Miniaturized and Durable Electronics for Extreme ...robotics.estec.esa.int/ASTRA/Astra2015/Presentations/Session 2A... · chemistry Uppsala University • Project Manager, ESA, SNSB,

Company confidential/proprietary www.aacmicrotec.com

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Miniaturized and Durable Electronics for Extreme Temperature Shifts ASTRA 2015 - 11 May ESTEC - Noordwijk Mattias Lindgren [email protected]


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Presentation overview

• Me, Mattias Lindgren • ÅAC Microtec company • What ÅAC do • Miniaturization • How to do it • TASST – Thermosonic Assisted Solder Sphere Transfer • Summary and a cool picture


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The speaker

• Mattias Lindgren • M.Sc in material

chemistry Uppsala University

• Project Manager, ESA, SNSB, B2G, B2B – Environmental Test Campaign on ÅAC products

• Thermal cycling, Radiation (TID, SEE), etc. – PSU for the MREP PLDPU with RUAG

• Development Engineer – UBM, Top Layer Routing, Solder Sphere Transfer

Photo by NASA


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ÅAC Microtec develops and supplies complete satellites and sub-systems to the small satellite market

Spin-off company from Uppsala University, The Ångström Laboratory, Sweden in 2005 Locations

• Head Quarters: Uppsala Science Park, Uppsala, Sweden

• AAC Microtec North America Inc., NASA Ames CA

• Partners: HTL (JP), Soletop (Kr)

ÅAC at a glance


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30 Employees

4M€ Revenue, 2014

Main owners

• Fouriertransform AB • RP Ventures AB • Kalogi Holding AB • Uppsala University Holding AB

ÅAC at a glance


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Satellite Avionics Components Satellite Systems

EGSE and training products

MATS

SPARC-1

µRTU nanoRTU OBC Lite

DPCU Mass Memory MPDU

RIA – “Rapid Integration Architecture”

VSI FSDK JTAG Debugger

NGP – “Advanced Rapid Integration Architecture”

OBC-S, RTU-S, TCM-S, SpW Router, PSU Architecture

DHS, EPS

Satellite prime Systems Engineering,

DHS, EPS, AIT, etc.

µPOL

Power conditioning

MCC

Motor Control

Inertial Sensing

IMU


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µPOL • Integrated power converter, with current limiter

and over voltage protection • Input VDC: 8 - 13 V, Output VDC: 1.5 - 5 V @ up

to 5A • 100 kRad MCC Motion Control Chip • Controls up to three brushed or one brushless

motors in torque, position, velocity and open-loop control mode

• Miniaturized design IMU • Integrated MEMS based accelerometer and rate

sensor. • Outputs the combined measurements from four

single axis accelerometers and four rate sensors. • Rover IMU, SINPLEX

Power Conditioning, Motor Control and Inertial Sensing


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Space, Ground, Launch Vehicle

Satellite SPARC-1 TechEdSat-1

DHS, Power, AIT

MATS: DHS, POW SPARC-1: DHS, POW, AIT RISESAT: DHS, POW

OBC, RTU, MM, PCDU

RIA: OBC Lite NGP: OBC-S, TCM-S, RTU-S, PSU, µPOL

Miniaturization, Electric and data interfaces, Form Factor

Flip Chip, Bare Die Proc., CCSDS, 3D package, LTCC, SpaceWire, SPA, CubeSat

Products, Projects and Tech

Mission

Satellite

Subsystem

Components

Technologies, Standards

Example categories

ÅAC Products, projects and technologies


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Si-interposer platform

Bare die processing

LTCC 3D-stacking

Hermetic sealing

Wire bonding

Mechanical integration

Electrical integration

Hybrid Multi Chip Modul (MCM) packaging


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Miniaturization technology

• Hybrid technology incl. several mounting techniques and circuit board materials (PCB, Ceramic)

• Highly robust systems with extreme tolerance towards large temperature cycles

• Designed for highly demanding missions and placement outside of temperature controlled environment for increased performance.


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Temp testing

• Multi wafer hybrid Integration Roover IMU (ESA) – Thermal cycling survival -135 to +85C (8 cycles -145 to +95C) including

electrical screening every second cycle

• Motor Control Chip (ESA) – Thermal cycling -135C to +55C pressure 8 mbar CO2, number of cycles

92. Checkup 3 times / 24h

• Assessment of ÅAC System-in-Package (SiP) technology (ESA)

– Thermal cycling -55C to +125C, number of cycles 100


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Making it possible

UBM Flipchip

LTCC Top layer routing

SMD

Wirebonding

AssemblyAssembly

DieDie

BoardBoard

Solder Sphere Transfer


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Under Bump Metallization


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Assembly

Wire-bond I/F

Flip-Chip & underfill

SMD


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Making it possible

• Systems require a lot of functions • Expensive to get customized components

SRAM UT8Q512E

ADC RHF1401

Comparator LM339

Hex inverter 54AC04

Op-amp LM324

CAN Transceiver TLE6250C

LVDS / Spacewire DS90LV019


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Making it possible

UBM Solder Sphere Tranfer Flipchip

LTCC Top layer routing

SMD

Wirebonding

AssemblyAssembly

DieDie

BoardBoard


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TASST

• Thermosonic Assisted Solder Sphere Transfer

Solder Sphere

Die with UBM pad

Placing tool

Heat

Force

Ultrasonic Hz


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TASST before and after reflow


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TASST Shear test JESD22-B117A Chip type Method Avg. max.

shear force (g)

Std. Dev (g)

LM324 Solder jetting 27,9 4,8 LM324 TASST 27,8 2,0 LM339 Solder jetting 25,6 4,6 LM339 TASST 28,2 2,1

DS90LV019 Solder jetting 36,0 2,9 DS90LV019 TASST 30,8 4,0 TLE6250C Solder jetting 32,4 4,3 TLE6250C TASST 34,4 2,9 54AC04 Solder jetting 30,2 2,5 54AC04 TASST 28,7 1,8

UT8Q512E Solder jetting 28,2 6,0 UT8Q512E TASST 30,5 4,7


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Summary and future work

• TASST method has promising results • TASST makes prototype system builds feasible • TASST needs to be evaluated further

• ÅACs long term goal is to miniaturize all avionics

components


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Summary and future work

• By making systems durable and smaller they can be moved out of the heated body of the robot or vehicle

• Lowering the need for power • Creating more room for payloads • Increased functionality of the robot or vehicle


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Thank you for listening Mattias Lindgren [email protected]

Documents

Miniaturized and Durable Electronics for Extreme ...robotics.estec.esa.int/ASTRA/Astra2015/Presentations/Session 2A... · chemistry Uppsala University • Project Manager, ESA, SNSB,