllers • Analog Devices • Linear Technology • Texas Instruments

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29 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Manufacturer Component Libraries供应商器件库 New Power Semiconductors, Ultracapacitors 新的半导体器件,超级电容

Si Power Semiconductors • ABB • APT • Fairchild • Fuji • Infineon • IRF • IXYS • NXP • Toshiba

SiC Power Semiconductors • Cree • Infineon • ROHM

Ultracapacitors • Maxwell

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30 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Enhanced H/EV System Library H/EV系统库功能提升

Extends application coverage for system-level analysis of electric vehicle powertrains

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31 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

New ANSYS Fluent LTI ROM Link 新增Fluent LTI ROM接口功能

• Takes step responses from Fluent CFD and uses rational fitting to generate accurate, efficient state space models

• Integrate system-level networks of fluid / thermal behavior and simulate orders of magnitude faster than CFD (seconds vs. hours)

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Heat Exchangerhigh_t

low_t

outlet_hinlet_h

outlet_c

inlet_c

U2_heat_ex

inletoutlet

U1_low_pump

inletoutlet

U3_h_pump

temp

temp

0.00 2.50 5.00 7.50 10.00 12.50 15.00 17.50 20.00Time [s]

300.00

350.00

400.00

450.00

500.00

550.00

600.00

Y2

[kel

]

Ansoft LLC Simplorer1XY Plot 1Curve InfoU2_heat_ex.tc100

TRU2_heat_ex.th100

TR

0

100

200

300

400

500

600

700

800

0 0.5 1 1.5 2

時間 (us)

電圧 (V)

0

100

200

300

400

500

600

700

800

電流 (A)

VCE-実測

VCE-SIM

IC-実測IC-SIM

FMU Functional Mock-up

Unit (Compiled C-code)

FMI Support in Simplorer支持FMI模型 Available Today in Version R15 and later R15及以后版本支持上述功能

FMI 1.0 for Model Exchange - Export

ANSYS Simplorer

Simplorer R16: FMUs now stored with Simplorer Design

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33 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential

Improved Simulation Performance 仿真性能提升 R16 vs. R15

Source Example R15 (s) R16 (s) Speed

up Customer <name removed> 656 467.9 29% Customer <name removed> 6015 5012 17% Customer <name removed> 224.2 206.1 8% Customer <name removed> 336 148.3 56% Customer <name removed> 98.2 81.7 17% Customer <name removed> 189.6 173.6 8% Customer <name removed> 50 4 90% VDA VDA eCar 51.4 44.9 13%

15% to 30% typical speed-up in transient simulation for power electronic and multi-domain

system applications

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Device Characterization Tool Usability 特征化建模工具易用性提升

• Characterization Tool now has modeless behavior for easy switching to/from Simplorer

• Extraction details are shown in the Simplorer Messages tool

• Improved dialogs help guide the characterization flow

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R&D Directions

• Solving faster and smarter • Solving faster multiple projects for parametric and Robust Design • Consider advanced Magnetic properties, including:

• Vector Hysteresis, Coreloss accuracy • Magnetization/Demagnetization

• Enable seamless multiphysics and system coupling • 3D coupling for Thermal, Stress, Harmonic, … • Reduce Order Model techniques for virtual

prototypes or Hardware in the Loop • Co-simulation techniques

• Enable Customization

• Modelica integration in Simplorer

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Thank You