General Information Congress Committee CALL FOR PAPERS

th12 International Congress

MoldedInterconnectDevices

Nuremberg – Fuerth

Germanyth th28 – 30 September 2016

organized by

Research Association

Molded Interconnect Devices 3-D MID e. V.

in cooperation with

University of Erlangen-Nuremberg

Institute for Factory Automation

and Production Systems – FAPS

Contact

Congress Location

The congress will take place at the Congress Center (Stadthalle) in

Fuerth in Northern Bavaria. Direct connections to Nuremberg Airport

(distance 15 km) as well as to Fuerth and Nuremberg

central station are available by subway.

Conference Languages

The conference languages are German and English.

In the Industrial Track, a simultaneous translation in German and

English will be provided. In the Scientific Track, the lectures will be

held in English.

Exhibition

The event will be complemented by an accompanying industrial

exhibition as well as a poster presentation.

Guest Lectures

Invited experts from industry and research complement the technical

program with speeches about general developments in

MID technology.

MID Award 2016

Within the conference the Research Association 3-D MID e.V.

awards the MID Award 2016 for an outstanding developement

work in the field of MID technology.

Best Paper Award

The congress committee honors the best scientific congress

contribution with the Best Paper Award.

Technical ToursthOn Friday September 30 , 2016 Technical Tours to leading

companies in electronics production are offered.

Further Information

For further information visit our website www.3dmid.de or directly

contact the 3-D MID e.V. office.

International Program Committee▪ Prof. Drummer D. – University Erlangen-Nuremberg, DE

▪ Dr. Dumitrescu R. – Fraunhofer Mechatronic Systems Design, DE

▪ Prof. Feldmann K. – Research Association 3-D MID e. V., DE

▪ Prof. Franke J. – University Erlangen-Nuremberg, DE

▪ Prof. Gausemeier J. – Heinz Nixdorf Institute, DE

▪ Dr. Goth C. – Conti Temic microelectronic GmbH, DE

▪ Häcker G. – Häcker Automation GmbH, DE

▪ Hellmich M. – MID Solutions GmbH, DE

▪ Dr. Heyer J. – hc-heyerconsulting, DE

▪ Prof. Hirsch S. – University Magdeburg, DE

▪ Hirvonen E. – Nordic 3D-MID Solutions AB, SE

▪ Dr. Krüger R. – LPKF Laser & Electronics AG, DE

▪ Dr. Kriebitzsch I. – BMW AG, DE

▪ Dr. Kuhmann K. – Evonik Industries AG, DE

▪ Dr. Moguedet M. – Centre Technique de la Plasturgie, FR

▪ Prof. Niino T. – University of Tokyo, JP

▪ Dr. Pojtinger A. – 2E mechatronic GmbH & Co. KG, DE

▪ Rohde H. – Robert Bosch GmbH, DE

▪ Prof. Schulze V. – Karlsruhe Institute of Technology, DE

▪ Prof. Tseng M. – Feng Chia University, TW

▪ Ueda K. – Panasonic AG, JP

▪ Volkov I. – Ostec Enterprise Ltd., RU

▪ Zadarej V. – Molex Inc., US

▪ Prof. Zhang Y. – Tongji University, CN

▪ Prof. Zimmermann A. – Hahn-Schickard, DE

▪ Zippmann V. – Buss-Werkstofftechnik GmbH & Co. KG, DE

Organizing Committee▪ Prof. Franke J. – University Erlangen-Nuremberg, DE

▪ Dr. Goth C. – Conti Temic microelectronic GmbH, DE

▪ Kuhn T. – Research Association 3-D MID e. V., DE

▪ Dr. Pojtinger A. – 2E mechatronic GmbH & Co. KG, DE

Office 3-D MID e. V.

Research Association 3-D MID e. V.

Fuerther Str. 246b

D-90429 Nuremberg

Phone: +49 911 5302-9100

Fax: +49 911 5302-9102

E-Mail: congress@3dmid.de

Internet

Further information about the congress and instructions for

the speakers are provided on:

www.3dmid.de

Bionic ANTs - Festo AG & Co. KG

Technology

Papers are invited concerning these topics:

1. Innovation with MID

▪ Integrative product concepts

▪ Economical aspects

▪ Strategies to enter new markets

2. MID – Implementation and Realization

▪ Advanced benefits by MID

▪ Selection of MID manufacturing processes

▪ Strategies for successful MID projects

3. Integrated CAD / CAM Systems

▪ Integration of ECAD and MCAD

▪ 3D-MID layout and design

▪ Simulation

4. Materials for MID

▪ Use of new substrates / foils

▪ Circuit carrier surfaces

▪ Pigments and additives

5. Plastics Processing

▪ One-shot / Two-shot molding

▪ Special procedures

▪ Design guidelines

6. Metallization

▪ Alternative surface coatings

▪ Ampacity, adhesion

▪ Requirements for interconnection technologies

7. Structuring of Circuit Paths

▪ 3D ability

▪ Flexibility

▪ Structure sizes

8. 3D Assembly

▪ Mounting technologies: SMD, chip on MID

▪ Soldering technologies, conductive adhesives

▪ Interconnection materials

9. Quality Assurance

▪ Quality-assuring methods

▪ Environmental protection, recycling

▪ Test methods and standards

10. Future Trends

▪ Printing technologies

▪ Alternative assembly technologies

▪ Rapid prototyping / manufacturing

Innovation MID Topics for Papers

Innovation with MID: Series Maturity Production

Concepts and Alternative Production Processes

Latest serial applications in the MID technology and the increasing range

of innovative manufacturing solutions for molded interconnect devices

strongly emphasize the growing market success of this technology.

Innovative assembly and equipment producers of MID technology record

significant growth rates. The direct application of the electronic on various

three-dimensional substrates offers versatile design and rationalization

potentials for mechatronic systems.

Up-to-date information and expert discussions can set major impulses for

the successful implementation of this innovative and interdisciplinary

technology as well as for a stable assessment of the growth areas. The

conferences about MID technology in the metropolitan region Nuremberg

have established themselves as international most significant forum about

this technology.

The Research Association Molded Interconnect Devices 3-D MID e.V. themphanizes with the 12 conference the thematic features of products,

materials, manufacturing processes and technologies as well as launch

strategies. The conference takes place at the Congress Center

(Stadthalle) in Fuerth. Additionally, a comprehensive industrial exhibition

is planned in the the presentation section.

Submission of Abstracts and Papers

Experts of industry and science are invited to present a paper on

the topics listed alongside. For this, abstracts in the extent of 500

words have to be provided via the online conference tool including the

following details.

▪ Title of the paper

▪ Preferred classification (Industrial Track / Scientific Track)

▪ Allocation to field of topic

▪ Name and address of the author(s)

Further information as well as a template for your abstract is available

at the congress pages on www.3dmid.de.

Please note the dates stated below. Abstracts will be verified before

acceptance by the program committee. All accepted contributions will

be published in the congress proceedings. Information regarding the

presentations will be sent separately. Speakers will be granted

discounted participation fees.

Important Datesth▪ Submission of abstracts February 29 , 2016

th▪ Information about program selection April 29 , 2016th▪ Submission of contributions June 30 , 2016

th th▪ Conference MID 2016 September 28 - 29 , 2016th▪ Technical Tours September 30 , 2016

Quality and Reliability

Media Application Wire Bonding3D Mounting

3D Assembly

Adhesion Tests Environmental TestingAmpacity

Metal Layer SystemsSubstrate MaterialsFillers & Additives

Printing Technologies Plasma ProcessesLaser Structuring

Manufacturing Processes

Materials

Graphics courtesy of University Erlangen-Nuremberg FAPS / LKT