Upload
vannhan
View
238
Download
1
Embed Size (px)
Citation preview
12
Mini
Jack
s
LGY22 9-0101F(LGY2209-0101F)
Circuits
2341
SMD Type Reflow SolderingP.C. Board Dimension(Top View)
(500pcs/reel)
LGY2209-03 F
P.C. Board Dimension(Bottom View)
Circuits
2341
DIP Type
[t=0.8]
Manual SolderingHousing Color
00 Black40 Yellow
0.1
0.05
(Ter
min
al p
ositi
on
rang
e)
2.24
.4
6 2 12
3.65
0.4
0.1
0.05
(Ter
min
al p
ositi
on
rang
e)
2.24
.4
6 2 12
3.65
0.4
2
4
1
3
3 3
1.8
1.822
2.75
2.75
9
3.5
7.5
22
5.35
1.8
1.8
2-1.2(Hol
e)
2
4
1
3
3 3
1.8
1.822
2.75
2.75
9
3.5
7.5
22
5.35
1.8
1.8
2-1.2(Hol
e)
Metal Sleeve0 Without1 With
Metal Sleeve0 Without1 With
4.4
2.2
5 4-2
3.6
6 2 12
4-1.5x0.7
9 5.3
51.
9
7.5
3.5
2.4 2.4
13
2
4
2-1.2
4.4
2.2
5 4-2
3.6
6 2 12
4-1.5x0.7
9 5.3
51.
9
7.5
3.5
2.4 2.4
13
2
4
2-1.2
3.5mm Dia. Jacks Features1. A small 3.5mm jack that was developed for small, mobile
equipment.2. A wide selection is available including surface mounting,
DIP, spring terminal, and mid mount types.
Specification1.Electric Performance
Rating : 1A, 12V DCContact Resistance : 30m max, 50m max.Insulation Resistance : 100M min.500V DCWithstanding Voltage : 500V AC(for one minute)
2.Mechanical PerformanceInsertion Force : 35N max. at 3.5mm Dia.gaugeWithdrawal Force : 3 to 35N at 3.5mm Dia.gauge
ApplicationSmart phones, mobile phones, tablet PCs, portable audio, other small AV equipment.
13
Mini
Jack
s
3.5mm Dia. JacksLGY2209-0800F
Circuits
DIP Type Reflow SolderingManual SolderingShading Type
[t=0.8]
LGY2109-0200F
P.C. Board Dimension(Bottom View)
Circuits
34521
DIP Type Manual Soldering[t=1.0]
LGY2109-1701F
Circuits
34521
DIP Type Reflow SolderingManual SolderingP.C. Board Dimension(Top View)
[t=0.8]
4
2 1
3
8-R0.4
2.2
2.42.4
0.4
7.5
33.
16
2-1.24-1.6x0.8 4
2 1
3
8-R0.4
2.2
2.42.4
0.4
7.5
33.
16
2-1.24-1.6x0.8
P.C. Board Dimension(Bottom View)P.C. Board Dimension(Bottom View)
2 12
2.5 4.52x1
0.5
2.62.14.
2
5.53.6 6
2
2 12
2.5 4.52x1
0.5
2.62.14.
2
5.53.6 6
2
3 1
24
5
2.2
2.4 2.4
2x1.15x1.5x0.8
7.8 5.
44.
52.
5
1.9
5.2
9.2
2.7 No printed this area (Component Side)
3 1
24
5
2.2
2.4 2.4
2x1.15x1.5x0.8
7.8 5.
44.
52.
5
1.9
5.2
9.2
2.7 No printed this area (Component Side)
6
0.6
5.53.6
4.2
2.1
2.6
2 12
0.5
6
0.6
5.53.6
4.2
2.1
2.6
2 12
0.5
1
2
5
3
4
2.2
9.2
5.2 1
.9
5.4
1.5x0.8
2x1.15
2.5
8.5
2.4 2.4(Land)
1
2
5
3
4
2.2
9.2
5.2 1
.9
5.4
1.5x0.8
2x1.15
2.5
8.5
2.4 2.4(Land)
14
Mini
Jack
s
3.5mm Dia. JacksLGY2109-3301F
Circuits
24531
DIP / SMD Type Reflow SolderingP.C. Board Dimension(Top View)
[t=0.8]
LGY2109-1801F
Circuits
245316
SMD Type Reflow SolderingP.C. Board Dimension(Top View)
(800pcs/reel)
LGY3509-0400F
Circuits
34521
DIP / SMD Type Reflow SolderingP.C. Board Dimension(Top View)
[t=0.7]
65.53.6
4.2
2.1
2.6
0.5
1
65.53.6
4.2
2.1
2.6
0.5
1
5.2 5.92.5
3.4
3.2
2.2
3.7
2.9Two 2.5x1.9
(Land)
6x1.
82.
5
2.5
6.3
6.9
10.6
13.49
.413
.4
5
3
16
2
4
5.2 5.92.5
3.4
3.2
2.2
3.7
2.9Two 2.5x1.9
(Land)
6x1.
82.
5
2.5
6.3
6.9
10.6
13.49
.413
.4
5
3
16
2
4
0.65
0.5
3.455
.55
6 2 12
8.72.5
5.5
2x1
3.6
0.65
0.5
3.455
.55
6 2 12
8.72.5
5.5
2x1
3.6
2.12.1
2.4 2.2
2x2.4
(Land)
1.9
5.4
9.2
8.7
2.5
5.2
2x1.22x1.6x0.8Through hole
5
31
2 4
2.12.1
2.4 2.2
2x2.4
(Land)
1.9
5.4
9.2
8.7
2.5
5.2
2x1.22x1.6x0.8Through hole
5
31
2 4
15
Mini
Jack
s
3.5mm Dia. Jacks
LGY3209-0400F
Circuits
24531
Spring Contact TypeP.C. Board Dimension(Top View)
LGY2409-0200F
Circuits
24531
Spring Contact TypeP.C. Board Dimension(Top View)
1.4 13.86
5
5
3.6
5.4
3.2
1.4 13.86
5
5
3.6
5.4
3.2
7.4
4.1
2
3
1
4
2.4
3 3
5.2
12.6
5(Land)
7.4
4.1
2
3
1
4
2.4
3 3
5.2
12.6
5(Land)
2.4
0.6 34.6
6.81.4 13.7
357.8
3.65.5
2.4
0.6 34.6
6.81.4 13.7
357.8
3.65.5
3.1
2.9 2.9
2.5
(Land)
1.7
4.9
11.4
1.5
8.9
3.3
5
3
12
4
3.1
2.9 2.9
2.5
(Land)
1.7
4.9
11.4
1.5
8.9
3.3
5
3
12
4
16
Mini
Jack
s
3.5mm Dia. JacksLGY6502-0900F
Circuits
3
2
1
DIP Type Flow SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
LGY6502-0800F Noise-Resistant Designed (With Earth Plate)
Circuits
3
2
1
DIP Type Flow SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
LGY6509-0100F
Circuits
2431
DIP Type Flow SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
816.5
4.5
7 3.
6
0.5
6.5 9
4
1
2
3
1.2
8.25.
9
6.25
11.2
516
1.7
1x2.5
0.8x21x2.5
816.5
4.5
7 3.
6
0.5
6.5 9
4
1
2
3
1.2
8.25.
9
6.25
11.2
516
1.7
1x2.5
0.8x21x2.5
11
6.5
7 3.6
1.5
4
1118
3
9.3
121417
.8
8
2-1.9x1
0.8x1.9
1x2.4
2.1
12
4
3
11
6.5
7 3.6
1.5
4
1118
3
9.3
121417
.8
8
2-1.9x1
0.8x1.9
1x2.4
2.1
12
4
3
17
Mini
Jack
s
3.5mm Dia. JacksLGS2318-0100F
Circuits
54321
DIP Type Manual SolderingP.C. Board Dimension(Bottom View)
[t=1.0]
LGS6506-0700F
Circuits
1872
543
DIP Type Flow SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
LGS6507-1300F
Circuits
1987
456
32
DIP Type Flow SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
14.53
6.4
2.5
4.5
2x1
9.153.55
3.6
14.53
6.4
2.5
4.5
2x1
9.153.55
3.6
3
54
2
3
1
5.453.42.15
1.95 6x0.8x1.4(Hole)4.82.7
5.4
3.5
4.5 11 11.4
12.
45.4
0.1
112x1.3(Hole)
3
54
2
3
1
5.453.42.15
1.95 6x0.8x1.4(Hole)4.82.7
5.4
3.5
4.5 11 11.4
12.
45.4
0.1
112x1.3(Hole)
11 183.5
6
114
2.5
1.5
6.5
7 3.
6
7 4
3 1
8
2
5
17.8 15
.3 127.
5 8
4.1 1-1x2.42-0.8x1.4
2-1.9x1
2-1.9x0.8
9.3
2.1
11 183.5
6
114
2.5
1.5
6.5
7 3.
6
7 4
3 1
8
2
5
17.8 15
.3 127.
5 8
4.1 1-1x2.42-0.8x1.4
2-1.9x1
2-1.9x0.8
9.3
2.1
18
Mini
Jack
s
3.5mm Dia. JacksLGS6509-1000F
Circuits
765432891
DIP Type Flow SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
LGY2502-0200F
Circuits
3
2
1
Flow Soldering(Please contact about soldering condition)Manual Soldering
DIP TypeP.C. Board Dimension(Bottom View)
[t=1.2/1.6]
LGY2512-0100F
Circuits
3
2
1
Flow Soldering(Please contact about soldering condition)Manual Soldering
DIP TypeP.C. Board Dimension(Bottom View)
[t=1.2/1.6]
3.518
6
11
7 3.
6
6.52.
513
4
1.5
9.3
4.111.3
87.5
1215
.316
.717
.8 1.9x0.8
1.9x1
0.8x1.4
1x2.41.9x0.8
2.1
6
8
3
4
9
2
7 51
3.518
6
11
7 3.
6
6.52.
513
4
1.5
9.3
4.111.3
87.5
1215
.316
.717
.8 1.9x0.8
1.9x1
0.8x1.4
1x2.41.9x0.8
2.1
6
8
3
4
9
2
7 51
6.53
1.51.8
2.5 11.58.3 0.2
6 3.
6
35
1
1.2
2.5
6.9 2
.6 3.5
4.5
9
1
32
31.7x0.8
21.4 2.2 2.6
6.53
1.51.8
2.5 11.58.3 0.2
6 3.
6
35
1
1.2
2.5
6.9 2
.6 3.5
4.5
9
1
32
31.7x0.8
21.4 2.2 2.6
6.53
1.51.8
2.5 11.58.3 0.2
6 3.
6
35
1
1.2
2.5
6.9 2
.6 3.5
4.5
9
1
32
31.7x0.8
21.4 2.2 2.6
6.53
1.51.8
2.5 11.58.3 0.2
6 3.
6
35
1
1.2
2.5
6.9 2
.6 3.5
4.5
9
1
32
31.7x0.8
21.4 2.2 2.6
19
Mini
Jack
s
3.5mm Dia. JacksLGT10 2-0100F
Circuits
321
DIP Type[t=1.6]
Manual SolderingPattern compatible with LGM10 9
LGT8002-0100F
Circuits
321
DIP Type Manual SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
LGT8502-0200F
Circuits
341
DIP Type Flow SolderingManual SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
1103.25
5(15)
1.5
8
7.53.6
12
1103.25
5(15)
1.5
8
7.53.6
121 3
2
3.93.9
6.8 2-1.1(Hole)
3-1x2(Hole)
5.4
4.85
1 3
2
3.93.9
6.8 2-1.1(Hole)
3-1x2(Hole)
5.4
4.85
P.C. Board Dimension(Bottom View)P.C. Board Dimension(Bottom View)
Metal Sleeve0 Without1 With
Metal Sleeve0 Without1 With
8.6
6
3.6
74
Applicable plug : 14.6 max.
138
5
P.W.B. Position
Plug-TopPosition
8.6
6
3.6
74
Applicable plug : 14.6 max.
138
5
P.W.B. Position
Plug-TopPosition
2
1
3
3.5
4.15
4.15
3.5
3.5
2x0.93.25
3.9
2x1x2
2x1.32
1
3
3.5
4.15
4.15
3.5
3.5
2x0.93.25
3.9
2x1x2
2x1.3
88
3.6
10
6.5 8.5
(15) 4
88
3.6
10
6.5 8.5
(15) 4
1
3
4
2x0.9
3.92x1.2
2x1.3 6.5
4.2
4.15
4.15
1
3
4
2x0.9
3.92x1.2
2x1.3 6.5
4.2
4.15
4.15
20
Mini
Jack
s
3.5mm Dia. JacksLGT1509-0200F
P.C. Board Dimension(Bottom View)
Circuits
2431
Flow Soldering
Manual Soldering
DIP Type[t=1.6]
LGT8509-0300F
Circuits
DIP Type Manual SolderingP.C. Board Dimension(Bottom View)
[t=1.6]
LGM10 9-0100F
Circuits
54321
DIP Type [t=1.6] Manual SolderingP.C. Board Dimension(Bottom View)
Pattern compatible with LGT10 2
3.6 7
8
3 15 4
1.5
8
4-1x23.1 3.13.
15
3.15
3.1
6.51
4
2 3
1.3
3.6 7
8
3 15 4
1.5
8
4-1x23.1 3.13.
15
3.15
3.1
6.51
4
2 3
1.3
10
4.15
4.15
(13)
8 4.5 8.5P.W.B position
Applicable plug:14.6 max.
3.6
7 2x1
.5
Plug-Top
10
4.15
4.15
(13)
8 4.5 8.5P.W.B position
Applicable plug:14.6 max.
3.6
7 2x1
.5
Plug-Top
13.25
105(15)
8
7.53.6
12
13.25
105(15)
8
7.53.6
12
1 3
54
2
6.83x1x2(Hole)
2-1x1.6(Hole)
2-1.1
2.4 2.4
3.9 3.9
54.
85
8.34.5
1 3
54
2
6.83x1x2(Hole)
2-1x1.6(Hole)
2-1.1
2.4 2.4
3.9 3.9
54.
85
8.34.5 Metal Sleeve
0 Without1 With
Metal Sleeve0 Without1 With
4
21
Mini
Jack
s
3.5mm Dia. JacksLGY0402-0111F
Circuits
321
Mid Mount Type Manual SolderingP.C. Board Dimension(Top View)
[t=0.8]
LGY0609-0600F
Circuits
24531
Mid Mount Type Reflow SolderingManual SolderingP.C. Board Dimension(Top View)
[t=0.8]
63.6
5
6
0.5
0.4
0.5
0.9
7.6
2 13
6.214
.25 13
2.5x2.54.62-2.4x1.7
3 12
63.6
5
6
0.5
0.4
0.5
0.9
7.6
2 13
6.214
.25 13
2.5x2.54.62-2.4x1.7
3 12
0.60
.61.1
1.1
2.1
4.2
5.314
2
3.86.8
5.1 4.3
4.55.53.6
0.60
.61.1
1.1
2.1
4.2
5.314
2
3.86.8
5.1 4.3
4.55.53.6
(4.1)5.1
6x1.31.4x0.5
4.3(3.3)
(Land)
1.85
4.95
6x2.
22.
2511
.5 8.05
10.4
53
1
2
4
(4.1)5.1
6x1.31.4x0.5
4.3(3.3)
(Land)
1.85
4.95
6x2.
22.
2511
.5 8.05
10.4
53
1
2
4
A metal panel etc. should not beinstalled near this area.A metal panel etc. should not beinstalled near this area.