NANOVAK Ar-Ge A.Ş. Company has been established in 2006 by Prof.Dr. Zafer Durusoy and Dr. Recep Görür. NANOVAK aims to meet the needs of the local and international users in the vacuum and thin film coating field. The company is located in the Hacettepe University techno-park and develops vacuum and thin film systems by means of research and development without using license or know-how. Nanovak does not sell other companies’ products or doesn’t represent other companies’ interests.

NANOVAK serves its partners on several fronts, such as • Designing LV, HV, UHV vacuum systems, • Consultancy on solving problems of vacuum and thin film systems, • Training in the vacuum and thin film systems area, • Developing thin film coating, vacuum furnace systems, • Design and production of vacuum and thin film system components,

The main activity of the company is building vacuum chambers and systems, equipping them with thermal evaporating, sputter and electron beam parts to as prepare them as thin film and vacuum processing systems. Vacuum and thin film production systems are manufactured according to users’ requests in the process of research and development phase and delivered to the users after training in the user’s own site. Thin film deposition systems are designed and

produced as turn-key systems which are made of vacuum chamber, sample holding and heating unit, pumping units, electronic control and measurement devices, plasma units, with pressure and gas flow tuning units, valves and other peripheral equipment like chillers. When needed, systems can be offered as fully automatic with touch screen control programs.

Among NANOVAK products, thermal evaporators, vacuum brazing systems, e-beam evaporators, sputtering systems, CVD, PECVD systems and bell-jar systems can be listed.

Running its operations with a powerful team of physics, electrical and electronics engineers, NANOVAK has

increased its technical capacity and product quality to international levels. As a result, export of coating equipment to international markets, has been growing considerably.

NANOVAK® Ar-Ge Vacuum Systems

Hacettepe Üniversitesi Teknokenti, 1596. Cadde No: 95/A, 4. Ar-Ge Binası Ofis 4-5, 06800 Beytepe/Ankara/Turkey Phone: +90 (312) 299 23 93, Fax: +90 (312) 299 23 94 www.nanovak.com info@nanovak.com

Vacuum Furnace & Bake-Out Systems

Vacuum Furnace and Bake-Out System is produced out of SS304. Furnace can be used for outgassing & baking of samples between 30 - 500 °C. Samples can be loaded vertically/horizontally. Various electrical feedthroughs can be added for real time monitoring of electronics. NANOVAK® Vacuum Furnace and Bake-Out System can be tailored to fit user desires. • Fully automatic computer control option, touch screen control

panel with real time LCD displays. • 50 - 500 °C high temperature PID controlled furnace inside the

vacuum chamber. • Adjustable (1 - 20 °C/minute) standart heating rate.

• Vacuum chamber made of Stainless Steel Type 304, material. Clean, electro-polished surfaces.

• 2x10-6 Torr vacuum level in 30 minutes. 1x10-7 Torr vacuum level in one hour, for fully loaded system. 10-8 Torr base pressure level.

• Turbomolecular + Mechanical pump is standard, and dry pump is an option.

• Wide range (1000 - 10-9 Torr) vacuum control and pressure measurement system.

• Closed loop water cooling system when needed. • Mass flow meter gas inputs (Ar, N2, O2, He…) are optional, if desired • 100 amu, residual gas analyzer optional, if desired. • 1 - 3 m3 working volume, can be changed as desired. • 10 steps, (up to 40 steps) programmable PID controlled

temperature profile. • Thermal Annealing - Quenching applications can be done with ±50

°C/min cooling - heating rates. • Rapid cycle times to allow 2 - 3 experiments per day, depending on

load volume. • Isolation valves, chamber backfill with Ar or N2 as desired. • Power failure protection, the chamber remains under vacuum with

isolation valve when not in use to keep the chamber in vacuum. • 75x120 cm system footprint, lockable wheels. • Two year warranty for design, materials and workmanship.

Thermal Evaporator Systems

Box type Physical Vapor Deposition system is based on prismatic/ cylindrical vacuum chambers. These systems have 2 – 4 thermal sources. Multi-layered thin films of two, three or four different materials can be prepared by NVTH system. NANOVAK® Thermal Evaporator Systems can be tailored to fit user desires in order to produce multilayered, nanosize metallic, oxide, fluoride or nitride films,such as Si, Al, Ti, SiO, Au, Ag, WO, BaF2, MgF2. • Fully automatic computer control option, touch screen panel

control with real time LCD displays. • Prismatic/cylindrical vacuum chamber made of SS304.

30/40/50/60 cm box size, clean electro-polished surfaces. • Front viewing window and rotatable shutter.

• Standard 1”, QF, CF, ISO ports. • Internal lighting and baking of the system, internal baking option up

to 120°C. • 10-8 Torr base pressure level, 2x10-6 Torr vacuum level in 20 minutes. • Turbomolecular + Mechanical pump, cryo-pump and dry pump as

desired. • Wide range (1000 - 10-9 Torr) vacuum control and measurement

system. • 50-700°C PID sample rotation-heating option. • 2-30 rpm adjustable sample rotation unit. • Sample surface cleaning option by RF plasma. • Automatic closed loop water cooling. • 0.1 Å/s dual-channel precision thickness-rate measuring unit with 1-4

QCM’s, with averaged value. • 2x2 channel, 12V - 200A sequential/co-evaporation thermal

evaporation sources with voltage current power display. • Mass flow meter controlled gas inputs, isolation valves, chamber

backfill with Ar or N2 as desired. • 1.5 hour experiment cycle-time. • The chamber remains under vacuum with isolation valve when not in

use. • Fully automated deposition of each layer of coatings. • 75x120 cm footprint, lockable wheels. • Easily passes through standard doors. • One year warranty for design, materials and workmanship.

Thermal & Sputter Combined Systems

Box type Physical Vapor Deposition system, based on prismatic/cylindrical vacuum chambers have 2 thermal and/or 1-4 DC-RF sputter sources (NVTS) enabling the user to do full co-evaporation. Multi-layered thin films of different materials can be prepared by NVTS systems. NANOVAK® Combined System can be tailored to fit user desires in order to produce multilayered, nanosize metallic, oxide, carbide or nitride films, such as Si, Al, Ti, SiO, WO, BaF2, MgF2, TiO2, Si3N4, SiO2, TiN. • Prismatic/cylindrical vacuum chambers made of SS304L.

Feather-touch, electro-polished, clean surfaces. Standard 1", QF, CF, ISO ports as desired.

• Internal lighting & baking up to 100 °C. UV-blocking, observation window & rotatable shutter.

PECVD Systems

NANOVAK® Ar-Ge has recently developed PECVD (Plasma Enhanced Chemical Vapor Deposition) tube furnace system, which consists of 300W RF plasma source, optional split tube size furnace, 3 channel mass flow controller unit. It is ideal for TiN, TiC, SiC, Si3N4, Graphene film production. • 1100 °C furnace temperature for continuous heating. • ±1 °C PID control of furnace temperature. • Split quartz tube (1000 mm long and 50, 80, 100 mm diameter

or as desired).

• Automated PLC controlled vacuum control unit, start-stop vent button PC touch screen control option.

• Throttle, vent and isolation valves, precise pressure setting, 1 - 100 mTorr.

• User defined programmable heating profiles/steps. • 3 channel 0.1 SCCM mass flow controller unit, Ar, N2, O2, H2, CH4,

NH3. • Real time control of all gases, continuous digital display of all gas

flows. • Option to add 6 more different gases. • Inductively coupled 300W 13.56 MHz plasma source. • Quartz sample holder, plasma is confined to the sample zone • Easy sample load door. • 220V - 16A power requirement. • Closed cycle water cooling. • 75x120 cm footprint, lockable wheels. • Easily passes through the standard doors. • One year warranty for design, materials and workmanship.

• Easily upgradable to add on additional thermal and sputtering sources. • RF Power supply, 13.6 MHz, 300 - 1200W. • DC Power supply, 0 - 1000V DC, 2000W. • 10-8 Torr base pressure level, 10-7 Torr vacuum level in one hour, for

loaded system. • Turbomolecular & Mechanical pump, cryo and dry pump as desired,

high pumping speed for low pump-down time. Wide range (1000 - 10-9 Torr) vacuum control and measurement.

• Ability to fix pressure precisely to desired values for plasma generation (1 - 100 mTorr).

• Optional 50 - 700 °C PID controlled sample heating with ± 1 °C sensitivity, 1 - 10 cm sample attachments, 3”, 4”, 6” wafer loading ability.

• 2 - 30 rpm sample rotation unit, continuous speed adjustment. • Optional ICP, CCP, DC - RF Sample plasma cleaning unit. • Automatic closed loop water cooling, interlock controlled, automatic

on-off process control to prevent premature use of power without water cooling.

• 0,1 Å/s dual-channel precision thickness-rate measuring unit with 1 - 4 QCM’s.

• Four 10V - 250A, 2x2 channel, co-evaporation thermal sources. Proprietary boxed source design to prevent cross contamination, easy replacement of boats/baskets.

• DC/RF magnetron sputtering sources (1”, 2”, 3”). Flex head, 85 mm diameter, magnetic/nonmagnetic material sputtering.

• Digital mass flow meter controlled gas inputs (Ar, N2, O2, He, CH4, H2 ), easy mix of gases, 0.1 SCCM sensitivity.

• Throttle, vent and isolation valves, the chamber remains under vacuum with an isolation valve, when not in use.

• 1.5 hour experiment cycle-time, possibility for 4 - 6 experiments per day.

• L120xW80xH180 cm footprint, lockable wheels. Easy passage through standard doors.

• All system functions are controlled by touch screen LabView control program. Full Panel control is available when the program is turned off.

• One year warranty for design, materials and workmanship.

E-Beam Systems

Water cooled cylindrical/prismatic vacuum chambers are produced out of SS304 materials. This system have 1-2 thermal and/or 4 crucible e-beam sources enabling the user to do full co-evaporation. Typical properties of the system are given below. Multi-layered thin films of different materials can be prepared by NVEB system. NANOVAK® E-Beam System can be tailored to fit user desires in order to produce multilayered, nanosize metallic, oxide, carbide or nitride films. • Prismatic / cylindrical vacuum chamber made of SS304. Feather-

touch clean, electro-polished surface, SS304 liner, water cooled surfaces.

• Standard 1", QF, CF, ISO ports as desired. Easy upgrade to add on additional thermal sources.

• UV-blocking, front observation window, rotatable shutter. Shutter-thickness control by LabView program.

• Turbomolecular + Mechanical pump, and dry pump as desired, high pumping speed. 10-8  Torr base pressure level, 10-7 Torr vacuum level in one hour, for fully loaded system.

Glove Box Adapted Vacuum Systems• Front viewing window and rotatable protection shutter. • 100 mm front observation window, UV-blocking glass. • KF25, CF40, 1” feed-through. 200 °C resistant viton O-rings in

all ports. • Inficon 1000 - 10-9 Torr wide range vacuum control and

measurement system. • Turbomolecular + Mechanical pump combination and 10-8 Torr

base pressure for fully loaded system. • Automatic vent, throttle, isolation valves when needed. • 4 thermal inorganic evaporation and 2-6 organic evaporation

sources. • Effusion cells for organic evaporation with 25 - 600 ±1 °C PID

control. • Automatic closed loop water cooling system. • Fully automatic computer control with touch screen panel. • 2 - 30 rpm sample rotation unit, 100 - 600 °C rotating sample

holder, heater. • Film thickness measurement with 0,1Å/s dual-channel precision

rate and thickness measurement. • Single phase, 220VAC - 16A. • Simple operation and rapid cycle time, 1.5 hours per experiment

at 10-7 Torr. • Full warranty for materials, design and workmanship.

Nanovak Glove-Box Systems are combinations of Glove-Box units which is supplied by dedicated Glove-Box specialists and NANOVAK vacuum and electronic components. These systems can be configured with one or two vacuum chambers with hinged doors in the back and sliding doors in the Glove-Box side. There are added components such as vacuum pumps, QCM units. Systems easily pump down to 1x10-7 Torr vacuum levels. Additionally, components like thickness monitors, sputter guns, evaporation sources, effusion cells can be added for different purposes. The chambers are e-polished inside and outside. Systems are configured to run automatically by computers with tailored LabView programs. The Glove-Box sustains 0.1 ppm water vapor and oxygen levels with its blower and filter apparatus. • Prismatic vacuum chamber made of SS304 30/40/50 cm in size with

sliding doors. • Inside and outside feather-touch, clean, electro-polished surface. • Thermal evaporation, e-beam, sputtering and vacuum furnace

applications.

• Throttle, vent and isolation valves, The chamber remains under vacuum with an isolation valve when not in use.

• Fully automatic computer control and/or automatic panel control with real time LCD displays.

• Automatic closed loop water cooling system, interlock controlled, automatic on-off process control to prevent premature use of power without water.

• 10 KV, adjustable power supply, 600 mA beam current. Arc protection ability.

• Ability to evaporate metals like Al, Pt, Ni and oxides like TiO2, SiO2, at high rates.

• Wide range (1000 - 10-9 Torr) vacuum control and measurement, ability to fix pressure to desired values.

• 50 - 700 °C PID controlled sample heating, ±1 °C sensitivity, 1 - 15 cm sample attachments, 3”, 4”, 6” wafer loading ability.

• 2 - 30 rpm sample rotation unit, continuous adjustment ability, panel - PC control, better than 3% homogenity across sample for 4” samples.

• ICP, CCP, DC-RF sample plasma cleaning unit, pressure adjustment. • 0.1 Å/s dual-channel precision thickness-rate measuring unit with

two QCM’s. • 10V - 250A, 2500 W sequential, 2x2 channel, thermal sources for co-

evaporation and doping. Ability to prevent cross contamination, easy replacement of sources.

• Digital Mass flow meter controlled gas inputs (Ar, N2, O2, He, CH4, …), easy mix of gases, 0.2 SCCM sensitivity, panel or PC control.

• 1.5 hour experiment cycle-time, possibility for 4 - 6 experiments per day.

• Full warranty for materials, design and workmanship.