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2/6/2011
Mobile Environment Chamber
Capstone
2011
Product Design Specifications
Team members:
Duc Tran
Giang Nguyen
Peter Elabd
Tuan Ngo
The Duong
Thien Nguyen
Advisor:
Dr. Mark Weislogel
Maseeh College of Engineering & Computer Science
This report details design criteria, performance
criteria, and customer identification for PSU’s
2011 Intel EXCEL team.
REV. 4
1
Revision History
1. Rev.0 (January 16, 2011): Initial Rev released
2. Rev.1 (January 17, 2011): Introduction, Mission Statement, Identification of Customers
and Risks added
3. Rev.2 (January 25, 2011): Product Design Specification and House of Quality added
4. Rev.3 (January 31, 2011): Complete full document. Ready to final review.
5. Rev.4 (February 6, 2011): Final Rev
2
Contents
Revision History .............................................................................................................................. 1
Introduction .................................................................................................................................... 3
The purpose of this document ........................................................................................................ 3
Mission Statements ........................................................................................................................ 3
Project Plan ..................................................................................................................................... 4
Identification of Customers ............................................................................................................ 5
External Customers ..................................................................................................................... 5
Internal Customers ...................................................................................................................... 6
Customer Interviews and Feedback ............................................................................................... 6
Product Design Specifications ......................................................................................................... 7
House of Quality ........................................................................................................................... 13
Risk Management ......................................................................................................................... 14
Conclusion ..................................................................................................................................... 15
Appendix A .................................................................................................................................... 16
Appendix B .................................................................................................................................... 17
Appendix C .................................................................................................................................... 18
3
Introduction
Functional testing of electronic devices in various temperatures is an important activity in
electronic industries. The thermal test method of Intel can present challenges regarding lack of
mobility, non-uniform temperature distributions throughout the large chamber, and cost. The
goal of this design project is to build a flexible test device chamber for Solid State Drivers (SSDs)
to resolve such issues. A mobile heating-cooling chamber in which the temperature can be
controlled will overcome these difficulties. If successful, the apparatus can be developed
further to test different devices and be implemented in both laboratory and factory
environments in Asia, Europe, and America.
The purpose of this document
This Product Design Specification (PDS) document defines the criteria and requirements for the
design project Mobile Heating and Cooling Chamber. Also, it is an agreement between the
design team and customers about the objectives, engineering requirements, cost, timeline,
methods of verification and other defined criteria.
Mission Statements
By the end of the Spring Term 2011, a Mobile Heating and Cooling Chamber will be designed
and built as the working product, which should be ready to be finalized and used in the factory.
The design will meet all defined criteria and be able to solve problems of the current testing
method. The design will be completely documented by a design report, including: analysis,
detailed drawings, and a bill of materials.
4
Project Plan
A master plan is developed as a general guideline for the team to complete the project on time
as well as to meet due dates for reports and presentations required by the Mechanical
Engineering department. The project is divided into two terms as shown in the Gantt chart
(Appendix A).
Some milestones, tentative finish dates and due dates for presentations and reports required
by PSU are summarized in the following table:
Project Milestones
Milestones Due date
Finish PDS Before 4th Feb
PDS presentation 7th Feb. (PSU required)
PDS report due 9th Feb. (PSU required)
External and internal search presentations 21st Feb. (PSU required)
Final concept Before the end of Winter term
Progress report 7th Mar. (PSU required)
Detailed design and review with sponsor (customer) Beginning of April
Prototype Beginning of April
Testing Middle of May
Final review, optimization Near the end of May
Final product ready for delivery End of May
5
Identification of Customers
Customers are those who set requirements for the product design and performance. The
customers are classified as external and internal.
External Customers
External customers are all those who are not affiliated with PSU. The following list of
requirements identifies external customers and their input on the project.
Intel Corporation
- 10 times lower cost than the current method
- Portability
Andrew Besore, Test Technician
- Compliance with safety requirements in the Semiconductor Equipment
and Materials International (SEMI)
- Prevention of process-chilled water (PCW) leakage.
- Requirement of Emergency Shut-off (EMO) for AC power of the heater.
Milo Juenemann , Test Engineer (End User)
- Scale-up capability
- 19 - inch form factor
- At least 2 weeks continuously functioning as a test time cycle
- Temperature uniformity
Walter Fenk, Test Development Engineer, Intel sponsor
- Timelines
- Capable of loading the temperature/timing profile to automatically
control the temperature inside the chamber
- Feature of reading and saving the set point as well as the actual
temperature
6
Internal Customers
Internal customers are those who are affiliated with the PSU capstone team. The following list
identifies internal customers and their input on the project.
The PSU Capstone Program
- Completion of the project
Dr Etesami, Mechanical Capstone Project Coordinator
- Methodology of design process.
Customer Interviews and Feedback
Asking question and getting feedback are essential and integral parts of our design process. The
team has interviewed two Intel representatives, who are directly related to the device that is
going to be designed.
Andrew Besore, a Test Technician who is operating functional testers, mentioned problems
with the current method of testing. He also described a situation when water leakage occurred
in the test floor caused by a failed connection between the facility and the chamber. Such
failures show a new design of the chamber is necessary.
Milo Juenemann, a Test Engineer who has been working with Solid State Driver (SSD) testing for
a long time, talked about the need for a low cost tester which could be easily adapted for other
applications. Problems with the uniformity of the temperature inside the chamber, and the
imperfect cover causing dust around the UUT, were brought up as issues with the current
chamber.
The team conducted a tour in the Stress Test Lab by Walter Fenk to get better understanding of
the project and the working environment of Intel lab facilities.
7
Product Design Specifications
Shown below is a list of general criteria sorted from high priority (scored 1), medium priority
(scored 2) and low priority (scored 3). Following that are detailed requirement tables also
arranged from high priority to low priority defined by information provided in Appendix B (Intel
requirements) and Appendix C (SEMI). The measurable criteria are clearly defined by a number
and metric column whereas the immeasurable criteria are identified as N/A.
Criteria Priority
Performance 1
Environment 1
Safety 1
Cost 1
Mobility 1
Timelines 1
Ergonomics 2
Testing 2
Quantity 2
Maintenance 2
Materials 2
Quality and Reliability 3
Regulatory 3
Documentation (processes) 3
Company constraints and procedures 3
Legend High priority Medium priority Low priority
8
[1] Section 21 (pgs. 33-35) - SEMI S002-00-0706a (Appendix C)
Performance
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Temperature range
Intel Inside
temperature Celsius -5 to 105
Customer Defined
Testing
Temperature tolerance
Intel Inside
temperature Celsius +/- 2
Customer Defined
Testing
Transient Intel Rate of change temperature
Celsius/minute +/-10 Customer Defined
Testing
Uniformity Intel
Temperature difference
between any 2 arbitrary points after 5 minutes
soak time
Celsius +/-4 Customer Defined
Testing
Airflow velocity Intel Inside airflow rate Meter/second Minimum:
0.5 Desired: 5
Customer Defined
Testing
Communication Intel Read and write set
point temp & actual temp to PC
N/A N/A Customer Defined
Testing
Over limit protection
Intel
Alarms (or light) activate when
over limit condition detected
N/A N/A Customer Defined
Testing
Capacity Intel Max. number of
UUT contained in 1 chamber
Number 3-12 Customer defined
Prototyping
Environment
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Chilled water reuse
Intel Percent volume of chilled water recycling within the
chamber % 100
SEMI international Standard[1]
Testing
Chemical selection
Intel Non toxic chemical N/A N/A SEMI
international Standard[1]
Property of chemicals
used
Leakage prevention
Intel Percent of volume
container capable to hold the certain liquid volume
% 110 SEMI
international Standard[1]
Testing
9
[2] Section 12 (pgs. 17-18) – SEMI S002-00-0706a (Appendix C)
[3] Section 18.6 – Table 1 (pg. 31) - SEMI S002-00-0706a (Appendix C)
[4] Section 10 (pg. 15) - SEMI S002-00-0706a (Appendix C)
[5] Section 17 (pgs. 26-27) - SEMI S002-00-0706a (Appendix C)
Safety
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Emergency Shutdown
Intel Chamber equipped with an EMO circuit, EMO actuator
N/A N/A SEMI
international Standard[2]
Testing
External Temperature
Intel External surfaces, knobs,
grips touching temperatures Celsius
Knobs, Grip: 51 or 60 Surface: 65
SEMI international Standard[3]
Testing
Hazard warning label
Intel
Labels required in associated risky, hazardous parts
(extreme temperature, electrical shock)
N/A N/A SEMI
international Standard[4]
Similar System
Comparison
Hazardous energy isolation
Intel
Lockable energy isolation capabilities (circuit breaker, disconnect switch, manual
valve)
N/A N/A SEMI
international Standard[5]
Similar System
Comparison
Cost
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Cost of production per UUT slot
Intel Cost Dollars/ UUT slot
150-500 Customer Defined
Bill of all cost
(materials, labors)
10
Timelines
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
All due date are met
PSU & Intel
Successful complete the tasks on time and follow
detailed plan closely N/A N/A
Course Requirements
Grade
Ergonomics
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Easy handling of
device Intel
Number of handles
Number 2 Customer defined
Prototyping
Handle design
Intel Enclosed handle [1], with designed
dimensions Inch
Minimum width: 5 Minimum depth: 1.75 Maximum diameter: 1
SEMI international Standard[6]
Prototyping
Testing
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
All tests must be conducted
Project team
Tests That Cannot be Conducted With Current
Resources
N/A 0 tests Customer Defined
Review
[6] Table A1-1 (pg. 11) - SEMI S008-00-0307E (Appendix C)
Mobility
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
19 - inch rack form factor
Intel Width and height of the
chamber Inch
Width:19 Height:1.75x
Standard Server Rack
width Testing
Mobility Intel
Can be moved within a single facility site with
minimal disassembly and facility work. Lifting point
clearly identified
N/A N/A Customer defined
Testing
Weight/density Intel Weight per unit area lb./sq.
ft. ≤75
Customer defined
Testing
11
Maintenance
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Components on the tester that are most likely to fail
must be easily replaceable
Intel
The number of components that
cannot be replaced
N/A 0
components Customer Defined
Prototyping and Bill of Materials
Easy reparation
Intel The time to fix
the device Hour
Maximum: 2 hours
Customer Defined
Prototyping
Materials
Requirements Customer Metrics &
Targets Metric Target Target Basis Verification
All materials near or in
contact with UUT must be
electrically dissipative to prevent ESD
Intel
Highly charging components and
ungrounded components
Number 0
components Customer Defined
Bill of Materials
Quality and Reliability
Requirements Customer Metrics &
Targets Metric Target
Target Basis
Verification
The system should be
durable and reliable
Intel
Mean Time Between Failures
(MTBA), Mean Time Between Assists (MTBA)
hour
Fix time>2h:MTBA > 5000h
Customer Defined
Testing
Fix time:6m-2h:MTBA > 2000h
Fix time: <6: MTBA > 125h
Quantity
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Capability of being
produced in small batch
Intel The number of chambers to be
produced Number 40 - 160
Customer Defined
Prototyping
12
Documentation
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Product is documented completely
Intel The ease of installing,
operating, and maintaining the tool
N/A N/A Customer Defined
Prototyping
The design is documented completely
Intel The ease of
redesigning the product
N/A N/A Customer Defined
Prototyping
Regulatory
Requirements Customer Metrics & Targets Metric Target Target Basis Verification
Comply with SEMI and get
Underwritten Laboratories (UL)
approved
Intel
The compliance with SEMI
document and UL standards
N/A N/A Customer Defined
Prototyping
13
House of Quality
Technical parameters
Legend:
*** : strong relation
**: medium relation
*: weak relation Im
port
ance
(1
00
)
Co
ntr
ol
syst
em
Wei
gh
t
Wid
th
Ch
amb
er’s
geo
met
ry
# o
f U
UT
in
1 c
ham
ber
Ch
amb
er’s
mat
eria
l
Hea
t so
urc
e
Co
st p
er U
UT
slo
t (d
oll
ar) Legend:
: Good
: Medium
: Poor
Customer demand: Market competition
Performance 35 1 2 3 4 5 6 7 8 FlexStar
Temp. range
(-5C to 105C)
9 ***
Temp. tolerance
2C
11 *** ** * * N/A
Transient at
10C/min.
6 *** * **
Uniform temp.
distribution
9 ** ** **
Safety 11 ** * **
Cost 11 ** * *** *** ** ***
Scalability 11 * * ** *
Mobility 9 *** ** *** **
Ergonomics 11 ** * **
Maintainability 6 * ** * ** N/A
Reliability 6 ** ** ** **
Market competition:
FlexStar N/A 2100
lb
49” N/A 64 N/A N/A
Target PID 70 lb 19” TBD 12 TBD Electric 200
14
Risk Management
The risks will address the cases that resulted in the failure of the final product. The risks and
plans for mitigating the risks are shown in the following table:
Risk Causes Consequences Probability Level Mitigation plan
Monitoring plan
1
Team communication and alignment
Lack of mutual understanding /
differences in schedule
Severe (confusing
lead to delay in project)
Possible High
Exchange information
during weekly meeting,
communicate through emails
and phone when issues emerge
Update status through weekly
meeting
2
Supplier issues and availability
of parts
Do not utilize off-the-shelf
components
Severe (slow down
progress) Possible Medium
Keep design simple. Contact
supplier for availability of part while designing.
An early brainstorming
meeting to try and
anticipate any long lead-
time materials
3
Project exceeds budget
Cost inflation, overly-designed
parts
Marginal (does not
satisfy customer)
Possible Medium Change to simpler design / Consult
sponsors N/A
4 Prototype does
not work Bad
calculation/design
Catastrophic (team must
rework) Possible High
Consult advisor and other related
technical engineers
Testing at each step of fabricating process to
prevent errors going
downstream.
5
Design too complicated to
fabricate
Too many features
Catastrophic (team must
change design, slow
down project)
Unlikely High
Remove unnecessary
features. Keep it as simple as
possible
N/A
15
Conclusion
The design project focuses on solving the current problems of Intel’s mass functional testing
method for SSDs, which affect productivity and testing quality. A mobile chamber is a promising
solution to eliminating many of the problematic issues. All of the requirements are defined in
term of engineering metrics in this report. A master plan is also developed as the main
guideline for completion of the project. With this understanding of the Product Design
Specification, the team is ready for the next phase of research, concept generation and
evaluation.
16
Appendix A
Project Grant Chart
ID Task Name Start Finish Duration27/320/2 6/3
1 19d2/4/20111/14/2011PDS
2 7d1/21/20111/14/2011Customer identification & requirements, existing product
3 7d1/28/20111/21/2011PDS criteria, engineering metrics, HoQ
3/4
Feb 2011
6/2 8/5
Mar 2011 Apr 2011
10/4 17/4 24/413/3 22/523/1 1/513/2
Jan 2011 May 2011
16/1 20/3 15/530/1 27/2
6d2/4/20111/30/2011Review, update tasks4
12d2/13/20111/31/2011External search5
7
14d2/17/20112/2/2011Internal search
14d2/28/20112/13/2011Concept evaluation & selection
6d2/18/20112/13/2011Review ideas8
9 9d2/28/20112/18/2011Finalize concept
6
Main task Sub task
12
11
10 18d4/15/20113/27/2011Detailed design
20d5/1/20114/8/2011Manufacturing, Prototyping
18d5/22/20115/2/2011Testing, optimization, review
Legend:
17
Appendix B
1
Equipment Requirements
Requirements Table Structure
The table that follows lists key feature requirements for the Equipment
The table includes these fields:
Key
Unique alphanumeric identifier to easily identify and reference each requirement.
Main Category
High level requirement category
Secondary Category
Secondary level requirement category
Flexibility/Importance
Rankings system as follows:
1: No flexibility. Imperative. All efforts must be made to meet this requirement
2: Somewhat flexible. Should be attained, but details are negotiable, especially if a significant cost driver.
3: Desirable, very flexible.
4: Suggested or optional.
Risk / Conformity of the design to Requirement
This column is to be filled out as the project evolves as an indication of progress.
3 (green): OK
2 (yellow): Problem defined, but not completely defined. Or, no data yet available to define problem
1 (red): Showstopper. Requirement cannot be met, or cannot be met in time.
Requirement
Description of the requirement.
2
Requirements Table
Key
Main
Category
Secondary
Category
Flexibility/
Importance
Risk Requirement
CS00 1 CS01 Control System General 1 The temperature controller should be a simple,
digital, PID. (Watlow PM3 recommended) CS02 Control System Communication 1 Capable of real time communication via Modbus
TCP/IP(Ethernet) or Modbus RTU (RS485). Need ability to read and write the current setpoint temperature as well as the current actual temperature via an interface to a PC.
CS03 Control System Over limit protection
1 An alarm activates, sound enunciator (and light) when thermal over‐limit condition is detected.
D00 1 D01 Safety General
Environment, Safety, and Ergonomics Requirements.
1 Must comply with SEMI S2‐93: Safety Guidelines for Semiconductor Manufacturing Equipment. This includes an EMO function. If the unit plugs into std 110‐240 AC, (up to 20A), Intel can provide the NC (normally closed) EMO circuit. This also includes a requirement that the external surface of the equipment not exceed a temperature that will cause injury if touched by an operator. The maximum allowable temperature depends on the material that may be touched. If the material is metal, the max temperature is: 60˚C If the material is plastic, the max temperature is: 85˚CRegardless of the material the minimum external temperature should not be less than 0˚C. Intel can provide additional design input / feedback.
D02 Safety Ergonomics 1 Must comply with SEMI S8‐95: Safety Guidelines for Ergonomic/Human Factors Engineering of Semiconductor Manufacturing Equipment. Intel can provide design input / feedback
D03 Safety Over limit Operator warning
1 See CSO3
D04 Safety Over limit test shutdown
1 The equipment should be capable of shutting down to a safe state when a dangerous over limit operation is detected (°C, etc) or when an EMO is pushed.
DM00 DM01 Documentation Users Manual 3 Possible documentation that is desirable, but not
necessarily required for a concept proto. Operations Manual Installation Manual Maintenance Manual Programming Manual (For process controller) Applications Manual (TBD)
3
Key
Main
Category
Secondary
Category
Flexibility/
Importance
Risk Requirement
DM02 Documentation Drawings and Schematics
2 Relevant Drawings: System layout Mechanical detail drawings, as required Assembly drawings Relevant Schematics: Electrical Mechanical Airflow Plumbing
DM03 Documentation Spare Part Identification and replacement guide
3 Listing of all Field Replaceable Units, if any. This would lead to a list of recommended spares.
DM04 Documentation Diagnostic & Troubleshooting
3 Procedural Information Diagnostic Troubleshooting
DM05 Documentation Original Equipment Manuals
3 OEM Equipment Manuals and Part identification sheets
F00 F01 Facilities Transportability 3 Instructions for crating and shipping. (Not needed for
concept proto)
F02 Facilities Mobility 2 Can be moved within a single facility site with minimal disassembly and facilities work. Lifting points clearly identified. The three (3) dimensions of the device must allow for passage through doorway – (83 in high, 60 in wide)
F03 Facilities Weight/Density 4 75 lb./sq. ft. or less F04 Facilities Electrical 3 Accommodate common available power standards
worldwide, especially US, Asia, Europe, Brazil. F05 Facilities Footprint 2 Equipment footprint excluding hood is desired to be
as small as possible. ME00
ME01 Mechanical Thermal Workspace Dimension, X‐Y‐Z
1 See drawing
ME03 Mechanical Hood Exterior Dimension, X‐Y‐Z
2 See drawing/slides
ME04 Mechanical Max Weight 3 TBD ME05 Mechanical UUT Access 1 Each UUT easily accessible from front. Any covering
or assembly in front of the UUTs must hinge or slide out of the way, be removable, or in some other way allow easy access to UUTs. The UUTs will be frequently swapped out and this must be a relatively easy activity for the end user/operator.
ME06 Mechanical Exterior Color 3 Exterior Color TBD. UU00
UU01 UUT Description
UUT Qty. 1 12. See drawing for layout
UU02 UUT Description
UUT Dimension (each)
1 Each UUT is a solid state disk drive, 2.5 inch mobile form factor. (16mm thickness)
UU03 UUT Description
UUT Material 1 PCB: Printed Circuit Board Assembly and Aluminum case. Additional UUT mass and material thermal property details TBD.
4
Key
Main
Category
Secondary
Category
Flexibility/
Importance
Risk Requirement
UU04 UUT Description
UUT Mass 1 TBD
UU05
UUT Description
UUT Live Load 1 9W of power consumption per UUT is maximum. Typical may be less.
M00 M01 Maintenance 3 Components on the tester that are most likely to fail
must be easily replaceable. ( See notes under reliability)
R00 R01 Reliability MTBF 3 Mean time between failure (when time to fix
equipment > 2 hours) > 5000 hours Mean time between failure (when time to fix equipment is between 6 minutes and 2 hours) > 2000 hours
R02 Reliability MTBA 3 Mean time between assists (when time to fix equipment < 6 minutes) > 125 hours An “assist” is any interruption during use of the equipment that requires operator intervention to correct so that use can be restarted. Examples: Fuse blows and needs to be replaced, refrigeration trip, etc.
R03 Reliability MTTR 3 Mean time to repair tester < 2 hours. RG00 RG01 Regulatory First Proto 3 For first unit delivered, all requirements of this section
may be replaced by a single-equipment, 3rd party inspection. However, the equipment should be designed with the intent of eventually complying with all requirements of this section.
RG02 Regulatory UL 3 UL ApprovedRG03 Regulatory SEMI 3 SEMI compliance, including
SEMI S2-0200 and S2-93 (Environmental, Health, and Safety Guidelines for Semiconductor Manufacturing Equipment) SEMI S1-0701 (Safety Guidelines for Equipment Safety Labels) SEMI S8-0701 and SEMI S8-95 (Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment)
RG04 Regulatory International 3 Must be designed and certified to any standards that are required by the following countries for installation and operation of the equipment in manufacturing plant s or laboratory environments. United States Malaysia China Europe (Ireland)
5
Key
Main
Category
Secondary
Category
Flexibility/
Importance
Risk Requirement
RG05 Regulatory International 3 Should be designed certified to any standards that are required by the following countries for installation and operation of the equipment in manufacturing plant s or laboratory environments. Taiwan Korea Europe (Hungary)
RG06 Regulatory International 3 Consider certification to any standards that are required by the following countries for installation and operation of the equipment in manufacturing plant s or laboratory environments. Brazil Mexico India Japan Israel Europe (All European Countries) Canada Australia
TH0 TH1 Thermal
Capability Air Temperature Setpoint Range
1 Must be able to hold temperature of air supplied to UUT Max / Min workspace thermal working range Minimum: +35 C Maximum +65 C
TH2 Thermal Capability
Air Temperature Setpoint Range
2 Must be able to hold temperature of air supplied to UUT Max / Min workspace thermal working range Minimum: ‐5 C Maximum +105 C
TH3 Thermal Capability
Transient 2.5 Air temperature supplied to UUTs can achieve a transient ramp of + and – 10 °C/minute between the min and max temperature setpoint.
TH4 Thermal Capability
Airflow velocity 2 Air flow rate past UUT Required: Minimum average air flow rate across UUT: 0.5 m/s Desired: Minimum average air flow rate across UUT: 5.0 m/s More is better.
TH5 Thermal Capability
Accuracy 1 The accuracy of the temperature measurement at any control point should be +/‐ 2 °C or better.
TH5 Thermal Capability
Uniformity 2 The air temperature measured anywhere within the workspace, after 5 minutes of soak time should be within 4 °C of the control point temperature. Because of live load self heating the temperature of the air temperature deviance within 1cm of the UUT may exceed this requirement.
6
Key
Main
Category
Secondary
Category
Flexibility/
Importance
Risk Requirement
TH6 Thermal Capability
Calibration 3 CalibrationLong term (week – year) Periodic calibration of thermocouple Short term drift (minute – week) Redundant temperature logging (May be provided by Intel) Details TBD, flexible. Provide calibration recommendations.
UE00 UE1 UUT
Environment ESD 3 All materials near or in contact with UUT must be
electrically dissipative to prevent ESD discharge related damage to UUTs
18
Appendix C
The SEMI standard is commercially purchased, copyrighted document. Please go to the link below for more information: http://www.semi.org/en/Standards/index.htm