10
12 Mini Jacks LGY22 9-0101F (LGY2209-0101F) Circuits 2 3 4 1 SMD Type Reflow Soldering P.C. Board Dimension (Top View) (500pcs/reel) LGY2209-03 F P.C. Board Dimension (Bottom View) Circuits 2 3 4 1 DIP Type [t=0.8] Manual Soldering Housing Color 00 Black 40 Yellow 0.1 0.05 (Terminal position range) 2.2 4.4 6 2 12 ø3.6 ø5 0.4 0.1 0.05 (Terminal position range) 2.2 4.4 6 2 12 ø3.6 ø5 0.4 2 4 1 3 3 3 1.8 1.8 2 2 2.75 2.75 9 3.5 7.5 2 2 5.35 1.8 1.8 2-ø1.2(Hole) 2 4 1 3 3 3 1.8 1.8 2 2 2.75 2.75 9 3.5 7.5 2 2 5.35 1.8 1.8 2-ø1.2(Hole) Metal Sleeve 0 Without 1 With Metal Sleeve 0 Without 1 With 4.4 2.2 ø5 4-2 ø3.6 6 2 12 4-1.5x0.7 9 5.35 1.9 7.5 3.5 2.4 2.4 2-ø1.2 4.4 2.2 ø5 4-2 ø3.6 6 2 12 4-1.5x0.7 9 5.35 1.9 7.5 3.5 2.4 2.4 1 3 2 4 2-ø1.2 3.5mm Dia. Jacks Features 1. A small ø3.5mm jack that was developed for small, mobile equipment. 2. A wide selection is available including surface mounting, DIP, spring terminal, and mid mount types. Specification 1.Electric Performance Rating : 1A, 12V DC Contact Resistance : 30mΩ max, 50mΩ max. Insulation Resistance : 100MΩ min.500V DC Withstanding Voltage : 500V AC(for one minute) 2.Mechanical Performance Insertion Force : 35N max. at 3.5mm Dia.gauge Withdrawal Force : 3 to 35N at 3.5mm Dia.gauge Application Smart phones, mobile phones, tablet PCs, portable audio, other small AV equipment.

Mimi Jacks, 3.5mm Dia. Jacks - SMK · 3.5mm Dia. Jacks Features 1. A small ø3.5mm jack that was developed for small, mobile equipment. 2.A wide selection is available including surface

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  • 12

    Mini

    Jack

    s

    LGY22 9-0101F(LGY2209-0101F)

    Circuits

    2341

    SMD Type Reflow SolderingP.C. Board Dimension(Top View)

    (500pcs/reel)

    LGY2209-03 F

    P.C. Board Dimension(Bottom View)

    Circuits

    2341

    DIP Type

    [t=0.8]

    Manual SolderingHousing Color

    00 Black40 Yellow

    0.1

    0.05

    (Ter

    min

    al p

    ositi

    on

    rang

    e)

    2.24

    .4

    6 2 12

    3.65

    0.4

    0.1

    0.05

    (Ter

    min

    al p

    ositi

    on

    rang

    e)

    2.24

    .4

    6 2 12

    3.65

    0.4

    2

    4

    1

    3

    3 3

    1.8

    1.822

    2.75

    2.75

    9

    3.5

    7.5

    22

    5.35

    1.8

    1.8

    2-1.2(Hol

    e)

    2

    4

    1

    3

    3 3

    1.8

    1.822

    2.75

    2.75

    9

    3.5

    7.5

    22

    5.35

    1.8

    1.8

    2-1.2(Hol

    e)

    Metal Sleeve0 Without1 With

    Metal Sleeve0 Without1 With

    4.4

    2.2

    5 4-2

    3.6

    6 2 12

    4-1.5x0.7

    9 5.3

    51.

    9

    7.5

    3.5

    2.4 2.4

    13

    2

    4

    2-1.2

    4.4

    2.2

    5 4-2

    3.6

    6 2 12

    4-1.5x0.7

    9 5.3

    51.

    9

    7.5

    3.5

    2.4 2.4

    13

    2

    4

    2-1.2

    3.5mm Dia. Jacks Features1. A small 3.5mm jack that was developed for small, mobile

    equipment.2. A wide selection is available including surface mounting,

    DIP, spring terminal, and mid mount types.

    Specification1.Electric Performance

    Rating : 1A, 12V DCContact Resistance : 30m max, 50m max.Insulation Resistance : 100M min.500V DCWithstanding Voltage : 500V AC(for one minute)

    2.Mechanical PerformanceInsertion Force : 35N max. at 3.5mm Dia.gaugeWithdrawal Force : 3 to 35N at 3.5mm Dia.gauge

    ApplicationSmart phones, mobile phones, tablet PCs, portable audio, other small AV equipment.

  • 13

    Mini

    Jack

    s

    3.5mm Dia. JacksLGY2209-0800F

    Circuits

    DIP Type Reflow SolderingManual SolderingShading Type

    [t=0.8]

    LGY2109-0200F

    P.C. Board Dimension(Bottom View)

    Circuits

    34521

    DIP Type Manual Soldering[t=1.0]

    LGY2109-1701F

    Circuits

    34521

    DIP Type Reflow SolderingManual SolderingP.C. Board Dimension(Top View)

    [t=0.8]

    4

    2 1

    3

    8-R0.4

    2.2

    2.42.4

    0.4

    7.5

    33.

    16

    2-1.24-1.6x0.8 4

    2 1

    3

    8-R0.4

    2.2

    2.42.4

    0.4

    7.5

    33.

    16

    2-1.24-1.6x0.8

    P.C. Board Dimension(Bottom View)P.C. Board Dimension(Bottom View)

    2 12

    2.5 4.52x1

    0.5

    2.62.14.

    2

    5.53.6 6

    2

    2 12

    2.5 4.52x1

    0.5

    2.62.14.

    2

    5.53.6 6

    2

    3 1

    24

    5

    2.2

    2.4 2.4

    2x1.15x1.5x0.8

    7.8 5.

    44.

    52.

    5

    1.9

    5.2

    9.2

    2.7 No printed this area (Component Side)

    3 1

    24

    5

    2.2

    2.4 2.4

    2x1.15x1.5x0.8

    7.8 5.

    44.

    52.

    5

    1.9

    5.2

    9.2

    2.7 No printed this area (Component Side)

    6

    0.6

    5.53.6

    4.2

    2.1

    2.6

    2 12

    0.5

    6

    0.6

    5.53.6

    4.2

    2.1

    2.6

    2 12

    0.5

    1

    2

    5

    3

    4

    2.2

    9.2

    5.2 1

    .9

    5.4

    1.5x0.8

    2x1.15

    2.5

    8.5

    2.4 2.4(Land)

    1

    2

    5

    3

    4

    2.2

    9.2

    5.2 1

    .9

    5.4

    1.5x0.8

    2x1.15

    2.5

    8.5

    2.4 2.4(Land)

  • 14

    Mini

    Jack

    s

    3.5mm Dia. JacksLGY2109-3301F

    Circuits

    24531

    DIP / SMD Type Reflow SolderingP.C. Board Dimension(Top View)

    [t=0.8]

    LGY2109-1801F

    Circuits

    245316

    SMD Type Reflow SolderingP.C. Board Dimension(Top View)

    (800pcs/reel)

    LGY3509-0400F

    Circuits

    34521

    DIP / SMD Type Reflow SolderingP.C. Board Dimension(Top View)

    [t=0.7]

    65.53.6

    4.2

    2.1

    2.6

    0.5

    1

    65.53.6

    4.2

    2.1

    2.6

    0.5

    1

    5.2 5.92.5

    3.4

    3.2

    2.2

    3.7

    2.9Two 2.5x1.9

    (Land)

    6x1.

    82.

    5

    2.5

    6.3

    6.9

    10.6

    13.49

    .413

    .4

    5

    3

    16

    2

    4

    5.2 5.92.5

    3.4

    3.2

    2.2

    3.7

    2.9Two 2.5x1.9

    (Land)

    6x1.

    82.

    5

    2.5

    6.3

    6.9

    10.6

    13.49

    .413

    .4

    5

    3

    16

    2

    4

    0.65

    0.5

    3.455

    .55

    6 2 12

    8.72.5

    5.5

    2x1

    3.6

    0.65

    0.5

    3.455

    .55

    6 2 12

    8.72.5

    5.5

    2x1

    3.6

    2.12.1

    2.4 2.2

    2x2.4

    (Land)

    1.9

    5.4

    9.2

    8.7

    2.5

    5.2

    2x1.22x1.6x0.8Through hole

    5

    31

    2 4

    2.12.1

    2.4 2.2

    2x2.4

    (Land)

    1.9

    5.4

    9.2

    8.7

    2.5

    5.2

    2x1.22x1.6x0.8Through hole

    5

    31

    2 4

  • 15

    Mini

    Jack

    s

    3.5mm Dia. Jacks

    LGY3209-0400F

    Circuits

    24531

    Spring Contact TypeP.C. Board Dimension(Top View)

    LGY2409-0200F

    Circuits

    24531

    Spring Contact TypeP.C. Board Dimension(Top View)

    1.4 13.86

    5

    5

    3.6

    5.4

    3.2

    1.4 13.86

    5

    5

    3.6

    5.4

    3.2

    7.4

    4.1

    2

    3

    1

    4

    2.4

    3 3

    5.2

    12.6

    5(Land)

    7.4

    4.1

    2

    3

    1

    4

    2.4

    3 3

    5.2

    12.6

    5(Land)

    2.4

    0.6 34.6

    6.81.4 13.7

    357.8

    3.65.5

    2.4

    0.6 34.6

    6.81.4 13.7

    357.8

    3.65.5

    3.1

    2.9 2.9

    2.5

    (Land)

    1.7

    4.9

    11.4

    1.5

    8.9

    3.3

    5

    3

    12

    4

    3.1

    2.9 2.9

    2.5

    (Land)

    1.7

    4.9

    11.4

    1.5

    8.9

    3.3

    5

    3

    12

    4

  • 16

    Mini

    Jack

    s

    3.5mm Dia. JacksLGY6502-0900F

    Circuits

    3

    2

    1

    DIP Type Flow SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    LGY6502-0800F Noise-Resistant Designed (With Earth Plate)

    Circuits

    3

    2

    1

    DIP Type Flow SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    LGY6509-0100F

    Circuits

    2431

    DIP Type Flow SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    816.5

    4.5

    7 3.

    6

    0.5

    6.5 9

    4

    1

    2

    3

    1.2

    8.25.

    9

    6.25

    11.2

    516

    1.7

    1x2.5

    0.8x21x2.5

    816.5

    4.5

    7 3.

    6

    0.5

    6.5 9

    4

    1

    2

    3

    1.2

    8.25.

    9

    6.25

    11.2

    516

    1.7

    1x2.5

    0.8x21x2.5

    11

    6.5

    7 3.6

    1.5

    4

    1118

    3

    9.3

    121417

    .8

    8

    2-1.9x1

    0.8x1.9

    1x2.4

    2.1

    12

    4

    3

    11

    6.5

    7 3.6

    1.5

    4

    1118

    3

    9.3

    121417

    .8

    8

    2-1.9x1

    0.8x1.9

    1x2.4

    2.1

    12

    4

    3

  • 17

    Mini

    Jack

    s

    3.5mm Dia. JacksLGS2318-0100F

    Circuits

    54321

    DIP Type Manual SolderingP.C. Board Dimension(Bottom View)

    [t=1.0]

    LGS6506-0700F

    Circuits

    1872

    543

    DIP Type Flow SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    LGS6507-1300F

    Circuits

    1987

    456

    32

    DIP Type Flow SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    14.53

    6.4

    2.5

    4.5

    2x1

    9.153.55

    3.6

    14.53

    6.4

    2.5

    4.5

    2x1

    9.153.55

    3.6

    3

    54

    2

    3

    1

    5.453.42.15

    1.95 6x0.8x1.4(Hole)4.82.7

    5.4

    3.5

    4.5 11 11.4

    12.

    45.4

    0.1

    112x1.3(Hole)

    3

    54

    2

    3

    1

    5.453.42.15

    1.95 6x0.8x1.4(Hole)4.82.7

    5.4

    3.5

    4.5 11 11.4

    12.

    45.4

    0.1

    112x1.3(Hole)

    11 183.5

    6

    114

    2.5

    1.5

    6.5

    7 3.

    6

    7 4

    3 1

    8

    2

    5

    17.8 15

    .3 127.

    5 8

    4.1 1-1x2.42-0.8x1.4

    2-1.9x1

    2-1.9x0.8

    9.3

    2.1

    11 183.5

    6

    114

    2.5

    1.5

    6.5

    7 3.

    6

    7 4

    3 1

    8

    2

    5

    17.8 15

    .3 127.

    5 8

    4.1 1-1x2.42-0.8x1.4

    2-1.9x1

    2-1.9x0.8

    9.3

    2.1

  • 18

    Mini

    Jack

    s

    3.5mm Dia. JacksLGS6509-1000F

    Circuits

    765432891

    DIP Type Flow SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    LGY2502-0200F

    Circuits

    3

    2

    1

    Flow Soldering(Please contact about soldering condition)Manual Soldering

    DIP TypeP.C. Board Dimension(Bottom View)

    [t=1.2/1.6]

    LGY2512-0100F

    Circuits

    3

    2

    1

    Flow Soldering(Please contact about soldering condition)Manual Soldering

    DIP TypeP.C. Board Dimension(Bottom View)

    [t=1.2/1.6]

    3.518

    6

    11

    7 3.

    6

    6.52.

    513

    4

    1.5

    9.3

    4.111.3

    87.5

    1215

    .316

    .717

    .8 1.9x0.8

    1.9x1

    0.8x1.4

    1x2.41.9x0.8

    2.1

    6

    8

    3

    4

    9

    2

    7 51

    3.518

    6

    11

    7 3.

    6

    6.52.

    513

    4

    1.5

    9.3

    4.111.3

    87.5

    1215

    .316

    .717

    .8 1.9x0.8

    1.9x1

    0.8x1.4

    1x2.41.9x0.8

    2.1

    6

    8

    3

    4

    9

    2

    7 51

    6.53

    1.51.8

    2.5 11.58.3 0.2

    6 3.

    6

    35

    1

    1.2

    2.5

    6.9 2

    .6 3.5

    4.5

    9

    1

    32

    31.7x0.8

    21.4 2.2 2.6

    6.53

    1.51.8

    2.5 11.58.3 0.2

    6 3.

    6

    35

    1

    1.2

    2.5

    6.9 2

    .6 3.5

    4.5

    9

    1

    32

    31.7x0.8

    21.4 2.2 2.6

    6.53

    1.51.8

    2.5 11.58.3 0.2

    6 3.

    6

    35

    1

    1.2

    2.5

    6.9 2

    .6 3.5

    4.5

    9

    1

    32

    31.7x0.8

    21.4 2.2 2.6

    6.53

    1.51.8

    2.5 11.58.3 0.2

    6 3.

    6

    35

    1

    1.2

    2.5

    6.9 2

    .6 3.5

    4.5

    9

    1

    32

    31.7x0.8

    21.4 2.2 2.6

  • 19

    Mini

    Jack

    s

    3.5mm Dia. JacksLGT10 2-0100F

    Circuits

    321

    DIP Type[t=1.6]

    Manual SolderingPattern compatible with LGM10 9

    LGT8002-0100F

    Circuits

    321

    DIP Type Manual SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    LGT8502-0200F

    Circuits

    341

    DIP Type Flow SolderingManual SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    1103.25

    5(15)

    1.5

    8

    7.53.6

    12

    1103.25

    5(15)

    1.5

    8

    7.53.6

    121 3

    2

    3.93.9

    6.8 2-1.1(Hole)

    3-1x2(Hole)

    5.4

    4.85

    1 3

    2

    3.93.9

    6.8 2-1.1(Hole)

    3-1x2(Hole)

    5.4

    4.85

    P.C. Board Dimension(Bottom View)P.C. Board Dimension(Bottom View)

    Metal Sleeve0 Without1 With

    Metal Sleeve0 Without1 With

    8.6

    6

    3.6

    74

    Applicable plug : 14.6 max.

    138

    5

    P.W.B. Position

    Plug-TopPosition

    8.6

    6

    3.6

    74

    Applicable plug : 14.6 max.

    138

    5

    P.W.B. Position

    Plug-TopPosition

    2

    1

    3

    3.5

    4.15

    4.15

    3.5

    3.5

    2x0.93.25

    3.9

    2x1x2

    2x1.32

    1

    3

    3.5

    4.15

    4.15

    3.5

    3.5

    2x0.93.25

    3.9

    2x1x2

    2x1.3

    88

    3.6

    10

    6.5 8.5

    (15) 4

    88

    3.6

    10

    6.5 8.5

    (15) 4

    1

    3

    4

    2x0.9

    3.92x1.2

    2x1.3 6.5

    4.2

    4.15

    4.15

    1

    3

    4

    2x0.9

    3.92x1.2

    2x1.3 6.5

    4.2

    4.15

    4.15

  • 20

    Mini

    Jack

    s

    3.5mm Dia. JacksLGT1509-0200F

    P.C. Board Dimension(Bottom View)

    Circuits

    2431

    Flow Soldering

    Manual Soldering

    DIP Type[t=1.6]

    LGT8509-0300F

    Circuits

    DIP Type Manual SolderingP.C. Board Dimension(Bottom View)

    [t=1.6]

    LGM10 9-0100F

    Circuits

    54321

    DIP Type [t=1.6] Manual SolderingP.C. Board Dimension(Bottom View)

    Pattern compatible with LGT10 2

    3.6 7

    8

    3 15 4

    1.5

    8

    4-1x23.1 3.13.

    15

    3.15

    3.1

    6.51

    4

    2 3

    1.3

    3.6 7

    8

    3 15 4

    1.5

    8

    4-1x23.1 3.13.

    15

    3.15

    3.1

    6.51

    4

    2 3

    1.3

    10

    4.15

    4.15

    (13)

    8 4.5 8.5P.W.B position

    Applicable plug:14.6 max.

    3.6

    7 2x1

    .5

    Plug-Top

    10

    4.15

    4.15

    (13)

    8 4.5 8.5P.W.B position

    Applicable plug:14.6 max.

    3.6

    7 2x1

    .5

    Plug-Top

    13.25

    105(15)

    8

    7.53.6

    12

    13.25

    105(15)

    8

    7.53.6

    12

    1 3

    54

    2

    6.83x1x2(Hole)

    2-1x1.6(Hole)

    2-1.1

    2.4 2.4

    3.9 3.9

    54.

    85

    8.34.5

    1 3

    54

    2

    6.83x1x2(Hole)

    2-1x1.6(Hole)

    2-1.1

    2.4 2.4

    3.9 3.9

    54.

    85

    8.34.5 Metal Sleeve

    0 Without1 With

    Metal Sleeve0 Without1 With

    4

  • 21

    Mini

    Jack

    s

    3.5mm Dia. JacksLGY0402-0111F

    Circuits

    321

    Mid Mount Type Manual SolderingP.C. Board Dimension(Top View)

    [t=0.8]

    LGY0609-0600F

    Circuits

    24531

    Mid Mount Type Reflow SolderingManual SolderingP.C. Board Dimension(Top View)

    [t=0.8]

    63.6

    5

    6

    0.5

    0.4

    0.5

    0.9

    7.6

    2 13

    6.214

    .25 13

    2.5x2.54.62-2.4x1.7

    3 12

    63.6

    5

    6

    0.5

    0.4

    0.5

    0.9

    7.6

    2 13

    6.214

    .25 13

    2.5x2.54.62-2.4x1.7

    3 12

    0.60

    .61.1

    1.1

    2.1

    4.2

    5.314

    2

    3.86.8

    5.1 4.3

    4.55.53.6

    0.60

    .61.1

    1.1

    2.1

    4.2

    5.314

    2

    3.86.8

    5.1 4.3

    4.55.53.6

    (4.1)5.1

    6x1.31.4x0.5

    4.3(3.3)

    (Land)

    1.85

    4.95

    6x2.

    22.

    2511

    .5 8.05

    10.4

    53

    1

    2

    4

    (4.1)5.1

    6x1.31.4x0.5

    4.3(3.3)

    (Land)

    1.85

    4.95

    6x2.

    22.

    2511

    .5 8.05

    10.4

    53

    1

    2

    4

    A metal panel etc. should not beinstalled near this area.A metal panel etc. should not beinstalled near this area.