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© 2011 ANSYS, Inc. April 27, 2015 1
New features for ANSYS Electromechanical products ——ANSYS电磁产品新功能
Marius Rosu PhD Lead Product Manager ANSYS Inc.
Vincent Delafosse Senior Product Manager ANSYS Inc.
Lee Johnson Product Manager ANSYS Inc.
© 2011 ANSYS, Inc. April 27, 2015 2
Introduction: Electromechanical Perspective 简介:电磁产品研发愿景
ANSYS has a comprehensive portfolio of simulation packages. Our goal is to provide tools that enable Electric Engineers to solve their problems in the most efficient way
ANSYS focus:
- Developing cutting-edge technology solving real world problems faster
- Enabling couplings between 3D physics solvers where it is relevant
- Leveraging the high-fidelity of 3D simulations into the “0D” system simulation design
© 2011 ANSYS, Inc. April 27, 2015 3
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Typical Electromechanical System 典型机电系统组成
CPU, ASIC, Memory Controller
Power Electronics
Controller
Electro-mechanical Device Power
- +
© 2011 ANSYS, Inc. April 27, 2015 4
Maxwell 2-D/3-D Electromagnetic Components
Field Solution
Model Generation
HFSS
ANSYS
Mechanical Thermal/Stress
ANSYS CFD Fluent
PExprt Magnetics
RMxprt Motor Design
Maxwell Design Flow – Field Coupling Maxwell设计流程-场耦合
© 2011 ANSYS, Inc. April 27, 2015 5
Simplorer System Design
PP := 6
ICA:
A
A
A
GAIN
A
A
A
GAIN
A
JPMSYNCIA
IB
IC
Torque JPMSYNCIA
IB
IC
TorqueD2D
HFSS, Q3D, SIwave
ANSYS CFD Icepak/Fluent
Maxwell 2-D/3-D Electromagnetic Components
ANSYS
Mechanical Thermal/Stress
PExprt Magnetics
RMxprt Motor Design
Simplorer Design Flow – System Coupling Simplorer设计流程—系统耦合
Model order Reduction
Co-simulation
Push-Back Excitation
© 2011 ANSYS, Inc. April 27, 2015 6
ANSYS Maxwell Applications • Linear or rotational actuators • Relays • Magnetic recording heads • Coils • Permanent magnets • Sensors • Transformers • Converters • Bus bars • Electrostatic discharge • Electromagnetic shielding • EMI/EMC • Semiconductor • Biomedical
© 2011 ANSYS, Inc. April 27, 2015 7
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Maxwell - New Vector Hysteresis Model Maxwell-矢量磁滞模型
Magnetic Field Decomposed into a Reversible and an Irreversible Components Recoil Lines
Hre
M
H
M
2Hir H
Hre
Hs
Hre Hir
+=+=+=
irreirre
irre
HHMBBBHHH
00 )( µµ
)()( 00 cre HHMHHB −=+−= µµH
B
© 2011 ANSYS, Inc. April 27, 2015 8
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• Some electromechanical devices rely on Vector Hysteresis to function Hysteresis motors
• Some Electromechanical devices have some remanent behavior that
only a Vector Hysteresis formulation can capture Sensors/Actuators
• Loss accuracy - Captures both alternating and rotational fields. The
global trend of designing more energy efficient power devices pushes us to provide better loss accuracy. The traditional method (Steinmetz) has limitations are removed by the new Vector Hysteresis Modeling.
Why Vector Hysteresis in Maxwell 为什么要在Maxwell中添加矢量磁滞模型
© 2011 ANSYS, Inc. April 27, 2015 9
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First Introduced in Maxwell R14.5
→ Formulation considering Major Loop
Extended in Maxwell R16
→ Formulation considering Minor Loop
Vector Hysteresis Modeling 矢量磁滞材料建模
-8
-4
0
4
8
-20 -10 0 10 20
B (k
G)
H (O)
© 2014 ANSYS, Inc. April 27, 2015 10
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Vector Hysteresis Modeling Description 矢量磁滞材料建模简介
First Magnetizing Curve & Hc
When the Hysteresis is defined by
H
time H
B
Hc
New in R16
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
-1500 -1000 -500 0 500 1000 1500
B (
T)
H (A/m)
© 2014 ANSYS, Inc. April 27, 2015 11
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Alternating Field
Rotational Field
Hystereis Simulation Need – Losses 磁滞仿真分析需求-损耗计算
12 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Vector Hysteresis Parameter Identification 磁滞材料建模参数设置
→ Enter B-H Curve
→ Select Hysteresis Model
→ Enter Hci
→ Enter Kc (Eddy Current losses)
New in R16
6/22 dkc ⋅⋅= σπLamination Conductivity Lamination Thickness
σ
d
© 2011 ANSYS, Inc. April 27, 2015 13
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» Je due to Bt is being realized through kc coefficient
Enhanced Core Loss 铁芯损耗计算功能提升
Lamination stacked in Z direction d
x
y z
Bt
6dk 22c /⋅⋅= σπ
tn
c ∂∂
−=×∇×∇BH σ A post processing step in terms of Bn
» Introduce an algorithm to take into account Je due to Bn
Bn
Je
Je
Consider Eddy Loss Due to Lamination Bn
New in R16
© 2011 ANSYS, Inc. April 27, 2015 14
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In R15 and Before: → User input data points will be used to construct analytic function derived from curve fitting based on minimum least- square approach → It is desirable if the sampling points are close-to evenly distributed along H-axis, not B-axis
In R16: → Maxwell uses the actual points that are entered by user → More accurate representation of BH characteristic if measurements are used
More accurate B-H handling 更精确的B-H曲线处理方法
• Best Practices to Better and Faster Convergence – BH data should be smooth (including derivatives) and enough datapoints
• To provide low-field data as well as high-field data
High-Field Data
Low-Field Data
B-H Data
© 2011 ANSYS, Inc. April 27, 2015 15
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→Symmetry support in 3D translation motion with sliding interface
→ Reduce the domain space and speed up the FE analyses
→ No remeshing at each time step
Linear Motor support 直线电机设计功能提升
© 2011 ANSYS, Inc. April 27, 2015 16
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R15 Mesh for Induction Machine
→ Mesh size 95,000 Elements
→ 3min 15 on average per time steps
R16 Clone Mesh for Induction Machine
→ Mesh size 50,000 Elements
→ No Mesh Operations are needed
→ 1min 15 on average per time steps
Clone Mesh reduces problem size 克隆网格降低模型网格量
© 2011 ANSYS, Inc. April 27, 2015 17
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Enhanced 3D Solver Performance 3D求解器功能提升
2006
Maxwell 3D v11
240,000 Tets
75mins per time step
About 19.5 days total
2011
Maxwell 3D v14
95,000 Tets
13mins per time step
About 4 days total
2014
Maxwell 3D R15
95,000 Tets
3mins per time step
About 20hours total
2015
Maxwell 3D R16
50,000 Tets
75 sec per time step
About 8hours total
R16 solves 60 times faster than v11
ANSYS Ansoft
© 2011 ANSYS, Inc. April 27, 2015 18
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Enhance 2D Solver Performance 2D求解器功能提升
2011
Maxwell 2D v14
4,300 triangles
10 mins to solve
2014
Maxwell R15
4,300 triangles
6 mins to solve
2015
Maxwell R16
1,800 triangles
3:15 mins to solve
© 2011 ANSYS, Inc. April 27, 2015 19
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Enhanced Simplorer co-simulation Performance Simplorer协同仿真分析功能提升
FE Simulator
2D and 3D transient solvers support larger time-steps ensuring convergence (applying roll-backs) when external circuit coupling is present → Enable usage of larger time steps → Ensure much better convergence for very complex models with close loop controls
Circuit Simulator
© 2011 ANSYS, Inc. April 27, 2015 20
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New method to create ROM (or e-model) out of Maxwell using dedicated Circuit element
→ Set up transient Analysis as usual
→ Add dedicated circuit elements
→ Specify Machine characteristics (Max currents, poles, …)
→Run the transient analysis
→ Maxwell automatically sweep angles and currents in transient with no remeshing in DQ or ABC format
e-Model Extractions of Electric Machines 电机等效电路模型提取
ECEW
ECE3
© 2011 ANSYS, Inc. April 27, 2015 21
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Market Voice/Demand: MIL, SIL, HIL (Potential extention to systems via Model-Based Design)
Maxwell Capability: ECE (Equivalent Circuit Export)
Model-Based Design FEA 基于“模型”的FEA设计
Controller
ETAS
, NI,
Opa
l-RT
e-dr
ive
plat
form
s
Maxwell e-model
10-20kHz 100-50µs
850ns
FPG
A b
ased
e-m
odel
(ET
AS,
NI)
SIL (Software-In-The-Loop)
Embedded Software
Sim
plor
er e
-driv
e sy
stem
sim
ulat
ion
HIL (Hardware-In-The-Loop)
ECU-Hardware
Will be extended to Transformers and actuators in R17
22 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Template-Based Magnetic and Thermal Analysis 基于“模板”的电磁、热分析 →Template-based electrical machine
design
→ Fast analytical calculations for popular electric machine topologies
→ One-click setup for Maxwell 2D and 3D finite element Solutions
→ Network analysis dedicated to thermal analysis
→ Heat transfer data calculated automatically
→ Detailed cooling systems & facilitates optimisation
RMxprt
Motor-CAD
23 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Template-Based Magnetic and Thermal Analysis 基于“模板”的电磁、热分析
→ Electromagnetic performance calculated in RMxprt → Default housing in RMxprt has axial fins which are suitable for TEFC cooling → Geometry and power losses are exported to Motor-CAD
RMxprt
Motor-CAD
24 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Template-Based Magnetic and Thermal Analysis 基于“模板”的电磁、热分析
→ Winding also exported from RMxprt → Motor-CAD updates winding to account for wire size available, enamel on wire and slot liner available
RMxprt
Motor-CAD
25 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Magnetic Field →Extend support to non-rotational applications
→Add more user control regarding the FFT input parameters
→Add support for stress induced bending
→Add link for LMS’s Virtual Lab for acoustic
Improvements in the Harmonic Stress Coupling 谐响应、应力耦合仿真分析功能提升
Structural Dynamics Acoustic Field
Forces Displacements
26 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Modeling the System系统建模 Powerful Capabilities for Assembly and Reuse 强大的系统集成与复用能力
Reduced Order Model Creation
Functional Mockup Interface (FMI)
3rd Party System Modeling tools
(AMESim, Simulink, Dymola, GT Suite etc.)
Embedded Software Integration
ANSYS SCADE
Simulink C Code
Co-simulation with 3D Physics
ANSYS 3D Physics
Mech EM Thermal Fluid
Multi-Domain Model Libraries
Language-Based Modeling
VHDL-AMS C/C++ SPICE SML
Modelica
Analog
Digital
Multi-Domain
App-Specific
Power Systems
Manufacturers
27 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Simplorer R16 Highlights Simplorer R16亮点功能
New and Improved Links with ANSYS 3-D for: • Electromagnetics • Fluids • Thermal
Libraries for Aerospace and
Automotive Systems
Improved support for SCADE &
Modelica via FMI • Solver Speedups (15-30%) • GUI and post-processing
improvements
New Libraries containing 100s of
Devices and Controllers
Analysis Replay
28 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Manufacturer Component Libraries供应商器件库 New Power Management Ics新增电源管理芯片
High and Low Side Switches • International Rectifier
Linear Regulators • Texas Instruments
Power Factor Correction • International Rectifier • Texas Instruments
Three Phase Bridge Drivers • International Rectifier
High and Low Side Drivers • Analog Devices • Intersil • International Rectifier • Texas Instruments
PWM Controllers • Analog Devices • Linear Technology • Texas Instruments
29 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Manufacturer Component Libraries供应商器件库 New Power Semiconductors, Ultracapacitors 新的半导体器件,超级电容
Si Power Semiconductors • ABB • APT • Fairchild • Fuji • Infineon • IRF • IXYS • NXP • Toshiba
SiC Power Semiconductors • Cree • Infineon • ROHM
Ultracapacitors • Maxwell
30 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Enhanced H/EV System Library H/EV系统库功能提升
Extends application coverage for system-level analysis of electric vehicle powertrains
31 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
New ANSYS Fluent LTI ROM Link 新增Fluent LTI ROM接口功能
• Takes step responses from Fluent CFD and uses rational fitting to generate accurate, efficient state space models
• Integrate system-level networks of fluid / thermal behavior and simulate orders of magnitude faster than CFD (seconds vs. hours)
32 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Heat Exchangerhigh_t
low_t
outlet_hinlet_h
outlet_c
inlet_c
U2_heat_ex
inletoutlet
U1_low_pump
inletoutlet
U3_h_pump
temp
temp
0.00 2.50 5.00 7.50 10.00 12.50 15.00 17.50 20.00Time [s]
300.00
350.00
400.00
450.00
500.00
550.00
600.00
Y2
[kel
]
Ansoft LLC Simplorer1XY Plot 1Curve InfoU2_heat_ex.tc100
TRU2_heat_ex.th100
TR
0
100
200
300
400
500
600
700
800
0 0.5 1 1.5 2
時間 (us)
電圧 (V)
0
100
200
300
400
500
600
700
800
電流 (A)
VCE-実測
VCE-SIM
IC-実測IC-SIM
FMU Functional Mock-up
Unit (Compiled C-code)
FMI Support in Simplorer支持FMI模型 Available Today in Version R15 and later R15及以后版本支持上述功能
FMI 1.0 for Model Exchange - Export
ANSYS Simplorer
Simplorer R16: FMUs now stored with Simplorer Design
33 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Improved Simulation Performance 仿真性能提升 R16 vs. R15
Source Example R15 (s) R16 (s) Speed
up Customer <name removed> 656 467.9 29% Customer <name removed> 6015 5012 17% Customer <name removed> 224.2 206.1 8% Customer <name removed> 336 148.3 56% Customer <name removed> 98.2 81.7 17% Customer <name removed> 189.6 173.6 8% Customer <name removed> 50 4 90% VDA VDA eCar 51.4 44.9 13%
15% to 30% typical speed-up in transient simulation for power electronic and multi-domain
system applications
34 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
Device Characterization Tool Usability 特征化建模工具易用性提升
• Characterization Tool now has modeless behavior for easy switching to/from Simplorer
• Extraction details are shown in the Simplorer Messages tool
• Improved dialogs help guide the characterization flow
35 © 2013 ANSYS, Inc. April 27, 2015 ANSYS Confidential
R&D Directions
• Solving faster and smarter • Solving faster multiple projects for parametric and Robust Design • Consider advanced Magnetic properties, including:
• Vector Hysteresis, Coreloss accuracy • Magnetization/Demagnetization
• Enable seamless multiphysics and system coupling • 3D coupling for Thermal, Stress, Harmonic, … • Reduce Order Model techniques for virtual
prototypes or Hardware in the Loop • Co-simulation techniques
• Enable Customization
• Modelica integration in Simplorer
© 2011 ANSYS, Inc. April 27, 2015 36
Thank You