GEM TN-93-412

Muon Chamber Design Meeting -SSCL

May 18, 1993

Abstract:

Agenda, attendees, and presentations of the Muon Chamber design meeting held at the SSC Laboratory on May 18, 1993.

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Oraft-3

GEM Post TDR Muon R&D Program for FY93

May 7, 199~

Abstract

The objectives of the Post-TOR FY93 R&D and Engineering Program for the GEM Muon System are to carry the chamber design, alignment, and support structure into fully integrated, and engineered system. In contrast, the Pre-TOR program concentrated on the conceptual design of the muon system and on extexsive investigations of various chamber technologies. This effort lead to our choosing Cathode Strip Ownbers for both the triggering and tracking functions of the muon system. In the Post-TOR program certain aspects of the Cathode Strip Ownber design will be developed and tested by means of small prototype chambers where the parameters of interest will be varied. Such issues as the resolution of the chamber for different anode-cathode gaps will be investigated. In addition, the full engineering details and "industrialization" of the chamber design will be conducted with the intent of setting up a pilot factory and producing first production chambers in FY94. The design of the chamber support and alignment systems will be developed in sufficient detail to allow for the fabrication of a sector prototype in late FY94. The construction of an alignment test-stand will be an important o1*ctlve for this phase of the R&D program. The test stand will enable the concept of the "false..sagitta" measaurement and interpolation to be validated.

Table of Contents

1.0 Introduction ··········-·······-······-···················-························-·············--············-················ .. ·· 2 2.0 Task Definition5 ·-········----·-·-----·················-····· .. ···-············-·············:........................... 4 2.1Task1 Develop Cathode Strip Chamber Technology ................................ 4 2.2 Task 2 Chamber Performance Evaluation ·····-·-... ··············-···················-·· 6 2.3 Task 3 Muon Trigger ·-······-·········-···-···········-················· .. ···························· 8 2.4 Task 4 Alignment Technology·····-··-· .. ·········-····-··············-···················· .. ·· 10 25 Task 5 Electronics Evaluation -·--·····-············--··-···-·~···-··-··················- 11 2.6 Task 6 Simulations ···---··-·····-·········· .. ··········-----·---·······-····· .. ·····-···- 12 2:7 Task 7 Industrialization of Chamber Design and

2.8 Task8 -2.8.1 Task 8.1 " 2.81 Task81 -

Layout of Clamber Factory ·········-·---·····--·---·---···--·-···--·- 14 Mechanical Engineering ... - ... · .. ··········---·····--···-·····-· .. ·····-·····-·· 16 Engineering Coordination····-··,········--·---··········-·············-·····-··- 16 Design Support Structures, Shielding and

Infrastructure ............... ·-··-·----·-··--··--··-···-------····-··-··- 16 2.8.3 Task 8.3 - Conceptual Design of Chamber Services --··--·--···-·-··-··---·- 17 3.0 Budget Sununary.·------··--····-··----··----··--·-···---··-··-- 19 4.0 Schedules and Milestones ·-·········· .. ·················-··· .. ···········•·•·•·····•····· 20 5.0 Budget Plans ·--·----··· .. ···-·-···-··········-··-·····-···-·················-·-··········································· 21

Compiled by:

Gena Mitselmakher • SSCL [SSCVXl::MITSELMAKHER) Frank Taylor- MIT !Ml1NLS::FET]

1 . 18:48 May 7, 1993

5

In order to manage the activities of the groups contributing to the chamber design a Chamber Commitee will be created with the primary function to overlook all activities and coordinate chamber design. The chairman of the Commitee is the Task Coordinator.

The proposed work is broken down into the following subtasks:

Deliverables:

(2.1.0) Purc.lu!se ~ommon parts (raw materials) for chamber construction. (2.1.1) FIX the baseline chamber design for barrel and endcap chambers. Document all

mechanical tolerances and dimensions. Compile a set of drawings. Integrate with electronics, alignment, gas and services. ·

(2.1.2) Investigate and validate with reduced size prototype measurements of different aspects of chamber design: al resolution performance vs. gap and strip segmentation; bl investigation of different possibilities of calibration: with wire induced signal, electronically and using data from real particles. cl consider foe possibility of molded chamber frame production.

(2.1.3) Construction of full size prototypes: al "-1 genemtion" prototype of a barrel middle layer chamber: 3m by l.lm- six 4mm

gaps; bl "O generation" prototype of a barrel outer layer chamber: 3.Sm by 1.4m - six Smm

gaps; cl "O generation" prototype of an end cap middle layer trapezoidal chamber:

2.2m by 0.9 /0.61m - six 4mm gaps.

Task Coordir:.•!Q!:. Gena Mitselmakher - SSCt

Chamber Coromitee: Carl Bromberg. Igor Golutvin, Ya-nan Guo, Coleman Johnson, Yuri I<iryushin, Kwong Lau, Louis Osborne, Vinnie Polychronakos, Alexei Vorobyov, Craig Wuest, Scott Whitaker.

Task Contn'butors: '

~ M. Atiya, M. J. Mlll".,agh, V. Polychronakos, V. Radeka l.lll ' J. Shank, S. Whitake.-, FS.U. visitor, engl, eng2, techl, tech2 !HEP-Beijjn~ Y. Chen, Y. Guo, Y. Xie, physicists and engineers IIn . M. Danilov, V. Gar.ilov, L. Laptin, P. Murat, V. Nagovitsin, A. Ostapchuk, V. Popov, V. Shibaev, V. Stolin, V. Tchistilin, I. T"ikhomirov. T!NR-Dubna Yu. Ershov, I. Golul:vin, N. Gorbunov, Yu. Kiryushin, A Makhankov, S. Movchan, V. Rashevsky, L. Simov, S. Ser~v, D. Smolin, V. Perelygin, V. Zhiltsov PNPI-5t.P~ V. Andreev, N. Bandar, G. Gavrilov, V. Grachev, O. Kiselev, A. Krivshich, V. Maleev, V. Mylnikov, S. Patrichev, O. Probfiev, A. Vorobyov SSQ.

5 · 18:48 May 7, 1993·

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We have identified several specific tasks organized along the general lines indicated above.

(1) Develop Cathode Strip Chamber Technology:

• Develop chamber design which achieves the baseline performance of spatial and time resolutions and has a good stability in tenns of alignment and operating point.

• Optimize the cha!nber design in regards to system performance and costs. • Construct several small-scale chamber prototypes to evaluate specific aspects of the design. • Construct large-scale prototypes of barrel and end cap chambers. • Integrate the chamber support and alignment systems with the chamber technology.

(2) Chamber Performance Evaluation:

•Test prototype che.:nbers at the Texas Test Rig and available accelerator beams (FNAL, BNL, RD5-CERN).

• Study the influence of the magnetic field on the chamber performance and the Lorentz-angle compensation.

• Study the single layer resolution, double track resolution, operation stability, and time resolution. • Develop an optimal gas mixture which has the best time resolution and efficiency. • Study the chamber sensitivity to neutrons. • Software development for calibration, tracking. trig,,aering. on-line monitoring. and off-line data

processing.

(3) Muon Trigger:

• Design and evaluate performance of Level 1 muon ·trigger by means of Monte Carlo simulations, cosmic ray, and. beam tests.

• Develop and evaluate electronics needed for trigger in collaboration with the GEM Electronic; Group.

(4) Alignment:

• Assess technology options and develop them for GEM application (LED-LENS, or CCD, etc). • Set up test bench to evaluate technologies in a standard way. • Integrate alignment technology with chamber design and support structure. •Set up Alignment Test Rig (ATR) to evaluate alignment technology with chamber mock-ups. • Design complete ~tem - specifying the type, number, and deployment of monitors. • Simulate operation of complete system and validate the design and its error budget. • Evaluate X-ray alignment scheme. Develop mass production techniques for aligning layers within a

chamber module.

(5) Electronics:

• Fabrication of front-end electronics for prototype chambers to be tested in FY1993. •Work in collaboradon with GEM Electronics Group to specify electronics for chamber readout

and trigger. •Test the design of front end/readout electronics on prototype c.'1ambers.

.. , (6) Simulations:

• Study backgrounds (muon-associated, punchthrough and neutron). • Evaluate system performance - resolutions vs. chamber placement, alignment specifications, flux

3 18:48 May 7, 1993

'

Consider a·middle superrnodule.

Module Length 350 cm Module Width · 119 cm Panel Skin Thickness(GIO) 0.05 cm Panel Skin Thickness(Cu) 0.0017 cm

.. Frame Thickness. 0.4 cm · . • Frame Width · · 6.5 cm

Densities of materials

Cu Epoxy Nomex 010

8.96 gr/cc 1.3 0.039 1.7

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Weight of Frame Weight of Epoxy Border Weight of Skins Weight of Cu Weight of Nomex

Weight of Polymer Frame Weight of wire attachemnet boards

Total

. Curreny design

49.8 Kg 34.1 Kg 49.6 Kg 8.9Kg 22.7 Kg

24.7 Kg 2.9Kg

165.1 Kg

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1. Low Density ( < 0.5gr / cm3)

2. Dimensional Stability

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3. No outgassing

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C\'lnxxx·l 5/18/VI

• Minimum material • Minimize fabrication costs • Minimize assembly costs

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SSC R_&D P~rt~

I. 8 NL c~~vr., ~et..i.u.~ "'t17!< BNL,~SC!.

i. L l.M.I'- ~ - 5t~ INf'f'l"k · ~~ C5C ~~fA

«) t~ IMh ,c twu , t""P, S» t~ w~J. tk 8) LoTJ.M,,t-t. ~ ~o~ti-oK. c) o~t~oK- ~wu.~

SiSCL J ITEP 3. TT R So/-fw«Xt, £,,,,vihl°~t ,,

"-) C,~ f ..,,,..,t~ OK- ,.."t "~t~ e/,u, ~. f) 0"1.- ... ~ llf/fAHhtfJ~

c) o/f- t.:KL /.t~ C 5>C ,!..fa. ~ c.."" L S NI - T c t'll s,_..., I . - > J. .... 1""

4. t>llBNA c.sc dTTR 1)1)8WA I 5SCL J I T'E p .

. 5 .. Lo VI tV(..,~ ~ t~fi&t1 Dl!B~/A, S!::>C L, BNL

. :; ....

40

I. sc.+ iw,~ Sf(,t.,.,l ~ t~*"' u~t~oll(, ~M, ~~t~t. f;.,_l,l 0. 8 Tl

JTEP . 2.. R,f.A,f ~ t~ 0)(,, vs t«-1° llAMI, s. t"IA.10 w ~Pl t k '

!TEP 3, ·· M e.~-u..~t~ o/ ~t UH-/ /"'*"''f.._

s~tivit1 "~ csc· · · · TTE P, B1VL

4. Two t~k ~kt,;"""'

ITEP

. . .:.;: ... ; .. : ·.

41

P N P I R. ~ D P~rut~

I. M~~~t fll D-iA.~l! (JIM," L,'1.l!~tx At.ttk ·

:l. C SC eJiWlc"f> ~~ M~tie r=~ . .3. /V~t'f.AM, ~ G~JM,w-w. seMAli,t~v;,t,.

4. C 5C t~ i"' I. 7 GtV p..,,,to}lf, l.eA-IM...

A) '/;iHA,~~

6) ~o ~ c.~ t koJL c) C SC w~ilc., ~ {.~tit ~~pS .l. > l#Ai,1.,I&, ~k. ~lc-c,t~oK,.

~. Mo~t'- ~ ~~t~~ ,,~ csc p~~ .

. :.··.·.-·

;; .. ·

42

--~...-·~----

. -

~ 5"- (f. q ¥Ct.I l.. . = \b· 0 (M,.

\·Si° ,_'i(Jw\~!1--- ·-----·-

-~.

'15

------·-·--·- -·---- ----·------ -.-

200

150

30 40 50 60

80

60

40

20

0 0 50 100

80

60

40

20

0 0 50 100

80

60

40

20

0 0 50 100

ns

ST Drift time distribution 2.5"/oAr 10%18 87.5°.4COz shortest out of 6, staggered, ±5° trigger 20ns width, Al-shield, 4800V SC1 •SC2 • ST1• ••• •ST6 coincidence

70 80 90

150 200 250 ns

150 200 250 ns

150 4 ()lOO 250 ns

80

100

!snl

300

!ST3I

300

!sT5I

300

. • '

·:·

Table 1. Radiation Length Comparison Between 1 cm pitch OPC and Baseline

Component Xo(cm) Baseline lcmOPC thickness !cml r.l thickness ! cml r.L

NOMEXCore 1400 7x 1.9 0.0095 7x 1.9 0.0095

Strip board GlO 19.4 14x0.05 0.0361 14x0.05 0.0361

Strip Board Cu 1.43 · 14x0.0017 0.0166 14x0.0017 0.0166

Epoxy edges (5.3 %) 31.2 7 x 1.9 x 0.053 0.0226 7 x i.9 x 0.053 0.0226

GlO gap frame (8.4%) 19.4 6x 8x0.084 0.0208 0

open profile chambers 16.0 0 6x0.433 0.1626

Chamber r.l Subtotal 0.1056 Q.2474

47 - --·------·---

·-·- - -----. -·- -- -· -- ... -· ·- .. ---- - -- . - ----·- ---------·-····------- ------·

f

------- ------

1.

. • •

Table2 Comparison between Baseline and OPC_(_0.8 cm cell sire and.doubleprofile)

----Component------:Xo(cm Basefu.e 0:8 cm ope-· --- . tbickness-(cm)=r.l tbictn·ss (cmCTJ;

----.NOMEX-€01T'l'e.-----t40Q--7x!.9 0:0095 4 x 1.9 0.0054

----...Stri~board-G-10----19.4 14-x-O;OS----0;03611----e--~x-o:os

Strip_BoaniCu. ___ --l.43-----14x 0.0011--0.0166--8x11001'7-- -0.0095

Epoxy edges (5.3 %) 31.2 7x 1 9x_QQS3 0.0226 4 x l.9-k0.05-3--0.012~

GIO gap frame (8.4%) 19.4 6x8x0.084 0.020 ()__

open profile chambers 16.0 0 6x0.260 . 0.09-1~ .

C:bamber rI SUbtotal 0.1056 0.1459

!

ltl7, 1·.

--~1-_:_-------------.-.,-,~-~~:~_;0;i::-.i=-.·~-.-__ -_;.-,,~~~~~---~--~.-------

I

0:-08 < 7J < 1.;J4t------

-8-i:=====-========

I 0 '''" • I