MIL-STD-1553 BC/RT/MT with Integrated Transformers · 2020. 11. 17. · SSRT mode provides a low-cost MIL-STD-1553 Remote Terminal interface for a simple system that doesn’t include

HI-6220 Rev. A

HI-6220MIL-STD-1553 BC/RT/MT

with Integrated Transformers

July 2018

HOLT INTEGRATED CIRCUITS2


Overview

1. OverviewThe HI-6220PB family is a fully integrated and dual redundant MIL-STD-1553 BC/RT/MT interface solution which includes 1553 protocol, SRAM, dual transceivers and dual isolation transformers in a single BGA package. The device is a direct pin compatible drop-in replacement for the Data Device Corporation (DDC®) Total-ACE® Family of MIL-STD-1553 Terminals.

1.1. Bus Controller

The BC is a programmable message-sequencing engine programmed using a set of 20 instruction op codes. It greatly reduces the host’s processing workload by autonomously supporting multi-frame message scheduling, message retry schemes, storage of message data in on-chip RAM, asynchronous message insertion and status/error reporting. The Enhanced BC mode also includes a General Purpose Queue and user-defined interrupts to further enhance host communication.

1.2. Remote Terminal

The HI-6220PB RT has been fully validated by a recognized independent third party. RT memory management options include single, double, and 2 circular buffer modes for individual subaddresses. The RT performs comprehensive error checking including word and format validation and checks for various transfer errors. The RT supports flexible interrupt conditions, command illegalization and a programmable busy bit by subaddress. In addition, the device has an “auto-boot” feature necessary for MIL-STD-1760 compliance, whereby the terminal can initialize as an online RT with the busy bit set following power turn-on.

1.2.1. Simple System Remote Terminal (SSRT) ModeThe HI-6220PB may be operated in a simplified RT mode called Simple System Remote Terminal (SSRT) mode. The SSRT mode provides a low-cost MIL-STD-1553 Remote Terminal interface for a simple system that doesn’t include a microprocessor, such as A/D and D/A converters, actuators, and other discrete I/O signals. SSRT mode is activated by strapping three balls to ground.

1.3. Monitor Terminal

The HI-6220PB family supports three monitor modes including a word monitor mode, a selective message monitor mode and a combined RT/Monitor Mode. For new applications it is recommended to implement the selective message monitor mode. Selective Message Monitor allows monitoring of 1553 messages and provides the ability to filter based on RT address, T/R bit and subaddress with no host processor intervention.

1.4. Host Processor Interface

Each device provides an 8/16-bit parallel host bus interface supporting a variety of processor configurations including shared RAM and DMA configurations. The host interface supports both non-multiplexed and multiplexed address/data buses, non-zero wait mode for interfacing to processor address/data buses, and zero wait mode for interfacing to microcontroller I/O ports.

Note: DDC®, Mini-ACE®, Enhanced Mini-ACE®, Micro-ACE®, Mini-ACE® Mark3 and Total-ACE® are registered trademarks of Data Device Corporation, Bohemia, NY, USA. There is no affiliation between Data Device Corporation and Holt Integrated Circuits Inc.

Overview


1.5. Built in Test

The HI-6220PB family provides an autonomous built-in self-test capability. The testing includes both RAM and protocol logic tests which may be initiated by the host processor.

1.6. Features

Dual Redundant MIL-STD-1553A/B/1760 Channel

BC, RT, MT, or RT/MT Modes

Integrated Dual Isolation Transformers

Direct and/or Transformer Coupled

Supports Simple System RT Mode

64Kx17 or 4Kx16 SRAM

External RT Address Inputs

MIL-STD-1760 RT “Auto Boot”

+3.3V Single Supply

Built-in Self-Test

Generic 8/16-bit Processor Interface

-40°C to +85°C or -55°C to +125°C

No Limitations on transmit duty cycle

PBGA-312

15.2mm x 27.9mm x 4.7mm

1.7. Application Benefits

Simplified Board Design and Layout

Third Party RT Validated

Single Die for Improved Reliability

Cost Effective Direct Drop-in Replacement for DDC® Total-ACE®

Fully Software Compatible to DDC® ACE, Mini-ACE®, Enhanced Mini-ACE®, Micro-ACE®, Mini-ACE® Mark3 and Total-ACE®.


Overview

1.8. Cross Reference Guide

Holt P/N DDC P/N

HI-62213PBxFBU-64843i8-xxx

BU-64843U8-xxx

HI-62213PBxBU-64843T8-xxx

BU-64843H8-xxx

HI-62203PBxFBU-64863i8-xxx

BU-64863U8-xxx

HI-62203PBxBU-64863H8-xxx

BU-64863T8-xxx

1.9. Block Diagram

TransceiverA

TransceiverB

Dual Encoder/Decoders

MIL-STD-1553BC/RT/MT Protocol

&Memory Management

InternalTransformers

SharedRAM

AddressBuffers

Host& MemoryInterface

Logic

DataBuffers Data Bus

Address Bus

D15 - D0

A15 - A0

HostData Bus

HostAddress Bus

RT Address Bus RTAD4 - RTAD0, RTADP, RTADD_LAT

Bus A

Bus B

TX_INH B

TX_INH A

Host& Memory

Control Signals

InterruptRequest

INT

MessageStatus

CLK_IN,Control & Protocol

Inputs

Registers and Command/Status Words


2. Registers and Command/Status WordsTable 1 summarizes the device registers and corresponding addresses.

Table 1. Register Summary

Hex Address Access Register Name

Hard Reset Default

0x0000 RD/WR Interrupt Mask Register 1 0x0000

0x0001 RD/WR Configuration Register 1


0x0003 WR Start/Reset Register

0x0003 RD Non-Enhanced BC or RT Command Stack Pointer / Enhanced BC Instruction List Pointer Register

0x0004 RD/WR BC Control Word / RT Subaddress Control Word Register

0x0005 RD/WR Time Tag Register

0x0006 RD Interrupt Status Register 1




0x000A RD/WR RT/Monitor Data Stack Address Register

0x000B RD BC Frame Time Remaining Register

0x000C RD BC Time Remaining to Next Message Register

0x000D RD/WRNon-Enhanced BC Frame Time / Enhanced BC Initial Instruction Pointer / RT Last Command/MT Trigger Word Register

0x000E RD RT Status Word Register

0x000F RD RT BIT Word Register

0x0010 − Test Mode Register 0









Hex Address Access Register Name

Hard Reset Default




0x001A − Reserved

0x001B RD BC Condition Code Register

0x001B WR BC General Purpose Flag Register

0x001C RD BIT Test Status Register

0x001D RD/WR Interrupt Mask Register 2

0x001E RD Interrupt Status Register 2

0x001F RD/WR BC General Purpose Queue Pointer / RT-MT Interrupt Status Queue Pointer Register



2.1. Interrupt Mask Register #1, Read/Write 0x0000

Interrupt Mask Registers #1 is used to enable/disable interrupt requests for various operational conditions.

Bit No. R/W Reset Bit Description

15 (MSB) − 0 Reserved

14 R/W 0RAM Parity Error

Note: RAM PARITY ERROR must be set to logic “0” for 4K RAM device options, since there is no 17-bit RAM for these devices.

13 R/W 0 BC/RT Transmitter Timeout

12 R/W 0 BC/RT Command Stack Rollover

11 R/W 0 MT Command Stack Rollover

10 R/W 0 MT Data Stack Rollover

9 R/W 0 Handshake Fail

8 R/W 0 BC Retry.

7 R/W 0 RT Address Parity Error

6 R/W 0 Time Tag Rollover

5 R/W 0 RT Circular Buffer Rollover

4 R/W 0 BC Control Word/RT Subaddress Control Word EOM

3 R/W 0 BC End of Frame

2 R/W 0 Format Error

1 R/W 0 BC Status Set/RT Mode Code/MT Pattern Trigger

0 (LSB) R/W 0 End of Message



2.2. Configuration Register #1, Read/Write 0x0001

Configuration Registers #1 is used to select the device’s mode of operation and for software control of operational attributes such as RT Status Word bits, RT Memory Management mode selection, Time-Tagging, etc. Specific bit functionality depends on the selected mode of operation. Table 2 summarizes the relevant bits for each mode.

Table 2. Configuration Register #1 Bit Summary by Mode of Operation.

BITBC FUNCTION

(Bits 11-0, Enhanced Mode Only)

RT WITHOUT ALTERNATE STATUS

RT WITH ALTERNATE STATUS

(Enhanced Mode Only)

MONITOR FUNCTION

(Bits 12-0, Enhanced Mode Only)

15 (MSB) RT/BC-MT (Logic 0) (Logic 1) (Logic 1) (Logic 0)

14 MT/BC-RT (Logic 0) (Logic 0) (Logic 0) (Logic 1)

13 Current Area B/A Current Area B/A Current Area B/A Current Area B/A

12 Message Stop-On-Error Message Monitor Enabled (MMT) Message Monitor Enabled Message Monitor

Enabled

11 Frame Stop-On-Error Dynamic Bus Control Acceptance S10 Trigger Word Enabled

10 Status Set Stop-On-Message Busy S09 Start-On-Trigger

9 Status Set Stop-On-Frame Service Request S08 Stop-On-Trigger

8 Frame Auto-Repeat SSFLAG S07 Not Used

7 External Trigger Enabled

RTFLAG (Enhanced Mode Only) S06 External Trigger Enabled

6 Internal Trigger Enabled Not Used S05 Not Used

5 Intermessage Gap Timer Enabled Not Used S04 Not Used

4 Retry Enabled Not Used S03 Not Used

3 Doubled / Single Retry Enabled Not Used S02 Not Used

2 BC Enabled (Read Only) Not Used S01 Monitor Enabled

(Read Only)

1 BC Frame In Progress (Read Only) Not Used S00 Monitor Triggered

(Read Only)

0 (LSB)BC Message In

Progress (Read Only)

RT Message In Progress (Enhanced mode only, Read

Only)

RT Message In Progress (Read Only)

Monitor Active (Read Only)

Notes: 1. The combined RT/Message Monitor mode uses the RT WITHOUT ALTERNATE STATUS or the RT WITH

ALTERNATE STATUS bit definitions not the MONITOR FUNCTION bit definitions.



2. In the alternate RT Status Word mode, bit 10 (Message Error) may also be set for an illegalized message (Broad-cast-T/R bit subaddress-word count/mode code).

Modes of operation are configured using a combination of bits 15, 14 and 12 in Configuration Register #1 and bit 15 in Configuration Register #3. See Table 3 for a summary of the bit combinations.

Table 3. Modes of Operation.

Config. Reg. #1 Config. Reg. #3 Mode

Bit 15 Bit 14 Bit 12 Bit 15

0 0 X 0 Non-ENHANCED BC (See Notes) (no Monitor modes available)

0 0 X 1 ENHANCED BC (no Monitor modes available)

0 1 0 X Word Monitor

0 1 1 0 Word Monitor (non-ENHANCED mode set)

0 1 1 1 Message Monitor (ENHANCED mode set)

1 0 X 0 Non-ENHANCED RT (no Monitor modes available)

1 0 0 1 ENHANCED RT/Word Monitor

1 0 1 1 ENHANCED RT/Message Monitor

1 1 X X Idle

Notes: 1. Following hardware reset (MSTCLR asserted) or software reset (by means of the Start/Reset Register), BC/RT/

MT versions of the device will initialize to (non-transmitting) BC mode, while RT only versions will initialize to Idle mode. In both cases, the values of bits 15 and 14 will initialize to logic “0.”

2. Notes 2 thru 6 are only applicable to the BC/RT/MT versions of the device: If the device is switched from RT to combined RT/Monitor mode in the middle of an RT message, the message will be completed.

3. If the device is switched from combined RT/Monitor mode to RT mode in the middle of an RT message or Monitor message, the message will be completed.

4. If the device is switched from either RT mode or Monitor mode to either BC mode or “Idle” mode in the middle of an RT message, the message will be aborted.

5. If the device is switched from non-enhanced RT mode to “Idle” mode, there is no effect.

6. If the device is switched from (ENHANCED or non-ENHANCED) BC mode to “Idle” mode in the middle of a message, the message will be aborted.

7. In BC Mode ((bits [15, 14] in Configuration Register #1 set to [0, 0] respectively), bit 12 of Configuration Register #1 functions as MESSAGE STOP-ON-ERROR bit and has no affect on mode of operation.





15 (MSB) R/W 0 Enhanced Interrupts

14 R/W 0 RAM Parity Enable

13 R/W 0 Busy Lookup Table Enable

12 R/W 0 Rx Subaddress Double Buffer Enable

11 R/W 0 Overwrite Invalid Data

10 R/W 0 256-Word Boundary Disable

9 R/W 0 Time Tag Resolution 2



6 R/W 0 Clear Time Tag on Synchronize

5 R/W 0 Load Time Tag on Synchronize

4 R/W 0 Interrupt Status Auto Clear

3 R/W 0 Level / Pulse Interrupt Request

2 R/W 0 Clear Service Request

1 R/W 0 Enhanced RT Memory Management

0 (LSB) R/W 0 Separate Broadcast Data

2.4. Command Stack Pointer Register/ Enhanced BC Instruction List Register, Read Only 0x0003

This register provides the host processor read access to the current value of the Stack Pointer for RT, MT and non-enhanced BC modes.


15 (MSB) R 0 Command Stack Pointer, bit 15

.

...

.

...

0 (LSB) R 0 Command Stack Pointer, bit 0



2.5. Start/Reset Register, Write Only 0x0003


15 (MSB) − 0 Reserved

14 − 0 Reserved

13 − 0 Reserved

12 − 0 Reserved

11 W 0 Clear RT Halt

10 W 0 Clear Self-Test Register

9 W 0 Initiate RAM Self-Test

8 W 0 Reserved

7 W 0 Initiate Protocol Self-Test

6 W 0 BC/MT Stop-On-Message

5 W 0 BC Stop-On-Frame

4 W 0 Time Tag Test Clock

3 W 0 Time Tag Reset

2 W 0 Interrupt Reset

1 W 0 BC/MT Start

0 (LSB) W 0 Reset



2.6. BC Control Word Register, Read/Write 0x0004


15 (MSB) R/W 0 Transmit Time Tag for Synchronize Mode Command

14 R/W 0 Message Error Mask

13 R/W 0 Service Request Bit Mask

12 R/W 0 Busy Bit Mask

11 R/W 0 Subsystem Flag Bit Mask

10 R/W 0 Terminal Flag Bit Mask

9 R/W 0 Reserved Bits Mask

8 R/W 0 Retry Enabled

7 R/W 0 Bus Channel A/B

6 R/W 0 Off-Line Self-Test

5 R/W 0 Mask Broadcast Bit

4 R/W 0 EOM Interrupt Enable

3 R/W 0 1553A/B Select

2 R/W 0 Mode Code Format

1 R/W 0 Broadcast Format

0 (LSB) R/W 0 RT-to-RT Format



2.7. RT Subaddress Control Word Register, Read/Write 0x0004


15 (MSB) R/W 0 Rx: Double/Global Buffer Enable

14 R/W 0 Tx: EOM INT

13 R/W 0 Tx: CIRC BUF INT

12 R/W 0 Tx: Memory Management 2 (MM2)



9 R/W 0 Rx: EOM INT

8 R/W 0 Rx: CIRC BUF INT

7 R/W 0 Rx: Memory Management 2 (MM2)



4 R/W 0 BCST: EOM INT

3 R/W 0 BCST: CIRC BUF INT

2 R/W 0 BCST: Memory Management 2 (MM2)

1 R/W 0 BCST: Memory Management 1 (MM1)

0 (LSB) R/W 0 BCST: Memory Management 0 (MM0)



2.8. Time Tag Register, Read/Write 0x0005


15 (MSB) R/W 0 Time Tag, bit 15

.

...

.

...

0 (LSB) R/W 0 Time Tag, bit 0

The resolution of the Time Tag Register (μs/LSB) is programmable by means of bits 9, 8, and 7 of “Configuration Register #2, Read/Write 0x0002” on page 11. See Table 4 below.

Table 4. Time Tag Register Resolution

Configuration Register #2Time Tag Resolution Rollover Time

(Modulus)BIT9 TTR2

BIT8 TTR1

BIT7 TTR0

0 0 0 64 μs 4.194 sec.

0 0 1 32 μs 2.097 sec.

0 1 0 16 μs 1.048 sec.

0 1 1 8 μs 524 ms

1 0 0 4 μs 262 ms

1 0 1 2 μs 131 ms

1 1 0 TEST MODE N/A

1 1 1 EXTERNAL CLOCK (see NOTE) N/A



2.9. Interrupt Status Register #1, Read Only 0x0006


15 (MSB) R 0 Master Interrupt

14 R 0 RAM Parity Error

13 R 0 Transmitter Timeout

12 R 0 BC/RT Command Stack Rollover

11 R 0 MT Command Stack Rollover

10 R 0 MT Data Stack Rollover

9 R 0 Handshake Fail

8 R 0 BC Retry

7 R 0 RT Address Parity Error

6 R 0 Time Tag Rollover

5 R 0 RT Circular Buffer Rollover

4 R 0 BC Control Word / RT Subaddress Control Word EOM

3 R 0 BC End of Frame

2 R 0 Format Error

1 R 0 BC Status Set / RT Mode Code / MT Pattern Trigger

0 (LSB) R 0 End of Message





15 (MSB) R/W 0 Enhanced Mode Enable

14 R/W 0 BC/RT Command Stack Size 1

13 R/W 0 BC/RT Command Stack Size 0

12 R/W 0 MT Command Stack Size 1

11 R/W 0 MT Command Stack Size 0

10 R/W 0 MT Data Stack Size 2



7 R/W 0 Illegalization Disabled

6 R/W 0 Override Mode T/R Error

5 R/W 0 Alternate Status Word Enable

4 R/W 0 Illegal Rx Transfer Disable

3 R/W 0 Busy RX Transfer Disable

2 R/W 0 RTFAIL / RTFLAG Wrap Enable

1 R/W 0 1553A Mode Codes Enable

0 (LSB) R/W 0 Enhanced Mode Code Handling





15 (MSB) R/W 0 External Bit Word Enable

14 R/W 0 Inhibit Bit Word If Busy

13 R/W 0 Mode Command Override Busy

12 R/W 0 Expanded BC Control Word Enable

11 R/W 0 Broadcast Mask ENA/XOR

10 R/W 0 Retry If 1553A and Message Error

9 R/W 0 Retry if Status Set

8 R/W 0 1st Retry ALT/ SAME Bus

7 R/W 0 2nd Retry ALT/ SAME Bus

6 R/W 0 Valid Message Error / No Data

5 R/W 0 Valid Busy Bit / No Data

4 R/W 0 MT Tag Gap Option

3 R/W 0 Latch RT Address with Configuration Register #5

2 R/W 0 Test Mode 2

1 R/W 0 Test Mode 1

0 (LSB) R/W 0 Test Mode 0





15 (MSB) R/W 0 12 / 16 MHz Clock Select

14 R/W 0 Single-Ended Select

13 R/W 0 External Tx Inhibit A

12 R/W 0 External Tx Inhibit B

11 R/W 0 Expanded Crossing Enabled

10 R/W 0 Response Time Out Select 1

9 R/W 0 Response Time Out Select 0

8 R/W 0 Gap Check Enabled

7 R/W 0 Broadcast Disabled

6 R/W 0 RT Address Latch / Transparent

5 R/W 0 RT Address 4





0 (LSB) R/W 0 RT Address Parity

2.13. RT/Monitor Data Stack Address Register, Read/Write 0x000A


15 (MSB) R/W 0 RT/Monitor Data Stack Address, bit 15

.

...

.

...

0 (LSB) R/W 0 RT/Monitor Data Stack Address, bit 0



2.14. BC Frame Time Remaining Register, Read Only 0x000B


15 (MSB) R 0 BC Frame Time Remaining, bit 15

.

...

.

...

0 (LSB) R 0 BC Frame Time Remaining, bit 0

2.15. BC Message Time Remaining Register, Read Only 0x000C


15 (MSB) R 0 BC Message Time Remaining, bit 15

.

...

.

...

0 (LSB) R 0 BC Message Time Remaining, bit 0

2.16. Non-Enhanced BC Frame Time/Enhanced BC Initial Instruction Pointer / RT Last Command / MT Trigger Register, Read/Write 0x000D


15 (MSB) R/W 0 Non-Enhanced BC Frame Time/Enhanced BC Initial Instruction Pointer / RT Last Command / MT Trigger Register, bit 15

.

...

.

...

0 (LSB) R/W 0 Non-Enhanced BC Frame Time/Enhanced BC Initial Instruction Pointer / RT Last Command / MT Trigger Register, bit 0



2.17. RT Status Word Register, Read Only 0x000E


15 (MSB) R 0 Logic “0”

14 R 0 Logic “0”

13 R 0 Logic “0”

12 R 0 Logic “0”

11 R 0 Logic “0”

10 R 0 Message Error

9 R 0 Instrumentation

8 R 0 Service Request

7 R 0 Reserved

6 R 0 Reserved

5 R 0 Reserved

4 R 0 Broadcast Command Received

3 R 0 Busy

2 R 0 SSFLAG

1 R 0 Dynamic Bus Control Accept

0 (LSB) R 0 Terminal Flag



2.18. RT Bit Word Register, Read Only 0x000F


15 (MSB) R 0 Transmitter Timeout

14 R 0 Loop Test Failure B

13 R 0 Loop Test Failure A

12 R 0 Handshake Failure

11 R 0 Transmitter Shutdown B

10 R 0 Transmitter Shutdown A

9 R 0 Terminal Flag Inhibited

8 R 0 Bit Test Fail

7 R 0 High Word Count

6 R 0 Low Word Count

5 R 0 Incorrect Sync Received

4 R 0 Parity/Manchester Error Received

3 R 0 RT−to−RT Gap / Sync / Address Error

2 R 0 RT−to−RT No Response Error

1 R 0 RT−to−RT 2nd Command Word Error

0 (LSB) R 0 Command Word Contents Error





15 (MSB) R/W 0 Enhanced Bus Controller

14 R/W 0 Enhanced CPU Access

13 R/W 0 Command Stack Pointer Increment on EOM (RT, MT)

12 R/W 0 Global Circular Buffer Enable

11 R/W 0 Global Circular Buffer Size 2



8 R/W 0 Disable Invalid Messages to Interrupt Statu Queue

7 R/W 0 Disable Valid Messages to Interrupt Status Queue

6 R/W 0 Interrupt Status Queue Enable

5 R/W 0 RT Address Source

4 R/W 0 Enhanced Message Monitor

3 R/W 0 Reserved

2 R/W 0 64-Word Register Space

1 − 0 (LSB) R/W 0

Clock Select Bits [1,0]

These two bits select the Clock Frequency according to the table below.

Clock Select Bit 1 Clock Select Bit 0 Clock Frequency (MHz)

0 0 16

0 1 12

1 0 20

1 1 10





15 (MSB) R/W 0 Memory Management Base Address 15

14 R/W 0 Memory Management Base Address 14





9 R/W 0 Reserved

8 R/W 0 Reserved

7 R/W 0 Reserved

6 R/W 0 Reserved

5 R/W 0 Reserved

4 R/W 0 RT Halt Enable

3 R/W 0 1553B Response Time

2 R/W 0 Enhanced Time Tag Synchronize

1 R/W 0 Enhanced BC Watchdog Timer Enabled

0 (LSB) R/W 0 Mode Code Reset / INCMD Select



2.21. BC Condition Code Register, Read Only 0x001B


15 (MSB) R 0 Logic “1”

14 R 0 Retry 1

13 R 0 Retry 0

12 R 0 Bad Message

11 R 0 Message Status Set

10 R 0 Good Block Transfer

9 R 0 Format Error

8 R 0 No Response

7 R 0 General Purpose Flag 7






1 R 0 Equal Flag / General Purpose Flag 1

0 (LSB) R 0 Less Than Flag / General Purpose Flag 0

Notes: 1. If the device is not online in enhanced BC mode, the BC Condition Code Register will always return a value of

0x0000.



2.22. BC General Purpose Flag Register, Write Only 0x001B


15 (MSB) W 0 Clear General Purpose Flag 7

14 W 0 Clear General Purpose Flag 6







7 W 0 Set General Purpose Flag 7







0 (LSB) W 0 Set General Purpose Flag 0



2.23. BIT Test Status Flag Register, Read Only 0x001C


15 (MSB) R 0 Protocol Built-In Test Complete

14 R 0 Protocol Built-In Test In-Progress

13 R 0 Protocol Built-In Test Passed

12 R 0 Protocol Built-In Test Abort

11 R 0 Protocol Built-In Test Complete / In-Progress

10 R 0 Logic “0”

9 R 0 Logic “0”

8 R 0 Logic “0”

7 R 0 RAM Built-In Test Complete

6 R 0 RAM Built-In Test In-Progress

5 R 0 RAM Built-In Test Passed

4 R 0 Logic “0”

3 R 0 Logic “0”

2 R 0 Logic “0”

1 R 0 Logic “0”

0 (LSB) R 0 Logic “0”



2.24. Interrupt Mask Register #2, Read/Write 0x001D


15 (MSB) R/W 0 Not Used

14 R/W 0 BC Op Code Parity Error

13 R/W 0 RT Illegal Command/Message MT Message Received

12 R/W 0 General Purpose Queue / Interrupt Status Queue Rollover

11 R/W 0 Call Stack Pointer Register Error

10 R/W 0 BC Trap Op Code

9 R/W 0 RT Command Stack 50% Rollover

8 R/W 0 RT Circular Buffer 50% Rollover

7 R/W 0 Monitor Command Stack 50% Rollover

6 R/W 0 Monitor Data Stack 50% Rollover

5 R/W 0 Enhanced BC IRQ3




1 R/W 0 Bit Test Complete

0 (LSB) R/W 0 Not Used



2.25. Interrupt Status Register #2, Read Only 0x001E


15 (MSB) R 0 Master Interrupt

14 R 0 BC Op Code Parity Error

13 R 0 RT Illegal Command/Message MT Message Received

12 R 0 General Purpose Queue / Interrupt Status Queue Rollover

11 R 0 Call Stack Pointer Register Error

10 R 0 BC Trap Op Code

9 R 0 RT Command Stack 50% Rollover

8 R 0 RT Circular Buffer 50% Rollover

7 R 0 Monitor Command Stack 50% Rollover

6 R 0 Monitor Data Stack 50% Rollover

5 R 0 Enhanced BC IRQ3




1 R 0 Bit Test Complete

0 (LSB) R 0 Interrupt Chain Bit



2.26. BC General Purpose Queue Pointer Register / RT, MT Interrupt Status Queue Pointer Register, Read/Write 0x001F


15 (MSB) R/W 0 Queue Pointer Base Address 15

14 R/W 0 Queue Pointer Base Address 14









5 R/W 0 Queue Pointer Address 5





0 (LSB) R/W 0 Queue Pointer Address 0



The following sections list various Command and Status Words stored in RAM.

2.27. BC Mode Block Status Word

Bit No. Bit Description

15 (MSB) EOM

14 SOM

13 Channel B / A

12 Error Flag

11 Status Set

10 Format Error

9 No Response Timeout

8 Loop Test Fail

7 Masked Status Set

6 Retry Count 1

5 Retry Count 0

4 Good Data Block Transfer

3 Wrong Status Address / No Gap

2 Word Count Error

1 Incorrect Sync Type

0 (LSB) Invalid Word



2.28. RT Mode Block Status Word


15 (MSB) EOM

14 SOM

13 Channel B / A

12 Error Flag

11 RT−to−RT Format

10 Format Error


8 Loop Test Fail

7 Data Stack Rollover

6 Illegal Command Word

5 Word Count Error

4 Incorrect Data Sync

3 Invalid Word

2 RT−to−RT Gap / Sync / Address Error

1 RT−to−RT 2nd Command Error

0 (LSB) Command Word Contents Error



2.29. 1553 Command Word


15 (MSB) Remote Terminal Address Bit 4

14 Remote Terminal Address Bit 3




10 Transmit / Receive

9 Subaddress / Mode Code Bit 4





4 Data Word Count / Mode Code Bit 4




0 (LSB) Data Word Count / Mode Code Bit 0



2.30. Word Monitor Identification Word


15 (MSB) Gap Time (MSB)

14 .

13 .

12 .

11 .

10 .

9 .

8 Gap Time (LSB)

7 Word Flag

6 This RT

5 Broadcast

4 Error

3 Command / Data

2 Channel B / A

1 Contiguous Data / Gap

0 (LSB) Mode_Code



2.31. Message Monitor Mode Block Status Word


15 (MSB) EOM

14 SOM

13 Channel B / A

12 Error Flag

11 RT−to−RT Transfer

10 Format Error


8 Good Data Block Transfer

7 Data Stack Rollover

6 Reserved

5 Word Count Error

4 Incorrect Sync

3 Invalid Word

2 RT−to−RT Gap / Sync / Address Error

1 RT−to−RT 2nd Command Error

0 (LSB) Command Word Contents Error



2.32. RT/Monitor Interrupt Status Word (For Interrupt Status Queue)

Bit No. Message Interrupt Event Non-Message Interrupt Event

15 (MSB) Transmitter Timeout Not Used

14 Illegal Command Not Used

13 Monitor Data Stack 50% Rollover Not Used

12 Monitor Data Stack Rollover Not Used

11 RT Circular Buffer 50% Rollover Not Used

10 RT Circular Buffer Rollover Not Used

9 Monitor Command (Descriptor) Stack 50% Rollover Not Used

8 Monitor Command (Descriptor) Stack Rollover Not Used

7 RT Command (Descriptor) Stack 50% Rollover Not Used

6 RT Command (Descriptor) Stack Rollover Not Used

5 Handshake Fail Not Used

4 Format Error Time Tag Rollover

3 Mode Code Interrupt RT Address Parity Error

2 Subaddress Control Word EOM Protocol Self-Test Complete

1 End-Of-Message (EOM) RAM Parity Error

0 (LSB) Logic “1” Logic “0”



2.33. 1553 Status Word


15 (MSB) Remote Terminal Address Bit 4





10 Message Error

9 Instrumentation

8 Service Request

7 Reserved

6 Reserved

5 Reserved

4 Broadcast Command Received

3 Busy

2 SSFLAG

1 Dynamic Bus Control Acceptance

0 (LSB) Terminal Flag

Signal Descriptions


3. Signal Descriptions

Table 5. Power and Ground

Signal Name Balls Description

+3.3V_XCVR

B6, B7, B8, C6, C7, C12, D12, G6, G7, G8, G9,

K12, L6, L7, L12, M6, M7, N9

+ 3.3 Volt Transceiver Power

+3.3V_LOGICB16, B17, C16, C17, F13,

F14, G13, G14, M16, M17, N19, N20

+3.3 V Logic Power

GND_XCVR A1, A2, A3, B1, B2, B3, M1, M2, M3, N1, N2, N3 Transceiver Ground

GND_XCVR/THERMAL

B9, B10, B11, C8, C9, C10, C11, D8, D9, D10, D11, E9, E10, E11, J9, J10, J11, K8, K9, K10,

K11, L8, L9, L10, L11, M9, M10, M11

Transceiver Ground/Thermal connections.

GND_LOGIC

A22, A23, A24, B20, B22, B23, B24, C22, C23, C24, E17, E18, E19, F17, F18,

F19, G17, G18, G19, H17, H18, H19, H20, J17, J18, J19, J20, L14, L15,

L22, L23, L24, M14, M15, M22, M23, M24, N22,

N23, N24

Logic Ground

Table 6. Bus Connections

Signal Name Function Balls Description

CHA_1553 Analog I/O D1, D2, D3

MIL-STD-1553 Transmit/Receive Input/Output. Transformer coupled connections.

CHA_1553 Analog I/O F1, F2, F3

CHB_1553 Analog I/O H1, H2, H3

CHB_1553 Analog I/O K1, K2, K3

CHA_1553-D Analog I/O D4, E4, F4

MIL-STD-1553 Transmit/Receive Input/Output. Direct coupled connections.

CHA_1553-D Analog I/O E1, E2, E3

CHB_1553-D Analog I/O H4, J4, K4

CHB_1553-D Analog I/O J1, J2, J3


Signal Descriptions

Table 7. External Transceiver Interface

Important Note: When using the integrated internal transceivers, the connections outlined in the table below are mandatory.

Signal Name Function Balls Using Internal “Built-In” Transceivers Using External Transceivers

SNGL_END Digital Input A21 No Connect “NC” if utilizing “Built-In”

Transceivers

If SNGL_END is connected to logic “0” the Manchester decoder inputs will be configured to accept single-ended input signals (e.g.,MIL-STD-1773 fiber optic receiver outputs).

If SNGL_END is connected to logic “1,” the decoder inputs will be configured to accept standard double-ended Manchester bi-phase input signals (i.e., MIL-STD-1553 receiver outputs).

TXINH_IN_A Digital Input A12

These two signals MUST be directly connected for normal “Built-In”

transceiver operation.

Do NOT connect these two signals together. Connect TXINH_OUT (Digital transmit inhibit output) to the TXINH input of external MIL-STD-1553 transceivers. Assert high to inhibit when not transmitting in the respective bus.

TXINH_OUT_A Digital Output A13

TXDATA_IN_A Digital Input A9



Do NOT connect these two signals. Connect TXDATA_OUT (Digital Manchester biphase transmit data output) directly to the corresponding input of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver.

TXDATA_OUT_A Digital Output A10

TXDATA_IN_A Digital Input B14




TXDATA_OUT_A Digital Output C14

RXDATA_IN_A Digital Input G12



Do NOT connect these two signals. Connect RXDATA_IN (Digital Manchester biphase receive data input) directly to the corresponding output of a MIL-STD-1553 or MIL-STD-1773 (fiber optic) transceiver.

RXDATA_OUT_A Digital Output F12

RXDATA_IN_A Digital Input G11




RXDATA_OUT_A Digital Output F11

TXINH_IN_B Digital Input M20



Do NOT connect these two signals together. Connect TXINH_OUT (Digital transmit inhibit output) to the TXINH input of external MIL-STD-1553 transceivers. Assert high to inhibit when not transmitting in the respective bus.

TXINH_OUT_B Digital Output M19

Signal Descriptions


Signal Name Function Balls Using Internal “Built-In” Transceivers Using External Transceivers

TXDATA_IN_B Digital Input J16




TXDATA_OUT_B Digital Output K16

TXDATA_IN_B Digital Input K18




TXDATA_OUT_B Digital Output K19

RXDATA_IN_B Digital Input M13




RXDATA_OUT_B Digital Output M12

RXDATA_IN_B Digital Input N13




RXDATA_OUT_B Digital Output N12


Signal Descriptions

Table 8. Data Bus

Signal Name Balls Description

D15 (MSB) D21

16-bit bi-directional data bus. This bus interfaces the host processor to the internal registers and internal RAM.

D14 E24

D13 E22

D12 E23

D11 E21

D10 F24

D09 F22

D08 F23

D07 F21

D06 G23

D05 G22

D04 G24

D03 G21

D02 H23

D01 H22

D00 (LSB) H24

Signal Descriptions


Table 9. Host Address Bus

Signal NameBalls DescriptionHI-62203x

(64K RAM)HI-62213x (4K RAM)

A15 (MSB) A15 / CLK_SEL_1 D17

16-bit bi-directional address bus.

For HI-62203x (64K RAM versions), this signal is always configured as address line A15 (MSB). Refer to the description for A11-A0 below.

For HI-62213x (4K RAM versions), if UPADDREN is connected to logic “1”, this signal operates as address line A15. If UPADDREN is connected to logic “0”, this signal operates as CLK_SEL_1. In this case, A15/CLK_SEL_1 and A14/CLK_SEL_0 are used to select the clock frequency, as follows:

CLK_SEL_1 CLK_SEL_0 Clock Frequency

0 0 10 MHz

0 1 20 MHz

1 0 12 MHz

1 1 16 MHz

A14 A14 / CLK_SEL_0 A16

For HI-62203x (64K RAM versions), this signal is always configured as address line A14. Refer to the description of A11-A0 below.

For HI-62213x (4K RAM versions), if UPADDREN is connected to logic “1”, this signal operates as A14. If UPADDREN is connected to logic “0”, then this signal operates as CLK_SEL_0. In this case, CLK_SEL_1 and CLK_SEL_0 are used to select the clock frequency, as defined in the table above.

A13 A13 / LOGIC “1” D16

For HI-62203x (64K RAM versions), this signal is always configured as address line A13. Refer to the description for A11-A0 below.

For HI-62213x (4K RAM versions), if UPADDREN is connected to logic “1”, this signal operates as A13. If UPADDREN is connected to logic “0”, then this signal MUST be connected to +3.3V_LOGIC (logic “1”).

A12 A12 / RTBOOT B15

For HI-62203x (64K RAM versions), this signal is always configured as address line A12. Refer to the description for A11-A0 below.

For HI-62213x (4K RAM versions), if UPADDREN is connected to logic “1”, this signal operates as A12. If UPADDREN is connected to logic “0”, then this signal functions as RTBOOT .

If RTBOOT is connected to logic “0”, the device will initialize in RT mode with the Busy status word bit set following power turn-on. If RTBOOT is hardwired to logic “1”, the device will initialize in either Idle mode (if BC_Disable is high), or in BC mode (if BC_Disable is low).


Signal Descriptions

Signal NameBalls DescriptionHI-62203x


A11 A11 / (MSB) C15

Lower 12 bits of 16-bit bi-directional address bus.

In both the buffered and transparent modes, the host CPU accesses registers and internal RAM by means of A11 − A0 (HI-62213x, 4K versions). For 64K versions, A15 − A12 are also used for this purpose.

In buffered mode, A11 − A0 (or A15 − A0) are inputs only. In the transparent mode, A11 − A0 (or A15 − A0) are inputs during CPU accesses and become outputs (driving) when the 1553 protocol/memory management logic accesses up to 64K words of external RAM.

In transparent mode, the address bus is driven (outputs) only when the signal DTACK is low (indicating that the device has control of the RAM interface bus) and IOEN is high, indicating a non-host access. Most of the time, including immediately after power turn-on, A11 − A0 (or A15 − A0) will be in high impedance (input) state.

A10 A10 A15

A09 A09 A14

A08 A08 D14

A07 A07 B12

A06 A06 D15

A05 A05 E13

A04 A04 E15

A03 A03 E12

A02 A02 F15

A01 A01 E14

A00 (LSB) A00 (LSB) F16

Table 10. Host Interface


SELECT Digital Input B18

Device Select.

Used by Host to select the device for a transfer to / from either RAM or registers.

STRBD Digital Input A18

Strobe Data.

Used in conjunction with SELECT to initiate and control the data transfer cycle between the host processor and the HI-6220.

STRBD must be asserted low through the full duration of the transfer cycle.

RD / WR Digital Input A17

Read/Write.

In the 16-bit buffered mode, if POL_SEL is logic “0”, then RD / WR should be low (logic “0”) for read accesses and high (logic “1”) for write accesses.

If POL_SEL is logic “1”, or the interface is configured for a mode other than 16-bit buffered mode, then RD / WR is high (logic “1”) for read accesses and low (logic “0”) for write accesses.

Signal Descriptions



ADDR_LAT Digital Input

L16

Memory Output Enable or Address Latch.

In buffered mode, the ADDR_LAT input is used to configure the buffers for A15 − A0, SELECT , MEM / REG , and MSB / LSB (for 8-bit mode only) in latched mode (when low) or transparent mode (when high). That is, internal transparent latches will track the values on A15 − A0, SELECT , MEM / REG , and MSB / LSB when ADDR_LAT is high, and latch the values when ADDR_LAT goes low.

In general, for interfacing to processors with a non-multiplexed address/data bus, ADDR_LAT should be hardwired to logic “1”. For interfacing to processors with a multiplexed address/data bus, ADDR_LAT should be connected to a signal that indicates a valid address when ADDR_LAT is logic “1”.

In transparent mode, MEMOE output signal is used to enable data outputs for external RAM read cycles (normally connected to the OE input signal on external RAM chips).

MEMOE Digital Output

ZEROWAIT Digital Input

N16

Memory Write or Zero Wait.

In buffered mode, input signal ( ZEROWAIT ) is used to select between the zero wait mode ( ZEROWAIT = “0”) and the non-zero wait mode ( ZEROWAIT = “1”).

In transparent mode, active low output signal ( MEMWR ) is asserted low during memory write transfers to strobe data into external RAM (normally connected to the WR input signal on external RAM chips).

MEMWR Digital Output

16 / 8 Digital Input

L17

Data Transfer Request or Data Bus Select.

In buffered mode, input signal 16 / 8 used to select between the 16 bit data transfer mode (16 / 8 = “1”) and the 8-bit data transfer mode (16 / 8 = “0”).

In transparent mode (16-bit only), DTREQ used to request access to the processor/RAM interface bus (address and data buses).

DTREQ Digital Output

MSB / LSB Digital Input

J14

Data Transfer Grant or Most Significant Byte/Least Significant Byte.

In 8-bit buffered mode, input signal (MSB / LSB) used to indicate which byte is currently being transferred (MSB or LSB). The logic sense of MSB / LSB is controlled by the POL_SEL input. MSB / LSB is not used in the 16-bit buffered mode.

In transparent mode, DTGRT is asserted in response to the DTREQ output to indicate that control of the external processor/RAM bus has been transferred from the host processor to the HI-6220. DTGRT Digital

Input


Signal Descriptions


POL_SEL Digital Input

N17

Data Transfer Acknowledge or Polarity Select.

In 16-bit buffered mode, if POL_SEL is connected to logic “1”, RD / WR should be asserted high (logic “1”) for a read operation and low (logic “0”) for a write operation. In 16-bit buffered mode, if POL_SEL is connected to logic “0”, RD / WR should be asserted low (logic “0”) for a read operation and high (logic “1”) for a write operation.

In 8-bit buffered mode (TRANSPARENT / BUFFERED = “0” and 16 / 8 = “0”), POL_SEL input signal is used to control the logic sense of the MSB / LSB signal. If POL_SEL is connected to logic “0”, MSB / LSB should be asserted low (logic “0”) to indicate the transfer of the least significant byte and high (logic “1”) to indicate the transfer of the most significant byte. If POL_SEL is connected to logic “1”, MSB / LSB should be asserted high (logic “1”) to indicate the transfer of the least significant byte and low (logic “0”) to indicate the transfer of the most significant byte.

In transparent mode, DTACK used to indicate acceptance of the processor/RAM interface bus in response to a data transfer grant ( DTGRT ).

RAM transfers over A15 − A0 and D15 − D0 will be framed by the time that DTACK is asserted low.

DTACK Digital Output

TRIG_SEL Digital Input

M18

Memory Enable or Trigger Select input.

In 8-bit buffered mode, input signal (TRIG-SEL) used to select the order in which byte pairs are transferred to or from the device by the host processor. In the 8-bit buffered mode, TRIG_SEL should be asserted high (logic "1") if the byte order for both read operations and write operations is MSB followed by LSB. TRIG_SEL should be asserted low (logic "0") if the byte order for both read operations and write operations is LSB followed by MSB. This signal has no operation in the 16-bit buffered mode (it does not need to be connected).

In transparent mode, MEMENA_IN is used as a Chip Select (CS) input to the internal shared RAM. If only internal RAM is used, MEMENA_IN should be connected directly to the output of a gate that is OR'ing the DTACK and IOEN output signals.

MEMENA_IN Digital Input

MEM/ REG Digital Input C18

Memory or Register.

Selects between memory access (MEM / REG = "1") or register access (MEM / REG = "0"). Usually connected to either a CPU address line or address decoder output.

Signal Descriptions



SSFLAG Digital Input

K14

Subsystem Flag (RT) or External Trigger (BC/Word Monitor) input.

In RT mode, if this input is asserted low, the Subsystem Flag bit will be set in the RT Status Word. If the SSFLAG input is logic "0" while bit 8 of Configuration Register #1 (SUBSYSTEM FLAG) has been programmed to logic "1", the Subsystem Flag RT Status Word bit will become logic "1," but bit 8 of Configuration Register #1, SUBSYSTEM FLAG, will return logic "1" when read. That is, the sense on the SSFLAG input has no effect on the SUBSYSTEM FLAG register bit.

In the non-enhanced BC mode, this signal operates as an External Trigger input. In BC mode, if the external BC Start option is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will issue a BC Start Command, starting execution of the current BC frame.

In the enhanced BC mode, during the execution of a Wait for External Trigger (WTG) instruction, the BC will wait for a low-to-high transition on EXT_TRIG before proceeding to the next instruction.

In the Word Monitor mode, if the external trigger is enabled (bit 7 of Configuration Register #1), a low to high transition on this input will initiate a monitor start.

This input has no effect in Message Monitor mode.

EXT_TRIG Digital Input

TRANSPARENT / BUFFERED

Digital Input D22

Used to select between the buffered mode (when strapped to logic "0") and transparent/DMA mode (when strapped to logic "1") for the host processor interface.

READYD Digital Output C21

Handshake output to host processor.

For a nonzero wait state read access, READYD is asserted at the end of a host transfer cycle to indicate that data is available to be read on D15 through D0. For a nonzero wait state write cycle, READYD is asserted at the end of the cycle to indicate that data has been transferred to a register or RAM location.

For both nonzero wait reads and writes, the host must assert STRBD low until READYD is asserted low.

In the (buffered) zero wait state mode, this output is normally logic "1", indicating that the device is in a state ready to accept a subsequent host transfer cycle. In zero wait mode, READYD will transition from high to low during (or just after) a host transfer cycle, when the device initiates its internal transfer to or from registers or internal RAM. When the internal transfer is complete, READYD returns to logic "1", indicating it is ready for the host to initiate a subsequent transfer cycle.

IOEN Digital Output C20

I/O Enable.

Tri-state control for external address and data buffers. Generally not used in buffered mode.

When low, indicates that the device is currently performing a host access to an internal register, or internal RAM (external RAM for transparent mode). In transparent mode, IOEN (low) should be used to enable external address and data bus tri-state buffers.


Signal Descriptions

Table 11. RT Address


RTAD4 (MSB) Digital Input J21

RT Address input.

If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the RT address is provided by means of these 5 input signals. In addition, if RT ADDRESS SOURCE is logic "0", the source of RT address parity is RTADP.

If RT ADDRESS SOURCE is programmed to logic "1", then the RT address and parity are under software control, via data lines D5-D0. In this case, the RTAD4 − RTAD0 and RTADP signals are not used.

RTAD3 Digital Input J24

RTAD2 Digital Input J22

RTAD1 Digital Input K23

RTAD0 (LSB) Digital Input K21

RTADP Digital Input J23

Remote Terminal Address Parity.

This input signal must provide an odd parity sum with RTAD4 − RTAD0 in order for the RT to respond to non-broadcast commands.

RT_AD_LAT Digital Input K24

RT Address Latch.

Input signal used to control the internal RT address latch. If RT_AD_LAT is connected to logic "0", then the RT is configured to accept a hardwired RT address from RTAD4 − RTAD0 and RTADP.

If RT_AD_LAT is initially logic "0", and then transitions to logic "1", the values presented on RTAD4 − RTAD0 and RTADP will be latched internally on the rising edge of RT_AD_LAT.

If RT_AD_LAT is connected to logic "1", then the RT address is latchable under host processor control. In this case, there are two possibilities:

1. If bit 5 of Configuration Register #6, RT ADDRESS SOURCE, is programmed to logic "0" (default), then the source of the RT Address is the RTAD4 − RTAD0 and RTADP input signals.

2. If RT ADDRESS SOURCE is programmed to logic "1", then the source of the RT Address is the lower 6 bits of the processor data bus, D5 − D1 (for RTAD4 − 0) and D0 (for RTADP).

In either of these two cases (with RT_AD_LAT = "1"), the processor will cause the RT address to be latched by:

1. Writing bit 15 of Configuration Register #3, ENHANCED MODE ENABLE, to logic "1".

2. Writing bit 3 of Configuration Register #4, LATCH RT ADDRESS WITH CONFIGURATION REGISTER #5, to logic "1".

3. Writing to Configuration Register #5. In the case of RT ADDRESS SOURCE = "1", then the values of RT address and RT address parity must be written to the lower 6 bits of Configuration Register #5, via D5 − D0.

In the case where RT ADDRESS SOURCE = "0", the bit values presented on D5 − D0 become "don't care".

Signal Descriptions


Table 12. Miscellaneous Signals

Signal NameFunction Balls DescriptionHI-62203x


+3.3V_Logic UPADDREN Digital Input A19

UPADDREN is used to control the function of the upper 4 address inputs (A15 − A12).

If UPADDREN is connected to logic "1", then these four signals operate as address lines A15 − A12.

If UPADDREN is connected to logic "0", then A15 and A14 function as CLK_SEL_1 and CLK_ SEL_0 respectively; A13 MUST be connected to LOGIC "1"; and A12 functions as RTBOOT.

SLEEPIN Digital Input H10 Connecting this input has no effect.

INCMD Digital Output H21

For BC, RT, or Selective Message Monitor modes, INCMD is asserted low whenever a message is being processed. In Word Monitor mode, INCMD will be asserted low for as long as the monitor is online.

MCRST Digital Output D19 For RT mode MCRST will be asserted low for two clock cycles

following receipt of a Reset Remote Terminal mode command.

RSTBITEN Digital Input K22

If this input is set to logic "1", the Built-In-Self-Test (BIST) will be enabled after hardware reset (for example, following power-up).

A logic "0" input disables both the power-up and user-initiated automatic BIST.

INT Digital Output D24

Interrupt Request output.

If the LEVEL / PULSE interrupt bit (bit 3) of Configuration Register #2 is logic "0", a negative pulse of approximately 500 ns is output on INT to signal an interrupt request.

If LEVEL / PULSE is high, a low level interrupt request output will be asserted on INT . The level interrupt will be cleared (high) after either:

1. The processor writes a value of logic "1" to INTERRUPT RE-SET, bit 2 of the Start/Reset Register; or

2. If bit 4 of Configuration Register #2, INTERRUPT STATUS AUTO-CLEAR is logic "1", then reading the Interrupt Status Register (#1 and/or #2) that is requesting an interrupt enabled by the corresponding Interrupt Mask Register will clear INT. However, for the case where both Interrupt Status Register #1 and Interrupt Status Register #2 have bits set reflecting interrupt events, it will be necessary to read both interrupt status registers in order to clear INT.

CLOCK_IN Digital Input N18 20 MHz, 16 MHz, 12 MHz, or 10 MHz clock input.

TX_INH_A Digital Input A20 Transmitter inhibit inputs for Channel A and Channel B.

For normal operation, these inputs should be connected to logic "0". To force a shutdown of Channel A and / or Channel B, a value of logic "1" should be applied to the respective TX_INH input.TX_INH_B Digital

Input D20


Signal Descriptions

Signal NameFunction Balls DescriptionHI-62203x


MSTCLR Digital Input D18

Master Clear.

Active low Reset input, normally asserted low following power turn-on.

TAG_CLK Digital Input D23

Time Tag Clock.

External clock that may be used to increment the Time Tag Register. This option is selected by setting Bits 7, 8 and 9 of Configuration Register # 2 to Logic "1".

BC_Disable Digital Input B21

Hardware lockout to disable BC opertation and operate the part in RT-Only mode.

Drive high to disable BC, low to enable all modes of operation.

NC -

A4, A5, A6, A7, A8, A11, B4,

B5, B13, B19, C1, C2, C3,

C4, C5, C13, C19, D5, D6, D7, D13, E5, E6, E7, E8,

E16, E20, F5, F6, F7, F8, F9, F10, F20, G1, G2, G3, G4,

G5, G10, G15, G16, G20, H5,

H6, H7, H8, H9, H11, H12, H13, H14, H15, H16, J5, J6, J7, J8, J12, J13, J15,

K5, K6, K7, K13, K15, K17,

K20, L1, L2, L3, L4, L5, L13, L18, L19, L20, L21, M4, M5, M8, M21, N4,

N5, N6, N7, N8, N10, N11, N14,

N15, N21

No User Connections to these balls allowed.

Host Interface


4. Host InterfaceThe most commonly used host interface is the 16-bit buffered, non-zero wait mode. This configuration may be used to interface the device with a 16 or 32-bit microprocessor. In this mode the device does not access external host memory and uses the internal 4K or 64K words of RAM for storing MIL-STD-1553 data and related buffering. Figure 1 and Table 13 illustrate host read timing and Figure 2 and Table 14 illustrate host write timing respectively.

4.1. Host RAM/Register Read (16-BIT Buffered, Nonzero Wait)

Clock In

t6t1

t5

t2

VALID

t3

t7

t8

t14 t18

t15t11

t13

VALID

t4 t10t9

t19

t12

t16

t17

VALID

SELECT(Note 2,7)

STRBD(Note 2)

MEM/REG(Note 3,4,7)

RD/WR(Note 4,5)

IOEN(Note 2,6)

READYD(Note 6)

A15-A0(Note 7,8,9)

D15-D0(Note 6)

Figure 1. Host RAM/Register Read Timing Diagram (16-BIT Buffered, Nonzero Wait)

Notes for Figure 1: 1. For the 16-bit buffered nonzero wait configuration, TRANSPARENT / BUFFERED must be connected to logic “0”.

ZERO_WAIT and DTREQ / 16/8 must be connected to logic “1”. The inputs TRIGGER_SEL and MSB/LSB may be connected to either Vcc or ground.

2. SELECT and STRBD may be tied together. IOEN goes low on the first rising CLK edge when SELECT • STRBD is sampled low (satisfying t1) and the devices’s protocol/memory management logic is not accessing the internal RAM. When this occurs, IOEN goes low, starting the transfer cycle. After IOEN goes low, SELECT may be released high.

3. MEM / REG must be high for memory access, low for register access.

4. MEM / REG and RD / WR are buffered transparently until the first falling edge of CLK after IOEN goes low. After this CLK edge, MEM / REG and RD / WR become latched internally.


Host Interface

5. The logic sense for RD / WR in the diagram assumes that POLARITY_SEL is connected to logic ”1”. If POLARITY_SEL is connected to logic “0”, RD / WR must be asserted low to read.

6. The timing for IOEN, READYD and D15-D0 assumes a 50 pf load. For loading above 50 pf, the validity of IOEN, READYD and D15-D0 is delayed by an additional 0.14 ns/pf typ, 0.28 ns/pf max.

7. The timing for A15-A0, MEM / REG and SELECT assumes that ADDR-LAT is connected to logic “1”. Refer to Address Latch timing for additional details.

8. The address bus A15-A0 is internally buffered transparently until the first rising edge of CLK after IOEN goes low. After this CLK edge, A15-A0 become latched internally.

9. Setup time given for use in worst case timing calculation. None of the device’s input signals are required to be synchronized to the system clock. When SELECT and STRBD do not meet the setup time of t1, but occur during the setup window of an internal flipflop, an additional clock cycle will be inserted between the falling clock edge that latches MEM / REG and RD / WR and the rising clock edge that latches the Address (A15-A0). When this occurs, the delay from IOEN falling to READYD falling (t11) increases by one clock cycle and the address hold time (t10) must be increased by one clock cycle.

Table 13. Host RAM/Register Read Timing (16-BIT Buffered, Nonzero Wait)

Time Description NotesResponse Time

UnitsMin. Typ. Max.

t1 SELECT and STRBD low setup time prior to clock rising edge 2, 9 15 ns

t2

SELECT and STRBD low to IOEN low

(uncontended access @ 20 MHz)2, 6 105 ns

(contended access, with ENHANCED CPU ACCESS = “0” @ 20 MHz) 2, 6 3.6 μs

(contended access, with ENHANCED CPU ACCESS = “1” @ 20 MHz) 2, 6 520 ns

(uncontended access @ 16 MHz) 2, 6 117 ns









t3

Time for MEM / REG and RD / WR to become valid following SELECT and STRBD low

(@ 20 MHz)3, 4, 5, 7 10 ns

(@ 16 MHz) 3, 4, 5, 7 16 ns

(@ 12 MHz) 3, 4, 5, 7 27 ns

(@ 10 MHz) 3, 4, 5, 7 35 ns

Host Interface



UnitsMin. Typ. Max.

t4

Time for Address to become valid following SELECT and STRBD low

(@ 20 MHz)12 ns

(@ 16 MHz) 25 ns

(@ 12 MHz) 45 ns

(@ 10 MHz) 62 ns

t5 CLOCK IN rising edge delay to IOEN falling edge 6 40 ns

t6 SELECT hold time following IOEN falling 2 0 ns

t7 MEM / REG , RD / WR setup time prior to CLOCK IN falling edge 3, 4, 5, 7 15 ns

t8 MEM / REG , RD / WR hold time following CLOCK IN falling edge 3, 4, 5, 7 30 ns

t9 Address valid setup time prior to CLOCK IN rising edge 7, 8 35 ns

t10 Address valid hold time following CLOCK IN rising edge 7, 8, 9 30 ns

t11

IOEN falling delay to READYD falling

(@ 20 MHz)6, 9 135 150 165 ns

(@ 16 MHz) 6, 9 170 187.5 205 ns

(@ 12 MHz) 6, 9 235 250 265 ns

(@ 10 MHz) 6, 9 285 300 315 ns

t12

Output Data valid prior to READYD falling (@ 20 MHz) 6 11 ns

(@ 16 MHz) 6 23 ns

(@ 12 MHz) 6 44 ns

(@ 10 MHz) 6 61 ns

t13 CLOCK IN rising edge delay to READYD falling 6 40 ns

t14 READYD falling to STRBD rising release time ∞ ns

t15 STRBD rising edge delay to IOEN rising edge and READYD rising edge 6 40 ns

t16 Output Data hold time following STRBD rising edge 0 ns

t17 STRBD rising delay to output data tri-state 40 ns

t18 STRBD high hold time from READYD rising 0 ns

t19 CLOCK IN rising edge delay to output data valid 40 ns


Host Interface

4.2. Host RAM/Register Write (16-BIT Buffered, Nonzero Wait)

t7t1

t6

t2

VALID

t3

t8

t9

t16 t18

t17t14

t15

VALID

t4 t12t10

VALID

t13

t5 t11

Clock In

SELECT(Note 2,7)

STRBD(Note 2)

MEM/REG(Note 3,4,7)

RD/WR(Note 4,5)

IOEN(Note 2,6)

READYD(Note 6)

A15-A0(Note 7,8,9)

D15-D0(Note 8,9)

Figure 2. Host RAM/Register Write Timing Diagram (16-BIT Buffered, Nonzero Wait)

Notes for Figure 2: 1. For the 16-bit buffered nonzero wait configuration, TRANSPARENT / BUFFERED must be connected to logic “0”.

ZERO_WAIT and DTREQ / 16/8 must be connected to logic “1”. The inputs TRIGGER_SEL and MSB/LSB may be connected to either Vcc or ground.

2. SELECT and STRBD may be tied together. IOEN goes low on the first rising CLK edge when SELECT • STRBD is sampled low (satisfying t1) and the devices’s protocol/memory management logic is not accessing the internal RAM. When this occurs, IOEN goes low, starting the transfer cycle. After IOEN goes low, SELECT may be released high.

3. MEM / REG must be high for memory access, low for register access.

4. MEM / REG and RD / WR are buffered transparently until the first falling edge of CLK after IOEN goes low. After this CLK edge, MEM / REG and RD / WR become latched internally.

5. The logic sense for RD / WR in the diagram assumes that POLARITY_SEL is connected to logic ”1”. If POLARITY_SEL is connected to logic “0”, RD / WR must be asserted high to write.

6. The timing for IOEN and READYD assumes a 50 pf load. For loading above 50 pf, the validity of IOEN and READYD is delayed by an additional 0.14 ns/pf typ, 0.28 ns/pf max.

7. The timing for A15-A0, MEM / REG and SELECT assumes that ADDR-LAT is connected to logic “1”. Refer to Address Latch timing for additional details.

8. The address bus A15-A0 and data bus D15-D0 are internally buffered transparently until the first rising edge of CLK after IOEN goes low. After this CLK edge, A15-A0 and D15-D0 become latched internally.

Host Interface


9. Setup time given for use in worst case timing calculations. None of the device’s input signals are required to be synchronized to the system clock. When SELECT and STRBD do not meet the setup time of t1, but occur during the setup window of an internal flipflop, an additional clock cycle may be inserted between the falling clock edge that latches MEM / REG and RD / WR and the rising clock edge that latches the Address (A15-A0) and Data (D15-D0). When this occurs, the delay from IOEN falling to READYD falling (t14) increases by one clock cycle and the address and data hold times (t12 and t13 respectively) must be increased by one clock cycle.

Table 14. Host RAM/Register Write Timing (16-BIT Buffered, Nonzero Wait)


UnitsMin. Typ. Max.

t1 SELECT and STRBD low setup time prior to clock rising edge 2, 10 15 ns

t2

SELECT and STRBD low to IOEN low

(uncontended access @ 20 MHz)2, 6 105 ns












t3

Time for MEM / REG and RD / WR to become valid following SELECT and STRBD low

(@ 20 MHz)3, 4, 5, 7 10 ns

(@ 16 MHz) 3, 4, 5, 7 16 ns

(@ 12 MHz) 3, 4, 5, 7 27 ns

(@ 10 MHz) 3, 4, 5, 7 35 ns

t4

Time for Address to become valid following SELECT and STRBD low

(@ 20 MHz)12 ns

(@ 16 MHz) 25 ns

(@ 12 MHz) 45 ns

(@ 10 MHz) 62 ns


Host Interface


UnitsMin. Typ. Max.

t5

Time for Data to become valid following SELECT and STRBD low

(@ 20 MHz)32 ns

(@ 16 MHz) 45 ns

(@ 12 MHz) 65 ns

(@ 10 MHz) 82 ns

t6 CLOCK IN rising edge delay to IOEN falling edge 6 40 ns

t7 SELECT hold time following IOEN falling 2 0 ns

t8 MEM / REG , RD / WR setup time prior to CLOCK IN falling edge 3, 4, 5, 7 15 ns

t9 MEM / REG , RD / WR hold time following CLOCK IN falling edge 3, 4, 5, 7 35 ns

t10 Address valid setup time prior to CLOCK IN rising edge 7, 8 35 ns

t11 Data valid setup time prior to CLOCK IN rising edge 15 ns

t12 Address valid hold time following CLOCK IN rising edge 7, 8, 9 30 ns

t13 Data valid hold time following CLOCK IN rising edge 9 15 ns

t14

IOEN falling delay to READYD falling

(@ 20 MHz)6, 9 85 100 115 ns

(@ 16 MHz) 6, 9 110 125 140 ns

(@ 12 MHz) 6, 9 152 167 182 ns

(@ 10 MHz) 6, 9 185 200 215 ns

t15 CLOCK IN rising edge delay to READYD falling 6 40 ns

t16 READYD falling to STRBD rising release time ∞ ns

t17 STRBD rising edge delay to IOEN rising edge and READYD rising edge 6 40 ns

t18 STRBD high hold time from READYD rising 10 ns

Pin Descriptions


5. Pin Descriptions

Table 15. HI-62213PBx (4K RAM) Package Pinout

Ball Signal Notes Ball Signal Notes

A1 GND_XCVR B1 GND_XCVR



A4 NC B4 NC

A5 NC B5 NC

A6 NC B6 +3.3V_XCVR

A7 NC B7 +3.3V_XCVR

A8 NC B8 +3.3V_XCVR

A9 TXDATA_IN_A Connect to ball A10 B9 GND_XCVR/THERMAL

A10 TXDATA_OUT_A Connect to ball A9 B10 GND_XCVR/THERMAL

A11 NC B11 GND_XCVR/THERMAL

A12 TXINH_IN_A Connect to ball A13 B12 A07

A13 TXINH_OUT_A Connect to ball A12 B13 NC

A14 A09 B14 TXDATA_IN_A Connect to ball C14

A15 A10 B15 A12 / RTBOOT

A16 A14 / CLK_SEL_0 B16 +3.3V_LOGIC

A17 RD / WR B17 +3.3V_LOGIC

A18 STRBD B18 SELECT

A19 UPADDREN B19 NC

A20 TX_INH_A B20 GND_LOGIC

A21 SNGL_END B21 BC_DISABLE

A22 GND_LOGIC B22 GND_LOGIC



Continued ...


Pin Descriptions


C1 NC D1 CHA_1553

C2 NC D2 CHA_1553

C3 NC D3 CHA_1553

C4 NC D4 NC / CHA_1553-D

C5 NC D5 NC

C6 +3.3V_XCVR D6 NC

C7 +3.3V_XCVR D7 NC

C8 GND_XCVR/THERMAL D8 GND_XCVR/THERMAL




C12 +3.3V_XCVR D12 +3.3V_XCVR

C13 NC D13 NC

C14 TXDATA_OUT_A Connect to ball B14 D14 A08

C15 A11 / (MSB) D15 A06

C16 +3.3V_LOGIC D16 A13 / LOGIC “1”

C17 +3.3V_LOGIC D17 A15 / CLK_SEL_1

C18 MEM / REG D18 MSTCLR

C19 NC D19 MCRST

C20 IOEN D20 TX_INH_B

C21 READYD D21 D15 (MSB)

C22 GND_LOGIC D22TRANSPARENT /

BUFFERED

C23 GND_LOGIC D23 TAG_CLK

C24 GND_LOGIC D24 INT

Continued ...

Pin Descriptions



E1 NC / CHA_1553-D F1 CHA_1553

E2 NC / CHA_1553-D F2 CHA_1553

E3 NC / CHA_1553-D F3 CHA_1553

E4 NC / CHA_1553-D F4 NC / CHA_1553-D

E5 NC F5 NC

E6 NC F6 NC

E7 NC F7 NC

E8 NC F8 NC

E9 GND_XCVR/THERMAL F9 NC


E11 GND_XCVR/THERMAL F11 RXDATA_OUT_A Connect to ball G11

E12 A03 F12 RXDATA_OUT_A Connect to ball G12

E13 A05 F13 +3.3V_LOGIC

E14 A01 F14 +3.3V_LOGIC

E15 A04 F15 A02

E16 NC F16 A00 (LSB)

E17 GND_LOGIC F17 GND_LOGIC



E20 NC F20 NC

E21 D11 F21 D07

E22 D13 F22 D09

E23 D12 F23 D08

E24 D14 F24 D10

Continued ...


Pin Descriptions


G1 NC H1 CHB_1553

G2 NC H2 CHB_1553

G3 NC H3 CHB_1553

G4 NC H4 NC / CHB_1553-D

G5 NC H5 NC

G6 +3.3V_XCVR H6 NC

G7 +3.3V_XCVR H7 NC

G8 +3.3V_XCVR H8 NC

G9 +3.3V_XCVR H9 NC

G10 NC H10 SLEEPIN Connecting this input has no effect

G11 RXDATA_IN_A Connect to ball F11 H11 NC


G13 +3.3V_LOGIC H13 NC


G15 NC H15 NC

G16 NC H16 NC

G17 GND_LOGIC H17 GND_LOGIC



G20 NC H20 GND_LOGIC

G21 D03 H21 INCMD

G22 D05 H22 D01

G23 D06 H23 D02

G24 D04 H24 D00 (LSB)

Continued ...

Pin Descriptions



J1 NC / CHB_1553-D K1 CHB_1553

J2 NC / CHB_1553-D K2 CHB_1553

J3 NC / CHB_1553-D K3 CHB_1553

J4 NC / CHB_1553-D K4 NC / CHB_1553-D

J5 NC K5 NC

J6 NC K6 NC

J7 NC K7 NC

J8 NC K8 GND_XCVR/THERMAL

J9 GND_XCVR/THERMAL K9 GND_XCVR/THERMAL



J12 NC K12 +3.3V_XCVR

J13 NC K13 NC

J14 MSB / LSB / DTGRT K14 SSFLAG / EXT_TRIG

J15 NC K15 NC

J16 TXDATA_IN_B Connect to ball K16 K16 TXDATA_OUT_B Connect to ball J16

J17 GND_LOGIC K17 NC

J18 GND_LOGIC K18 TXDATA_IN_B Connect to ball K19

J19 GND_LOGIC K19 TXDATA_OUT_B Connect to ball K18


J21 RTAD4 (MSB) K21 RTAD0 (LSB)

J22 RTAD2 K22 RSTBITEN

J23 RTADP K23 RTAD1

J24 RTAD3 K24 RT_AD_LAT

Continued ...


Pin Descriptions


L1 NC M1 GND_XCVR

L2 NC M2 GND_XCVR

L3 NC M3 GND_XCVR

L4 NC M4 NC

L5 NC M5 NC

L6 +3.3V_XCVR M6 +3.3V_XCVR


L8 GND_XCVR/THERMAL M8 NC

L9 GND_XCVR/THERMAL M9 GND_XCVR/THERMAL



L12 +3.3V_XCVR M12 RXDATA_OUT_B Connect to ball M13

L13 NC M13 RXDATA_IN_B Connect to ball M12

L14 GND_LOGIC M14 GND_LOGIC


L16 ADDR_LAT / MEMOE M16 +3.3V_LOGIC

L17 16 / 8 / DTREQ M17 +3.3V_LOGIC

L18 NC M18 TRIG_SEL / MEMENA_IN

L19 NC M19 TXINH_OUT_B Connect to ball M20

L20 NC M20 TXINH_IN_B Connect to ball M19

L21 NC M21 NC




Continued ...

Pin Descriptions


Ball Signal Notes

N1 GND_XCVR

N2 GND_XCVR

N3 GND_XCVR

N4 NC

N5 NC

N6 NC

N7 NC

N8 NC

N9 +3.3V_XCVR

N10 NC

N11 NC

N12 RXDATA_OUT_B Connect to ball N13

N13 RXDATA_IN_B Connect to ball N12

N14 NC

N15 NC

N16 ZEROWAIT / MEMWR

N17 POL_SEL / DTACK

N18 CLOCK_IN

N19 +3.3V_LOGIC

N20 +3.3V_LOGIC

N21 NC

N22 GND_LOGIC

N23 GND_LOGIC

N24 GND_LOGIC


Pin Descriptions

Table 16. HI-62203PBx (64K RAM) Package Pinout





A4 NC B4 NC

A5 NC B5 NC

A6 NC B6 +3.3V_XCVR

A7 NC B7 +3.3V_XCVR

A8 NC B8 +3.3V_XCVR

A9 TXDATA_IN_A Connect to ball A10 B9 GND_XCVR/THERMAL

A10 TXDATA_OUT_A Connect to ball A9 B10 GND_XCVR/THERMAL

A11 NC B11 GND_XCVR/THERMAL

A12 TXINH_IN_A Connect to ball A13 B12 A07

A13 TXINH_OUT_A Connect to ball A12 B13 NC

A14 A09 B14 TXDATA_IN_A Connect to ball C14

A15 A10 B15 A12

A16 A14 B16 +3.3V_LOGIC

A17 RD / WR B17 +3.3V_LOGIC

A18 STRBD B18 SELECT

A19 +3.3V_LOGIC B19 NC

A20 TX_INH_A B20 GND_LOGIC

A21 SNGL_END B21 BC_DISABLE




Continued ...

Pin Descriptions



C1 NC D1 CHA_1553

C2 NC D2 CHA_1553

C3 NC D3 CHA_1553

C4 NC D4 NC / CHA_1553-D

C5 NC D5 NC

C6 +3.3V_XCVR D6 NC

C7 +3.3V_XCVR D7 NC





C12 +3.3V_XCVR D12 +3.3V_XCVR

C13 NC D13 NC

C14 TXDATA_OUT_A Connect to ball B14 D14 A08

C15 A11 / (MSB) D15 A06

C16 +3.3V_LOGIC D16 A13

C17 +3.3V_LOGIC D17 A15

C18 MEM / REG D18 MSTCLR

C19 NC D19 MCRST

C20 IOEN D20 TX_INH_B

C21 READYD D21 D15 (MSB)

C22 GND_LOGIC D22TRANSPARENT /

BUFFERED

C23 GND_LOGIC D23 TAG_CLK

C24 GND_LOGIC D24 INT

Continued ...


Pin Descriptions


E1 NC / CHA_1553-D F1 CHA_1553

E2 NC / CHA_1553-D F2 CHA_1553

E3 NC / CHA_1553-D F3 CHA_1553

E4 NC / CHA_1553-D F4 NC / CHA_1553-D

E5 NC F5 NC

E6 NC F6 NC

E7 NC F7 NC

E8 NC F8 NC



E11 GND_XCVR/THERMAL F11 RXDATA_OUT_A Connect to ball G11

E12 A03 F12 RXDATA_OUT_A Connect to ball G12

E13 A05 F13 +3.3V_LOGIC

E14 A01 F14 +3.3V_LOGIC

E15 A04 F15 A02

E16 NC F16 A00 (LSB)




E20 NC F20 NC

E21 D11 F21 D07

E22 D13 F22 D09

E23 D12 F23 D08

E24 D14 F24 D10

Continued ...

Pin Descriptions



G1 NC H1 CHB_1553

G2 NC H2 CHB_1553

G3 NC H3 CHB_1553

G4 NC H4 NC / CHB_1553-D

G5 NC H5 NC

G6 +3.3V_XCVR H6 NC

G7 +3.3V_XCVR H7 NC

G8 +3.3V_XCVR H8 NC

G9 +3.3V_XCVR H9 NC

G10 NC H10 SLEEPIN Connecting this input has no effect





G15 NC H15 NC

G16 NC H16 NC




G20 NC H20 GND_LOGIC

G21 D03 H21 INCMD

G22 D05 H22 D01

G23 D06 H23 D02

G24 D04 H24 D00 (LSB)

Continued ...


Pin Descriptions


J1 NC / CHB_1553-D K1 CHB_1553

J2 NC / CHB_1553-D K2 CHB_1553

J3 NC / CHB_1553-D K3 CHB_1553

J4 NC / CHB_1553-D K4 NC / CHB_1553-D

J5 NC K5 NC

J6 NC K6 NC

J7 NC K7 NC

J8 NC K8 GND_XCVR/THERMAL




J12 NC K12 +3.3V_XCVR

J13 NC K13 NC

J14 MSB / LSB / DTGRT K14 SSFLAG / EXT_TRIG

J15 NC K15 NC

J16 TXDATA_IN_B Connect to ball K16 K16 TXDATA_OUT_B Connect to ball J16


J18 GND_LOGIC K18 TXDATA_IN_B Connect to ball K19

J19 GND_LOGIC K19 TXDATA_OUT_B Connect to ball K18


J21 RTAD4 (MSB) K21 RTAD0 (LSB)

J22 RTAD2 K22 RSTBITEN

J23 RTADP K23 RTAD1

J24 RTAD3 K24 RT_AD_LAT

Continued ...

Pin Descriptions



L1 NC M1 GND_XCVR

L2 NC M2 GND_XCVR

L3 NC M3 GND_XCVR

L4 NC M4 NC

L5 NC M5 NC



L8 GND_XCVR/THERMAL M8 NC




L12 +3.3V_XCVR M12 RXDATA_OUT_B Connect to ball M13

L13 NC M13 RXDATA_IN_B Connect to ball M12



L16 ADDR_LAT / MEMOE M16 +3.3V_LOGIC

L17 16 / 8 / DTREQ M17 +3.3V_LOGIC

L18 NC M18 TRIG_SEL / MEMENA_IN

L19 NC M19 TXINH_OUT_B Connect to ball M20

L20 NC M20 TXINH_IN_B Connect to ball M19

L21 NC M21 NC




Continued ...


Pin Descriptions

Ball Signal Notes

N1 GND_XCVR

N2 GND_XCVR

N3 GND_XCVR

N4 NC

N5 NC

N6 NC

N7 NC

N8 NC

N9 +3.3V_XCVR

N10 NC

N11 NC

N12 RXDATA_OUT_B Connect to ball N13

N13 RXDATA_IN_B Connect to ball N12

N14 NC

N15 NC

N16 ZEROWAIT / MEMWR

N17 POL_SEL / DTACK

N18 CLOCK_IN

N19 +3.3V_LOGIC

N20 +3.3V_LOGIC

N21 NC

N22 GND_LOGIC

N23 GND_LOGIC

N24 GND_LOGIC

Electrical Characteristics


6. Electrical Characteristics

6.1. Absolute Maximum Ratings

Supply voltages

Logic -0.3 V to +6.0 V

Transceivers (not transmitting) -0.3 V to +6.0 V

Transceivers (transmitting) -0.3 V to +4.5 V

Logic input voltage range -0.3 V to +6.0 V

Receiver differential voltage 10 Vp-p

Power dissipation at 25°C 1.0W

Solder Temperature (reflow) 260oC

Junction Temperature 175oC

Storage Temperature -65oC to +150oC

6.2. Recommended Operating Conditions

ParametersLimits

UnitMin Typ Max

Supply VoltagesLogic 3.0 3.3 3.6 V

Transceivers 3.14 3.3 3.46 V

Temperature RangeIndustrial -40 85 oC

Extended -55 125 oC



6.3. DC Electrical Characteristics

Unless otherwise stated, VDD = 3.3V, GND = 0V, TA = Operating Temperature Range

Parameters Symbol ConditionsLimits

UnitMin Typ Max

Power Supply

Operating Supply VoltagesLogic VLogic 3.0 3.3 3.6 V

Transceivers VDD 3.14 3.3 3.46 V

Power Supply Current See Note 1

ICC1 Not Transmitting - 10 15 mA

ICC2

Continuous supply current while one bus transmits @ 50% duty

cycle, 70Ω resistive load- 365 380 mA

ICC23

Continuous supply current while one bus transmits @ 100% duty

cycle, 70Ω resistive load- 685 700 mA

Power Dissipation See Note 2

PD1 Not Transmitting - - 60 mW

PD2Transmit one bus @ 50% duty

cycle, 70Ω resistive load - 380 500 mW

PD3Transmit one bus @ 100% duty

cycle, 70Ω resistive load - 510 680 mW

Logic

Input Voltage (High) VIH

All digital inputs, except CLKIN 2.1 - - V

CLKIN 0.8 VDD

Input Voltage (Low) VIL

All digital inputs, except CLKIN - - 0.7 V

CLKIN 0.2 VDD

Input Current (High) IIH

All digital inputs, except CLKIN

VLOGIC = 3.6V, VIH = 2.5V-100 - -10 μA

CLKIN -10 - 10 μA

Input Current (Low) IIL

All digital inputs, except CLKIN

VLOGIC = 3.6V, VIL = 0V-100 - -20 μA

CLKIN -10 - 10 μA

Output Voltage (High) VOH

VLOGIC = 3.0V, VIH = 2.7V, VIL = 0.2V, IOH = max

2.4 - - V

Output Voltage (Low) VOL

VLOGIC = 3.0V, VIH = 2.7V, VIL = 0.2V, IOL = max

- - 0.5 V

Output Current (High) IOH VLOGIC = 3.0V - - -2.2 mA

Output Current (Low) IOL VLOGIC = 3.0V 2.2 - - mA

RECEIVER (Measured at Point “AD” in Figure 4 unless otherwise specified)

Input Resistance RIN Differential 20 - - kΩ

Input Capacitance CIN Differential - - 5 pF



Parameters Symbol ConditionsLimits

UnitMin Typ Max

Common Mode Rejection Ratio CMRR 40 - - dB

Input Level VIN Differential - - 9 Vp-p

Input Common Mode Voltage VICM -10 - +10 V-pk

Threshold Voltage (Direct-Coupled)

Detect VTHD 1 MHz Sine Wave (Measured at Point “AD“ in Figure 4)

1.2 - 20.0 Vp-p

No Detect VTHND - - 0.28 Vp-p

Threshold Voltage (Transformer-Coupled)

Detect VTHD 1 MHz Sine Wave (Measured at Point “AT“ in Figure 5)

0.86 - 14.0 Vp-p

No Detect VTHND - - 0.2 Vp-p

TRANSMITTER (Measured at Point “AD” in Figure 4 unless otherwise specified)

Output Voltage

Direct Coupled VOUT 35Ω Load 6.0 7.2 9.0 Vp-p

Transformer Coupled VOUT70Ω Load (Measured at Point

“AT“ in Figure 5) 20.0 21.5 27.0 Vp-p

Output Noise VON Differential, inhibited - - 14.0 mVRMS

Output Dynamic Offset Voltage

Direct Coupled VDYN 35Ω Load -90 - 90 mV

Transformer Coupled VDYN70Ω Load (Measured at Point

“AT“ in Figure 5) -250 - 250 mVp

Rise/Fall Time tr/f 100 150 300 ns

Output Resistance ROUT Differential, not transmitting 10 - - kΩ

Output Capacitance COUT 1 MHz sine wave - - 15 pF

Clock Input

Frequency

(Default)

CLKIN

16.0 MHz

(option) 12.0 MHz

(option) 10.0 MHz

(option) 20.0 MHz

MIL-STD-1553 Message Timing

Completion of CPU write (BC Start) to Start of First Message for non-Enhanced BC Mode 2.5 μs

BC intermessage gap time (typical value; may be lengthened under software control to 65.535 ms)

non-Enhanced BC Mode 9.5 μs

Enhanced BC Mode 10.5 μs

BC/RT/MT Response Timeout (Software programmable, 4 options)

18.5 nominal 17.5 18.0 19.5 μs

22.5 nominal 21.5 22.5 23.5 μs

50.5 nominal 49.5 50.5 51.5 μs

128.0 nominal 127.0 129.5 131.0 μs

RT Response Time (mid-parity to mid-sync) 4 7 μs

Transmitter Watchdog Timeout 660.5 μs



Note 1: In actual use, the highest practical transmit duty cycle is 96%, occurring when a Remote Terminal responds to a series of 32 data word transmit commands (RT to BC) repeating with minimum intermessage gap of 4μs (2μs dead time) and typical RT response delay of 5μs.

Note 2: While one bus continuously transmits, the power delivered by the 3.3V power supply is 3.3V × 685mA typical = 2.26W. Of this, 510mW is dissipated in the device, the remainder in the load.

6.4. MIL-STD-1553 Bus Interface

BUSB

BUSB

BUSA

BUSA

Transceiver A

Transceiver B

55Ω

55Ω

Isolation Transformer

1:2.65


1:2.07

MIL-STD-1553BUS A

(Direct Coupled)

MIL-STD-1553BUS B

(Transformer Coupled)MIL-STD-1553Stub Coupler

52.5Ω

52.5Ω

1:1.4

Integrated Dual Transceivers and Transformers

Figure 3. Bus Connection Example



Each Bus


MIL-STD-1553Transceiver

Interface

55Ω

35Ω

55Ω

Point“AD”

CHA/B_1553-D

CHA/B_1553-D

Figure 4. MIL-STD-1553 Direct Coupled Test Circuits

70Ω

Point“AT”

Each Bus


MIL-STD-1553Transceiver

Interface

CHA/B_1553

CHA/B_1553

Figure 5. MIL-STD-1553 Transformer Coupled Test Circuits


Package Dimensions

7. Package Dimensions12 EQ. SP. @ 0.0394 (1.0) =

0.473 (12.0)

123456789

101112131415161718192021222324

ABCDEFGHJKLMN

23 EQ. SP. @ 0.0394 (1.0) =

0.906 (23.0)

Triangle denotesball A1

0.097 (2.46)TYP

0.064 (1.63)TYP

0.60 (15.2) TYP

1.100 (27.9)± 0.015

Top View Bottom View

310x Ø = 0.022 (0.56)

Side View

Epoxy Cover

0.015 (0.38)± .002 0.185

(4.7) (MAX)

Ordering Information


8. Ordering Information

HI - 622 x 3 PB x x

Blank = Leaded balls (Sn63/Pb37)F = RoHS compliant, SAC305 solder balls (Sn96.5/Ag3/Cu0.5)

I = −40oC to +85oC T = −55oC to +125oC

PB = Plastic BGA-312

3 = 3.3V Transceiver supply voltage

0 = 64K x 17 bit word RAM capacity 1 = 4K x 16 bit word RAM capacity

622 = Integrated transformers


Revision History

9. Revision History

Revision Date Description of Change

DS6220, Rev. New 05/10/18 Initial Release

A 07/02/18 Add BGA ball metallurgy to Ordering Information

Documents

MIL-STD-1553 BC/RT/MT with Integrated Transformers · 2020. 11. 17. · SSRT mode provides a low-cost MIL-STD-1553 Remote Terminal interface for a simple system that doesn’t include