Nano Summer School 2011, Beyond CMOS – Aug 28 th -30th, 2011 – Kildare, Ireland Advanced Nanoelectronics Devices in European R&D Programmes Georg Kelm

Nano Summer School 2011, Beyond CMOS – Aug 28th-30th, 2011 – Kildare, Ireland

Advanced Nanoelectronics Devices in European R&D

Programmes

Georg Kelm

Nanoelectronics Components and Systems

Information Society & Media Directorate-GeneralEuropean Commission


Presentation Outline

ICT FP7 Current situation

Today’s opportunities: WP 2011-12 + FET

And WP 2013?

Something on the future 8th FP

Nano Summer School 2011, Beyond CMOS – Aug 28th-30th, 2011 – Kildare, Ireland ••• 3

Fu

ture

& E

mer

gin

g

Tec

hn

olo

gie

s (F

ET

)

1. Network and Service Infrastructures

ICT for socio-economic challenges

Bas

ic IC

T te

chno

logi

es &

in

fras

truc

ture

s

~10% ~9%

~11%

International cooperation, Cooperation in an enlarged Europe, Pre-commercial Procurement

3. Component and Systems

4. Digital Content and Languages

2. Cognitive Systems and Robotics

5. ICT for Health, Ageing, Inclusion & Gov.

~26%

~6%

~17%

~7%

~11%

6. ICT for Lower-Carbon Economy

~12%

7. ICT for Manufac. & Enterprise

8. ICT for Learning & Cultural Resources

~6% ~4%

+JTIs

+AAL

PPP

2 PPPs

incl FI PPP

What is the money spent on? (in 2011-12)


M€ 2007 2008 2009 2010 2011 2012 2013 TOTAL

PF7 ICT 1.189 1.217 1.227 1.241 1.382 1.582 1.760 9.597

CIP 58 52 105 113 120 135 149 732

Financial support • FP7: master & shape research & development

• CIP: ensure wider uptake & better use of research

• + Regional and Structural Funds,…

FP7-CIP/ICT Budget Profile: 70% increase in period 2011-13


• In 2011, the FP7 ICT Programme is in its fifth year

of implementation

• Six main calls have been launched and evaluated• Total EU funding of 3,9 B€

• Total number of projects ~1200

• Launch of two JTIs and AAL• 3 Calls launched for 220 M€

• WP 2011-12 done, WP 2013 (1.5 B€) still to be drafted

ICT in FP7: Where do we stand?


• ICT in the FP supports collaborative R&D projects• industry - academia from at least 3 Member or ASs• Project size between 3M€ and 20 M€ of funding• 4 to 20 partners per project

• Supports ~17000 researchers and engineers/year

• During 2007-10 • ~ 5000 distinct organisations, ~14000 participations• 1250 projects running (FP6 + FP7)

ICT in FP7: In Summary





And WP 2013?



Lower cost, higher performance and more

functionality

pe

rfo

rma

nc

e

Smart design and Smart manufacturing of Smart Components

and Systems

Enabled by

•Power consumption

-

Mo

ore

’s L

aw:

Min

iatu

riza

tio

nB

asel

ine

CM

OS

: C

PU

, Mem

ory

, Lo

gic

130nm

90nm

65nm

45nm

32nm

22nm

Beyond

Moore

Analog/RF Passives HV Power SensorsActuators

Biochips

InformationProcessing

Digital content SoC

Interacting with people and environment

Non-digital SoC & SiP

Combining SoC and SiP: Higher Value Systems

More than Moore: Diversification

Nanoelectronics and Smart Systems”Small, smaller, smarter”


Objective 3.1: Very Advanced Nanoelectronics Components

• a) Beyond CMOS technology• b) Circuit-technology

solutions • c) Nano-manufacturing and

Joint Equipment Assessment • d) Coordination and Support

Actions

Call 8

60M€

Objective 3.2: Smart components and smart systems integration

• Smart components • Smart (miniaturized)

systems • Micro-Nano Bio Systems

(MNBS)• Coordination and Support

Actions

Call 8 - MNBS

39M€

ICT Work Programme 2011-12


• To stimulate interaction of system and technology to better explore European system competences.

• To address energy efficiency needs for mobile applications

• Nanoelectronics products as system enablers and solution providers for global challenges as aging society, global warming, growing population or sustainable manufacturing.

• To prepare for “beyond” traditional shrinking (ITRS roadmap)

35 nmGate Length

Objective 3.1: Advanced Nanoelectronics Technology


ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms.

• Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep impact of its results on the applications and markets.

• Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures.

• Integrate-ability of novel technology with CMOS and their reliability become key factors.

Objective 3.1: Advanced Nanoelectronics Technology


• a) Beyond CMOS technology• - New switches and interconnects (scalability, performance and• energy efficiency gains, operational reliability and RT operation);• - Advanced system integration technology and new methods for• computation;• - Emerging memories targeting the concept of non-volatile

universal• memory;• - Nano-photonic devices & interconnects integrated with nano- and• Beyond-CMOS;• - Carbon based electronic devices;• -Novel materials for interconnects , nano-packaging, Beyond-CMOS• (logic and memory);• - Understanding fundamental artefacts and limits: nano-scale

thermal processes; computational material and device science.

Developed components and technologies need to fulfil the criteria of

“systemability”,“integratability”, and – in the end – of “manufacturability”

3.1 Very advanced nanoelectronic components


• Access to nano-manufacturing and to advanced technologies to be assured in Europe.

• Access to world wide equipment market for European suppliers, especially SMEs, need to be stimulated.

Semiconductor Equipment for Wafer Bonding with Plasma Activation

EV Group, CEA-LETI, Soitec

3D Integration of Bulk Si WafersEV Group, CEA-LETI,

STMicroelectronics Crolles II

Low Energy and Dose Implant TestSEMILAB, Fraunhofer IISB,

ST Microelectronics Crolles II,NXP Crolles R&D

Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic

Device GenerationsAIXTRON, Fraunhofer IISB, Infineon

Munich

Metrology Using X-Ray TechniquesJordan Valley, CEA-LETI,

STMicroelectronics Crolles II,NXP Crolles R&D

Objective 3.1: c) Manufacturing and Equipment assessment


Call 8

Open: 26 July 2011 Close: 17 January 2012 (at 17:00 Brussels local time)

Funding schemes:

a) Beyond CMOS technology: STREPs b) Circuit-technology solutions: STREPs and at least 1 IPc) Nano-manufacturing and joint equipment assessment: STREPs and

at least 1 IPd) Support measures: CSAs

Indicative budget - 60 M€:

3.1 Very advanced nanoelectronic components: design, engineering, technology and manufacturability

Summary


Two complementary funding schemes

FET Proactive

• Top-down approach• Set of novel pre-defined themes

FET Open

• Bottom-up approach• Open to any research idea

Nano-electronics related topics with EU funding ~ 30M€/year:Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based and towards zero power ICT

Future & Emerging Technologies – FETSupporting high-risk transformative research in ICT


Objective ICT-2011.9.8: Minimising Energy Consumption of Computing to the Limit

(FET Pro-active)

Target Outcome:Foundations for radically new ICT technologies striving forthe theoretical limits in energy consumption

• New elementary devices and inter-device-communication

mechanisms

• Novel computing paradigms with radically improved energy efficiency (e.g. inspired by biology, post-Boolean logics, …)

• Software models and programming methodologies supporting the strive for the energetic limit (e. g. energy cost awareness,..)

• Proof of concept, indication of expected energy gain, appropriate energy metrics or benchmarks for verification


Objective ICT-2011.9.8: Minimising Energy Consumption of Computing to the Limit (MINECC)

-Funding/Instruments: 15 MEuro for STREPs

-Closing of Call 8 (tbc): 17 Jan 2012

-Contacts:

Ralph.Stuebner (at) ec.europa.eu

Francisco.Ibanez-Gallardo (at) ec.europa.eu


ICT-2011.9.9: Quantum Information and Communication Technologies (QICT)

Target OutcomesPush forward the boundaries of our knowledge in the Quantum-ICT area by demonstrating

• Quantum simulators capable to operate on many-particle systems

• Hybrid systems linking different quantum bit realizations.

• Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication

• Enabling methods and technologies to support aforementioned outcomes


Objective ICT-2011.9.9: Quantum Information and Communication Technologies (QICT)

“How the combination of quantum mechanics and information theory offers new concepts and

resources for computing and communications.”

-Funding/Instruments: 15 MEuro, STREPs & IPs

7 MEuro, ERA-NET Plus

-Closing of Call 9 (tbc): 17 April 2012

-Contact: Werner.Steinhoegl (at) ec.europa.euDavid.Guedj (at) ec.europa.eu


Idea

Proof-of-Principle

Proof-of-Concept

Prototype demonstration

FET

Objective 3.1: Advanced Nanoelectronics TechnologyObjective 3.2: Smart components and Systems

Work Programme 2011-12Objectives 3.1 and 3.2 vs FET





And WP 2013?



What is next?

2010 2011 2012 2013 2014

FP7ICT WP 2011-12

ICT WP 2013

FP8

Preparatory work

Strengthen, focus & simplify EIPs

KETs

Light and fast

MAFF 2014+Externalisation

2011: Framework 8 Preparation• 9 Feb Green Paper• Feb-May Consultation based on Green Paper• 10/6 Consultation ‘wrap-up’ event in Brussels• June Proposal for next MAFF• Dec Proposal (s) for FP8/CIP-II


Advanced devices – more focus – but on what?

Stronger links Technology - Design

Mfg approaches for BC and adv MtM integration

Joint E&M assessments – focus on 450 mm?

Bridging to FP8: Innovation elements (pilots, research infrastructure, …)

And in FP7 ICT WP 2013 ?


Towards a Common R&I framework in the next MAFF

“3 sets of challenges, 4 type of activities, (funding schemes)”

Societal challenges

Industrial leadership

Excellence in science

Focussed, Roadmap

based

Flexible, Open, agile

Infrast and skills

Testing, piloting

e.g. EIPs

e.g. PPPs

e.g. FET flagships

e.g. FET openERC

Light WP

Any time

Small size

SMEs specific

e.g. Living labs

e.g. Clean rooms,

Innovation clusters

E-Infrastruct.

CIP Pilots

CIP Pilots

Draft

Some first and preliminary thinking on FP 8


Two messages:

•Input from Summer School is very welcome

•Participate in Call 8 !!!

Summary


THANK YOU

[email protected]

Information Society and Media:http://ec.europa.eu/information_society

http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html

European research on the web:http://cordis.europa.euhttp://www.eniac.eu

Documents

Nano Summer School 2011, Beyond CMOS – Aug 28 th -30th, 2011 – Kildare, Ireland Advanced Nanoelectronics Devices in European R&D Programmes Georg Kelm