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2371-8
Advanced Workshop on Energy Transport in Low-Dimensional Systems: Achievements and Mysteries
Ali SHAKOURI
15 - 24 October 2012
Birck Nanotechnology Center, Purdue University West Lafayette
U.S.A.
Nanoscale Thermal and Thermoelectric Characterization Techniques
N l Th l dNanoscale Thermal and Thermoelectric CharacterizationThermoelectric Characterization
Techniques
Thermal Transport in Low DimensionThermal Transport in Low Dimension
Hot Cold
Measuring Power and Temperature from Real P ThProcessors The
Next Generation Software (NGS) Workshop (NGS08),
http://masc.cse.ucsc.edu
0
S b k 1 22ASnapback current =1.22A.
IRPS
atu
re
emp
era
ativ
e Te
Time (ps)
Rel
a
Time (ps)
World Marketed Energy Use1990-2035
13TW 2050: 25 30TW13TW 2050: 25-30TW
CO2 Emission Goals (2000-2100)
IPCC
P l ti (billi )Population (billions)
World Energy Use in 2005 (15TW)
Energy
Direct Conversion of Heat into ElectricityDirect Conversion of Heat into Electricity
ElectricalHot Cold
TVS
Seebeck coefficient(1821)
V~ S T
Electrical ConductorT(1821)
2
V~ S T
2
2
kSZ Rload = RTE internal
)()()( 2
tyconductivithermaltyconductivielectricalSeebeckZ
Power Generation Efficiencies
K. Yazawa and A. Shakouri, J. Appl. Phys. 111, 024509 (2012)
Measuring voltage at nanometer scale
Measuring temperature at nanometer scale
Measuring heat flow at nanometer scale
M th d P i i lMethod Principle
Micro-thermocouple
Infrared Thermography
Liquid CrystalLiquid Crystal Thermography
Hot ElectronHot ElectronCold Electron
1 m
Si (10nm)
Appl. Phys. Lett.
Si (10nm)
Si0.89Ge0.1C0.01
Proceedings of IEEE
Si/SiGe Micro refrigerator on a chip
CathodeCathode
1 micron
BarrierMetallic
contact for top
connection
Anode
connection
100 i100 microns
Applied Physics Lett.
Micro thermocouple measurements: Cooling vs. Current
(60x60 m2 )
(oC
)MeasurementMeasurement
Co
olin
g
100
Bulk material
MeasurementThermocouple
ReferenceThermocouple
BottomContact
TopContact
MeasurementThermocouple
ReferenceThermocouple
BottomContact
TopContact
100 microns
Substrate
Emitter
Superlattice
Collector Substrate
Emitter
Superlattice
Collector
Current (mA)
SiGe/Si Superlattice CoolersTemperature Controlled
StageTemperature Controlled
Stage
Calibrated infrared imagingCalibrated infrared imaging
AMD Processor (cm) Microrefrigerator
Francisco Mesa-Martinez, Jose Renau, UCSC Vivek Sahu, Georgia Tech
M th d P i i lMethod Principle
Scanning thermal microscopy (SThM)microscopy (SThM)
Optical Interferometry
Micro Raman
Near Field Probe (NSOM)Near Field Probe (NSOM)
Scattered light intensity versus wavelength shift
Cm-1
Thermal imaging of nanostructures with a scanning fluorescent particle as a probeThermal imaging of nanostructures with a scanning fluorescent particle as a probe
Many dipoles randomly oriented
Simplicity APL 83 147 (2003)APL, 83, 147 (2003)
Infrared excitation :emission and absorption lines well separated
HOW CAN WE DEDUCE THE TEMPERATURE ? HOW CAN WE DEDUCE THE TEMPERATURE ?
E / Yb iPL spectrum of Er / Yb doped particles
Er / Yb ionsPL spectrum of Er / Yb doped particles
4F7/22H11/2H11/24S3/2 (980 nm)
(550 nm)(527 nm)
(980 nm)
).
exp(TkE
II
yellow
green
4I15/2
Thermal imaging using Fluorescence NanoparticlesThermal imaging using Fluorescence Nanoparticles
I = 50 mA
I = 0 mA
Hot spots
Uniform temperature (room temperature)
I = 0 mA
Optical contrast visible between different zones
Reference image
APL, 8 7, 184105 (2005).
InterferrometricInterferrometric measurementsmeasurements
Pogany, Gornik et al., TU Vienna 2003
Incident light Reflected light (R)
Reflected light intensity:
C
SUBSTRATE
DEVICE
Laser Probe on aLaser Probe on a micro cooler, lock-in detection at 1KHz
Lock-in imaging resultLock-in imaging result
Normalization Phase
Raw AC data Image Mask
Thermoreflectance image of microcoolerThermoreflectance image of microcooler
DC Reflection Thermal ImageC e ec o
TT (C)
Pioneering works by: Claeys FournierClaeys, Fournier, Dilhaire, Tessier,…
Transient Response 50x50 Micron Device
CCD based system:
Picosecond thermal imaging (800ps)
, Int. Heat Transfer Conf., August 2010
H e a tin g o n M e ta l A b o v e V ia
, Heat Transfer Conf., August 2010
J. Christofferson, et al, J. Electronic Packaging,130 (4) 041101, 2008
Scanning Thermal MicroscopyScanning Thermal MicroscopyScanning Thermal MicroscopyScanning Thermal Microscopy
Pt Line
Pt-Cr Junction
Laser ReflectorTip
Junction
SiNx Cantilever
Cr lineCr line
m
et al J. MEMS
Scanning Thermal Microscopy (SThM)
Tip
CantileverCantilever Mount
Pt-Crp Pt Cr Junction
Courtesy: Arun Majumdar, UC Berkeley; StefanBerkeley; Stefan Dilhaire, Univ. Bordeaux
SThM Metallic Single Wall Nanotube
T hTopography
2 K
T tipThermal images
Contact
1 m
1 nmtube 0
1 m
tube 0.45 V 0.77 V 1.2 V 1.7 V 0
Contact
Th l I 0
SThMSThM Thermal Mapping Thermal Mapping ofof MicrorefrigeratorsMicrorefrigerators
Thermal, I=0 Thermal, I=200mA
Prof. Arun Majumdar, UC Berkeley
of of MicrorefrigeratorsMicrorefrigerators
CTTT 1TC
))(,( 1 CTTyxSVDT
V S
(UT Austin)
S p-nS p-n
n pp
)105( 318 cm )101( 319 cm
mV
)
Measurement
Vo
ltag
e (m Theory
oel
ectr
ic V
Th
erm
o
Science 303
Position (nm)
Thin Film Thermal Conductivity MeasurementThin Film Thermal Conductivity Measurement
Rev. Sci. Instrum
L 2b
Thin FilmMetal line
L 2b• I ~ 1
• T ~ I2 ~ 2• R T 2
V
I0 sin( t)Substrate
• R ~ T ~ 2• V~ IR ~3
sLbkPdi
bD
kLPT
242ln
21ln
21)2( 2
fs LbkbkL 2422
David Cahill, UIUC, 2003
Modulated & delayed femtosecond laser pulse used as a PumpModulated & delayed femtosecond laser pulse used as a Pump.A Probe beam measures reflectivity variation on the surfaceThe lock-in amplifier gives the In-phase (Vin) and Out-of-phase (Vout) signals.
d)
mal
ized
R (
no
rm
Time (ps)Time (ps)
Thermal Transport in Carbon NanotubesThermal Transport in Carbon Nanotubes
Hot Coldp
• Few scattering: long mean free path l
Strong SP2 bonding: high sound velocity v
high thermal conductivity: k = Cvl/3 ~ 6000 W/m-K
• Below 30 K, thermal conductance 4G0 = ( 4 x 10-12T) W/m-K,
linear T dependence (G :Quantum of thermal conductance)linear T dependence (G0 :Quantum of thermal conductance)
Thermal Measurements of NanowiresThermal Measurements of Nanowires
Themal conductance: G = Q / (T T )
Suspended SiNx membraneLong SiNx h
(K)
1.0
1.5 T0 = 54.95 K
Themal conductance: G = Q / (Th-Ts)
g xbeams T h
0.0
0.5
0 10QI Current ( A)
-6 -4 -2 0 2 4 6
Pt resistance s (K
)
0 04
0.06
0.08
0.10
T0 = 54.95 K
Pt resistance thermometer
T s0.00
0.02
0.04
Current ( A)
-6 -4 -2 0 2 4 6, PRL 87JHT
Thermal Conductance of a NanotubeThermal Conductance of a Nanotube
APL 77APL 77
Thermal Conductivity of Carbon NanotubesThermal Conductivity of Carbon Nanotubes)
(W/m
-K
1-3 nm CVD SWCN
uctiv
ity ( 14 nm MWCN bundle
~ T 2
CVD SWCN
al C
ondu
148 nm SWCN
10 nm SWCN bundle~ T 2.5 CNT
Ther
ma 148 nm SWCN
bundle~ T 1.6
Temperature (K)
k
Li Shi, UT Austin
D id C hillDavid Cahill (UIUC)
Nano Electromechanical System (NEMS)
Thermal conductance quantization in nanoscale SiN beamsThermal conductance quantization in nanoscale SiNx beams (Schwab et al., Nature 404, 974 )
Nanoscale heat transport and microrefrigerators on a chip; A. Shakouri, Proceedings of IEEE, July 2006
J. Christofferson, et al, J. Electronic Packaging,130 (4) 041101, 2008
AcknowledgementResearch Professors: Zhixi Bian Kaz YazawaResearch Professors: Zhixi Bian, Kaz Yazawa
Postdocs/Graduate Students: Kerry Maize, Hiro Onishi, Tela Favaloro, Phil Jackson, Oxana Pantchenko, Amirkoushyar Ziabari, Bjorn V h J H B hk Y R i K hVermeersch, Je-Hyeong Bahk, Yee Rui Koh
Collaborators: John Bowers, Art Gossard (UCSB), Tim Sands, Yue Wu (Purdue), Rajeev Ram (MIT), Venky Narayanamurti (Harvard), Arun ( ), j ( ), y y ( ),Majumdar (Berkeley/ARPA-E), Josh Zide (Delaware), Lon Bell (BSST), Yogi Joshi, Andrei Federov (Georgia Tech), Kevin Pipe (Michigan), Stefan Dilhaire (Bordeaux), Natalio Mingo (CEA), Mike Isaacson, Sriram Shastry, Joel Kubby, Ronnie Lipschutz, Melanie Dupuis, Ben Crow, Steve Kang (UCSC), Bryan Jenkins, Susan Kauzlarich (Davis)
Alumni: Younes Ezzahri (Prof. Univ. Poitier), Daryoosh Vashaee (Prof. ( ), y (Oklahoma State), Zhixi Bian (Adj. Prof. UCSC), Mona Zebarjadi (Prof. Rutgers), Yan Zhang (Tessera), Rajeev Singh (PV Evolutions), James Christofferson (Microsanj), Kazuhiko Fukutani (Canon), Je-Hyoung Park (Samsung) , Javad Shabani (postdoc, Harvard), Xi Wang (InterSil), Helene Michel (CEA), Gilles Pernot (Bordeaux), Ramin Sadeghian (H2scan), Shila Alavi (UCSC ASL), Tammy Humphrey, David Hauser